JP2018201594A - Imaging module, endoscope, and endoscope device - Google Patents

Abstract

To provide an imaging module capable of improving durability of a semiconductor chip in which an imaging element is formed, an endoscope having the imaging module, and an endoscope device having the endoscope.SOLUTION: An imaging module 40 includes: a flexible board 60 having an opening 60b opposed to a prism 47; a semiconductor chip 50 having an imaging element 51 in which an imaging surface 51a is disposed in a state of being parallel to a longitudinal direction X of an insertion part 10, which is electrically connected to the flexible board 60 in a state that the imaging surface 51a is facing the opening 60b; and a reinforcement member 70, a frame-like reinforcement member disposed on the outer periphery of the semiconductor chip 50 for reinforcing the semiconductor chip 50, whose inner peripheral surface is bonded to the entire outer peripheral surface of the semiconductor chip 50.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an imaging module, an endoscope, and an endoscope apparatus.

  A semiconductor chip on which an image sensor such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor is formed, and a circuit board on which a circuit electrically connected to the semiconductor chip is formed. Imaging modules are used in many devices such as digital cameras, smartphones, and endoscopes.

  As a method for mounting such an imaging module on a device, there is a method described in Patent Documents 1-3.

  Patent Document 1 discloses an endoscope in which an imaging surface of a semiconductor chip including an imaging element is mounted on a distal end portion of an insertion portion of an endoscope in a state in which the imaging surface is parallel to the longitudinal direction of the insertion portion. . In this endoscope, the semiconductor chip is fixed to the circuit board with the imaging surface facing the opening provided in the flexible circuit board. An adhesive is applied between the edge of the semiconductor chip and the circuit board, thereby improving the fixing strength between the semiconductor chip and the circuit board.

  In Patent Document 2, a semiconductor chip including an imaging element is disposed inside a frame-shaped member fixed to a lens barrel, and between two opposing side surfaces of the semiconductor chip and an inner peripheral surface of the frame-shaped member. Describes an imaging module in which is bonded with an adhesive.

  In Patent Document 3, a circuit board having an opening, a semiconductor chip disposed with the imaging surface facing the opening, and an optical system provided at a position facing the semiconductor chip across the opening Are described.

JP 2012-157472 A JP 2011-097407 A JP 2010-283443 A

  In an endoscope, in order to reduce the diameter, it is effective to arrange a semiconductor chip on which an imaging element is formed in a state where the imaging surface is parallel to the longitudinal direction of the insertion portion. When such an arrangement is adopted, the insertion portion can be further reduced in diameter by thinning the semiconductor chip. Further, reducing the thickness of the semiconductor chip also reduces the manufacturing cost when using an expensive semiconductor material.

  However, when the semiconductor chip is thinned, it is necessary to consider that the semiconductor chip is not damaged or the electrical connection with the circuit board is not cut off by the handling of the insertion part or the impact applied to the insertion part.

  In the imaging module described in Patent Literatures 1-3, a part of the outer peripheral surface of the semiconductor chip is bonded to another member with an adhesive, but it is assumed that the semiconductor chip is prevented from being damaged. Not.

  The present invention has been made in view of the above circumstances, an imaging module capable of improving the durability of a semiconductor chip on which an imaging element is formed, an endoscope including the imaging module, and the endoscope. An object of the present invention is to provide an endoscopic device provided.

  The imaging module of the present invention is an imaging module provided at a distal end portion of an insertion portion of an endoscope, and includes a circuit board having an opening facing an optical member provided at the distal end portion, and an imaging surface of the insertion portion. A semiconductor chip disposed in a state parallel to the longitudinal direction of the semiconductor chip, the semiconductor chip disposed in a state where the imaging surface faces the opening, and electrically connected to the circuit board, and the semiconductor chip A frame-shaped reinforcing member disposed on the outer periphery to reinforce the semiconductor chip, the inner peripheral surface of which is bonded to the outer peripheral surface of the semiconductor chip.

  An endoscope according to the present invention includes an insertion portion that is inserted into a subject, and the imaging module that is provided at a distal end portion of the insertion portion.

  An endoscope apparatus according to the present invention includes a light source device to which the endoscope is connected, and a control device to which the endoscope is connected and which controls the endoscope and the light source device.

  According to the present invention, it is possible to provide an imaging module capable of improving the durability of a semiconductor chip on which an imaging element is formed, an endoscope including the imaging module, and an endoscope apparatus including the endoscope. Can do.

1 is a diagram illustrating a schematic configuration of an endoscope apparatus 100 according to an embodiment of the present invention. It is a cross-sectional schematic diagram which shows schematic structure of the imaging module 40 incorporated in the front-end | tip part 10C of the endoscope 1 shown in FIG. It is an external appearance perspective view of the flexible substrate 60 which comprises the imaging module 40 shown in FIG. It is an external appearance perspective view of the imaging module 40 shown in FIG. FIG. 3 is a partial enlarged view of the imaging module 40 shown in FIG. It is a figure which shows the structure of 70 A of reinforcement members which are the modifications of the reinforcement member 70 shown in FIG. 2, and is a front view corresponding to FIG. It is a figure which shows the structure of the reinforcement member 70B which is another modification of the reinforcement member 70 shown in FIG. 2, and is a front view corresponding to FIG. It is a figure which shows the structure of the reinforcement member 70C which is another modification of the reinforcement member 70 shown in FIG. 2, and is a front view corresponding to FIG. It is a figure which shows the modification of the imaging module 40 shown in FIG. It is a figure which shows another modification of the imaging module 40 shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings. In this specification, two surfaces being parallel means that the angle formed by the two surfaces is ideally 0 degrees, but this angle may include a tolerance. In addition, that an arbitrary plane and an arbitrary direction are parallel means that an angle formed by a direction perpendicular to this plane and the arbitrary direction is ideally 90 degrees, Tolerances may be included. Further, that the two directions are orthogonal means that the angle formed by the two directions is ideally 90 degrees, but this angle may include a tolerance. In addition, two positions in an arbitrary direction being the same means that the difference between the two positions is ideally “0”, but this difference may include a tolerance. .

  FIG. 1 is a diagram showing a schematic configuration of an endoscope apparatus 100 according to an embodiment of the present invention.

  As shown in FIG. 1, an endoscope apparatus 100 includes an endoscope 1 and a main body unit 2 including a control device 4 and a light source device 5 to which the endoscope 1 is connected.

  Connected to the control device 4 are a display unit 3 for displaying image information and an input unit 6 for receiving an input operation. The control device 4 controls the endoscope 1 and the light source device 5.

  The endoscope 1 is a tubular member extending in one direction and is provided at an insertion portion 10 to be inserted into a subject, and at a proximal end portion of the insertion portion 10, and mode switching operation, imaging operation, air supply / water supply operation, and An operation box 11 provided with a button for performing a suction operation, the angle knob 12 provided adjacent to the operation box 11, and the endoscope 1 are detachably connected to the light source device 5 and the control device 4, respectively. And a universal cord 13 including connector portions 13A and 13B.

  Although not shown, various channels such as a forceps channel for inserting a treatment tool such as a forceps, a channel for air supply and water supply, a channel for suction, etc. are provided inside the operation box 11 and the insertion portion 10. Is provided.

  The insertion portion 10 includes a flexible portion 10A having flexibility, a bending portion 10B provided at the tip of the soft portion 10A, and a tip portion 10C provided at the tip of the bending portion 10B.

  The bending portion 10 </ b> B is configured to be freely bent by the turning operation of the angle knob 12. The bending portion 10B can be bent in an arbitrary direction and an arbitrary angle in accordance with a portion of the subject in which the endoscope 1 is used, and the tip portion 10C can be directed to a desired observation portion.

  At the distal end of the distal end portion 10C, an observation window for taking in light from the site to be observed, an illumination window for emitting illumination light to the site to be observed, an opening for taking in and out treatment tools such as forceps, and air supply A water supply nozzle or the like is provided. An imaging module 40, which will be described later, is disposed inside the distal end portion 10C at a position facing the observation window.

  FIG. 2 is a schematic cross-sectional view showing a schematic configuration of the imaging module 40 built in the distal end portion 10C of the endoscope 1 shown in FIG. FIG. 3 is an external perspective view of the flexible substrate 60 constituting the imaging module 40 shown in FIG.

  The imaging module 40 is fitted with a lens barrel 41 that houses a lens group including a first lens 43, a second lens 44, a third lens 45, and a fourth lens 46, and an outer periphery of the lens barrel 41. The combined cylindrical prism holder 42, the prism 47 as an optical member, the semiconductor chip 50 in which the image sensor 51 is formed on a semiconductor substrate such as silicon, and the flexible electrically connected to the semiconductor chip 50. A substrate 60 and a reinforcing member 70 are provided.

  The first lens 43, the second lens 44, the third lens 45, the fourth lens 46, and the prism 47 are arranged in the longitudinal direction X of the insertion portion 10 from the position facing the observation window at the distal end of the distal end portion 10C. Are arranged in this order. The optical axis of the lens group including the first lens 43, the second lens 44, the third lens 45, and the fourth lens 46 is parallel to the longitudinal direction X.

  The prism 47 is bonded to the end surface or a transparent cylindrical parallel flat plate fitted to the end surface with an adhesive so as to close the opening on the end surface of the prism holder 42 on the curved portion 10B side. The prism 47 may be fixed to the prism holder 42 by being connected to the prism holder 42 by a connecting member (not shown) without using an adhesive.

  The prism 47 bends light incident on the light incident surface through the lens group housed in the lens barrel 41 in a direction perpendicular to the optical axis of the lens group and emits the light from the light emitting surface. The light exit surface of the prism 47 is parallel to the longitudinal direction X. The lens group and the prism 47 constitute an imaging optical system, and the prism 47 constitutes an optical member arranged at the last stage in the imaging optical system.

  The flexible substrate 60 is a circuit board having flexibility, and as shown in FIG. 3, a flat plate-like one end portion 60a extending in the longitudinal direction X and a portion of the one end portion 60a parallel to the one end portion 60a. The linear portion 60d facing each other, the curved portion 60c curved in a U-shape connecting the one end portion 60a and the linear portion 60d, and the inclination along the inclined surface of the prism 47 from the end portion in the longitudinal direction X of the linear portion 60d. The other end portion 60e extending to a position facing the surface, the branch portion 60f protruding from the straight portion 60d in a direction perpendicular to the longitudinal direction of the straight portion 60d and bent at a right angle, and the tip of the branch portion 60f. And a sub-board 60g that is parallel to the straight line portion 60d.

  An opening 60 b penetrating in the direction perpendicular to the light exit surface of the prism 47 is formed at one end 60 a of the flexible substrate 60.

  The sub-board 60g is formed with a soldering part 62 for connecting a terminal group of the circuit in the flexible board 60 and each signal line 81 of the signal cable 80 built in the insertion part 10 of the endoscope 1. ing.

  On the surface of the other end portion 60e on the prism 47 side, a circuit for driving the image sensor 51 and components such as an amplifier for amplifying an image signal output from the image sensor 51 are provided. A cover 61 for protecting these components is fixed to the other end 60e. This cover 61 is fixed to the prism 47.

  The semiconductor chip 50 has an imaging element 51 such as a CCD image sensor or a CMOS image sensor formed on a rectangular plate-shaped semiconductor substrate made of silicon or the like, and an imaging surface 51a of the imaging element 51 on the semiconductor substrate. A spacer 52 made of a frame-like member formed around the imaging surface 51a on the side surface and a flat light-transmitting member 53 formed on the spacer 52 and parallel to the imaging surface 51a are provided.

  The semiconductor chip 50 is fixed to a surface opposite to the surface on the prism 47 side of the one end portion 60a of the flexible substrate 60 in a state where the image pickup surface 51a of the image pickup device 51 faces the opening 60b of the one end portion 60a of the flexible substrate 60. Then, it is electrically connected to a terminal formed at the one end 60a.

  The surface of the translucent member 53 is parallel to the light exit surface of the prism 47. The surface of the translucent member 53 and the light emitting surface of the prism 47 are bonded by an adhesive such as a thermosetting resin or a photocurable resin.

  The reinforcing member 70 is a frame-shaped molded member disposed on the outer periphery of the semiconductor chip 50 and is provided to reinforce at least one of the strength and rigidity of the semiconductor chip 50.

  The reinforcing member 70 is made of a material harder than the semiconductor chip 50. As the material of the reinforcing member 70, a material such as a ceramic (for example, zirconia) or a carbon fiber composite having a higher strength or rigidity than the substrate of the semiconductor chip 50 is used.

  The entire inner peripheral surface of the reinforcing member 70 is bonded to the outer peripheral surface of the semiconductor chip 50 with an adhesive such as a thermosetting resin or a photocurable resin. As this adhesive, for example, a material having a sufficiently low thermal expansion coefficient is used.

  The thickness of the reinforcing member 70 and the thickness of the semiconductor chip 50 in the direction perpendicular to the imaging surface 51a are the same. That is, the surface on the imaging surface 51a side of the semiconductor chip 50 in the direction perpendicular to the imaging surface 51a is the same surface as the surface on the flexible substrate 60 side of the reinforcing member 70 in the direction perpendicular to the imaging surface 51a. Further, the surface (second surface) opposite to the surface on the imaging surface 51a side of the semiconductor chip 50 in the direction perpendicular to the imaging surface 51a is on the flexible substrate 60 side of the reinforcing member 70 in the direction perpendicular to the imaging surface 51a. It is the same surface as the surface (first surface) opposite to the surface. The difference in position between the first surface and the second surface is ideally “0”, but this difference may include a tolerance.

  The outer peripheral surface of the reinforcing member 70 is parallel to the outer peripheral surface of the semiconductor chip 70. Thereby, the thickness of the reinforcing member 70 in the direction parallel to the imaging surface 51a can be sufficiently ensured, and the reinforcing performance of the reinforcing member 70 is enhanced.

  FIG. 4 is an external perspective view of the imaging module 40 shown in FIG. FIG. 5 is a partially enlarged view of the imaging module 40 shown in FIG. 2, and is a front view seen from the back side of the semiconductor chip 50 in a direction perpendicular to the imaging surface 51a. In FIG. 4, the cover 61 and the soldering part 62 are not shown.

  4 and 5, the position of the end portion 70x on one side of the reinforcing member 70 in the longitudinal direction X (the distal end side of the distal end portion 10C) and one side of the flexible substrate 60 in the longitudinal direction X (the distal end portion 10C). The position of the end portion 60x on the front end side is the same.

  Further, the position of the end portion 70yu on one side (upper side in FIG. 5) of the reinforcing member 70 in the orthogonal direction Y that is parallel to the imaging surface 51a and orthogonal to the longitudinal direction X is the position of the flexible substrate 60 in the orthogonal direction Y. It is in the same position as the end 60yu on one side (upper side in FIG. 5).

  The position of the end portion 70yd on the other side (lower side in FIG. 5) of the reinforcing member 70 in the orthogonal direction Y is the end portion 60yd on the other side (lower side in FIG. 5) of the flexible substrate 60 in the orthogonal direction Y. Is in the same position.

  In the endoscope 1 configured as described above, the semiconductor chip 50 is disposed so that the imaging surface 51a is parallel to the longitudinal direction X. For this reason, an increase in the thickness of the imaging module 40 in the direction perpendicular to the optical axis of the lens group in the lens barrel 41 can be suppressed, and the endoscope 1 can be thinned.

  The semiconductor chip 50 of the imaging module 40 has a reinforcing member 70 bonded to the entire outer peripheral surface thereof, and at least one of strength and rigidity is reinforced by the action of the reinforcing member 70. For this reason, it is possible to prevent the semiconductor chip 50 from being damaged or the electrical connection between the semiconductor chip 50 and the flexible substrate 60 from being cut by the drawing portion 10 or the impact applied to the distal end portion 10C.

  Further, the surface opposite to the surface on the flexible substrate 60 side in the direction perpendicular to the imaging surface 51 a of the reinforcing member 70 is the surface opposite to the surface on the imaging surface 51 a side in the direction perpendicular to the imaging surface 51 a of the semiconductor chip 50. Are on the same plane. For this reason, the thickness of the imaging module 40 in the direction perpendicular to the imaging surface 51a can be reduced, and the diameter of the endoscope 1 can be reduced.

  Further, according to the imaging module 40, since the semiconductor chip 50 is reinforced by the reinforcing member 70, the semiconductor chip 50 can be further thinned, and the endoscope 1 can be further reduced in diameter and reduced in manufacturing cost. Can be achieved.

  6 is a diagram showing a configuration of a reinforcing member 70A, which is a modification of the reinforcing member 70 shown in FIG. 2, and is a front view corresponding to FIG.

  The reinforcing member 70A is a reinforcing member except that one end portion 70x in the longitudinal direction X protrudes in the longitudinal direction X from the one end portion 60x in the longitudinal direction X of the flexible substrate 60. 70.

  In this way, the end portion 70x of the reinforcing member 70A protrudes in the longitudinal direction X from the end portion 60x of the flexible substrate 60, so that the reinforcing effect of the semiconductor chip 50 is prevented without hindering the diameter reduction of the endoscope 1. Can be further increased.

  FIG. 7 is a view showing a configuration of a reinforcing member 70B, which is a modification of the reinforcing member 70 shown in FIG. 2, and is a front view corresponding to FIG.

  The reinforcing member 70 </ b> B has a point in which one end 70 yu in the orthogonal direction Y protrudes in the orthogonal direction Y from the one end 60 yu in the orthogonal direction Y of the flexible substrate 60 and the other in the orthogonal direction Y. The configuration is the same as that of the reinforcing member 70 except that the end portion 70yd on the side protrudes in the orthogonal direction Y from the end portion 60yd on the other side in the orthogonal direction Y of the flexible substrate 60.

  As described above, the end portion 70yu (end portion 70yd) of the reinforcing member 70B protrudes in the orthogonal direction Y with respect to the end portion 60yu (end portion 60yd) of the flexible substrate 60, thereby further enhancing the reinforcing effect of the semiconductor chip 50. be able to.

  In the reinforcing member 70B, the position of the end portion 70yu in the orthogonal direction Y may be the same as that of the end portion 60yu of the flexible substrate 60. In the reinforcing member 70B, the position of the end portion 70yd in the orthogonal direction Y may be the same as that of the end portion 60yd of the flexible substrate 60. Even if it is these structures, compared with the reinforcement member 70, the reinforcement effect of the semiconductor chip 50 can be heightened.

  FIG. 8 is a view showing a configuration of a reinforcing member 70C, which is a modification of the reinforcing member 70 shown in FIG. 2, and is a front view corresponding to FIG.

  The reinforcing member 70 </ b> C has one end 70 x in the longitudinal direction X projecting in the longitudinal direction X from one end 60 x in the longitudinal direction X of the flexible substrate 60 and one in the orthogonal direction Y. The end 70yu on the side protrudes in the orthogonal direction Y from the one end 60yu in the orthogonal direction Y of the flexible substrate 60, and the other end 70yd in the orthogonal direction Y corresponds to the flexible substrate 60. The reinforcing member 70 has the same configuration as that of the reinforcing member 70 except that the other end 60yd of the other orthogonal direction Y protrudes in the orthogonal direction Y.

  As described above, the end portion 70x of the reinforcing member 70C protrudes in the longitudinal direction X from the end portion 60x of the flexible substrate 60, and the end portion 70yu (end portion 70yd) of the reinforcing member 70C is the end portion of the flexible substrate 60. By protruding in the orthogonal direction Y from 60 yu (end portion 60 yd), the reinforcing effect of the semiconductor chip 50 can be further enhanced.

  In the reinforcing member 70 </ b> C, the position of the end portion 70 yu in the orthogonal direction Y may be the same as that of the end portion 60 yu of the flexible substrate 60. In the reinforcing member 70 </ b> C, the position of the end portion 70 yd in the orthogonal direction Y may be the same as that of the end portion 60 yd of the flexible substrate 60. Even if it is these structures, compared with the reinforcement member 70, the reinforcement effect of the semiconductor chip 50 can be heightened.

  In the imaging module 40, it is preferable that the surfaces of the reinforcing members 70, 70 </ b> A, 70 </ b> B, and 70 </ b> C on the flexible substrate 60 side are bonded to the flexible substrate 60 with an adhesive. According to this configuration, the deformation of the flexible substrate 60 can be prevented by the rigidity of the reinforcing member. For this reason, the attitude of the semiconductor chip 50 can be stabilized, and the effect of preventing damage to the semiconductor chip 50 or disconnection of the wiring connection can be enhanced.

  In the imaging module 40, the semiconductor chip 50 can be made thinner than the conventional one by the action of the reinforcing members 70, 70A, 70B, and 70C. Therefore, it is possible to protect the semiconductor chip 50 by bonding a ceramic plate such as zirconia having a thickness equivalent to that of the thinned semiconductor chip 50 to the back surface of the semiconductor chip 50.

  In the description so far, the first surface of each of the reinforcing members 70, 70 </ b> A, 70 </ b> B, 70 </ b> C opposite to the surface on the flexible substrate 60 side is the second surface opposite to the surface on the imaging surface 51 a side of the semiconductor chip 50. However, the present invention is not limited to this.

  For example, as shown in FIG. 9, the first surface is located closer to the imaging surface 51a than the second surface, or, as shown in FIG. 10, the first surface is imaging surface 51a from the second surface. It may be located on the opposite side to the side. Even with these configurations, the diameter of the endoscope 1 can be reduced if the semiconductor chip 50 is thinned.

  In the imaging module 40, a flexible flexible substrate 60 is used as a circuit substrate electrically connected to the semiconductor chip 50. However, a hard circuit substrate having no flexibility is used as the circuit substrate. May be.

  Even in the case of a hard circuit board, the rigidity of the circuit board is lowered by forming an opening for exposing the imaging surface 51a, so that it is effective to provide the reinforcing members 70, 70A, 70B, and 70C. It becomes. In the case where the circuit board is a flexible board, the rigidity is particularly likely to decrease due to the opening. For this reason, it is particularly effective to provide the reinforcing members 70, 70A, 70B, and 70C.

  As described above, the following items are disclosed in this specification.

(1) An imaging module provided at a distal end portion of an insertion portion of an endoscope, the circuit board having an opening facing an optical member provided at the distal end portion, and an imaging surface in a longitudinal direction of the insertion portion A semiconductor chip having an image sensor arranged in a parallel state, with the imaging surface facing the opening and electrically connected to the circuit board, and disposed on the outer periphery of the semiconductor chip An imaging module comprising: a frame-shaped reinforcing member that reinforces the semiconductor chip, the inner peripheral surface of which is bonded to the outer peripheral surface of the semiconductor chip.

(2) The imaging module according to (1), wherein the reinforcing member is further bonded to the circuit board.

(3) In the imaging module according to (1) or (2), the first surface of the reinforcing member opposite to the surface on the circuit board side is opposite to the surface on the imaging surface side of the semiconductor chip. An imaging module located on the same plane as the second surface on the side or on the imaging plane side with respect to the second plane.

(4) In the imaging module according to any one of (1) to (3), an end portion on the one side in the longitudinal direction of the reinforcing member is more than an end portion on the one side of the circuit board. An imaging module protruding in the longitudinal direction.

(5) The imaging module according to any one of (1) to (4), wherein an end portion of the reinforcing member in the orthogonal direction parallel to the imaging surface and orthogonal to the longitudinal direction is the circuit board. The imaging module which protrudes in the said orthogonal direction rather than the edge part of the said orthogonal direction.

(6) The imaging module according to any one of (1) to (5), wherein the reinforcing member is made of a material harder than the semiconductor chip.

(7) The imaging module according to (6), wherein the material is made of a ceramic or a carbon fiber composite material.

(8) The imaging module according to any one of (1) to (7), wherein an outer peripheral surface of the reinforcing member is parallel to an outer peripheral surface of the semiconductor chip.

(9) The imaging module according to any one of (1) to (8), wherein the circuit board is a flexible circuit board.

(10) An endoscope comprising: an insertion portion to be inserted into a subject; and the imaging module according to any one of (1) to (9) provided at a distal end portion of the insertion portion.

(11) An endoscope comprising the endoscope according to (10), a light source device to which the endoscope is connected, and a control device to which the endoscope is connected and which controls the endoscope and the light source device. Endoscopic device.

DESCRIPTION OF SYMBOLS 100 Endoscope 1 Endoscope 2 Main body part 3 Display part 4 Control apparatus 5 Light source device 6 Input part 10 Insertion part 10A Soft part 10B Bending part 10C Tip part 11 Operation box 12 Angle knob 13 Universal code 40 Imaging module 41 Lens Lens barrel 42 Prism holder 43 First lens 44 Second lens 45 Third lens 46 Fourth lens 47 Prism 50 Semiconductor chip 51 Imaging element 51a Imaging surface 52 Spacer 53 Translucent member 60 Flexible substrate 60a One end 60b Opening portion 60c Bending portion 60d Linear portion 60e Other end portion 60f Branch portion 60g Sub-board 61 Cover 62 Soldering portions 70, 70A, 70B, 70C Reinforcing members 70x, 70yu, 70yd End portions 60x, 60yu, 60yd End portion 80 Signal Cable 81 Signal line

Claims (11)

An imaging module provided at a distal end portion of an insertion portion of an endoscope,
A circuit board having an opening facing the optical member provided at the tip;
A semiconductor chip having an imaging element arranged in a state in which the imaging surface is parallel to the longitudinal direction of the insertion portion, and arranged in a state in which the imaging surface faces the opening and electrically connected to the circuit board When,
An imaging module comprising: a frame-shaped reinforcing member that is disposed on an outer periphery of the semiconductor chip and reinforces the semiconductor chip, and has an inner peripheral surface bonded to the outer peripheral surface of the semiconductor chip. The imaging module according to claim 1,
The imaging module in which the reinforcing member is further bonded to the circuit board. The imaging module according to claim 1 or 2,
The first surface of the reinforcing member opposite to the surface of the circuit board is on the same surface as the second surface of the semiconductor chip opposite to the surface of the imaging surface or from the second surface. An imaging module located on the imaging surface side. The imaging module according to any one of claims 1 to 3,
An imaging module in which an end portion on one side of the reinforcing member in the longitudinal direction protrudes in the longitudinal direction from an end portion on the one side of the circuit board. The imaging module according to any one of claims 1 to 4,
An imaging module in which an end portion of the reinforcing member in the orthogonal direction parallel to the imaging surface and orthogonal to the longitudinal direction protrudes in the orthogonal direction from an end portion of the circuit board in the orthogonal direction. The imaging module according to any one of claims 1 to 5,
The reinforcing module is an imaging module made of a material harder than the semiconductor chip. The imaging module according to claim 6,
The imaging module is made of a ceramic or carbon fiber composite material. The imaging module according to any one of claims 1 to 7,
An imaging module in which an outer peripheral surface of the reinforcing member is parallel to an outer peripheral surface of the semiconductor chip. The imaging module according to any one of claims 1 to 8,
The imaging module, wherein the circuit board is a flexible circuit board. An insertion part to be inserted into the subject;
An endoscope comprising: the imaging module according to claim 1 provided at a distal end portion of the insertion portion. An endoscope according to claim 10;
A light source device to which the endoscope is connected;
An endoscope apparatus comprising: the endoscope connected to the endoscope; and a control device that controls the endoscope and the light source device.

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