JPH11274232A - Semiconductor chip and tape carrier package provided therewith - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor chip and a tape carrier package(TCP), with which a display device can be miniaturized. SOLUTION: Plural electrodes A-C and Y of a semiconductor chip 10 are arranged in line in an area 17 extended in lengthwise direction along with a long side. Thus, it is enough for the semiconductor chip 10 to provide only one area for providing the electrodes A-C and Y in breadthwise direction vertical to the long side and a dimension L1 in the breadthwise direction can be reduced. Thus, the TCP for loading this semiconductor chip 10 can be miniaturized and the display device for further mounting the TCP can be miniaturized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a semiconductor chip for driving a display panel mounted on a display device such as a liquid crystal display device used for a computer and a word processor and a tape carrier package having the semiconductor chip mounted thereon.

[0002]

2. Description of the Related Art A tape base on which wiring is formed on one surface side, and a semiconductor chip mounted on the other surface side of the tape base and having electrodes electrically connected to the wiring, are provided. The tape base has a structure extending from one end to the other end on the opposite side, and has a connection portion in which an intermediate wiring portion is electrically connected to the electrode, and whether or not the semiconductor chip is a non-defective product An invention relating to a tape carrier package (hereinafter, may be abbreviated as "TCP") that can compensate for such a problem has been filed by the present applicant as a patent application as Japanese Patent Application No. 8-320174. In the present invention, TCP
The upper wiring, the wiring in the semiconductor chip, and the wiring on the glass substrate are electrically connected to each other using an anisotropic conductive film, so that the function of the multilayer wiring that the conventional printed circuit board has can be substituted. In addition, it is possible to transmit and receive an input signal and a power supply with low wiring resistance without using a continuous large external substrate such as a flexible wiring board or a printed circuit board.

FIG. 24 is a front view showing such a TCP1. The TCP 1 has a semiconductor chip 2 on a tape base 3.
Is implemented and configured. The semiconductor chip 2 is a liquid crystal driver for driving and controlling a liquid crystal panel, and includes a power supply electrode 4a to which power is supplied and a control unit (not shown) or another TC.
An input electrode 4b for inputting an input signal (for example, an image signal and a control signal as input signals and a start pulse, a latch pulse, a clock, etc. as control signals) including an image to be displayed; And a drive electrode 4d for outputting a drive signal for driving and controlling the liquid crystal panel based on the input signal to the display panel. Are formed with lead wires 5a-5d electrically connected to the electrodes 4a-4d, respectively, and are electrically connected to ITO wires on the glass substrate.

A power supply to the semiconductor chip 2 is supplied from a control board or another TCP to ITO (Indium Tin Ox) on a glass substrate.
ide) Power is supplied from one longitudinal end 6 side of each lead wiring 5a via a wiring, and this power is supplied to the other longitudinal end 7
It is supplied from the side to another TCP via ITO wiring on the glass substrate. Similarly, the image signal to the semiconductor chip 2 is
The input signal is supplied from the control substrate or another TCP via each of the lead wirings 5b via the ITO wiring on the glass substrate, and this input signal is transmitted from each of the lead wirings 5c via the aluminum wiring in the semiconductor chip 2 to the glass. It is supplied to another TCP via the ITO wiring on the substrate. The semiconductor chip 2
A drive signal for driving the liquid crystal panel is output from each lead wiring 5d to the liquid crystal panel via the ITO wiring on the glass substrate based on the input signal input. Such a semiconductor chip 2 is mounted on a liquid crystal panel and plays an important factor as a peripheral component for driving the liquid crystal panel.

[0005]

In recent years, the wave of a new information society in which the communication information network has expanded has been rapidly rushing in,
Accordingly, portable information terminal devices with higher portability have been demanded. For example, even if a notebook-type personal computer device is taken as an example, thinner and lighter personal computers are required. In contrast, the length, width, and thickness dimensions are
At present, improvements have been made to reduce the size on the order of 1.5 to 1 mm. In order to reduce the size in this way, there is a strong demand for a semiconductor chip 2 for driving a liquid crystal panel, which is also high-density mounting capable of responding to a reduction in size, thickness, and narrowing of a frame of a liquid crystal display device.

However, in the prior art described above, the power supply electrode 4a is formed on one side along the long side of the circuit element 8 of the semiconductor chip 2, that is, on one side in the width direction, and the long side of the circuit element 8 is formed. The drive electrode 4d is formed on the other side in the width direction, that is, the other side in the width direction, and the input electrode 4b and the output electrode 4c are formed on both sides in the width direction. The circuit is arranged so that the lead wires 5a to 5d on the TCP are drawn from the electrodes 4a to 4d arranged as described above. When the electrodes 4a to 4d are formed on both sides in the width direction as described above, the region 4 for forming two electrodes in the width direction is formed.
A and 4B must be provided, which increases the size of the semiconductor chip 2 in the width direction. As a result, the external dimensions of the TCP in the width direction increase, and the frame of the liquid crystal module becomes large.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a semiconductor chip capable of reducing the width dimension and a tape carrier package using the same.

[0008]

According to a first aspect of the present invention, there is provided a rectangular semiconductor chip having a circuit element.
At least, an input electrode for inputting a signal, a drive electrode for driving the display panel, and a plurality of electrodes having a power supply electrode for obtaining power, each of these electrodes,
A semiconductor chip characterized by being formed in a line in the longitudinal direction.

According to the present invention, the plurality of electrodes of the semiconductor chip are arranged in a line in a region extending in the longitudinal direction along the long side. As a result, only one region for providing electrodes on the semiconductor chip needs to be provided in the width direction perpendicular to the long side, and the size in the width direction can be reduced. Further, since only one electrode is formed in the width direction, a lead wire electrically connected to each electrode can be drawn out in any direction in the width direction without interference with other electrodes. In addition, the degree of freedom in designing each lead wiring can be increased.

According to a second aspect of the present invention, in a rectangular semiconductor chip having a circuit element, at least an input electrode for inputting a signal, an output electrode for outputting the signal, and a display panel are driven. A drive electrode for
A semiconductor chip having a plurality of electrodes having a power supply electrode for obtaining a power supply, and the electrodes being arranged in a line in a longitudinal direction.

According to the present invention, the plurality of electrodes of the semiconductor chip are arranged in a line in a region extending in the longitudinal direction along the long side. As a result, only one region for providing electrodes on the semiconductor chip needs to be provided in the width direction perpendicular to the long side, and the size in the width direction can be reduced. Further, since only one electrode is formed in the width direction, a lead wire electrically connected to each electrode can be drawn out in any direction in the width direction without interference with other electrodes. In addition, the degree of freedom in designing each lead wiring can be increased.

According to a third aspect of the present invention, in a rectangular semiconductor chip having circuit elements, at least an input electrode for inputting a signal, a drive electrode for driving a display panel, and a power supply are provided. And a plurality of electrodes each having a power supply electrode, and the electrodes are arranged in a staggered manner in the longitudinal direction.

According to the present invention, the plurality of electrodes of the semiconductor chip are arranged in a staggered manner in a region extending in the longitudinal direction along the long side. As a result, only one region for providing electrodes on the semiconductor chip needs to be provided in the width direction perpendicular to the long side, and the size in the width direction can be reduced. Further, by arranging the electrodes in a staggered manner, the electrodes adjacent in the longitudinal direction are shifted in the width direction, whereby mutual electrical insulation can be obtained, and the arrangement interval in the longitudinal direction can be reduced. . Therefore, the dimension in the longitudinal direction can be reduced. Further, since only one electrode is formed in the width direction, a lead wire electrically connected to each electrode can be drawn out in any direction in the width direction without interference with other electrodes. In addition, the degree of freedom in designing each lead wiring can be increased.

According to a fourth aspect of the present invention, in a rectangular semiconductor chip having circuit elements, at least an input electrode for inputting a signal, an output electrode for outputting the signal, and a display panel are driven. A drive electrode for
A semiconductor chip having a plurality of electrodes having a power supply electrode for obtaining a power supply, and the electrodes are arranged in a staggered manner in a longitudinal direction.

According to the present invention, the plurality of electrodes of the semiconductor chip are arranged in a staggered manner in a region extending in the longitudinal direction along the long side. As a result, only one region for providing electrodes on the semiconductor chip needs to be provided in the width direction perpendicular to the long side, and the size in the width direction can be reduced. Further, by arranging the electrodes in a staggered manner, the electrodes adjacent in the longitudinal direction are shifted in the width direction, whereby mutual electrical insulation can be obtained, and the arrangement interval in the longitudinal direction can be reduced. . Therefore, the dimension in the longitudinal direction can be reduced. Further, since only one electrode is formed in the width direction, a lead wire electrically connected to each electrode can be drawn out in any direction in the width direction without interference with other electrodes. In addition, the degree of freedom in designing each lead wiring can be increased.

According to a fifth aspect of the present invention, in the configuration according to any one of the first to fourth aspects, each of the electrodes is
It is characterized in that it is formed on a peripheral portion on one side in the width direction perpendicular to the longitudinal direction.

According to the present invention, since each electrode is formed on the peripheral part on one side in the width direction, a wide area can be formed on the other side in the width direction of the area where these electrodes are formed. This region can be effectively used as a region for forming lead wiring when a semiconductor chip is mounted on a tape carrier package or the like, for example.

According to a sixth aspect of the present invention, in the configuration of the first aspect of the invention, each of the electrodes is
It is characterized in that it is formed at an intermediate portion in the width direction perpendicular to the longitudinal direction.

According to the present invention, since each electrode is formed at the intermediate portion in the width direction, regions can be formed on both sides in the width direction of the region where these electrodes are provided, and can be used properly.
Each area can be effectively used as an area for forming a lead wiring when mounted on, for example, a TCP.

According to a seventh aspect of the present invention, in the configuration of the first aspect of the invention, each of the electrodes is
It is characterized in that it is formed in a region other than the region where the circuit element is provided.

According to the present invention, since each electrode is formed in a region other than the region where the circuit element is provided, when each electrode is electrically connected to the wiring, the electrode is connected to the circuit element in a connecting step. The accompanying external force and heat are less likely to act, and circuit elements are less likely to be damaged. Therefore, no consideration is required for preventing damage, and the connection process is easy.

According to the present invention as set forth in claim 8, in the configuration of the invention as set forth in any of claims 1 to 6, each of the electrodes is
It is formed in a region where a circuit element is provided.

According to the present invention, since each electrode is formed in a region where a circuit element is provided, there is no need to provide a region in which an electrode is formed separately from a region where a circuit element is provided. The dimension in the width direction can be reduced.

According to a ninth aspect of the present invention, in the configuration according to any one of the first to eighth aspects, each of the electrodes is
The remaining electrodes are arranged outside the driving electrodes.

According to the present invention, since the remaining electrodes are arranged outside the driving electrodes, it is easy to arrange the lead wires electrically connected to the electrodes so as not to cross each other. is there. More specifically, since the semiconductor chip is arranged on the side of the display panel so as to face the width direction, the lead wires electrically connected to each electrode indicate the lead wires electrically connected to the drive electrodes. By extending toward the panel and extending the lead wires electrically connected to the remaining electrodes in the longitudinal direction, it is possible to electrically connect to the control board and other semiconductor chips. Therefore, the lead wiring can be easily provided without extending the lead wiring over a wide area and so that the lead wirings do not cross each other.

The present invention described in claim 10 is the invention according to claims 1 to 9
A tape carrier package on which the semiconductor chip described in any one of the above is mounted.

According to the present invention, since the semiconductor chip according to any one of claims 1 to 7 is mounted, the width of the tape carrier package in the width direction can be reduced. When arranging on the side of the display panel, the arrangement space is small,
In a display device having such a tape carrier package and a display panel, a region outside a display panel, that is, a width of a frame is reduced, so that the display device can be downsized. Therefore, portability of a device including the display device can be improved.

According to an eleventh aspect of the present invention, in the configuration of the tenth aspect of the present invention, the terminals of the lead wires electrically connected to the input electrode and the power supply electrode are respectively formed on the peripheral edges on both sides in the longitudinal direction. The terminals are arranged so that their positions are alternately shifted in a width direction perpendicular to the longitudinal direction at one peripheral edge and the other peripheral edge in the longitudinal direction.

According to the present invention, since the terminals of the lead wiring electrically connected to the input electrode and the power supply electrode are formed on the both peripheral edges of the tape carrier package in the longitudinal direction, they are formed on each peripheral edge. The number of terminals can be reduced. In addition, since the terminals on each peripheral portion are formed so as to be alternately shifted, the distance between adjacent terminals of each terminal formed on each side can be increased. Therefore, the permissible amount of displacement between each terminal and the wiring of the other substrate is increased, connection is facilitated, and the width of the tape carrier package can be reduced.

According to a twelfth aspect of the present invention, in the configuration of the tenth aspect, a peripheral portion on one side in the longitudinal direction is provided.
A terminal of a lead wiring electrically connected to the input electrode and the power supply electrode is formed.

According to the present invention, the terminal of the lead wiring connected to the input electrode and the power supply electrode is formed on one peripheral edge in the longitudinal direction. Therefore, there is only one connection region with wiring provided on another substrate or the like, and the connection process is easy.

According to a thirteenth aspect of the present invention, in the configuration according to the tenth aspect, the semiconductor chip has an output electrode for outputting a signal, and the input electrode is provided on a peripheral portion on one side in the longitudinal direction. And a lead wire terminal electrically connected to the output electrode is formed at a peripheral edge on the other side in the longitudinal direction.

According to the present invention, the semiconductor chip has an output electrode and outputs an image signal representing display contents from the control board.
Input can be made from an input electrode and output from an output electrode via a wiring in a semiconductor chip. Thus, when a plurality of semiconductor chips are used, the semiconductor chips can be used as a part of a wiring for guiding an image signal from the control board. Therefore, it is not necessary to connect the semiconductor chip to a common wiring extending long from the control board, and it is not necessary to use a long wiring. As the wiring, a wiring having a high resistance such as an ITO wiring is frequently used in the display device. Therefore, by shortening the wiring, the wiring resistance can be reduced.

According to a fourteenth aspect of the present invention, in the configuration of the tenth aspect, each electrode is electrically connected to a wiring formed on one glass substrate of the display panel. And

According to the present invention, since each electrode is electrically connected to the wiring formed on one glass substrate of the display panel, the terminal of the lead wiring electrically connected to each electrode is once provided. In the connection step, the connection step can be reduced as compared with the case where a substrate different from one glass substrate of the display panel is used.

According to a fifteenth aspect of the present invention, in the configuration of the tenth aspect, the driving electrode is electrically connected to a wiring formed on one glass substrate of the display panel,
The remaining electrodes are electrically connected to wiring formed on a printed wiring board provided separately from the one glass substrate of the display panel.

According to the present invention, the electrodes for driving the display panel and the remaining electrodes are electrically connected to separate substrates, respectively. It is possible to fold it and to arrange it so as to overlap with the display panel. Therefore, the area outside the display panel of the display device having such a tape carrier package and the display panel, that is, the width of the frame can be reduced, and the display device can be downsized.

[0038]

FIG. 1 is a front view schematically showing a semiconductor chip 10 according to an embodiment of the present invention. The semiconductor chip 10 is a liquid crystal driver for driving a liquid crystal panel 11 (see FIG. 4), has a rectangular shape, more specifically, an elongated rectangular shape, has a circuit element 12, and has one side in the thickness direction. Are formed with a large number of electrode pads A, B, C and Y. Each electrode pad A
C, Y are arranged in a line along the longitudinal direction (the left-right direction in FIG. 1) along the long side of the semiconductor chip 10, and have one peripheral circuit in the width direction along the short side perpendicular to the longitudinal direction. It is provided in the remaining electrode arrangement region 17 excluding the circuit element region 15 where the element 12 is provided.

Each of the electrode pads A to C and Y includes an input electrode A for inputting a signal, an output electrode B for outputting a signal, a power supply electrode C for obtaining power, and a liquid crystal panel 11.
And a drive electrode Y for driving Each electrode A
In the columns C to Y, 240 drive electrodes Y
1 to Y240 (collectively referred to as “Y”) are arranged, and six electrodes are arranged on both sides of the row of the drive electrodes Y.
Two power supply electrodes C1 to C6 and C7 to C12 (referred to as C when collectively referred to) are arranged, and 16 input electrodes A1 to A16 (to one side of the row of the drive electrode Y and the power supply electrode C). A is arranged when generically referred to), and 1 is provided on the other side of the row of the drive electrode Y and the power supply electrode C.
Six output electrodes B1 to B16 (referred to as B when collectively referred to) are arranged. Each of the electrodes A to C and Y is formed by forming a gold bump by plating. The height and the width and height of the gold bump vary depending on the pitch, but as an example, the height and width of the bump are 4 mm.
The height of the bump is selected to be about 10 to 20 μm, and each of the electrode pads A to C and Y is about 70 μm.
Are arranged at the same pitch.

FIG. 2 is a front view showing a configuration example of the circuit element 12. The circuit element 12 has a plurality of circuit cells, and has a drive control area, an input area, an output area, a power supply area, and a control area. The drive control area includes a driver buffer unit 20 for driving the liquid crystal panel 11 output from each drive electrode Y, and a buffer control circuit for controlling each driver buffer unit 20 and controlling the output of a drive signal to the display panel 11. Unit 21, a latch circuit unit 23 for holding data, and a driving ESD (Eletronic S) for protecting a circuit 20 for outputting a driving signal.
system design) protection elements 22 corresponding to the number of each drive electrode Y.

The input area includes an input buffer circuit section 25 for cutting and shaping the input signal input from the input electrode A, and an input ESD protection element 26 for protecting the input buffer circuit section 25. Each input electrode A has a corresponding number. The output area has an output buffer circuit section 27 output from the output electrode B, and an output ESD protection element 28 for protecting the output buffer circuit section 27, corresponding to each output electrode B and the number thereof. The electrode area is the liquid crystal panel 1
1 and two power supply wiring regions 30a and 30b for guiding a power supply for driving the power supply 1 to each circuit section in the circuit element 12.
Corresponding to the number of the power supply electrodes C, and each power supply wiring region is provided with a power supply ESD protection element for protecting the regions 30a and 30b. The control region includes a control circuit 32 that controls data represented by the input drive signal and supplies the data to the latch circuit unit 23, and is used to electrically connect the input buffer circuit unit 25 and the output buffer circuit unit 27. A wiring made of aluminum is provided.

FIG. 3 is a front view schematically showing a tape carrier package (TCP) 35 on which the semiconductor chip 10 is mounted. The TCP 35 is configured by mounting the semiconductor chip 10 on a flexible tape base material 36. The semiconductor chip 10 is mounted with the surface corresponding to the paper surface of FIGS. 1 and 2 facing one surface of the tape base 36 (the back side with respect to the paper surface of FIG. 3). A device hole 37 is formed in the tape base 36 in a region corresponding to each of the electrodes A to C and Y of the semiconductor chip 10 to be mounted. The device hole 37 is inserted through the tape base 36 in the thickness direction. Each of the electrodes A to C and Y can be viewed from the other side (the front side with respect to the plane of FIG. 3).

On the other side of the tape base, electrodes A to C
Are formed, lead wires a to c and y electrically connected to the respective lines are formed. Each of the drive lead wires y1 to y240 (collectively referred to as y) connected to each of the drive electrodes Y1 to Y240 is on the opposite side from each drive electrode Y to one side in the width direction in which each of the drive electrodes Y is provided. The terminals yy1 to yy240 (referred to collectively as yy) of the lead wires y1 to y240 are formed on the peripheral portion 38 on the other side in the width direction.

The input lead wires a1 to a16 (referred to as “a” when collectively referred to) connected to the input electrodes A1 to A16, respectively, are connected from the input electrodes A to the respective input electrodes A1 to A16.
Is extended toward a portion closer to one side in the width direction of a peripheral portion 39 on one side in the longitudinal direction of the side where the terminal is provided, and the terminals aa1 to aa16 of the lead wires a1 to a16 (referred to collectively as aa) are provided on the peripheral portion 39. ) Are formed respectively. The output lead wires b1 to b16 (referred to as b when collectively referred to) connected to the output electrodes B1 to B16, respectively, are provided on the other longitudinal side of the output electrode b on the side where the output electrodes B are provided. Each of the lead wires b extends toward a portion closer to one side in the width direction of the peripheral edge portion.
1 to b16 terminals bb1 to bb16 (b.
b) are formed.

Each of the power supply lead wires c1 to c6 (collectively referred to as c) is connected to each of the power supply electrodes C1 to C6.
) Extends from the power supply electrodes C1 to C6 toward a portion closer to the other side in the width direction of the peripheral portion 39 on one side in the longitudinal direction on the side where the power supply electrodes C1 to C6 are provided. Terminals cc1 to cc of each lead wiring c1 to c6
6 (generally referred to as cc) are formed. The power supply lead wires c7 to c12 (referred to as c when collectively referred to) connected to the power supply electrodes C7 to C12 respectively extend from the power supply electrodes C7 to C12 to the side where the power supply electrodes C7 to C12 are provided. Extending toward a portion closer to the other side in the width direction of the peripheral portion 40 on the other side in the direction,
The terminal cc of each of the lead wires c7 to c12 is
7 to cc12 (hereinafter referred to as cc when collectively referred to).

FIG. 4 is a front view showing a part of a liquid crystal display device on which the TCP 35 is mounted, and FIG. 5 is an enlarged front view showing section V of FIG. A plurality of TCPs 35 are mounted on the liquid crystal panel 11 as a source driver for driving the matrix type liquid crystal panel 11, for example.
A source signal is output to the liquid crystal panel 11, and the source signal and T
The liquid crystal panel 11 is driven by the gate signal output from the CP 39.

The TCP 35 is mounted on one glass substrate 40 of the liquid crystal panel 11, and the terminals yy of the driving lead wires y are electrically connected to bus lines (not shown) formed on the glass substrate 40. The terminals aa of the input lead wires a and the terminals cc7 to cc12 of the power supply lead wires c1 to c6 are connected to the IT 35 upstream of the TCP 35 formed on the glass substrate 40 in the signal flow direction S.
Each is electrically connected to the O wiring 42. Each terminal bb of each output lead wiring b and each power supply lead wiring c
7 to c12 are connected to the glass substrate 4
0 of the signal flow than the TCP 35 formed on
Are electrically connected to the respective ITO wirings 42 on the downstream side. Each ITO wiring 42 is formed only over a range L in which the terminals aa, c1 to c6 and the terminals bb, c7 to c12 of the adjacent TCP 35 can be electrically connected.

In such a liquid crystal display device, power and input signals from a control unit (not shown) are supplied to the TCP 35 from the terminals aa, cc1 to cc6 via the ITO wiring 42. Each TCP 35 transfers the supplied power and input signal from the terminals bb, cc7 to cc12 via the aluminum wiring of the control circuit 32 of the semiconductor chip 10 to the downstream side in the signal flow direction via the ITO wiring 42. T
Supply to CP. In this way, the power and the input signal from the control unit (not shown) are first supplied to the TCP 35 on the most upstream side in the signal flow direction S, and are sequentially supplied to the TCP 35 on the downstream side in the signal flow direction.

In each TCP 35, an input signal given from each terminal aa is applied to each input lead wire a, each input electrode A,
Is input to the input buffer circuit 25. The input signal is supplied to the control circuit 32 and also to the output buffer circuit 27. The input signal is output from each terminal bb via each output electrode B, each output lead wire b, and input to the adjacent TCP 35. . In addition, each TCP35
The latch circuit 23 fetches a part of an image signal in charge of driving from a control circuit 32 based on an image signal given as serial data, converts the part into a parallel signal, and uses this drive signal as a source signal to control a driver buffer. The signal is output to the bus line of the liquid crystal panel 11 via each drive electrode Y, each lead wire y, and each terminal yy via the circuit 21 and the driver buffer 20.

Each TCP 39 is supplied with power and an input signal from a controller (not shown) via a printed circuit board 44, and outputs a drive signal to the liquid crystal panel 11 as a gate signal based on the input signal. Thus, each TCP
The liquid crystal panel 11 is driven by the source signal and the gate signal output from 35 and 39, and an image is displayed.

The semiconductor chip 10 according to the present invention mounted on the liquid crystal panel has the electrodes A to C and Y arranged in a line so that the semiconductor chip 10 can be elongated.
The dimension D1 in the width direction can be shortened, whereby the dimension D2 in the width direction of the TCP 35 can be reduced, and when the TCP 35 is mounted on the liquid crystal display device as described above, the frame width D3 can be reduced. As a result, the size of the liquid crystal display device can be reduced. Each electrode A
By arranging C to Y in the region 17 excluding the region 15 of the circuit element 12 on one side in the width direction, it is possible to obtain a wide wiring region on the other side in the width direction and to mount on the tape base material 36. Heat and external force when the circuit element 1
2 can be hardly affected. In addition, since a signal can be sent to another TCP 35 using the wiring in the semiconductor chip 10, the ITO wiring having a high resistance value can be shortened, and low wiring resistance can be realized.

FIG. 6 is a front view schematically showing the structure of a circuit element 12α according to another embodiment of the present invention. FIG. 7 is a TC mounted with a semiconductor chip 10α having the circuit element 12α.
It is a front view which shows a part of liquid crystal panel 11 in which P35 (alpha) is mounted. Since it has a configuration similar to that of the embodiment shown in FIGS. 1 to 5, the same reference numerals are given to corresponding parts, only different configurations will be described, and description of similar configurations will be omitted. The semiconductor chip 10α has input / output electrodes A and B for inputting or outputting a drive signal, and also functions as the input buffer circuit unit 25 or the output buffer circuit unit 27 of the above-described embodiment.
And the input electrode ESD protection element 26 or the output electrode E
It has input / output electrode ESD protection elements 26 and 28 functioning as SD protection elements 28. In the embodiment described above with reference to FIGS. 1 to 5, the power supply and the image signal are input from one side in the longitudinal direction, and the other semiconductor chip 1 is input from the other side in the longitudinal direction.
0, the semiconductor chip 10α of the present embodiment may be input from either one of the longitudinal direction and the other side, and the other semiconductor chip 10α may be input from the side opposite to the input side. Is output to

That is, it is possible to select and use a configuration in which the arrangement of the input buffer circuit section 25 and the output buffer circuit section 27 in the above-described embodiment is changed. Such a selection is made outside the semiconductor chip 10α. , And the signal flow can be selected and used in one of the direction S similar to the configuration of FIGS. 1 to 5 and the opposite direction S1. It is convenient.

FIG. 8 is a front view schematically showing a semiconductor chip 10β of still another embodiment of the present invention, and FIG. 9 is a front view schematically showing a TCP 35β on which the semiconductor chip 10β is mounted. Since it has a configuration similar to that of the embodiment shown in FIGS. 1 to 5, the same reference numerals are given to corresponding parts, only different configurations will be described, and description of similar configurations will be omitted. In the above-described embodiment, each of the electrodes A to C and Y is formed in the region 17 excluding the region 15 of the circuit element 12β on the peripheral edge on one side in the width direction.
To C, Y are formed in a partial region 17β of the region 15 in which the circuit element 12β in the width direction intermediate portion is provided.

Thus, the region 15 of the circuit element 12β
It is not necessary to separately provide the regions 17β of the electrodes A to C and Y, so that the width of the semiconductor chip 10β can be further reduced. Regions can be respectively formed on both sides in the width direction of .about.C and Y, and the degree of freedom of arrangement of the lead wirings a to c and y is improved.

FIG. 10 is a front view schematically showing a TCP 35γ on which a semiconductor chip 10γ according to still another embodiment of the present invention is mounted. Since it has a configuration similar to that of the embodiment shown in FIGS. 1 to 5, the same reference numerals are given to corresponding parts, only different configurations will be described, and description of similar configurations will be omitted. In the embodiment shown in FIGS.
Although C and Y are formed in a line in the longitudinal direction, in this embodiment, each of the electrodes A to C and Y has a region 17 extending in the longitudinal direction excluding the region 15 of the circuit element 12 on one peripheral portion in the width direction. Then, it is formed in a zigzag pattern.

As a result, the electrodes A to C and Y adjacent to each other can achieve mutual electrical insulation by being shifted in the width direction, so that the electrodes A to C and Y can be arranged in a line in the longitudinal direction. Reduce the longitudinal spacing,
The length in the longitudinal direction of the semiconductor chip 10γ can be reduced.

FIG. 11 is a front view schematically showing a TCP 35δ on which a semiconductor chip 10δ according to still another embodiment of the present invention is mounted. 6, 7, and 10, the corresponding components are denoted by the same reference numerals, and only different configurations will be described. Descriptions of similar configurations will be omitted. In the embodiment shown in FIG. 10, each of the electrodes A to C and Y is provided in a region 17 extending in the longitudinal direction excluding the region 15 of the circuit element 12 at one peripheral portion in the width direction.
Although formed in a staggered manner, in the TCP 35δ of the present embodiment, the respective electrodes A to C and Y are formed in a staggered shape in the longitudinal direction at the middle portion in the width direction similarly to the embodiments of FIGS. Thereby, the effect of the embodiment shown in FIGS. 6 and 7 and the effect of the embodiment shown in FIG. 10 can be achieved simultaneously.

FIG. 12 is a front view schematically showing a semiconductor chip 110 according to still another embodiment of the present invention. The semiconductor chip 110 is the semiconductor chip 1 shown in FIGS.
Since it has a configuration similar to 0, the same components are denoted by the same reference numerals, only different configurations will be described, and description of similar configurations will be omitted. The semiconductor chip 110 is a liquid crystal driver, has an elongated rectangular shape,
A circuit element 112 is provided, and a large number of electrode pads A, C, and Y are formed on the surface on one side in the thickness direction. That is, although the semiconductor chip 10 shown in FIGS. 1 to 5 has the output electrode B, the semiconductor chip 110 of the present embodiment does not have the output electrode B. Each electrode pad A,
C and Y are arranged in a line along the longitudinal direction (the left-right direction in FIG. 12) along the long side of the semiconductor chip 10 and are the circuit elements at one peripheral portion in the width direction along the short side perpendicular to the longitudinal direction. It is provided in the remaining electrode arrangement region 17 excluding the circuit element region 15 where 112 is provided.

Each of the electrode pads A to C and Y has an input electrode A for inputting a signal and a power supply electrode C for obtaining power.
And a drive electrode Y for driving the liquid crystal panel 11. In the rows of the electrodes A, C, and Y, the drive electrodes Y1 to Y240 are disposed at the center, and the power supply electrodes C1 to C6 and C7 to C1 are provided on both sides of the row of the drive electrodes Y.
2, and a total of 16 input electrodes A1 to A8 and A9 to A16 are arranged on each side of the row of the drive electrode Y and the power supply electrode C.

FIG. 13 is a front view showing a configuration example of the circuit element 112. Circuit element 12 of the form shown in FIGS.
Has an output area, but the circuit element 112 of the present embodiment does not have an output area, but instead has another input area, and has a total of two input areas. That is, the function of the input area is distributed to two areas.

FIG. 14 is a front view schematically showing a TCP 135 on which the semiconductor chip 110 is mounted. TCP13
In 5, lead wires a, c, y electrically connected to the respective electrodes A, C are formed on the other surface side of the tape base material 36. Each of the input lead wires a1 to a8 connected to each of the input electrodes A1 to A8 has a longitudinal direction on the side where the input electrodes A1 to A8 are provided from the input electrodes A1 to A8. The terminals aa1 to aa8 of the lead wires a1 to a8 are formed on the peripheral edge portion 39 so as to extend toward one side. Further, the input lead wires a9 to a16 connected to the input electrodes A9 to A16, respectively, correspond to the peripheral edge portion 40 on the other longitudinal side of the input electrodes A9 to A16 on the side where the input electrodes A9 to A16 are provided. The terminal a of each of the lead wirings a9 to a16 extends toward a portion closer to one side in the width direction.
a9 to aa16 are formed respectively.

FIG. 15 is a schematic illustration of a TCP 13 shown in a longitudinal scale to explain the arrangement of the terminals aa and cc.
5 is a front view of FIG. Each terminal aa formed on the peripheral portion 39
1 to aa8, cc1 to cc6 and the terminals aa9 to aa16, cc7 to cc12 formed on the peripheral portion are arranged so as to be shifted from each other in the width direction. That is, in the width direction, between the terminals aa1 to aa8 and cc1 to cc6,
The terminals aa9 to aa16 and cc7 to cc12 are respectively located.

FIG. 16 is a front view showing a part of the liquid crystal display device on which the TCP 135 is mounted, and FIG. 5 is an enlarged front view showing section V of FIG. TCP 135 is
A plurality of terminals aa of each input lead wire a and each terminal cc of each power supply lead wire c are mounted on one glass substrate 40 of the liquid crystal panel 11 in an area where each TCP 135 is provided on the glass substrate 40. Extend, each TCP13
5 is electrically connected to an ITO wiring 142 formed in common. Power and input signals are individually supplied to each TCP 135 from a common ITO wiring 142.

In each TCP 35, an input signal given from each terminal aa is applied to each input lead wire a, each input electrode A,
Is input to the input buffer circuit 25. The input signal is applied to the control circuit 32. Each T
The CP 35 fetches a part of the image signal in charge of driving from the control circuit 32 by the latch circuit 23 based on the input signal given as serial data, converts it into a parallel signal, and uses this driving signal as a source signal.
Through the driver buffer control circuit 21 and the driver buffer 20, each drive electrode Y, each lead wiring y, each terminal y
Output to the bus line of the liquid crystal panel 11 via y.

The semiconductor chip 110 according to the present invention mounted on the liquid crystal panel 11 as described above also has the electrodes A, C, and Y arranged in a line in the same manner as the semiconductor chip 10 described above. It is possible to increase the length and width D11 in the width direction, thereby reducing the TC
When the dimension D12 in the width direction of P135 is reduced and the TCP 135 is mounted on the liquid crystal display device as described above, the frame width D13 can be reduced, and as a result, the size of the liquid crystal display device can be reduced. Can be. Further, by adopting a configuration in which a signal is input to each semiconductor chip 110, an output electrode becomes unnecessary, and the size of the semiconductor chip 110 can be prevented from increasing. Further, each terminal aa for inputting a signal can be distributed to each of the peripheral portions 39 and 40 on both sides in the longitudinal direction, and each of the peripheral portions 39 and 4 can be dispersed.
0 terminals can be reduced, miniaturization can be achieved, and the mutual interval in the width direction increases,
The connection process with the ITO wiring 142 is facilitated. In addition, by disposing the electrodes A, C, and Y in the region 17 excluding the region 15 of the circuit element 12 on one peripheral side in the width direction, a wide wiring region can be obtained on the other side in the width direction.
It is possible to make it difficult for heat and external force acting on the circuit element 12 to be mounted on the tape base material 36.

FIG. 17 is a plan view showing a part of a liquid crystal display device according to still another embodiment of the present invention. 12 to 1
6 has a configuration similar to that of the embodiment shown in FIG. 6, the same reference numerals are given to corresponding parts, and only different configurations will be described.
The description of the same configuration is omitted. 12 to 16
In the embodiment shown in FIG. 1, the semiconductor chip 110α is mounted on one glass substrate 40 of the liquid crystal panel 11, but the semiconductor chip 110α of the present embodiment is mounted on a printed circuit board 150 separate from the glass substrate 140 of the liquid crystal panel 111. Is done. More specifically, each terminal aa, cc is electrically connected to the wiring 152 on the printed circuit board 150, and each terminal yy is electrically connected to the bus line of the glass substrate 140. Even with such a configuration, the frame width D13 can be similarly reduced, and the printed circuit board 150 is separated from the glass substrate 140, so that the printed circuit board 150 is folded using the flexibility of the TCP 135α. Positioning the printed circuit board 150 behind the glass substrate 140,
Further, the frame width D13 can be reduced.

FIG. 18 is a front view schematically showing a part of a liquid crystal display device mounted with a TCP 135β on which a semiconductor chip 110β according to still another embodiment of the present invention is mounted. Since it has a configuration similar to that shown in FIGS. 12 to 16, the same reference numerals are given to the corresponding parts, and only different configurations will be described, and description of similar configurations will be omitted. In the TCP 135β of this embodiment, the terminals aa and cc are formed only on one side in the longitudinal direction. Even with such a configuration, miniaturization can be realized similarly to the above-described embodiment. In addition, compared with the case where the terminals aa and cc are dispersedly formed at the peripheral portions on both sides in the longitudinal direction, the TCP 135
The connection area between β and the glass substrate 40 can be reduced, and this connection step can be facilitated.

FIG. 19 is a front view schematically showing a part of a liquid crystal display device mounted with a TCP 135γ on which a semiconductor chip 110γ according to still another embodiment of the present invention is mounted. Since it has a configuration similar to that of the embodiment shown in FIGS. 12 to 16 and the embodiment shown in FIG. 17, the same reference numerals are given to corresponding parts, and only different configurations will be described, and description of similar configurations will be omitted. The TCP 135β of the present embodiment is
The terminals aa and cc are formed only on one side in the longitudinal direction, and are mounted on the printed circuit board 150. Thereby, the same effect as the embodiment shown in FIGS. 12 to 16 and the same effect as the embodiment shown in FIG. 17 can be achieved at the same time.

FIG. 20 is a front view schematically showing a semiconductor chip 110δ according to still another embodiment of the present invention, and FIG. 21 is a TCP 135δ mounting the semiconductor chip 110δ.
It is a front view which shows typically. Since it has a configuration similar to the configurations shown in FIGS. 12 to 16 and the configurations shown in FIGS. 8 and 9, corresponding portions are denoted by the same reference numerals, and only different configurations will be described, and similar configurations will be described. Is omitted. In the above-described embodiment, the electrodes A, C, and Y are formed in the region 17 excluding the region 15 of the circuit element 112δ on one side in the width direction, but in the present embodiment, the electrodes A, C, and Y are Is formed in a partial region 17β of the region 15 in which the circuit element 112δ in the width direction intermediate portion is provided.

Thus, the region 1 of the circuit element 112δ
Since it is not necessary to provide a region for each of the electrodes A, C, and Y separately from the semiconductor device 110, the width of the semiconductor chip 110δ can be further reduced. , C, and Y can be formed on both sides in the width direction, respectively, and the degree of freedom in the arrangement of the lead wires a, c, and y is improved.

FIG. 22 is a front view schematically showing a TCP 135ε on which a semiconductor chip 110ε according to still another embodiment of the present invention is mounted. Since it has a configuration similar to that shown in FIGS. 12 to 16, the same reference numerals are given to the corresponding parts, and only different configurations will be described, and description of similar configurations will be omitted. In the embodiment shown in FIGS. 12 to 16, the electrodes A, C, and Y are formed in a line in the longitudinal direction, but in the present embodiment, the electrodes A, C, and Y are formed at one peripheral portion in the width direction. The circuit elements 112 are formed in a staggered manner in a region extending in the longitudinal direction excluding the region 15.

As a result, the adjacent electrodes of the electrodes A, C, and Y can be mutually shifted in the width direction, thereby achieving mutual electrical insulation. Therefore, compared to the case where the electrodes are aligned in the longitudinal direction, Reduce the longitudinal spacing,
The length of the semiconductor chip 110ε in the longitudinal direction can be reduced.

FIG. 23 is a front view schematically showing a TCP 135 # on which a semiconductor chip 110 # according to still another embodiment of the present invention is mounted. Since it has a configuration similar to each of the embodiments shown in FIGS. 20 to 22, the same reference numerals are given to corresponding parts, and only different configurations will be described, and description of similar configurations will be omitted. In the embodiment shown in FIG. 22, each of the electrodes A, C, and Y is a circuit element 112ε on one peripheral portion in the width direction.
In the present embodiment, the electrodes A, C, and Y are formed in a staggered manner in a region 17 extending in the longitudinal direction except the region 15 of FIG.
Are formed in the middle part in the width direction in a staggered manner in the longitudinal direction, similarly to the forms of FIGS. 20 and 21. FIG. 2
0 to 22 can be achieved simultaneously.

The present invention is not limited to the above-described embodiment, but can be modified within the scope of the present invention. For example, the present invention is not limited to a liquid crystal display device, but a display device using electroluminescence (EL). May be implemented. Further, although the embodiment implemented as a source driver has been described, the embodiment may be implemented as a gate driver. In addition, as long as each electrode is in one line, the arrangement is not limited to the above-described embodiment.

[0076]

According to the present invention, a plurality of electrodes of a semiconductor chip are arranged in a line in a region extending in a longitudinal direction along a long side. As a result, only one region for providing electrodes on the semiconductor chip needs to be provided in the width direction perpendicular to the long side, and the size in the width direction can be reduced. Also, each electrode is 1 in the width direction.
Since only one electrode is formed, the lead wiring electrically connected to each electrode can be drawn out in any direction in the width direction without interference with other electrodes, and the design of each lead wiring is free. The degree can be increased.

According to the third or fourth aspect of the present invention,
The plurality of electrodes of the semiconductor chip are arranged in a staggered manner in a region extending in the longitudinal direction along the long side. As a result, only one region for providing electrodes on the semiconductor chip needs to be provided in the width direction perpendicular to the long side, and the size in the width direction can be reduced. Further, by arranging the electrodes in a staggered manner, the electrodes adjacent in the longitudinal direction are shifted in the width direction, whereby mutual electrical insulation can be obtained, and the arrangement interval in the longitudinal direction can be reduced. . Therefore, the dimension in the longitudinal direction can be reduced.
Further, since only one electrode is formed in the width direction, a lead wire electrically connected to each electrode can be drawn out in any direction in the width direction without interference with other electrodes. In addition, the degree of freedom in designing each lead wiring can be increased.

According to the fifth aspect of the present invention, since each electrode is formed on the peripheral edge on one side in the width direction, a wide area is formed on the other side in the width direction of the area where these electrodes are formed. can do. This area is, for example, when a semiconductor chip is mounted on a tape carrier package, etc.
It can be effectively used as a region for forming a lead wiring.

According to the sixth aspect of the present invention, since each electrode is formed in the middle portion in the width direction, regions can be formed on both sides in the width direction of the region where these electrodes are provided, and can be selectively used. . Each area can be effectively used as an area for forming a lead wiring when mounted on, for example, a TCP.

According to the present invention, since each electrode is formed in a region other than a region where a circuit element is provided, a circuit is provided when each electrode is electrically connected to a wiring. It is difficult for external force and heat accompanying the connection process to act on the element, and the circuit element is not easily damaged. Therefore, no consideration is required for preventing damage, and the connection process is easy.

According to the present invention, since each electrode is formed in the region where the circuit element is provided, it is necessary to provide a region where the electrode is formed separately from the region where the circuit element is provided. In addition, the width of the semiconductor chip can be reduced.

According to the ninth aspect of the present invention, since the remaining electrodes are arranged outside the driving electrodes,
It is easy to arrange the lead wires electrically connected to each electrode so as not to cross. More specifically, since the semiconductor chip is arranged on the side of the display panel so as to face the width direction, the lead wires electrically connected to each electrode indicate the lead wires electrically connected to the drive electrodes. By extending toward the panel and extending the lead wires electrically connected to the remaining electrodes in the longitudinal direction, it is possible to electrically connect to the control board and other semiconductor chips. Therefore, the lead wiring can be easily provided without extending the lead wiring over a wide area and so that the lead wirings do not cross each other.

According to the tenth aspect of the present invention, since the semiconductor chip according to any one of the first to seventh aspects is mounted, the width of the tape carrier package in the width direction can be reduced. In arranging the tape carrier package on the side of the display panel, a space for arranging the tape carrier package is small, and a region outside the display panel in a display device having such a tape carrier package and the display panel, that is, a width of a frame is reduced. Thus, the size of the display device can be reduced. Therefore, portability of a device including the display device can be improved.

According to the eleventh aspect of the present invention, the terminals of the lead wiring electrically connected to the input electrode and the power supply electrode are formed on both the peripheral edges in the longitudinal direction of the tape carrier package. The number of terminals formed in the portion can be reduced. In addition, since the terminals on each peripheral portion are formed so as to be alternately shifted, the distance between adjacent terminals of each terminal formed on each side can be increased. Therefore, the permissible amount of displacement between each terminal and the wiring of the other substrate is increased, connection is facilitated, and the width of the tape carrier package can be reduced.

According to the twelfth aspect of the present invention, the terminal of the lead wiring connected to the input electrode and the power supply electrode is formed on one peripheral edge in the longitudinal direction. Therefore, there is only one connection region with wiring provided on another substrate or the like, and the connection process is easy.

According to the thirteenth aspect of the present invention, the semiconductor chip has an output electrode, receives an image signal representing a display content from the control board from the input electrode, and outputs the image signal via the wiring in the semiconductor chip. It can be output from the output electrode. Thus, when a plurality of semiconductor chips are used, the semiconductor chips can be used as a part of a wiring for guiding an image signal from the control board. Therefore, it is not necessary to connect the semiconductor chip to a common wiring extending long from the control board, and it is not necessary to use a long wiring. As the wiring, a wiring having a high resistance such as an ITO wiring is frequently used in the display device. Therefore, by shortening the wiring, the wiring resistance can be reduced.

According to the fourteenth aspect of the present invention, since each electrode is electrically connected to the wiring formed on one glass substrate of the display panel, the lead wiring is electrically connected to each electrode. Can be connected in one connection step, and the number of connection steps can be reduced as compared with the case where a substrate different from one glass substrate of the display panel is used.

According to the fifteenth aspect of the present invention, the electrodes for driving the display panel and the remaining electrodes are electrically connected to separate substrates, respectively. It can be folded back using the flexibility of the carrier package and arranged to overlap with the display panel. Therefore, the area outside the display panel of the display device having such a tape carrier package and the display panel, that is, the width of the frame can be reduced, and the display device can be downsized.

[Brief description of the drawings]

FIG. 1 is a front view schematically showing a semiconductor chip 10 according to an embodiment of the present invention.

FIG. 2 is a front view schematically showing a configuration of a circuit element 12.

FIG. 3 is a front view schematically showing a TCP 35.

FIG. 4 is a front view showing a part of the liquid crystal display device on which the TCP 35 is mounted.

FIG. 5 is an enlarged front view showing section V of FIG. 4;

FIG. 6 shows a semiconductor chip 10α according to another embodiment of the present invention.
FIG. 6 is a front view schematically showing the configuration of the circuit element 12α of FIG.

FIG. 7 is a front view showing a part of a liquid crystal display device on which a TCP 35α having a semiconductor chip 10α is mounted.

FIG. 8 is a front view schematically showing a semiconductor chip 10β according to still another embodiment of the present invention.

FIG. 9 is a front view showing a TCP 35β on which a semiconductor chip 10β is mounted.

FIG. 10 is a front view schematically showing a semiconductor chip 10γ according to still another embodiment of the present invention.

FIG. 11 is a front view schematically showing a semiconductor chip 10δ according to still another embodiment of the present invention.

FIG. 12 is a front view schematically showing a semiconductor chip 110 according to still another embodiment of the present invention.

FIG. 13 is a front view schematically showing a configuration of a circuit element 112.

FIG. 14 is a front view schematically showing a TCP 135.

FIG. 15 is a front view showing a part of the liquid crystal display device on which the TCP 35 is mounted.

FIG. 16 is a front view showing the liquid crystal display device in a longitudinal scale.

FIG. 17 is a front view showing a part of a liquid crystal display device according to another embodiment of the present invention.

FIG. 18 is a front view showing a part of a liquid crystal display device according to another embodiment of the present invention.

FIG. 19 is a front view showing a part of a liquid crystal display device according to another embodiment of the present invention.

FIG. 20 is a front view schematically showing a semiconductor chip 110δ according to still another embodiment of the present invention.

FIG. 21 is a TCP13 mounted with a semiconductor chip 110δ.
It is a front view which shows 5delta.

FIG. 22 is a front view schematically showing a TCP 135ε mounting a semiconductor chip 110ε according to still another embodiment of the present invention.

FIG. 23 is a front view schematically showing a TCP 135 # on which a semiconductor chip 110 # of still another embodiment of the present invention is mounted.

FIG. 24 is a front view showing a conventional TCP1.

[Explanation of symbols]

10,10α to 10δ, 110,110α to 110 °
Semiconductor chip 11, 110α Liquid crystal panel 12, 12β, 112 Circuit element 15 Circuit element area 17, 17β Electrode arrangement area 36 Tape base material 40, 140 Glass substrate 150 Printed circuit board A to C, Y electrode a to c, y Lead wiring aa ~ Cc, yy terminal

Claims (15)

[Claims] 1. A rectangular semiconductor chip having circuit elements, comprising: a plurality of at least input electrodes for inputting a signal, a drive electrode for driving a display panel, and a power electrode for obtaining power. A semiconductor chip comprising: a plurality of electrodes, each of which is arranged in a line in a longitudinal direction. 2. A rectangular semiconductor chip having circuit elements, comprising: at least an input electrode for inputting a signal, an output electrode for outputting the signal, and a drive electrode for driving a display panel; A semiconductor chip comprising: a plurality of electrodes having a power supply electrode for obtaining a power supply; and each of the electrodes is arranged in a line in a longitudinal direction. 3. A rectangular semiconductor chip having circuit elements, comprising: at least a plurality of input electrodes for inputting a signal, a drive electrode for driving a display panel, and a power electrode for obtaining power. A semiconductor chip, comprising: a plurality of electrodes, wherein each of the electrodes is arranged in a staggered manner in the longitudinal direction. 4. A rectangular semiconductor chip provided with circuit elements, comprising at least an input electrode for inputting a signal, an output electrode for outputting the signal, and a drive electrode for driving a display panel. A semiconductor chip comprising a plurality of electrodes having a power supply electrode for obtaining a power supply, wherein each of these electrodes is arranged in a staggered manner in a longitudinal direction. 5. The semiconductor chip according to claim 1, wherein each of said electrodes is formed on a peripheral portion on one side in a width direction perpendicular to a longitudinal direction. 6. The device according to claim 1, wherein each of the electrodes is formed at an intermediate portion in a width direction perpendicular to the longitudinal direction.
5. The semiconductor chip according to any one of items 1 to 4, 7. The semiconductor chip according to claim 1, wherein each of said electrodes is formed in a region other than a region where a circuit element is provided. 8. The semiconductor chip according to claim 1, wherein each of said electrodes is formed in a region where a circuit element is provided. 9. The semiconductor chip according to claim 1, wherein each of the electrodes has a remaining electrode disposed outside a driving electrode. 10. A tape carrier package on which the semiconductor chip according to claim 1 is mounted. 11. A lead wire terminal electrically connected to an input electrode and a power supply electrode is formed on each of the peripheral portions on both sides in the longitudinal direction, and these terminals are connected to one peripheral portion and the other peripheral portion in the longitudinal direction. The tape carrier package according to claim 10, wherein the tape carrier package is arranged so as to be alternately shifted in a width direction perpendicular to the longitudinal direction. 12. The tape carrier package according to claim 10, wherein terminals of lead wires electrically connected to the input electrode and the power supply electrode are formed at a peripheral portion on one side in the longitudinal direction. 13. A semiconductor chip having an output electrode for outputting a signal, a terminal of a lead wiring electrically connected to an input electrode is formed on a peripheral portion on one side in a longitudinal direction. 11. The tape carrier package according to claim 10, wherein a terminal of a lead wiring electrically connected to the output electrode is formed at a peripheral portion on the other side in the direction. 14. The tape carrier package according to claim 10, wherein each electrode is electrically connected to wiring formed on one glass substrate of the display panel. 15. The driving electrode is electrically connected to wiring formed on one glass substrate of the display panel, and the remaining electrode is formed on a printed wiring board provided separately from the one glass substrate of the display panel. The tape carrier package according to claim 10, wherein the tape carrier package is electrically connected to the wiring.