JPH11284221A - Semiconductor relay - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor relay which can be reduced in thickness and size without using any lead frame. SOLUTION: Switch elements 3a and 3b are mounted on the rear surface of a circuit board 20 and wire passing holes 21 and 21 are bored through the circuit board 20 in the thickness direction. Through the holes 21 and 21, the switch elements 3a and 3b are electrically connected to a wiring pattern formed on the front surface of the circuit board 20 by wire bonding. Since all parts are arranged on one circuit board 20, the thickness of a semiconductor relay can be reduced. In addition, since the switch elements 3a and 3b are wire-bonded through the wire passing holes 21 bored through the circuit board 20, the area of the relay can be reduced as compared with the case where the switch elements 3a and 3b are mounted on the front surface of the circuit board 20 together with a light emitting element 1 and light receiving parts 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor relay in which a switching element is turned on and off by an output of a light receiving element optically coupled to a light emitting element provided on an input side.

[0002]

2. Description of the Related Art Conventionally, a semiconductor relay having the configuration shown in FIG. 7 has been proposed. This semiconductor relay comprises a light emitting element 1 comprising a light emitting diode array on the input side, and a light emitting element 1
Light receiving element 2 composed of a photodiode array or a solar cell array optically coupled to a light receiving element 2 and an enhancement type n-channel M turned on and off by the photovoltaic force of light receiving element 2
A pair of switch elements 3a and 3b made of OSFET are provided. The light emitting element 1 is connected between the input terminals ta and ta ', and turns on and off according to an input signal provided between the input terminals ta and ta'. A bias resistor 4 is connected in series to the negative electrode of the light receiving element 2, and a gate of a driving switch element 5 composed of a depletion type n-channel MOSFET is connected to a series circuit of the light receiving element 2 and the resistor 4.
The resistor 4 is connected between the gate and the source of the switch element 5, and the light receiving element 2 is connected between the gate and the drain. In the switch elements 3a and 3b, the gates and the sources are commonly connected, the gate is connected to the drain of the switch element 5, and the source is connected to the source of the switch element 5. The drains of the switch elements 3a and 3b are connected to output terminals tb and tc, respectively.

The semiconductor relay shown in FIG. 7 is of a normally-off type, and when an input current flows between input terminals ta and ta 'to light the light emitting element 1, the light receiving element optically coupled to the light emitting element 1 is turned on. 2 generates photovoltaic power. A current flows through the resistor 4 due to the photovoltaic force, and a voltage is applied between the gate and the source of the switch element 5. Since the switching element 5 is of the depletion type, it is on when no voltage is applied between the gate and the source, but when the applied voltage between the gate and the source becomes higher than the threshold voltage of the switching element 5, the switching element 5 is turned on. Turns off. That is, since no voltage is applied between the gate and the source of the switch elements 3a and 3b when the switch element 5 is turned on, the enhancement-type switch elements 3a and 3b are off, but when the switch element 5 is turned off, the switch element 3a is turned off. , 3b, a voltage is applied by a series circuit of the light receiving element 2 and the resistor 4 between the gate and the source.
If the threshold voltage is equal to or higher than the threshold voltages a and 3b, the switching element 3
a and 3b are turned on. When the switch element 5 is turned off and the switch elements 3a and 3b are turned on, the resistance 4
A small current flows through the switching element 5, and the voltage generated between both ends of the resistor 4 by this current keeps the switching element 5 at a high impedance. Although the current flowing through the resistor 4 when the switch elements 3a and 3b are on is small, the bias voltage required to keep the switch element 5 off by setting the value of the resistor 4 sufficiently large is set. Obtainable.

On the other hand, when the current stops flowing between the input terminals ta and ta ', the light emitting element 1 is turned off, and no photoelectromotive force is generated in the light receiving element 2. Therefore, no voltage is applied between the gate and the source of the switch element 5, and the switch element 5 is turned on. That is, the electric charge stored in the capacitance component between the gate and the source of the switching elements 3a and 3b is rapidly discharged through the switching element 5, and
a and 3b are turned off. That is, the output terminal tb (t
c) and between tb 'are cut off. Here, since the drain and source of the two switching elements 3a and 3b are connected in anti-series, the body diodes of the switching elements 3a and 3b are connected in anti-series and the output terminals tb (tc) and tb 'are connected. Current is not flown through the body diode in a state where is shut off. In other words, the above configuration can be used for both AC and DC. Further, if one output switching element is used, a current flows through the body diode, so that it can be used only for direct current. Although the above-described one is a normally-off type semiconductor relay, a normally-on type semiconductor relay is also provided by using a depletion type as the switching elements 3a and 3b.

[0005] The semiconductor relay having the above-described configuration is housed in a package 10 in the form shown in FIG.
The illustrated package 10 is a surface mount type SO (smal
l outline) type package in which components are mounted on two lead frames 11 and 12. The light receiving component 6 and the switch elements 3a, 3
b is fixed by die bonding using a silver paste or the like. The light receiving component 6 is an element in which the light receiving element 2, the resistor 4, and the switch element 5 are integrated into one chip. Also, the light receiving component 6, the switch elements 3a and 3b, and the lead frame 11
Is connected by wire bonding using a wire 7 which is a gold wire. The light emitting element 1 is fixed to the other lead frame 12 by die bonding using a silver paste or the like, and the light emitting element 1 and the lead frame 12 are connected using the wires 7. Both lead frames 11, 12
Is arranged so that the light emitting element 1 and the light receiving component 6 are opposed to each other, and a space between the light emitting element 1 and the light receiving component 6 is filled with a coupling member 13 made of a transparent resin for optically coupling the two. Further, the entire package is sealed by transfer molding of an opaque resin, and the package 10 is formed.

[0006]

In the above-described configuration, the 2
Since the wire 7 is used for each of the lead frames 11 and 12, and the two lead frames 11 and 12 are arranged to face each other, the size of the package 10 in the thickness direction of the lead frames 11 and 12 is increased, and There is a problem that realization of miniaturization and miniaturization is difficult. Further, since the package 10 is formed by transfer molding, the lead frames 11 and 12 may be bent by the flow of the resin, and the distance between the light emitting element 1 and the light receiving element (light receiving component 6) 2 may vary.

[0007] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor relay which can be made thinner and smaller without using a lead frame.

[0008]

According to the first aspect of the present invention, there is provided a semiconductor relay in which a switch element is turned on / off by an output of a light receiving component optically coupled to a light emitting element, and the surface of the semiconductor relay is provided in the surface thereof. The light emitting element and the light receiving component are mounted on the surface of the circuit board on which the wiring pattern is formed and are electrically connected to the wiring pattern, respectively, and the switch element is mounted on the back surface of the circuit board, and the circuit board is perforated. Wherein the switch element is electrically connected to the wiring pattern on the surface of the circuit board through wire insertion holes by wire bonding, and the components are mounted on both the front and back surfaces of one circuit board. Thinner compared to the case of using a lead frame, and also smaller in area than the conventional configuration with surface mounting leads. It made. In addition, since the switch element is wire-bonded through the wire insertion hole drilled in the circuit board, the area can be reduced compared to the case where the switch element is mounted together with the light-emitting element and light-receiving component on the surface of the circuit board. become. Furthermore, since no lead frame is used, the occurrence of defective products due to bending of the lead frame is reduced, and the yield is improved.

According to a second aspect of the present invention, in the first aspect, the light emitting element and the light receiving component are electrically connected to the wiring pattern on the surface of the circuit board by wire bonding, and the light emitting element and the light receiving component are transparent. 2. The method according to claim 1, wherein the wires are optically coupled by a resin having optical properties, and at least the wires exposed on the circuit board surface through the light emitting elements and the light receiving components and the wire insertion holes are resin-sealed. It is a desirable embodiment of the invention.

According to a third aspect of the present invention, in the first aspect of the present invention, a light emitting element is mounted in a recess provided on the surface of the circuit board, is electrically connected to the wiring pattern, and faces the light emitting element. The light receiving component is electrically connected to the wiring pattern by flip-chip bonding, and a space where the light emitting element and the light receiving component face each other is filled with a translucent coupling member, and at least passes through the wire insertion hole. Wherein the wire exposed on the surface of the circuit board is resin-sealed.
In addition to the operation of the invention of the third aspect, by mounting the light emitting element in the recess of the circuit board, further reduction in thickness can be achieved.

According to a fourth aspect of the present invention, in the first aspect, the light emitting element is mounted on the light receiving component as a build-up element and is integrated with the light receiving component, and the light receiving component is electrically connected to the wiring pattern by wire bonding. And the light-emitting element and the integrated light-receiving component are optically coupled by a resin having a light-transmitting property, and are exposed to the surface of the circuit board through at least the light-receiving component and the wire insertion hole. Are sealed with a resin, and in addition to the function of the invention of claim 1, since the light emitting element and the light receiving component are integrated as a build-up element, the positioning accuracy of the light emitting element and the light receiving component is improved. Will be higher.

According to a fifth aspect of the present invention, in the first aspect of the present invention, the light emitting element is mounted on the light receiving component as a build-up element, is integrated with the light receiving component, and is mounted in a recess provided on the surface of the circuit board. The light receiving component is electrically connected to the wiring pattern by flip chip bonding so as to house at least a part of the projecting portion of the build-up element, and in addition to the effect of the invention of claim 1, Since the light emitting element and the light receiving component are integrated as a build-up element, the positioning accuracy between the light emitting element and the light receiving component is increased. In addition, since at least a part of the protruding portion of the build-up element is accommodated in the recess provided on the surface of the circuit board, the thickness can be reduced.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the embodiment described below, 2
Instead of a single lead frame, each component is distributed and mounted on both the front and back surfaces of a single circuit board.
In order to realize this configuration, the switch elements 3a and 3b are mounted on the back side of the circuit board 20, and the wire insertion holes 21 and 21 penetrating the circuit board 20 in the thickness direction are formed. Through the switch elements 3a, 3b
Are electrically connected to a wiring pattern formed on the surface of the circuit board 20 by a wire bonding. In the following description, the circuit configuration shown in FIG. 7 is assumed, but the same technical idea can be applied to other circuit configurations.

(Embodiment 1) In this embodiment, as shown in FIG. 1, a pair of output switch elements 3a and 3b are mounted on the back surface of a circuit board 20 such as a ceramic substrate having a wiring pattern formed on the front surface. Is done. Both switch elements 3a, 3
The chip b is bonded to the back surface of the circuit board 20 by bonding or dummy bumps 8, and is electrically connected to a wiring pattern on the surface of the circuit board 20 by performing wire bonding using a wire 9 that is a gold wire or an aluminum wire. Is done. Also,
The two switching elements 3a and 3b are arranged apart from each other. The switch elements 3a and 3b have gate, source and drain electrodes formed on the same surface of the chip.
A MOSFET (such as a lateral DMOSFET) is used.

Here, the circuit board 20 is provided with a wire insertion hole 21 penetrating in the thickness direction, and a switch attached to the back surface of the circuit board 20 so that the wire 9 is inserted through the wire insertion hole 21. The elements 3a and 3b are connected to the circuit board 2
0 is wire-bonded to the wiring pattern on the surface (see FIG. 2).
reference). On the other hand, the light emitting element 1 composed of an LED and the light receiving component 6 are die-bonded to the surface of the circuit board 20 using a silver paste or the like, and the wire bonding is performed using a wire 7 that is a gold wire or an aluminum wire. With this, it is electrically connected to the wiring pattern on the surface of the circuit board 20. In addition, the light emitting element 1 and the light receiving component 6 are disposed separately on the surface of the circuit board 20.

Further, on the surface of the circuit board 20, the light emitting element 1, the light receiving component 6, the wires 7, 9 and the like are sealed by a coupling member 13 made of a transparent resin, and the light emitting element 1 and the light receiving component 6 are sealed by the coupling member 13. Are optically coupled to each other, so that the efficiency of transmitting light emitted from the light emitting element 1 to the light receiving component 6 by reflection at the interface of the coupling member 13 can be increased.

By arranging and electrically connecting the components as described above and covering the light emitting element 1 and the light receiving component 6 with the coupling member 13 in an optically coupled state, the light emitting element 1 and the light receiving component 6 are covered with an underfill member 15 made of epoxy resin or the like. The light emitting element 1, the light receiving component 6, and the wires 7, 9 are sealed and fixed. The underfill member 15 is preferably made of an opaque resin in order to reduce the influence of light from the light emitting element 1 and external light on the switch elements 3a and 3b.

With the above configuration, one circuit board 2
Since all parts are arranged at 0, the thickness dimension (the dimension in the vertical direction in FIG. 1) can be reduced as compared with the conventional configuration. Since the switch elements 3a and 3b are wire-bonded through the wire insertion holes 21 formed in the circuit board 20, the switch elements 3a and 3b are mounted on the surface of the circuit board 20 together with the light emitting element 1 and the light receiving component 6. This makes it possible to reduce the area as compared with the case of performing the above. In addition, since the lead frame is not used, when the underfill member 15 is applied, the light emitting element 1
Does not occur.

(Embodiment 2) In this embodiment, as shown in FIG. 3, a recess 20a for accommodating and mounting the light emitting element 1 is formed on the circuit board 20, and faces the light emitting element 1 in the recess 20a. As described above, the light receiving component 6 is arranged so as to straddle the recess 20a. The light emitting element 1 is formed by using a silver paste
A is die-bonded to the bottom of a. The light receiving component 6 is connected to the circuit board 20 via the bump 22 by flip chip bonding. That is, the light receiving component 6
And the circuit board 20 are connected without using wire bonding. Further, a space including the inside of the recess 20a where the light emitting element 1 and the light receiving component 6 face each other is filled with a coupling member 13 made of a light transmitting resin. Then, at least a part of the light receiving component 6 and the wire 9 are covered with an underfill member 15 using an epoxy resin or the like, so that the light receiving component 6
In addition, the wire 9 is sealed and fixed. The other configuration is the same as that of the first embodiment, and the switch elements 3a and 3b mounted on the back surface of the circuit board 20 are connected to the circuit board 20 by the wires 9 inserted through the wire insertion holes 21 formed in the circuit board 20. Wire-bonded to the wiring pattern on the surface.

In the present embodiment, the recess 20 is formed in the circuit board 20.
Since a is formed, if the thickness of the circuit board 20 is the same as in the first embodiment, the thickness dimension can be further reduced than in the first embodiment. If a reflector is provided on the inner peripheral surface of the recess 20a or the inner peripheral surface is plated, the amount of light condensed from the light emitting element 1 can be further increased.
The utilization efficiency of light emitted from the light emitting element 1 can be further increased.

(Embodiment 3) In this embodiment, as shown in FIG. 4, the light emitting element 1 is mounted on the light receiving component 6 as a build-up element and is integrated with the light receiving component 6.
As shown in FIG. 5, on the upper surface of the light receiving component 6, light receiving sections 6a, 6a of a light receiving element formed of a photodiode array or a solar cell array, and a light emitting element 1 formed of a light emitting diode between both light receiving sections 6a, 6b. Bonding pad 6
b, 6b and electrodes 6c, 6c, 6d, 6d at four corners. Also, electrodes 6d, 6d formed at both corners on one side are connected to bonding pads 6b, 6b by conductive patterns, respectively. Thus, the light emitting element 1 is laminated on the upper surface of the light receiving component 6 so as to straddle both bonding pads 6b, 6b, and the electrodes 1a, 1a of the light emitting element 1 are formed using a conductive adhesive such as silver paste 14. Are respectively die-bonded to the bonding pads 6b, 6b, and the electrodes 1a, 1a of the light emitting element 1 are connected to the respective electrodes 6d, 6d from the bonding pads 6b, 6b via conductive patterns.
Is electrically connected to Such a light-emitting element 1 and the light-receiving component 6 that are stacked and integrally connected are called a build-up element.

The light-receiving component 6 'as a build-up element constructed as described above is die-bonded to the surface of the circuit board 20 with a silver paste as shown in FIG. 6 'each electrode 6
The wires c, 6c, 6d, and 6d are wire-bonded by wires 7 and are electrically connected. Further, on the surface of the circuit board 20, the light receiving component 6 'and the wires 7, 9 and the like are sealed by a coupling member 13 made of a transparent resin, and the light emitting element 1 and the light receiving portion 6a of the light receiving component 6' are sealed by the coupling member 13. 6a and the coupling member 1
The transmission efficiency of the light emitted from the light emitting element 1 to the light receiving portions 6a, 6a due to the reflection at the interface of No. 3 can be increased.

With the components arranged and electrically connected as described above, and the light emitting element 1 and the light receiving portions 6a, 6a optically coupled by the coupling member 13, the underfill member 15 using an epoxy resin or the like is used to couple the coupling member. 13, the light receiving component 6 'and the wires 7,
9 is sealed and fixed. The other configuration is the same as that of the first embodiment, and the switch element 3 mounted on the back surface of the circuit board 20
a, 3b are wire insertion holes 2 formed in the circuit board 20;
The wire 9 is wire-bonded to the wiring pattern on the surface of the circuit board 20 by the wires 9 inserted into the wire.

As described above, in the present embodiment, the light emitting element 1
And the light receiving part 6 are integrated as a build-up element, so that the light emitting element 1 and the light receiving portions 6a, 6a of the light receiving part 6 are integrated.
And the accuracy of the alignment is increased. Moreover, Embodiment 1
The light emitting element 1 and the light receiving component 6 are provided on the surface of the circuit board 20 as shown in FIG.
Can be reduced in area as compared with the case of mounting. (Embodiment 4) In this embodiment, as shown in FIG. 6, the light emitting element 1 of the light receiving component 6 'integrated as a build-up element as described in Embodiment 3 is replaced with the circuit board 2
The light receiving component 6 ′ is housed in the recess 20 a formed at 0 and is connected to the circuit board 20 via the bump 22 by flip chip bonding. Further, the recess 20a
Is filled with a coupling member 13 made of a translucent resin, and an underfill member 15 made of an epoxy resin or the like.
By covering at least a part of the light receiving component 6 'with the wire 9, the light receiving component 6' and the wire 9 are sealed and fixed. The other configuration is the same as that of the first embodiment, and the switch elements 3a and 3b mounted on the back surface of the circuit board 20 are replaced by the wires 9 inserted through the wire insertion holes 21 formed in the circuit board 20. Wire-bonded to the wiring pattern on the surface.

In this embodiment, the light-emitting element 1 of the light-receiving component 6 'integrated as a build-up element is housed in the recess 20a formed in the circuit board 20, so that the thickness of the circuit board 20 is reduced. If it is the same as the third embodiment,
The thickness dimension can be reduced as compared with the third embodiment. If a reflector is provided on the inner peripheral surface of the recess 20a or the inner peripheral surface is plated, the amount of light condensed from the light emitting element 1 can be further increased, and the light emitted from the light emitting element 1 can be used. Efficiency can be further increased.

In each of the above-described embodiments, a structure corresponding to the circuit configuration shown in FIG. 7 has been described. However, as described above, only one switch element for output is provided for DC. You may.

[0027]

According to the first aspect of the present invention, there is provided a semiconductor relay in which a switching element is turned on / off by an output of a light receiving element optically coupled to a light emitting element, wherein the semiconductor element has a wiring pattern formed on the surface thereof. The light emitting element and the light receiving component are mounted and electrically connected to the respective wiring patterns, the switch element is mounted on the back surface of the circuit board, and the switch element is mounted on the circuit board surface through a wire insertion hole formed in the circuit board. And electrically connected to said wiring pattern by wire bonding.
In the invention, the light emitting element and the light receiving component are electrically connected to the wiring pattern on the circuit board surface by wire bonding, and the light emitting element and the light receiving component are optically coupled by a resin having a light transmitting property. Since the wire exposed on the circuit board surface through the light emitting element and the light receiving component and the wire insertion hole is formed by resin sealing,
Since parts are placed on both sides of one circuit board, 2
As compared with the case where a single lead frame is used, there is an effect that the thickness can be reduced and the area can be reduced as compared with the conventional configuration in which the leads for surface mounting are provided. In addition, since the switch element is wire-bonded through the wire insertion hole drilled in the circuit board, the area can be reduced compared to the case where the switch element is mounted together with the light-emitting element and light-receiving component on the surface of the circuit board. become,
Furthermore, by not using a lead frame,
This has the effect of reducing the occurrence of defective products due to the bending of the lead frame and improving the yield.

According to a third aspect of the present invention, a light emitting element is mounted in a recess provided on the surface of the circuit board, is electrically connected to the wiring pattern, and the light receiving component is flip-chip so as to face the light emitting element. While being electrically connected to the wiring pattern by bonding, a space where the light emitting element and the light receiving component face each other is filled with a translucent coupling member, and is exposed on the surface of the circuit board through at least the wire insertion hole. Since the wires are sealed with resin, in addition to the effect of the first aspect of the present invention, there is an effect that the light emitting element is mounted in the recess of the circuit board so that the thickness can be further reduced.

According to a fourth aspect of the present invention, the light emitting element is mounted on the light receiving component as a build-up element and integrated with the light receiving component, and the light receiving component is electrically connected to the wiring pattern by wire bonding. The integrated light emitting element and the light receiving component are optically coupled with a resin having a light transmitting property, and the wire exposed at least on the circuit board surface through the light receiving component and the wire insertion hole is resin-sealed. Therefore, in addition to the effect of the first aspect, since the light emitting element and the light receiving component are integrated as a build-up element, there is an effect that the accuracy of alignment between the light emitting element and the light receiving component is increased.

According to a fifth aspect of the present invention, the light emitting element is mounted on the light receiving component as a build-up element, is integrated with the light receiving component, and the projecting portion of the build-up element is provided in a recess provided on the surface of the circuit board. The light-receiving element is electrically connected to the wiring pattern by flip-chip bonding so as to house at least a part thereof. As a result, the alignment accuracy between the light emitting element and the light receiving component is increased, and at least a part of the projecting portion of the build-up element is housed in a recess provided on the surface of the circuit board. From that
There is an effect that the thickness can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing Embodiment 1 of the present invention.

FIG. 2 is a sectional view showing a main part of the above.

FIG. 3 is a sectional view showing Embodiment 2 of the present invention.

FIG. 4 is a sectional view showing Embodiment 3 of the present invention.

5A and 5B show a build-up device in which a light-emitting device and a light-receiving component are stacked, and FIG. 5A is an exploded perspective view and FIG.
Is a perspective view.

FIG. 6 is a sectional view showing a fourth embodiment of the present invention.

FIG. 7 is a circuit diagram showing a conventional example.

FIG. 8 is a sectional view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Light emitting element 3a, 3b switch element 6 Light receiving component 8 Dummy bump 9 Wire 20 Circuit board 21 Wire insertion hole

Claims (5)

[Claims] 1. A semiconductor relay in which a switch element is turned on and off by an output of a light receiving element optically coupled to a light emitting element, wherein the light emitting element and the light receiving element are provided on a surface of a circuit board having a wiring pattern formed on the surface. The switch element is mounted on the back surface of the circuit board while being electrically connected to the wiring pattern, and the switch element is wire-bonded to the wiring pattern on the surface of the circuit board through a wire insertion hole formed in the circuit board. A semiconductor relay characterized by being electrically connected by: 2. The light emitting element and the light receiving component are electrically connected to the wiring pattern on the surface of the circuit board by wire bonding, and the light emitting element and the light receiving component are optically coupled by a resin having a light transmitting property. 2. The semiconductor relay according to claim 1, wherein at least the wire exposed on the circuit board surface through the light emitting element, the light receiving component, and the wire insertion hole is resin-sealed. 3. A light emitting element is mounted in a recess provided on a surface of the circuit board and is electrically connected to the wiring pattern, and the light receiving component is flip-chip bonded to the light receiving component so as to face the light emitting element. And a space where the light emitting element and the light receiving component face each other is filled with a light-transmitting coupling member, and at least the wire exposed through the wire insertion hole to the circuit board surface is sealed with a resin. The semiconductor relay according to claim 1, wherein the semiconductor relay is stopped. 4. The light-emitting device is mounted on a light-receiving component as a build-up device and is integrated with the light-receiving component, and the light-receiving component is electrically connected to the wiring pattern by wire bonding and integrated. The light emitting element and the light receiving component are optically coupled by a resin having a light transmitting property, and at least the wire exposed on the circuit board surface through the light receiving component and the wire insertion hole is resin-sealed. The semiconductor relay according to claim 1. 5. The light-emitting element is mounted on a light-receiving component as a build-up element, is integrated with the light-receiving component, and accommodates at least a part of a protruding portion of the build-up element in a recess provided on a surface of the circuit board. 2. The semiconductor relay according to claim 1, wherein the light receiving component is electrically connected to the wiring pattern by flip chip bonding.