JPH11274249A - Laser marking equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent fragments from sticking again on a semiconductor substrate and maintain the surface of the semiconductor substrate in a clean state, by perpendicularly fixing and holding the semiconductor substrate to a laser beam, forming an air flow in parallel to the semiconductor substrate, and forcedly discharging the fragments scattered from the semiconductor substrate with the air flow. SOLUTION: A semiconductor substrate 2 is perpendicularly set to a laser beam 4, and air flow 9 is formed parallel with a laser irradiation surface of the semiconductor substrate 2 fixed and held with a substrate retaining part 7. Consequently, when fragments 2b generated from the semiconductor substrate 2 flies in the vicinity of the laser irradiation surface of the semiconductor substrate 2, the fragments 2b are removed from the semiconductor substrate 2 by the air flow 9 and forcedly sucked and discharged to an air sucking port 8b. As a result the fragments 2b of the semiconductor substrate 2 which flies in the vicinity of the laser irradiation surface of the semiconductor substrate 2 do not stick on the semiconductor substrate 2 again, contamination to the semiconductor substrate 2 which is to be caused by the splinters 2b is perfectly prevented, and the surface of the semiconductor substrate 2 can be kept clean.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser marking apparatus for marking a semiconductor substrate with a laser beam.

[0002]

2. Description of the Related Art Conventionally, in the field of manufacturing semiconductor devices,
The semiconductor substrate is irradiated with laser light, and a part of the semiconductor substrate is melted for marking.

Conventionally, various types of laser marking devices have been used to perform this marking.

The technique disclosed in Japanese Patent Application Laid-Open No. 8-330196 discloses a technique in which a semiconductor substrate 2 is set horizontally on a stage 1 and a marking portion of the semiconductor substrate 2 is shielded by a shielding plate 3 as shown in FIGS. The laser light 4 is applied to the surface of the semiconductor substrate 2 separated by the shielding plate 3 for marking.

In the technique disclosed in Japanese Patent Application Laid-Open No. 8-330196, as shown in FIG. 5, a jig 6 for cutting off a laser marking area in the form of a duct is attached to a marking location on a semiconductor substrate 2 and an upper part of the jig 6 is provided. The laser beam 4 is introduced from the opening 6a, and the gas is exhausted from the lateral exhaust port 6b.

In the technique disclosed in Japanese Patent Laid-Open No. 5-104265, as shown in FIG. 6, an oxidizing gas 5 is blown onto a marking portion 2a of a semiconductor substrate 2 and irradiated with a laser beam 4 to partially melt the substrate. Then, the surface of the scattered substrate fragments 2b is oxidized by the oxidizing gas 5 so as to reduce the adhesive force when the substrate fragments 2b fall onto the substrate 1.

[0007]

However, the conventional example shown in FIG. 3 has a problem that the melted and scattered fragments are reattached to the area isolated by the shielding plate 3 and become contaminated.

In the conventional example shown in FIG. 5, there is a problem that the irradiation position of the laser beam and the position accuracy of the exhaust port are required, and the working efficiency is reduced.

In the conventional example shown in FIG.
When the oxide oxidized by the metal adheres to the substrate, the oxide needs to be removed by etching.

It is an object of the present invention to provide a laser marking device which completely prevents fragments generated by laser beam irradiation from re-adhering to a substrate and contaminating.

[0011]

In order to achieve the above object, a laser type marking apparatus according to the present invention has a substrate holding section and an air section, irradiates a semiconductor substrate with laser light, Is a laser marking apparatus for applying a marking by melting the semiconductor substrate, wherein the substrate holding unit is for fixing and holding the semiconductor substrate perpendicular to the laser beam, and the air unit is the fixed semiconductor substrate The air flow is formed in parallel to the laser light irradiation surface of the above.

The air portion has an air ejection port and an air suction port, and the air ejection port is disposed on the upper side of the semiconductor substrate, and injects air to a laser light irradiation surface of the semiconductor substrate. The air flow is formed in parallel, and the air suction port is disposed below the semiconductor substrate and forcibly sucks an air flow parallel to the laser light irradiation surface of the semiconductor substrate.

Further, the substrate holding section supports the orientation flat of the semiconductor substrate and vertically fixes and holds the substrate.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a configuration diagram showing a laser marking device according to an embodiment of the present invention, and FIG. 2 is a configuration diagram showing a substrate holding section.

The present inventor technically studied a mechanism of irradiating a semiconductor substrate with a laser beam and causing fragments generated by the melting thereof to adhere to the semiconductor substrate again. From the results, it was found that the state in which the fragments were floating on the semiconductor substrate was not avoided, so that reattachment had occurred. In the present invention, the fragments floating on the semiconductor substrate were forcibly removed. Things.

That is, the laser marking device according to the embodiment of the present invention has the substrate holding unit 7 and the air unit 8.

The substrate holding unit 7 is adapted to fix and hold the semiconductor substrate 2 perpendicular to the laser beam 4. More specifically, as shown in FIG. 2, the substrate holding portion 7 supports the orientation flat 2c in which a part of the peripheral edge of the substrate 2 is cut linearly by a flat surface 7b of a support rod 7a, and forms an arc-shaped rising edge 2d of the orientation flat 2c.
Of the support rod 7a is applied to the semiconductor substrate 2
Is fixedly held.

The air section 8 forms an air flow 9 parallel to the laser beam irradiation surface 2e of the substrate 2 fixed and held by the substrate holding section 7. Specifically, as shown in FIG. 1, the air section 8 has an air ejection port 8a and an air suction port 8b. As shown in FIG. 1, the air ejection port 8a is disposed on the upper side of the semiconductor substrate 2 and forcibly ejects air in parallel with the laser irradiation surface 2e of the semiconductor substrate 2 to form the laser irradiation surface 2e of the semiconductor substrate 2. An air flow 9 is formed in parallel with the air flow. Further, as shown in FIG. 1, the air suction port 8b is disposed below the semiconductor substrate 2 and forcibly exhausts an air flow 9 parallel to the semiconductor substrate 2, and
The fragments 2b scattered from the air are exhausted by the air flow 9.

As shown in FIG. 1, a laser beam 4 output from a laser output unit (not shown) through an optical system reaches a mirror group via a reflection mirror and is condensed. The light is irradiated onto the light irradiation surface 2e.

When the semiconductor substrate 2 is irradiated with the laser beam 4,
A part of the substrate on the laser beam irradiation surface 2e is melted, and fragments (Si) 2b are scattered from the semiconductor substrate (Si) 2.

The splash of the scattered fragments 2b is applied to the semiconductor substrate 2
In the vicinity of the laser beam irradiation surface 2e.

According to the embodiment of the present invention, the semiconductor substrate 2
Are set perpendicular to the laser beam 4 and form the air flow 9 in parallel to the laser beam irradiation surface 2e of the semiconductor substrate 2 fixed and held by the substrate holding section 7, so that the semiconductor substrate 2 The debris 2b generated from is separated from the semiconductor substrate 2 by the air flow 9 while floating near the laser beam irradiation surface 2e of the semiconductor substrate 2 and is forcibly sucked and discharged to the air suction port 8b.

Therefore, according to the embodiment of the present invention, the fragments 2 b of the semiconductor substrate 2 floating near the laser beam irradiation surface 2 e of the semiconductor substrate 2 do not adhere to the semiconductor substrate 2 again, and Forcibly ejected, debris 2b
Can be completely prevented from re-adhering to the semiconductor substrate 2 and contamination.

[0025]

As described above, according to the present invention, the semiconductor substrate is fixed and held vertically to the laser beam, and an air flow parallel to the semiconductor substrate is formed, so that the debris scattered from the semiconductor substrate is removed by the air. Because it is forcibly exhausted by the flow,
The fragments can be prevented from re-adhering to the semiconductor substrate, so that the surface of the semiconductor substrate can be kept clean.

The substrate holding portion supports the orientation flat of the semiconductor substrate and holds the substrate vertically, so that the semiconductor substrate can be held vertically to the laser light. Since the particles flow in parallel with the substrate, debris from the semiconductor substrate can be reliably captured without re-adhering to the semiconductor substrate.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a laser marking device according to an embodiment of the present invention.

FIG. 2 is a configuration diagram showing a substrate holding unit used in the laser marking device according to the embodiment of the present invention.

FIG. 3 is a configuration diagram showing a conventional example.

FIG. 4 is a plan view showing the conventional example shown in FIG.

FIG. 5 is a configuration diagram showing a modification of the conventional example shown in FIG. 3;

FIG. 6 is a configuration diagram showing another conventional example.

[Explanation of symbols]

 Reference Signs List 2 semiconductor substrate 2b fragment from semiconductor substrate 2c orientation flat of semiconductor substrate 2e laser irradiation surface of semiconductor substrate 7 substrate holding unit 8 air unit 8a air jet port 8b air suction port

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[Procedure amendment]

[Submission date] February 22, 1999

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction contents]

[0011]

In order to achieve the above object, a laser marking apparatus according to the present invention is provided with a diffusion manufacturing method.
A laser marking device that irradiates a semiconductor substrate with a laser beam during a process, melts a part of the substrate, and applies a marking to the semiconductor substrate.
And a laser for irradiating the semiconductor substrate with a laser beam vertically
An output unit, disposed at a vertical upper direction end of the semiconductor substrate;
Irradiating the semiconductor substrate with laser light
An air outlet for forming an air flow parallel to the surface;
The semiconductor disposed at a vertical lower end of the conductive substrate;
Forced suction of air flow parallel to laser beam irradiation surface of substrate
And an air suction port .

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction contents]

Further, the substrate holding portion is provided on the semiconductor substrate.
Supports the orientation flat and vertically holds and holds the semiconductor substrate
Things.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Deleted

Claims (3)

[Claims] 1. A laser marking device having a substrate holding part and an air part, irradiating a semiconductor substrate with a laser beam, and melting a part of the substrate to apply a marking, wherein the substrate holding part is The semiconductor substrate is fixedly held perpendicular to the laser light, and the air portion is configured to form an air flow parallel to the laser light irradiation surface of the fixed semiconductor substrate. Laser marking device. 2. The air part has an air outlet and an air suction port, and the air outlet is disposed on an upper side of the semiconductor substrate, and emits air to irradiate a laser beam on the semiconductor substrate. The air suction port is arranged below the semiconductor substrate, and forcibly sucks an air flow parallel to the laser light irradiation surface of the semiconductor substrate. The laser marking device according to claim 1, wherein: 3. The laser marking apparatus according to claim 1, wherein the substrate holding section supports an orientation flat of the semiconductor substrate and vertically fixes and holds the substrate.