JP2001073530A - Base board for tiling - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a base board for tiling, by which an air layer can be formed in thick size, working is facilitated and approximately uniform adhesive strength can be obtained to the whole surface of a tile and which can be installed firmly onto a wall surface. SOLUTION: A plurality of adhesive through-holes 22 are formed to the whole surface of a base board material 21, a plurality of guide projecting sections 23, to which the lower sections of tiles are retained, are formed on the tile adherend 21a side of the substrate material 21, and the substrate materil 21 is bent to the reverse side to the tile adherend 21a and mounting sections 26 onto a wall surface are formed while a plurality of air layers are formed among the mounting sections 26 and the wall surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a tile-attaching substrate.

[0002]

2. Description of the Related Art Some buildings have tile walls as outer and inner walls. Conventionally, this type of tile wall has been constructed by, for example, bonding a tile by pressure bonding using a bonding mortar on a mortar base.

However, since the mortar base is heavy, there is a problem that sufficient strength is required for a building. In addition, there is a problem that the plastering work on the base of the mortar takes a considerable number of days, and moreover, it takes about one week to ten days for the mortar to dry and solidify after the construction, so that the construction period becomes long. Furthermore, since the tile is attached to the mortar base using the bonding mortar as described above, there is a problem that a heavy tile may sag or fall before being fixed. Was. In addition, there is a problem that considerable skill is required for orderly arrangement of tiles on a mortar base.

[0004] In order to solve the above problem, a tile sticking substrate as disclosed in Japanese Utility Model Publication No. 7-35003 has been proposed. The tile attaching substrate is shown in FIG.
As shown in FIG. 13, a substrate material 2 such as a stainless steel or aluminum thin plate which can be attached to a base material 1 constituting a wall surface using screws (not shown) is provided, and a large number of substrates are arranged on the entire surface of the substrate material 2 on average. By forming a through hole 3 and bending the substrate material 2 toward the front side, a guide ridge 5 extending in the lateral direction and capable of locking the lower surface of the tile 4 is formed.
A plurality of strips 6 extending in the horizontal direction are formed between the guide protrusions 5 by forming a plurality of strips in the longitudinal direction at intervals substantially equal to the length in the vertical direction, and by bending the substrate material 2 toward the back side. It was done.

[0005] According to this configuration, the substrate material 2 having a large number of through holes 3 formed on the entire surface thereof is brought into contact with the base material 1 constituting the wall surface, and the substrate material 2 is formed using screws (not shown).
By fastening between the concave streak 6 part and the ground 1,
The substrate 2 is fixed to the base 1. Thereafter, the tiles 4 coated with the adhesive 7 are adhered to the back surface along the guide ridges 5 protrudingly formed on the substrate material.

At this time, the adhesive 7 is filled into the concave stripes 6 and escapes from the peripheral edge of the tile 4 in all directions, and partly escapes to the back side through the through hole 3.

As described above, the use of the substrate material 2 eliminates the need for a mortar foundation, thereby making it possible to reduce the weight of the wall surface and shorten the construction period. Moreover, the guide ridges 5 formed on the substrate material 2 can prevent the tiles 4 from sagging and falling, and can arrange the tiles 4 neatly without requiring skill.

By the way, the above-mentioned tile attaching substrate has the following problems. That is, as a means for forming the guide ridges 5 and the concave ridges 6 on the substrate material 2, a drawing process by a press is usually used. However, since the substrate for tile attachment has a complicated uneven shape, For 2, it is necessary to use a material having a remarkably good elongation rate, and the material cost increases accordingly. In particular, if the corner 10 between the bonding surface 8 of the substrate material 2 and the upper surface of the guide ridge 5 is not sharp, the tile 4 slips and falls as shown by the phantom line in FIG. In this case, the tiles 4 must be held down until the adhesive 7 hardens. However, forming the corners 10 at an acute angle is difficult due to difficulties in press working and mechanical properties of the material. With difficulty.

In order to provide a plurality of guide ridges 5 having different intervals depending on the size of the tile 4 to be used, it is necessary to prepare a large number of press dies. Costly.

Further, in the press working, since the size of the mold is limited, it is not possible to produce an excessively long substrate for tile application. Therefore, a large number of joints are formed between the tile-attaching substrates at the time of construction, but it is difficult to align the tile-attaching substrates, and if there is a misalignment, the tile wall is not beautifully finished.

In addition, there is a problem that the adhesive strength of the tile 4 to the substrate material 2 becomes nonuniform in each part, and a strong adhesive state cannot be obtained.

That is, in the case of FIGS. 12 and 13, the bonding surface 9 is widened at the center of the tile 4 and the adhesive 7
Suffices to escape from the through hole 3 to the back side to form a nail head-like mass and exert a locking force, so that a high adhesive strength can be obtained. On the other hand, in the upper and lower portions of the tile 4, the area of the adhesive surface 8 is relatively small, and the adhesive 7 easily escapes in four directions. Since a nail-like mass cannot be formed, only a weak adhesive strength can be obtained. In the recess 6, the back side of the through hole 3 is the base 1.
The adhesive 7 cannot escape to the back side because it is closed by the nail, so that a nail head-shaped mass is not formed and a locking force cannot be obtained.

In order to solve the above problem, the applicant of the present application has previously proposed a tile bonding substrate as shown in FIGS. This tile sticking substrate is tile 14
A plurality of tile bonding protrusions 15 having an adhesive through hole are formed on the tile bonding portion of the substrate material 11 formed with the protrusions 13 for locking the lower portion of the tile. The portion 15 is a tapered top 5 of the peripheral portion.
A burring hole 15b having an adhesive through hole is formed in a.
The guide projection 13 shears the substrate material 11 in the horizontal direction and punches the alternately extruded portions between the sheared portions toward the front surface and the rear surface, respectively. A plurality of air layer forming projections 18 are formed so as to protrude toward the opposite surface to form an air layer 17 between the air wall 17 and the wall surface.

According to such a configuration, the substrate material 11 is brought into contact with the base material 12 constituting the wall surface, and the substrate material 11 is fastened to the base material 12 using screws (not shown). Is fixed to the base 12. Thereafter, the tiles 14 coated with the adhesive 16 are adhered to the back surface along the guide projections 13 formed on the substrate material 11.

At this time, the adhesive 16 is filled into the tile bonding portion of the substrate material 11 and escapes to the opposite side to form a lump larger than the adhesive through hole inside the tile bonding projection. Become. After that, the surplus adhesive is filled in the gap between the back surface of the tile and the tile bonding portion, and the surplus adhesive escapes to the four sides of the tile.

As described above, the use of the substrate material 11 eliminates the need for a mortar base, thereby making it possible to reduce the weight of the wall surface and shorten the construction period. In addition, the guide protrusions 13 formed on the substrate material 11 can prevent the tiles 14 from sagging or dropping, and can neatly arrange the tiles 14 without skill.

[0017]

However, the above-mentioned substrate for tile attachment has the following problems. That is, the air layer 17 formed between the air layer forming projection 18 of the substrate material 11 and the base 12 is the air layer forming projection 18
However, since the air layer forming projections 18 are formed by burring, the height that can be processed is limited, and it may not always be possible to achieve the desired height. For this reason, the size of the air layer 17 is limited, and there has been a problem that a necessary heat insulating effect cannot be obtained.

Further, since the projection 15 for bonding the tile and the projection 18 for forming the air layer are formed by burring, a processing step is required as compared with a simple punching process, and the mold is complicated. Therefore, there was a problem that the processing cost was increased.

Another problem is that the adhesive strength between the tile 14 and the substrate material 11 cannot be sufficiently obtained. That is, FIG.
Since the tile 14 is mounted on the tapered top of the tile bonding projection 15 as shown in FIG.
Since the contact area between the tile 4 and the tile bonding projection 15 is reduced, the bonding area is also reduced, and a sufficient bonding strength cannot be obtained.

Further, when the substrate material 11 is fixed to the base 12, a screw (not shown) is used. However, the base material 11 abuts on the top of the air layer forming projection 18, and the substrate material 11 is Since it is fixed in a floating state, there is a problem that the substrate material 11 cannot be fixed to the base 12 in a stable state.

The present invention has been made in view of the above-mentioned problems of the above-described structure, and it is possible to form a thick air layer, facilitate processing, and obtain substantially uniform adhesive strength over the entire surface of the tile. It is an object of the present invention to provide a tile-attaching substrate that can be firmly attached to a wall surface.

[0022]

SUMMARY OF THE INVENTION Therefore, according to the present invention, a plurality of adhesive through-holes are formed on the entire surface of a substrate material, and guide protrusions for locking a lower portion of the tile on the tile bonding surface side of the substrate material. A basic feature is that a plurality of portions are formed, and the substrate material is bent to the side opposite to the tile bonding surface to form a mounting portion to a wall surface, and a plurality of air layers are formed between the substrate material and the wall surface. In other words, the tile bonding substrate of the present invention is:
A plurality of attachment portions to the wall surface formed in a groove shape in parallel at a predetermined interval, and one or more tile adhesion portions formed in a substantially flat plate shape between the attachment portions to the wall surface; Each of the attachment portions to the wall has an abutting surface portion that abuts against a wall surface and has a fastener insertion hole, and a side wall portion that is formed to rise from both edges of the corresponding abutting surface portion. Is formed at an appropriate distance from the wall surface and substantially parallel to the wall surface, and has an adhesive surface portion having a plurality of adhesive through-holes, protrudingly provided from the adhesive surface portion on the side opposite to the wall surface side, and the wall surface Guide projections formed at appropriate intervals (specifically, intervals approximately matching the dimensions of the tiles) in the direction in which the attachment portions to the grooves extend in a groove shape, for locking the lower portion of the tiles. And a part.

More specifically, the adhesive through holes are formed by forming a large number of holes on the entire surface of the substrate material on average.

Further, it is conceivable that the guide projections are formed by shearing the substrate material in a lateral direction in parallel, and by punching out the portion between the sheared portions to the surface side.

When the tile-attaching substrate is installed, a plurality of wide substrates are sequentially joined and finally, in order to adjust the width, a plurality of widths having several different widths are adjusted. At least one adjustment plate selected from narrow adjustment plates may be attached. Here, as the wide tile attaching substrate to be joined, a substrate having an attachment portion to the wall surface between both edges and the both edges may be used. In addition, as an adjustment plate (a narrow-width tile-attaching substrate) for adjusting the width at the end of the construction, a plate having attachment portions to the wall surface only at both edges may be used. The adjustment plate can correspond to an arbitrary width dimension by arranging various adjustment plates having different widths and appropriately combining them.

With the above configuration, the following operations can be obtained. That is, when constructing a tile wall, a board material is attached to the wall surface,
Thereafter, while being locked to the guide projection formed on the substrate material, a tile coated with an adhesive is attached to the back surface.

At this time, since a large number of adhesive through-holes are formed on the entire surface of the substrate material on average, the adhesive first escapes to the opposite side through the adhesive through-holes, and the tile bonding protrusions are formed. A large lump larger than the adhesive through-hole is formed inside. After that, the surplus adhesive is filled in the gap between the back surface of the tile and the tile bonding portion, and the surplus adhesive escapes to the four sides of the tile.

As described above, the use of the above-mentioned substrate material eliminates the need for a mortar base, thereby making it possible to reduce the weight of the wall surface and shorten the construction period. Moreover, the guide projections formed on the substrate material can prevent the tiles from sagging and falling, and can arrange the tiles neatly without requiring skill.

Further, since the guide projections are formed by ordinary punching and the like, and the adhesive through-holes can be formed by ordinary punching, the whole substrate material can be easily manufactured. it can.

Therefore, the degree of freedom for the substrate material is increased, and the cost can be reduced accordingly.
Further, by forming the guide projections into a punched configuration, the acute angle of the corner between the general surface of the substrate material and the upper portion of the punched portion does not matter, and therefore, the tile does not slip at this portion.

Further, in the case of manufacturing a product in which the interval between the guide projections differs according to the size of the tile to be used, it can be performed by adjusting the feed amount of the substrate material or the timing such as the punching process. There is no need to prepare many molds.

Further, since processes such as punching and burring are performed by repeatedly using a small mold,
It is possible to make long tile application substrates. Therefore, at the time of construction, the number of joints between the tile-attaching substrates is reduced, and displacement of the tile-attaching substrate is less likely to occur, so that the tile wall can be beautifully finished.

Further, since the substrate material is bent to the side opposite to the tile bonding surface of the substrate material to form a mounting portion to the wall surface, the substrate material can be mounted on the wall surface in a plane, so that the substrate material is stable and Can be firmly fixed with screws.

Furthermore, by forming an attachment portion to the wall surface by projecting to the side opposite to the tile adhesion surface on the substrate material and forming an air layer between the substrate and the wall surface, the effect of promoting drying on the wall surface and the high drainage Properties, a heat insulating effect, and a soundproofing effect can be obtained.

In addition, in the above configuration, even when the base of the wall surface has a circular curved surface, the interval between the adjacent guide projections hardly increases or decreases, so that the tile can be mounted. become.

[0036]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of a tile sticking substrate according to the present invention will be described. FIG. 1 is a perspective view showing a tile bonding substrate according to a first embodiment of the configuration of the present invention,
2 is a cross-sectional view taken along line XX of FIG. 1, FIG. 3 is a cross-sectional view taken along YY of FIG. 1, and FIG. 4 is a cross-sectional view showing a state where the tile bonding substrate of FIG. is there.

As shown in FIGS. 1 to 3, the tile bonding substrate according to the present invention has a plurality of adhesive through holes 22 formed on the entire surface of a substrate material 21 and a tile bonding surface 21a of the substrate material 21. Guide projection 23 that locks the lower part of tile 24 on the side
Are formed, and the substrate material 21 is further bonded to the tile bonding surface 21.
a, which is bent to the opposite side to a, and is attached to the base 25 of the wall surface.
Is formed, and a plurality of air layers 30 are provided between the substrate material 21 and the base 25. Further, a plurality of screw holes 27 are formed in the mounting portion 26, and
Fixed to 5. Reference numeral 29 denotes an adhesive applied to the back surface of the tile 24.

As the substrate material 21 used for the tile-attaching substrate, a thin plate made of a metal material such as stainless steel or aluminum that does not easily rust is used. An even punching process is performed on the entire surface of the substrate material 21 to form an adhesive through hole 22 and a screw hole 27.
Is formed, and the guide projection 23 is punched. Then, a bending process is performed to bend the attachment portion 26 to the base 25 and form the air layer 30.

The guide projection 23 is formed, for example, on the substrate 2
1 was sheared in parallel in the lateral direction, and punched so as to extrude between the sheared portions to the surface side.
The plurality of guide projections 23 are formed in the horizontal direction at intervals substantially equal to or smaller than the horizontal dimension of the tiles 24, and at intervals substantially equal to the vertical dimensions of the tiles 24. A plurality is formed in the vertical direction.

When a tile wall is to be constructed, the mounting portion 26 of the substrate material 21 is aligned with a base 25 constituting the wall surface, and a screw 28
Attach using Thereafter, the tiles 24 to which the adhesive 29 is applied are adhered to the back surface while being locked to the guide projections 23 formed on the substrate material 21.

At this time, since the adhesive through holes 22 are formed in the substrate material 21, the adhesive 29 first escapes to the back side through the adhesive through holes 22, and passes through the adhesive through hole on the back surface of the substrate material 21. Hole 2
2. A nail head-shaped mass is formed around the periphery of the body. Thereafter, the surplus adhesive 29 is filled in the gap between the back surface of the tile 24 and the tile adhering surface 21a of the substrate material 21, and the surplus adhesive 29 escapes to the four sides of the tile 24.

As described above, the use of the substrate material 21 eliminates the need for a mortar base, thereby making it possible to reduce the weight of the wall surface and shorten the construction period. In addition, the guide protrusions 23 formed on the substrate material 21 can prevent the tiles 24 from sagging and falling, and can arrange the tiles 24 neatly without requiring skill.

Further, since the adhesive through-holes 22 and the guide projections 23 are formed by ordinary punching, there is no extra processing such as burring, so that they can be manufactured easily. Since the mounting portion 26 is formed by bending, the bending height can be freely set, and is not limited by the processing.

Therefore, the degree of freedom for the material of the substrate member 21 is increased, and the cost can be reduced accordingly. In addition, since the guide projection 23 is formed by punching as described above, the acute angle of the corner between the general surface of the substrate 21 and the upper part of the guide projection 23 does not matter, and therefore, in this portion, No slippage of the tile 24 occurs.

In the case of manufacturing a product in which the interval between the guide projections 23 is different depending on the size of the tile 24 to be used,
Since the adjustment can be performed by adjusting the feed amount of the substrate material 21 or adjusting the timing such as punching, it is not necessary to prepare a large number of press dies.

Furthermore, since the punching process is performed by repeatedly using a small mold, it is possible to produce a long tile-attaching substrate. Therefore, at the time of construction, the number of joints between the tile-attaching substrates is reduced, and displacement of the tile-attaching substrate is less likely to occur, so that the tile wall can be beautifully finished.

Further, by forming a plurality of mounting portions 26 on the substrate material 21 projecting to the side opposite to the tile adhesion surface and forming an air layer between the substrate material 21 and the wall surface, the substrate material 21 and the base 25 are formed.
Thus, the air layer 30 is formed between them, so that the effect of promoting drying on the wall surface can be obtained. In other words, when the wall is made of concrete, it is said that it usually takes about 5 years for the concrete to completely dry after casting. During that time, the moisture contained in the concrete causes dew condensation on the indoor side and mold This causes the tile 24 to fall on the outdoor side. In the present embodiment, since the air layer 30 allows moisture contained in the concrete to escape, drying of the wall surface is promoted, and an effect of preventing dew condensation on the indoor side and an effect of preventing the tile 24 from dropping on the outdoor side are obtained. be able to.

Further, high air drainage can be obtained by the air layer 30. That is, provided that the air layer 30 is provided, rainwater that has infiltrated from the joints may be used as a substrate material, provided that the base 25 is made of a breathable waterproof paper or a waterproof liquid having the same effect is applied to the base 25. The air flows down the narrow air layer 30 between the base 21 and the base 25 and is discharged to the lowermost part of the wall surface. Thereby, the whitening phenomenon and the peeling phenomenon of the tile 24 can be prevented.

The air layer 30 can provide a heat insulating effect. As a result, the influence of the outside air temperature or the heat of irradiation with sunlight can be cut off. In addition, in the construction such as renovation, since the work can be performed from above the existing finish, there is an advantage that the labor for removing the existing finish can be omitted, and the generation and treatment of waste materials are not required.

Further, a soundproofing effect can be obtained by the air layer 30. Thus, noise generated indoors and outdoors can be reduced.

In addition, in the above configuration, even when the base 25 is a curved surface, as shown in FIG. 4, the substrate material 21 can be adapted to a curved surface because the substrate 21 is a continuous bent substrate.
Since the contact surface between the tile bonding surface 21a and the tile 24 is large, at least the bonding strength of a high-cost adhesive is sufficiently ensured, and as a result, a high-cost adhesive can be saved. Since the area of adhesion between the tile adhesive surface 21a and the tile 24 is increased and the locking portion of the tile 24 is a projection of the guide projection 23, the adhesive is not restricted by an expensive adhesive having a strong adhesive force. A sufficient cementing effect and adhesive strength can be obtained even with a simple cement-based adhesive.

FIG. 5 shows a second embodiment of the structure of the present invention, in which the guide projection 31 is a V-shaped bridge.

In this case, the guide projection 31 constituted by the bridge has a simple shape and an improved strength.

Except for the above, the second embodiment has the same configuration as that of the first embodiment, and the same operation and effect can be obtained.

FIG. 6 shows a third embodiment of the present invention, in which the guide projection 32 is a substantially arc-shaped bridge. Since the guide projection 32 configured as described above can easily process the mold, the cost can be reduced.

Except for the above, the second embodiment has the same configuration as that of the second embodiment, and the same operation and effect can be obtained.

FIG. 7 shows a fourth embodiment of the structure of the present invention, in which the guide projection 33 is cut and raised.

The guide projection 33 thus formed is
Since it is processed simultaneously with the punching process of the adhesive through hole 22,
Processing becomes simple, cost can be reduced, and joints need to be reduced in the case of small tiles. However, there is an advantage that narrow joints in joints can be handled.

Except for the above, the configuration is the same as that of the above embodiment, and the same operation and effect can be obtained.

The present invention is not limited only to the above-described embodiments, and other combinations of the above-described embodiments are possible, and various modifications may be made without departing from the spirit of the present invention. Of course, changes can be made.
For example, the tile 24 of the present invention includes a brick, a natural stone,
Various wall materials such as artificial stones or composite plates including metal plates are included.

[0061]

According to the configuration of the present invention described in detail above, the use of the substrate material eliminates the need for a mortar base,
It is possible to reduce the weight of the wall and shorten the construction period. Moreover, the guide projections formed on the substrate material can prevent the tiles from sagging and falling, and can arrange the tiles neatly without requiring skill.

Further, since the guide projections are formed by ordinary punching and the like, and the adhesive through-holes can be formed by simple punching, they can be easily manufactured.

Accordingly, the degree of freedom for the material of the substrate material is increased, and the cost can be reduced accordingly.
In addition, by forming the guide projections into a punched configuration, the acute angle of the corner between the general surface of the substrate material and the upper part of the guide projections does not matter, and therefore, the tile does not slip at this portion. .

Further, in the case of manufacturing a product having a different guide protrusion interval according to the size of a tile to be used, it can be performed by adjusting the feed amount of the substrate material or the timing of punching and the like. There is no need to prepare many molds.

Further, since the punching process is performed by repeatedly using a small mold, it is possible to produce a long tile attaching substrate. Therefore, at the time of construction, the number of joints between the tile-attaching substrates is reduced, and displacement of the tile-attaching substrate is less likely to occur, so that the tile wall can be beautifully finished.

In addition, since a tile bonding protrusion projecting to the front surface side is formed on the substrate material and an adhesive through hole is formed in the tile bonding protrusion, the adhesive first passes through the adhesive through hole. Escape to the back side to form a lump larger than the adhesive through hole inside the tile bonding projection, and then the excess adhesive is filled into the gap between the back surface of the tile and the tile bonding part, Excess adhesive will escape to all sides of the tile. Therefore, the adhesive passing through the adhesive through-hole can be formed into a large lump regardless of the location, so that substantially equal locking effects can be obtained between the upper and lower portions and the center portion of the tile, and the tile substrate material can be obtained. Adhesive strength to the surface can be made uniform.

Further, by forming a plurality of projections for forming an air layer on the substrate material projecting to the back surface side and forming an air layer between the substrate and the wall surface, a drying promoting effect on the wall surface, a high drainage property, heat insulation, An effect and a soundproofing effect can be obtained.

In addition, in the above configuration, even if the base is a curved surface, the substrate material is a continuous bent substrate, so that it can be adapted to a base having a curved surface, and the tile can be attached. .

Furthermore, an expensive adhesive can be saved by the locking effect of the guide projection and the effect of increasing the contact area between the substrate and the tile. In addition, since there is no restriction on the adhesive, an inexpensive conventional cement-based adhesive can be used.

Next, a description will be given of how to adjust the dimensions when the tile attaching substrate is installed. In the construction work of pasting the tile-attaching substrate of the present invention onto the wall of a building, the final edge of the tiled-attached substrate and the edge of the surface to which the tile-attached substrate is to be attached are , Usually do not match. For example, at a corner formed by two wall surfaces intersecting at a right angle, or at a location where a window frame or the like exists, a portion that needs dimensional adjustment that usually cannot be applied to the tile bonding substrate as it is is generated. In this case, if the size of the tile attaching substrate is cut by cutting, the cut portion (edge portion) is a tile bonding surface portion formed at a predetermined distance from a wall surface, and a screw is formed. A situation may occur in which the fixation by the device becomes impossible.

Therefore, as shown in FIG. 8, of the tile-attached substrates 34 at the end of the spliced portion, once at the attachment portion 34a to the wall surface, which is closest to the position where cutting must be performed in order to match the dimensions. After cutting and screwing, the adjustment plate 35 (the adjustment plate 35 is also a kind of the substrate for tile attachment of the present invention) corresponding to the width of the unattached portion is attached and sized.

As the adjusting plate 35, various types having different dimensions may be prepared. For example, FIGS.
As shown in FIG. 1, an adjusting plate (FIG. 9) having a width of 60 mm and having one guide protrusion in the lateral direction (width direction), and an adjusting plate having a width of 80 mm and two guide protrusions in the width direction. An adjusting plate (FIG. 10) provided with a portion and an adjusting plate (FIG. 11) having a width of 100 mm and provided with three guide projections in the width direction are prepared, and these are appropriately combined and used. . For example, when the width of the unapplied portion is 140 mm, a portion having a width of 60 mm (FIG. 9) and a portion having a width of 80 mm (FIG. 10) may be combined and attached. When the adjusting plate 35 is attached, the vertical position of the guide projection of the adjusting plate 35 is adjusted to the position of the guide projection of the tile attaching substrate 34 so that the tiles can be joined.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a tile bonding substrate according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line XX of FIG.

FIG. 3 is a sectional view taken along line YY of FIG. 1;

FIG. 4 is a cross-sectional view showing a state in which the tile attaching substrate of FIG. 1 is attached to a circumferential wall surface.

FIG. 5 is a perspective view showing a tile attaching substrate according to a second embodiment of the present invention.

FIG. 6 is a perspective view showing a tile bonding substrate according to a third embodiment of the present invention.

FIG. 7 is a perspective view showing a tile attaching substrate according to a fourth embodiment of the present invention.

FIG. 8 is a diagram showing a method of adjusting a dimension in a width direction in the construction of the tile attaching substrate of the present invention.

FIG. 9 is a front view (a) and a plan view (b) showing a first embodiment of an adjustment plate used in the present invention.

FIG. 10 is a front view (a) and a plan view (b) showing a second embodiment of the adjusting plate used in the present invention.

FIG. 11 is a front view (a) and a plan view (b) showing a third embodiment of an adjusting plate used in the present invention.

FIG. 12 is a perspective view showing a tile bonding substrate according to a conventional example.

FIG. 13 is a side sectional view of FIG.

FIG. 14 is a perspective view showing a tile bonding substrate according to a conventional example.

FIG. 15 is a side sectional view of FIG. 14;

[Explanation of symbols]

1, 12, 25 Base 2, 11, 21 Substrate material 3 Through hole 4, 14, 24 Tile 5 Guide ridge 5a Top 6 Concave ridge 7, 16, 29 Adhesive 8, 9 Adhesive surface 10, Corner 13, 23, 31, 32, 33 Guide projection 15 Tile bonding projection 15b Burring hole 17, 30 Air layer 18 Air layer formation projection 21a Tile bonding surface 22 Adhesive through hole 26, 34a Mounting part 27 Screw hole 28 Screw 34 tile Sticking board 35 Adjustment plate (Tile sticking board for width adjustment)

Claims (5)

[Claims] A plurality of adhesive through holes are formed on the entire surface of a substrate material, and a plurality of guide projections for locking a lower portion of a tile are formed on a tile bonding surface side of the substrate material. A tile-attaching substrate, wherein the substrate is bent to the side opposite to the tile bonding surface to form an attachment portion to a wall surface, and a plurality of air layers are formed between the wall surface and the wall. 2. The tile bonding substrate according to claim 1, wherein the adhesive through-hole has an average number of holes formed on the entire surface of the substrate material. 3. The method according to claim 1, wherein the guide protrusions are formed by shearing the substrate material in a lateral direction in parallel, and punching out between the sheared portions toward the surface side. 2. The tile bonding substrate according to 2. 4. The device according to claim 1, wherein said wall has at least one attachment portion to be attached to said wall.
4. The tile sticking substrate according to any one of items 1 to 3. 5. The method according to claim 1, wherein the mounting portion for attaching to the wall surface is provided only at both edges, and is used as an adjusting plate for adjusting the width at the time of construction. 2. The substrate for attaching a tile according to claim 1.