JPH11262467A - Image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent disconnection at a connection and separation of bonding parts by enhancing the strength for securing a solid image pickup element to a fixed member. SOLUTION: An objective optical system 11 and a solid image pickup element 12 are fixed together with their respective optical axes coinciding with each other, and the rear end face of a final objective lens 14e is bonded to the front surface of the image pickup element 12. A third adhesive 23 is applied to a proximal end of a fixed frame 20, a part of the outer peripheral surface of the frame 20, and the outer periphery of a first adhesive 21 securing the image pickup element 12 to protective glass 16, so that they are firmly fixed together. Two reinforcing plates 25 are disposed at the image pickup element 12 and the upper and lower outer peripheral surfaces of the fixed frame 20, and the fixed frame 20, the image pickup element 12, and the reinforcing plates 25 are covered with a thermally contracting tube 26, with the proximal end of the thermally contracting tube 26 fitted over a signal cable 13. The thermally contracting tube 26 is filled with a third adhesive 23 to integrally fix TAB tape 18, a signal line, and electric parts 24 together.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus for increasing the mounting strength between a solid-state image pickup device and a fixing member.

[0002]

2. Description of the Related Art In recent years, an image pickup device constituted by an objective optical system, a solid-state image pickup device, a circuit board, and the like is built in the distal end portion of an endoscope insertion section, and an observation image captured by the objective optical system is solid-state image pickup device. The photoelectrically converted electric signal is transmitted to an image processing device, which is an external device of the endoscope, via a signal cable to generate an image signal, and the image signal is displayed on a monitor screen for endoscope conversion. 2. Description of the Related Art Electronic endoscope apparatuses capable of observing a mirror image are widely used.

[0003] As shown in FIG.
, An objective optical system 4 in which a plurality of objective lenses 2,..., 2 are disposed on an objective lens frame 3, and an image sensor protection glass 5 disposed on the front surface of the solid-state image sensor 1 and the objective lens frame 3.
The solid-state image pickup device protection glass 5, the base end surface of the objective lens frame 3, and the objective lens are fixed together by providing an adhesive fixing portion 6 for fixing the base end surface of the objective lens frame 3 as shown in FIG. An adhesive fixing section 6 for fixing the final objective lens 2e provided at the base end of the frame 3 is provided and integrally fixed.

A signal line provided in a signal cable or a signal line grounding land provided on a circuit board constituting an image pickup device is connected to an external lead 1a extending from the solid-state image pickup device by soldering or the like. An imaging device driving signal, an imaging device output signal, an imaging device driving power supply, and the like, which are input / output signals of the imaging device, are connected to the external lead 1a and the circuit board, and are inserted through the endoscope insertion portion. The signal is transmitted to an image processing device or the like, which is an external device of the endoscope, through a signal cable.

[0005]

For this reason, when the bending portion provided in the endoscope insertion portion is operated to bend up, down, left, and right, for example, the above-described signal cable inserted through the endoscope insertion portion is used. If the external lead is pulled or pulled by the bending operation, a stress is applied to an electrical connection portion between the external lead and the circuit board or the signal line to cause a disconnection, or an adhesion between the image sensor and the fixed frame. There was a possibility that troubles such as peeling and cracking of the portion would occur.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an image pickup apparatus that prevents peeling or cracking of an adhesive portion between an image pickup device and a fixed frame.

[0007]

An imaging apparatus according to the present invention is an imaging apparatus having a solid-state imaging device and a fixing member for fixing the solid-state imaging device, wherein the mounting strength between the solid-state imaging device and the fixing member is reduced. A reinforcing member for reinforcement is provided.

According to this structure, when a stress is applied to the imaging device, the stress applied to both the solid-state imaging device and the fixing member is dispersed by the reinforcing member, and the stress is separated at the bonding portion between the solid-state imaging device and the fixing member. And cracks do not occur.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 relate to a first embodiment of the present invention. FIG. 1 is an explanatory view showing a configuration of an image pickup apparatus, FIG. 2 is a view showing an example of fixing a lens frame and a lens, and FIG. It is an enlarged view explaining. As shown in FIG. 1, the imaging apparatus 10 according to the present embodiment is arranged in a through-hole for observation formed in a not-shown distal end constituent member constituting a distal end portion of an endoscope insertion section. The device 10
An objective optical system 11 disposed on the distal end side for taking an observation image of a region to be inspected, a solid-state imaging device 12 for converting an optical image taken by the objective optical system 11 into an electric signal, and an input to the solid-state imaging device 12 It mainly comprises a drive signal as an output signal, and a signal cable 13 for transmitting the output signal and the drive power supply.

The objective optical system 11 is provided with a plurality of objective lenses 14,..., 14 and a metal objective lens frame 15 formed of, for example, stainless steel. A non-conductive member that also serves as a fixing member for the solid-state imaging device 12 having the final objective lens 14e provided therein and an insulating member frame for preventing the flow of static electricity from the metal objective lens frame 15, for example, ceramic or polymer. It is formed by bonding and fixing a fixing frame 20 made of a material. A first objective lens 14a, a second objective lens 14b,..., 14 are sequentially arranged from the front end side of the objective lens frame 15, and a thin plate is provided between the first objective lens 14a and the second objective lens 14b. An aperture 11a is provided. Further, the final objective lens 14e is a protective glass 1
6.

As shown in FIG. 2 (a), when the shape of the bonding portion between the objective lenses 14a and 14b and the objective lens frame 15 is circular, the circular second objective lens 14b has The chamfered portions A are provided on the upper, lower, left, and right sides to reduce the amount of adhesion between the second objective lens 14b and the objective lens frame 15. As a result, the second objective lens 14
b, the aperture 11a, and the first objective lens 14a are dropped to the distal end side, and then an adhesive applied to adhesively fix the first objective lens 14a to the objective lens frame 15 is applied to the second objective lens 14b side. Even when it flows and adheres to the outer peripheral surface, the amount of adhesion between the objective lens frame 15 and the second objective lens 14b is small, and a tool such as tweezers can be arranged in the chamfered portion A to facilitate the work. The operation of replacing the lens provided on the front end side of the lens frame 15 can be performed in a short time.

In the case where the shape of the bonding portion between the objective lenses 14a and 14b and the objective lens frame 15 is a quadrangle as shown in FIG. 1B, the quadratic second objective lens 1 is used.
By providing the chamfered portions A at the four corners of 4b, the same operation and effect as in the case where the chamfered portions A are formed on the circular second objective lens 14b described above can be obtained.

On the other hand, the solid-state imaging device 12 shown in FIG.
The rear end surface of a solid-state image sensor protection glass (hereinafter abbreviated as protection glass) 16 is integrally fixed to the front surface of the device by bonding. At this time, the objective optical system 11 and the solid-state imaging device 12 are fixed so that their optical axes are aligned with each other. A non-conductive first adhesive 21 is further applied to the surface and the base end surface of the solid-state imaging device 12 to firmly fix the solid-state imaging device 12 and the protective glass 16.

As shown in FIG. 3, an inner lead 19 of a TAB tape 18 is electrically connected to an electrode (not shown) provided on the front surface of the solid-state imaging device 12 via a bump joint 17. The bump bonding portion 17, the inner lead 19, and the tip of the TAB tape 18 are covered with a non-conductive second adhesive 22, so that the inner lead 19 and the electrode portion of the solid-state imaging device 12 are further strengthened. To prevent disconnection. The TA
The B tape 18 extends further rearward than the base end of the solid-state imaging device 12, and electric components 24 such as ICs and capacitors are mounted on the TAB tape 18. The electrodes (not shown) of these electric components 24 and T
A signal line built in the signal cable 13 is connected to the cable wiring land 18a of the AB tape 18. In the signal cable 13, for example, 7
The core cable, the single-core cable, and the single-core cable are inserted, and the signal lines are bundled together by the heat-shrinkable tube 13a.

In order to further firmly fix the image sensor 12 and the fixed frame 20, the base end and a part of the outer peripheral surface of the fixed frame 20, the image sensor 12 and the protective glass 16 are fixed. A third adhesive 23 is applied to an outer peripheral portion of the first adhesive 21, and both members 12, 12 are attached to an upper outer peripheral surface and a lower outer peripheral surface of the image sensor 12 and the fixed frame 20 to which the third adhesive 23 is applied. Two reinforcing plates 25 having a flat plate shape are provided as reinforcing members related to the fixing member 20, and the fixing frame 20, the image sensor 12, and the reinforcing plate 25 are covered with a heat-shrinkable tube 26 and fixed integrally. Then, the third adhesive 23 is filled in the heat-shrinkable tube 26, the TAB tape 18, the signal line, and the electric component 24 are integrally fixed, and the base end is fitted to the signal cable 13. The imaging device 10 is configured.

The TAB tape 18 is bent inward while projecting rearward from the solid-state image pickup device 12 to reduce the outer diameter of the image pickup device 10.
Further, the final objective lens 14e may be a parallel plate glass.

As described above, when the protective glass adhered and fixed to the solid-state imaging device and the final objective lens provided on the base end surface side of the fixed frame are adhered and fixed together, the solid-state imaging device and the protective glass are fixed. A first adhesive is applied to the side surface to improve the fixing strength, and a third adhesive is applied around the first adhesive and the fixing frame. By configuring the imaging device by disposing the reinforcing plate as described above, the connection strength of the connection between the solid-state imaging device and the protective glass and the fixed frame can be significantly improved. Thus, when a signal cable is pulled or swung by a bending operation or the like and a generated stress acts in the direction of the image sensor, the reinforcing plate is disposed on both the solid-state image sensor and the fixed frame. As a result, the stress is dispersed, so that peeling or cracking is prevented from occurring at the connection between the solid-state imaging device and the protective glass and the fixed frame.

When the inner leads of the TAB tape and the electrode portions of the solid-state imaging device are electrically connected to each other by providing a bump joint, the bump joint, the inner leads, and the TAB tape are electrically connected to each other.
By fixing the front end portion of the tape by covering with the second adhesive, the fixing strength is improved, and disconnection due to stress generated when the signal cable is pulled or swung can be prevented.

In this embodiment, the configuration example in which the reinforcing plate 25 is disposed on the upper and lower sides is shown. However, the position where the reinforcing plate 25 is disposed is limited to the upper and lower sides. Instead, it may be arranged on any two sides such as top / right and top / left. Also, the TA on the rear side of the solid-state imaging device
Although the outer diameter of the imaging device is reduced by bending the B tape 18 inward, the bending position is not limited to the above-described TAB tape 18 but may be the inner lead 19.

FIGS. 4 and 5 relate to a second embodiment of the present invention. FIG. 4 is an explanatory view showing another configuration of the image pickup apparatus, and FIG. 5 is a sectional view taken along line XX of FIG.

As shown in FIGS. 4 and 5, in the image pickup apparatus 10A of this embodiment, a reinforcement formed in a substantially U-shape so as to cover both the solid-state image pickup device 12, the protective glass 16 and the fixed frame 20 is provided. A U-shaped plate 25A, which is a member, is externally fitted and fixed, and a heat-shrinkable tube 26 is coated around the U-shaped plate 25A and integrally fixed therewith, and the adhesive 23 is filled therein to fill the imaging device 10A.
Is composed. At this time, the fixing frame 20 is formed with a stepped portion 20a having substantially the same thickness as the U-shaped plate 25A. The U-shaped plate 25A protrudes from the outer peripheral surface of the fixed frame 20 to prevent the image display device 10A from having a large diameter. Other configurations are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

As described above, since the U-shaped plate, which is a reinforcing member formed in a U-shape, is disposed so as to cover the solid-state imaging device and the fixing frame, the U-shaped plate can be connected to the solid-state imaging device and the fixed member. Since they are integrally provided in the three sides of the frame, the connection strength of the connection portion between the solid-state imaging device and the protective glass and the fixed frame is further improved, and the signal cable is pulled or swung by a bending operation or the like. It is possible to more reliably prevent peeling or cracking from occurring in the connection between the solid-state imaging device and the protective glass and the fixed frame due to the stress generated when the fixing frame is pressed. Other functions and effects are the same as those of the first embodiment.

In a conventional endoscope having a plurality of viewing directions, a solid-state image pickup device is arranged for each viewing direction. There was a problem that the mirror became expensive. For this reason, an endoscope having an inexpensive configuration without increasing the diameter of the distal end of an endoscope having a plurality of viewing directions has been desired.

As shown in FIG. 6, the endoscope 40 according to the present embodiment
Has, for example, three observation windows 41, 42, 43 at the distal end, and one imaging device 44 is provided for these observation windows 41, 42, 43. An operation cable 45 is attached to the imaging device 44. For example, by operating an operation unit lever provided in an endoscope operation unit (not shown), the operation cable 45 is moved forward and backward. The viewing direction of the imaging device 44 is
1, 42, 43.

As described above, one of the imaging devices provided in the endoscope is moved by operating the operation cable, and the direction of the field of view is changed so as to face the desired observation window. By enabling observation in directions, an endoscope capable of observation in multiple directions can be provided at low cost without reducing the diameter of the distal end. This makes it possible to provide an endoscope having good insertability and easy orientation.

Instead of using the operation cable 45 shown in FIG. 6 in order to change the direction of the visual field of the image pickup device, the image pickup device 44 is arranged on an elevator 46 as shown in FIG. A configuration in which the direction of the field of view of the imaging device 44 may be changed by pulling and raising the raising wire 47 to rotate.

By the way, in the endoscope, it is desired that the insertability is improved and the orientation is easily provided. As shown in FIGS. 8 and 9, the endoscope 50 of the present embodiment is configured such that the cross-sectional shape of the distal end portion 51 is elliptical, and two oblique objective optical systems 52 and 53 are arranged on the major axis of the ellipse. Have been placed. This facilitates observation by increasing the viewing angle, improves insertability, and provides an orientation endoscope.

It should be noted that the present invention is not limited to only the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.

[Appendix] According to the above-described embodiment of the present invention as described in detail above, the following configuration can be obtained.

(1) An image pickup apparatus having a solid-state image pickup device and a fixing member for fixing the solid-state image pickup device, in which a reinforcing member for reinforcing the mounting strength between the solid-state image pickup device and the fixing member is provided.

(2) The imaging device according to Supplementary Note 1, wherein the reinforcing member is a plate-like member.

(3) The imaging device according to attachment 1, wherein the reinforcing member is a U-shaped member.

[0033]

As described above, according to the present invention, it is possible to provide an image pickup apparatus that prevents peeling or cracking of an adhesive portion between an image pickup element and a fixed frame.

[Brief description of the drawings]

FIGS. 1 to 3 relate to a first embodiment of the present invention, and FIG. 1 is an explanatory diagram showing a configuration of an imaging apparatus.

FIG. 2 is a diagram showing an example of fixing a lens frame and a lens.

FIG. 3 is an enlarged view illustrating a bump bonding portion.

4 and 5 relate to a second embodiment of the present invention,
FIG. 4 is an explanatory diagram showing another configuration of the imaging apparatus.

FIG. 5 is a sectional view taken along line XX of FIG. 4;

FIG. 6 is a diagram showing a configuration example of an endoscope including a plurality of observation windows and one imaging device.

FIG. 7 is a diagram illustrating another configuration example of an endoscope including a plurality of observation windows and one imaging device.

FIG. 8 is a diagram showing a configuration example of an endoscope in which a cross-sectional shape of a distal end portion is elliptical.

FIG. 9 is a diagram showing another configuration example of an endoscope in which the cross-sectional shape of the distal end is elliptical.

FIG. 10 is a diagram illustrating a configuration example of a conventional endoscope imaging apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Image pick-up device 12 ... Image pick-up element 20 ... Fixed frame 21 ... 1st adhesive 22 ... 2nd adhesive 23 ... 3rd adhesive 25 ... Reinforcement plate

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H04N 5/225 H04N 5/225 D 5/335 5/335 V

Claims (1)

[Claims] 1. An imaging apparatus having a solid-state imaging device and a fixing member for fixing the solid-state imaging device, wherein a reinforcing member for reinforcing the mounting strength between the solid-state imaging device and the fixing member is provided. Imaging device.