JPH1126940A - Manufacture of ceramic circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable prevention of separation of an external electrode from a multilayer ceramic board or a single layer ceramic board, by integrally sintering the multilayer ceramic board, first and second via-hole electrode, and the external electrode. SOLUTION: Ceramic sheets 11a to 11d are stacked and compression-bonded to form a multilayer ceramic board 11. After an external electrode 13 is formed on the surface thereof by printing a copper-based paste-like conductive material by screen printing, the multilayer ceramic board 11, a conductor pattern 12, the external electrode 13, and first and second via-hole electrodes 14, 15 are integrally sintered at a temperature not higher than 1000 deg.C. Thus, the durability of the external electrode against thermal stress or mechanical stress is improved, and consequently, the external electrode can be prevented from being separated from the multilayer ceramic board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic circuit board, and more particularly to a method for manufacturing a ceramic circuit board for improving the adhesive strength of external electrodes on the surface.

[0002]

2. Description of the Related Art FIG. 6 shows a method of manufacturing a conventional ceramic circuit board. First, a powder such as glass + alumina is used as a main material, a binder, a plasticizer, a solvent, and the like are kneaded at a predetermined ratio, and ceramic sheets 51a to 51d are formed by a doctor blade method or the like, and these ceramic sheets 51a to 51d are formed. And via hole 5 by punching
2 is formed (FIG. 6A). Next, a paste-like conductive material is printed on the ceramic sheets 51a to 51c by screen printing to form the conductive pattern 53 based on the circuit configuration, and the paste-like conductive material is filled in the via holes 52. Thereby, a second via-hole electrode 54 connected to the conductor pattern 53 is formed,
Each of the ceramic sheets 51a to 51d is laminated and pressed, and
Sintering at a temperature below 000 ° C.
Is formed (FIG. 6B). Next, a silver-based paste-like conductive material is printed on the surface of the multilayer ceramic substrate 51 by screen printing to form the external electrode 55, and the paste-like conductive material is applied to the multilayer ceramic substrate 51.
The first via-hole electrode 56 connected to the external electrode 55 and not connected to the conductor pattern 53 is formed by filling the via-hole 52 opened on the surface of the first via hole 52. Thereafter, the external electrode 55 and the first via-hole By firing the electrodes 56, the ceramic circuit board 50 is completed (FIG. 6C).

[0003]

However, in the above-described conventional method for manufacturing a ceramic circuit board, after sintering a multilayer ceramic substrate including a conductor pattern and a second via-hole electrode therein, an external electrode and a first In order to improve the bonding strength between the multilayer ceramic substrate and the external electrode, the first ceramic substrate and the external electrode, and between the multilayer ceramic substrate and the second ceramic electrode, are provided in order to improve the adhesive strength between the multilayer ceramic substrate and the external electrode. As a result, the adhesive strength between the multilayer ceramic substrate and the external electrode and between the multilayer ceramic substrate and the first via-hole electrode are deteriorated. Accordingly, there is a problem that the external electrode is peeled off from the multilayer ceramic substrate together with the first via hole electrode.

Further, when firing the external electrode and the first via-hole electrode, there is also a problem that the conductor pattern formed inside the multilayer ceramic substrate is liable to cause migration, resulting in poor insulation and short circuit.

The present invention has been made to solve such a problem, and a method of manufacturing a ceramic circuit board capable of preventing an external electrode from being peeled off from a multilayer ceramic substrate or a single-layer ceramic substrate. The purpose is to provide.

[0006]

In order to solve the above-mentioned problems, a method of manufacturing a ceramic circuit board according to the present invention comprises a first via-hole electrode not connected to a conductor pattern formed inside a multilayer ceramic substrate; A method of manufacturing a ceramic circuit board comprising: a second via-hole electrode connected to the conductor pattern; a step of preparing a plurality of ceramic sheets; a step of forming a via-hole in the plurality of ceramic sheets; Printing a conductive material on a sheet to form the conductive pattern; filling the via hole with a conductive material to form the first and second via-hole electrodes; laminating and pressing the plurality of ceramic sheets; Forming a multilayer ceramic substrate by printing a conductive material on the surface of the multilayer ceramic substrate to form external electrodes. A step, the laminated ceramic substrate,
And sintering said first via-hole electrode, said second via-hole electrode and said external electrode integrally.

A method for manufacturing a ceramic circuit board comprising: a first via hole electrode having only one end connected to an external electrode; and a second via hole electrode having both ends connected to the external electrode. A step of preparing a ceramic substrate; a step of forming a via hole in the single-layer ceramic substrate; a step of filling the via hole with a conductive material to form the first and second via-hole electrodes; A step of printing a conductive material on the surface to form the external electrode, and a step of integrally sintering the single-layer ceramic substrate, the first via-hole electrode, the second via-hole electrode, and the external electrode. Features.

According to the ceramic circuit board of the first aspect,
Not connected to the multilayer ceramic substrate and conductor pattern,
A first via hole electrode having one end connected only to the external electrode, a second via hole electrode having both ends connected to the conductor pattern, or one end connected to the conductor pattern, and the other end connected to the external electrode; Is integrally sintered, the laminated ceramic substrate can be integrated with the external electrode, the first via-hole electrode, and the second via-hole electrode.

According to the method for manufacturing a ceramic circuit board of the present invention, the single-layer ceramic substrate, the first via-hole electrode having only one end connected to the external electrode, and both ends connected to the external electrode only at one end. Since the second via-hole electrode and the external electrode are integrally sintered, the single-layer ceramic substrate can be integrated with the external electrode, the first via-hole electrode, and the second via-hole electrode.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a sectional view of a ceramic circuit board obtained from a first embodiment of a method for manufacturing a ceramic circuit board according to the present invention. The ceramic circuit board 10
A multilayer ceramic substrate 11 in which a plurality of ceramic sheets 11a to 11d are stacked; a conductor pattern 12 formed in the multilayer ceramic substrate 11; an external electrode 13 formed on the surface of the multilayer ceramic substrate 11; And a first via-hole electrode 14 having one end connected only to the external electrode 13 without being connected to the conductor pattern 12 and the multilayer ceramic substrate 1.
1 and both ends of the conductor pattern 1
2 or one end is connected to the conductor pattern 12,
A second via-hole electrode having the other end connected to the external electrode;

A method of manufacturing the ceramic circuit board 10 as shown in FIG. 1 will be described with reference to FIG. First, barium oxide, aluminum oxide, silica powder as the main material,
Kneading the binder, plasticizer and solvent at a predetermined ratio,
Ceramic sheet 11a by doctor blade method etc.
To 11d, and these ceramic sheets 11a to 11d
A via hole 16 is formed in 11d by punching (FIG. 2A).

Next, the ceramic sheets 11a to 11c
A paste-like conductive material made of copper, silver, silver / palladium, tungsten, platinum, or the like is printed by screen printing to form a conductor pattern 12 based on the circuit configuration;
The via holes 16 of the ceramic sheets 11a to 11d are filled with a paste-like conductive material made of copper, silver, silver / palladium, tungsten, platinum, or the like. One end is connected only to the external electrode 13 without being connected to the conductive pattern 12. First via-hole electrode 14 to be formed, and conductor pattern 12
Or a second via-hole electrode 1 having one end connected to the conductor pattern 12 and the other end connected to the external electrode 13.
5 is formed (FIG. 2B).

Next, each of the ceramic sheets 11a to 11
d are laminated and pressure-bonded to form a laminated ceramic substrate 11,
A copper-based paste-like conductive material is printed on the surface of the multilayer ceramic substrate 11 by screen printing to form the external electrodes 1.
3 is formed, and at a temperature of 1000 ° C. or lower, the laminated ceramic substrate 11, the conductor pattern 12, the external electrode 13,
By sintering the second via-hole electrodes 14 and 15 integrally, the ceramic circuit board 10 is completed.
(c)).

According to the above-described first embodiment, the laminated ceramic substrate, the first via hole electrode having one end connected only to the external electrode without being connected to the conductor pattern, and both ends connected to the conductor pattern. Or a second via-hole electrode having one end connected to the conductor pattern and the other end connected to the external electrode, and the external electrode are integrally sintered, so that the laminated ceramic substrate, the external electrode, the first via-hole electrode, 2 via-hole electrodes can be integrated.

Therefore, it is possible to prevent the adhesive strength between the multilayer ceramic substrate and the external electrode, the first via-hole electrode, and the second via-hole electrode from deteriorating, so that the external electrode can withstand thermal stress or mechanical stress. As a result, the external electrodes can be prevented from peeling off from the multilayer ceramic substrate.

In addition, migration does not occur in the conductive pattern, and the migration resistance of the conductive pattern is improved, so that insulation failure and short circuit do not occur.

Furthermore, since the step of sintering the multilayer ceramic substrate and the step of sintering the external electrode, the first via hole electrode, and the second via hole electrode are simultaneously performed,
The manufacturing process is facilitated and the manufacturing cost is reduced.

FIG. 3 shows a sectional view of a ceramic circuit board obtained from a second embodiment of the method for manufacturing a ceramic circuit board according to the present invention. The ceramic circuit board 20 includes a single-layer ceramic substrate 21, an external electrode 22 formed on the surface of the single-layer ceramic substrate 21, and a single-layer ceramic substrate 21.
And one end 23 is connected to the external electrode 22.
a is connected to the first via-hole electrode 23, and the second via-hole electrode 24 is formed inside the single-layer ceramic substrate 21 and has both ends connected to the external electrode 22.
And

A method of manufacturing the ceramic circuit board 20 as shown in FIG. 3 will be described with reference to FIG. First, barium oxide, aluminum oxide, silica powder as the main material,
Kneading the binder, plasticizer and solvent at a predetermined ratio,
Single-layer ceramic substrate 21 by doctor blade method, etc.
Then, via holes 25 are formed in the single-layer ceramic substrate 21 by punching (FIG. 4A).

Next, copper, silver, silver / palladium, tungsten,
A first via hole electrode 23 having only one end 23a connected to the external electrode 22 and a second via hole electrode 24 having both ends connected to the external electrode 22 are formed by filling a paste-like conductive material made of platinum or the like. (FIG. 4 (b)).

Next, after a copper-based paste-like conductive material is printed on the surface of the single-layer ceramic substrate 21 by screen printing to form the external electrodes 22, the single-layer ceramic substrate 21 is heated at a temperature of 1000 ° C. or less. External electrode 22, first
By sintering the second via hole electrodes 23 and 24 integrally, the ceramic circuit board 20 is completed.
(c)).

According to the above-described second embodiment, the single-layer ceramic substrate, the first via-hole electrode having only one end connected to the external electrode, and the second via-hole having both ends connected to the external electrode only at one end are provided. Since the electrode and the external electrode are integrally sintered, the single-layer ceramic substrate can be integrated with the external electrode, the first via-hole electrode, and the second via-hole electrode.

Therefore, it is possible to prevent the adhesive strength between the single-layer ceramic substrate and the external electrode, the first via-hole electrode, and the second via-hole electrode from deteriorating, so that the external electrode is not affected by thermal stress or mechanical stress. The durability can be improved, and as a result, the external electrodes can be prevented from peeling off from the single-layer ceramic substrate.

Further, since the step of sintering the single-layer ceramic substrate and the step of sintering the external electrode, the first via-hole electrode, and the second via-hole electrode are performed simultaneously, the manufacturing process is facilitated, and Cost reduction is realized.

In the second embodiment, the first via-hole electrode 2 having one end 23a connected to the external electrode 22 is provided.
3, the other end 23b is opened to the surface of the single-layer ceramic substrate 21. However, like the ceramic circuit board 20a shown in FIG. The same effect can be obtained even when staying inside the substrate 21. And
The method of manufacturing the ceramic circuit board 20a is the same as the method of manufacturing the ceramic circuit board 20 shown in FIG.

[0026]

According to the ceramic circuit board of the first aspect, the multilayer ceramic substrate, the first via hole electrode not connected to the conductor pattern but having one end connected only to the external electrode, and both ends connected to the conductor pattern. Or the other end is connected to the conductor pattern and the other end is connected to the external electrode.
In order to sinter the via hole electrode and external electrode integrally,
The multilayer ceramic substrate can be integrated with the external electrode, the first via-hole electrode, and the second via-hole electrode.

Therefore, it is possible to prevent the adhesive strength between the multilayer ceramic substrate and the external electrode, the first via-hole electrode, and the second via-hole electrode from deteriorating, so that the external electrode can withstand thermal stress or mechanical stress. As a result, the external electrodes can be prevented from peeling off from the multilayer ceramic substrate.

Further, migration does not occur in the conductive pattern, and the migration resistance of the conductive pattern is improved, so that insulation failure and short circuit do not occur.

Further, the step of sintering the multilayer ceramic substrate and the step of sintering the external electrode, the first via-hole electrode, and the second via-hole electrode are simultaneously performed.
The manufacturing process is facilitated and the manufacturing cost is reduced.

According to the ceramic circuit board of the second aspect,
In order to integrally sinter the single-layer ceramic substrate, the first via-hole electrode having only one end connected to the external electrode and the second via-hole electrode having both ends connected to the external electrode only at one end, and the external electrode, The layer ceramic substrate can be integrated with the external electrode, the first via-hole electrode, and the second via-hole electrode.

Therefore, it is possible to prevent the adhesive strength between the single-layer ceramic substrate and the external electrode, the first via-hole electrode, and the second via-hole electrode from deteriorating, so that the external electrode is not affected by thermal stress or mechanical stress. The durability can be improved, and as a result, the external electrodes can be prevented from peeling off from the single-layer ceramic substrate.

Further, since the step of sintering the single-layer ceramic substrate and the step of sintering the external electrode, the first via-hole electrode, and the second via-hole electrode are performed simultaneously, the manufacturing process is facilitated, and Cost reduction is realized.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of a ceramic circuit board according to the present invention.

FIG. 2 is a cross-sectional view illustrating a method of manufacturing the ceramic circuit board of FIG.

FIG. 3 is a sectional view showing a second embodiment of the ceramic circuit board of the present invention.

FIG. 4 is a cross-sectional view illustrating a method for manufacturing the ceramic circuit board of FIG.

FIG. 5 is a sectional view showing a modification of the ceramic circuit board of FIG. 3;

FIG. 6 is a cross-sectional view illustrating a method for manufacturing a conventional ceramic circuit board.

[Explanation of symbols]

 10, 20, 20a Ceramic circuit board 11 Multilayer ceramic substrate 11a to 11d Ceramic sheet 12 Conductor pattern 14, 23 First via hole electrode 15, 24 Second via hole electrode 16, 25 Via hole 21 Ceramic substrate

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[Procedure amendment]

[Submission date] August 28, 1997

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0001

[Correction method] Change

[Correction contents]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic circuit board, and more particularly to a method for manufacturing a ceramic circuit board for improving the bonding strength of external electrodes on the front and back surfaces.

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

According to the method for manufacturing a ceramic circuit board of the second aspect, the single-layer ceramic substrate, the first via-hole electrode having only one end connected to the external electrode, and the second via-hole electrode having both ends connected to the external electrode. Since the via-hole electrode and the external electrode are integrally sintered, the single-layer ceramic substrate can be integrated with the external electrode, the first via-hole electrode, and the second via-hole electrode.

[Procedure amendment 3]

[Document name to be amended] Drawing

[Correction target item name] Fig. 4

[Correction method] Change

[Correction contents]

FIG. 4

Claims (2)

[Claims] 1. A method of manufacturing a ceramic circuit board comprising: a first via-hole electrode not connected to a conductor pattern formed inside a multilayer ceramic substrate; and a second via-hole electrode connected to the conductor pattern. A step of preparing a plurality of ceramic sheets, a step of forming a via hole in the plurality of ceramic sheets, a step of printing a conductive material on the ceramic sheet to form the conductive pattern, and a step of forming a conductive material in the via hole. Filling and forming the first and second via-hole electrodes; laminating and pressing the plurality of ceramic sheets to form a multilayer ceramic substrate; and printing a conductive material on the surface of the multilayer ceramic substrate to form an external device. Forming an electrode, the multilayer ceramic substrate, the first via-hole electrode, and the second via-hole electrode; And method for producing a ceramic circuit board, wherein the step of integrally sintering the external electrode, in that it consists of. 2. A method for manufacturing a ceramic circuit board, comprising: a first via-hole electrode having only one end connected to an external electrode; and a second via-hole electrode having both ends connected to the external electrode. A step of preparing a ceramic substrate; a step of forming a via hole in the single-layer ceramic substrate; a step of filling the via hole with a conductive material to form the first and second via-hole electrodes; A step of printing a conductive material on the surface to form the external electrode, and a step of integrally sintering the single-layer ceramic substrate, the first via-hole electrode, a second via-hole electrode and the external electrode,
A method for manufacturing a ceramic circuit board, comprising: