JPH11261222A - Manufacture of multilayered wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayered wiring board manufacturing method by which a multilayered wiring board in which a wiring pattern is formed in a highly uniform thickness can be manufactured by transferring multilayered wiring to one surface of a base substrate for multilayered wiring board by using a plurality of plates for transfer having wiring sections. SOLUTION: In a multilayered wiring board manufacturing method in which wiring 131 is formed by successively transferring the wiring sections composed of conductive layers having prescribed shapes and formed on substrates 110 of a plurality of plates for transfer to a base substrate 180 side for multilayered wiring board by successively press-contacting the plates for transfer having the wiring sections with the base substrate 180, the wiring sections on the substrate 110 are formed by selective plating. At the time of performing selective plating for forming the wiring sections, extra wiring patterns 135 having prescribed shapes are simultaneously plated around the wiring sections and, when the wiring sections are transferred to the base substrate 180, the extra wiring pattern sections 135 are covered with a masking material 160 so as to prevent the transfer of the sections 135 to the substrate 180.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer wiring board having a high definition wiring with high productivity. It relates to a manufacturing method.

[0002]

2. Description of the Related Art With the rapid development of semiconductor manufacturing technology,
The miniaturization of semiconductor packages, the increase in the number of pins, the fine pitch, and the miniaturization of electronic components have rapidly progressed, and the era of so-called high-density mounting has entered. Along with this, printed wiring boards have also shifted from single-sided wiring to double-sided wiring, and further multilayering and thinning have been promoted. At present, a subtractive method and an additive method are mainly used for forming a copper pattern on a printed wiring board. The subtractive method is
After drilling holes in a copper-clad laminate, copper plating is performed on the inside and surface of the holes, and a pattern is formed by photoetching. This subtractive method is technically highly complete and inexpensive, but it is difficult to form a fine pattern due to restrictions such as the thickness of the copper foil. On the other hand, in the additive method, a resist is formed on the part of the laminate containing the catalyst for electroless plating other than the circuit pattern forming part, and a circuit pattern is formed on the exposed part of the laminate by electroless copper plating or the like. How to This additive method is
Although it is possible to form a fine pattern, there are difficulties in terms of cost and reliability.

In the case of a multilayer wiring board, a method of laminating a single-sided or double-sided printed wiring board prepared by the above method or the like together with a prepreg in a semi-cured state in which a glass cloth is impregnated with an epoxy resin or the like is laminated under pressure. Is used. In this case, the prepreg serves as an adhesive for each layer, and a connection between the layers is made by forming a through hole and performing electroless plating or the like inside. In addition, with the progress of high-density mounting, multilayer wiring boards are required to be thinner and lighter, while at the same time high wiring capacity per unit area is required. Ingenuity has been devised. However, the production of a multilayer wiring board using a double-sided printed wiring board manufactured by the above-described subtractive method requires higher density due to the accuracy of drilling for forming holes in the double-sided printed wiring board and the limit of miniaturization. And it was difficult to reduce the production cost.

On the other hand, a multilayer wiring board which is manufactured by sequentially laminating a conductor pattern layer and an insulating layer on a base material has been developed to satisfy the demand for thinner, lighter weight and higher density wiring. Since this multilayer wiring board is manufactured by alternately performing photo-etching of the copper plating layer and patterning of the photosensitive resin, high-definition wiring and interlayer connection at an arbitrary position are possible. However, the production of this multi-layer wiring board is performed a plurality of times by alternately performing copper plating and photo-etching, which complicates the process.Moreover, if a trouble occurs in an intermediate process due to a series process in which one layer is stacked on the board, Reproduction of the product became difficult, which hindered the reduction of manufacturing costs. Further, in the conventional multilayer wiring board, since the connection between the layers is performed by forming via holes, a complicated photolithography step is required, which hinders a reduction in manufacturing cost.

[0005] As a multilayer wiring board which can cope with miniaturization and high-density wiring, does not require a complicated process, and can cope with mass production, the present applicant has already proposed a multi-layer wiring board which is sequentially transferred onto a base substrate. A multilayer wiring board provided with a wiring portion, wherein the wiring portion of each layer is fixed to a base substrate or a lower wiring portion by an insulating resin layer formed below the wiring portion, and a method of manufacturing the multilayer wiring board is also proposed. Has been proposed.
(Japanese Patent Application No. 6-220962) However, in the production of this multilayer wiring board, the wiring portion is formed on the transfer master by plating in a predetermined wiring shape, and the insulating resin layer is also formed at the stage of manufacturing the transfer master. It is formed by electrodeposition only on the wiring part, and when forming the wiring part and the insulating resin layer, their peripheral parts become thick and uneven due to the effect of electrolytic concentration. There is a problem.

[0006]

SUMMARY OF THE INVENTION Under such circumstances, the present invention can cope with miniaturization and high-density wiring, does not require a complicated process, has high productivity, and is suitable for mass production. It is an object of the present invention to provide a method of manufacturing a substrate that can cope with the quality. Specifically, a plurality of transfer masters having wiring portions formed thereon were used, and each transfer master was sequentially pressed on one surface of a base substrate for a multilayer wiring board, and each wiring portion was provided on the wiring portion. What is claimed is: 1. A method for manufacturing a multi-layer wiring board, comprising forming a multi-layer wiring by sequentially transferring to a base substrate via an insulating resin layer, the method comprising: It is intended to provide.

[0007]

According to the present invention, there is provided a method for manufacturing a multilayer wiring board, comprising the steps of: using a plurality of transfer masters provided with a wiring portion comprising a conductive layer of a predetermined shape on a support; Each transfer original plate is pressed on one side of the base substrate in order,
A method of manufacturing a multilayer wiring board in which each wiring portion is sequentially transferred to a base substrate side to form wiring, wherein a transfer master is pressed against the base substrate side and a support of the transfer master is peeled off. In the transfer step of transferring the wiring portion of the original to the base substrate side, a peripheral region of the wiring portion region on the wiring portion side of the transfer original plate is covered with a masking material and pressure-bonded to the base substrate. And in the above,
The wiring portion on the support of the transfer master is formed by selective plating, and at the time of selective plating for forming the wiring portion,
Around the wiring portion together with the wiring portion, a predetermined shape of a discarded wiring pattern is formed by plating, and when the wiring portion is transferred to the base substrate side, the discarded wiring pattern portion is covered with a masking material, and the discarded wiring pattern portion is formed. The transfer is performed while preventing the transfer to the base substrate.
In addition, the transfer master plate is provided with a wiring portion made of a conductive layer of a predetermined shape, or a wiring portion and a discarded wiring pattern on at least a surface of a conductive support, and has an adhesive on the conductive layer. (A) forming a conductive layer for forming a wiring portion or a wiring portion and a discarded wiring pattern on one surface of a support by selective plating on one surface of a support; And (b) a resin layer forming step of forming an insulating resin layer or a conductive resin layer by electrodeposition on the conductive layer formed by the selective plating step. It is a feature. In the above, a metal foil having an opening in a wiring region of a wiring portion and having a thickness of 10 to 100 μm is used as the masking material. Alternatively, in the above, the masking material has an opening in the wiring region of the wiring portion and has a thickness of 10 to 1 mm.
It is characterized in that a polymer film having a thickness of 00 μm is used, and the polymer film has a heat resistance of 200 ° C. or more.

[0008]

According to the method of manufacturing a transfer master of the present invention, by adopting such a structure, it is possible to manufacture a transfer master having high uniformity of the film thickness of a wiring portion. A multi-layer wiring board manufacturing method using a transfer master that is not required, is suitable for mass production, and can respond to miniaturization and high density of wiring, and has high uniformity of the film thickness of the wiring part. It enables the manufacture of wiring boards. Specifically, using a plurality of transfer masters provided with a wiring portion made of a conductive layer of a predetermined shape on a support, and sequentially pressing each transfer master on one surface of a base substrate for a multilayer wiring board. A method of manufacturing a multilayer wiring board in which wiring portions are sequentially transferred to a base substrate side to form wiring, and a transfer original plate is pressure-bonded to the base substrate side;
In the transfer step of transferring the wiring portion of the transfer master to the base substrate side by peeling off the support of the transfer master, the peripheral region of the wiring portion region on the wiring portion side of the transfer master is covered with a masking material to form a base. By press-bonding to the substrate, the wiring portion on the support of the transfer master is formed by selective plating. In order to prevent the transfer of the discarded wiring pattern portion to the base substrate, cover the discarded wiring pattern portion with a masking material when transferring the wiring portion to the base substrate side. Meanwhile, this is achieved by performing the transfer. In other words, by the masking material, at the time of transfer,
Pressure bonding can be performed on the entire area of the wiring portion while keeping the distance between the surface of the support and the surface of the base substrate substantially the same, thereby enabling uniform transfer over the entire area of the wiring portion.

Further, the wiring portion on the support of the transfer original plate is formed by selective plating. In the selective plating for forming the wiring portion, a predetermined shape of the wiring portion is disposed around the wiring portion together with the wiring portion. By forming the wiring pattern by plating, the uniformity of the plating film in the wiring portion is improved.

Further, a specific method of manufacturing the transfer master includes (a) a selective plating step of forming a conductive layer for forming a wiring portion or a wiring portion and a waste wiring pattern on one surface of a support by selective plating. And (b) sequentially performing a resin layer forming step of forming an insulating resin layer or a conductive resin layer by electrodeposition on the conductive layer formed by the selective plating step. In particular, according to this method, if a discarded wiring pattern is provided around the wiring portion, the thickness of the conductive layer of the wiring portion formed by plating, and the transfer of the wiring portion formed on the conductive layer for transfer are performed. The thickness of the insulating resin or conductive resin having tackiness or adhesiveness can be formed with good uniformity.

As the masking material, a metal foil having a thickness of 10 to 100 μm having an opening in the wiring region of the wiring portion and a polymer film having a thickness of 10 to 100 μm having an opening in the wiring region of the wiring portion can be applied. In particular, in order to increase the heat resistance against the temperature at the time of pressing, the polymer film has a temperature of 200 ° C.
Those having the above heat resistance are preferable from the viewpoint of transferability of the wiring portion made of the conductive layer.

After all, the method of manufacturing a wiring board according to the present invention is a method of manufacturing a wiring board in which the wiring portions of the respective transfer masters are sequentially transferred to the base substrate side to form wiring, and does not require complicated steps. In addition, it is possible to cope with mass production with good productivity, and furthermore, it is possible to cope with miniaturization and high density of wiring, and it is possible to manufacture a multilayer wiring board with high uniformity of a film thickness of a wiring portion.

Note that the wiring portion is not formed by selective plating,
In addition, even when a discarded wiring pattern is not provided, a predetermined shape of tackiness or adhesion conforming to the shape of the wiring portion is provided on a thin film made of a conductive layer provided on one surface of the support of the transfer master. Even if a resin layer is formed and the conductive layer is etched using the mask as a mask to form a wiring portion,
A transfer wiring board having good uniformity of the wiring thickness of the wiring in the wiring portion can be formed. Of course, the wiring portion is transferred to the base substrate side via the above-mentioned adhesive or adhesive resin layer. In this case, the formation of the thin film composed of the conductive layer on the support,
The support may be bonded to a metal foil such as a copper foil, or may be formed by applying electroless plating on the support, and then applying electrolytic plating thereon. A support may be used and formed thereon by electrolytic plating. The resin layer having a predetermined shape having tackiness or adhesiveness can be formed by a photolithography method, an etching method, a dispensing method, a printing method, or the like.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, an embodiment of a method for producing a transfer master according to the present invention will be described with reference to the drawings. FIG.
Is a process diagram showing an example of the embodiment, FIG. 2 is a plan view showing a configuration of a transfer master, and FIG. 3 is a plan view showing a masking material. 1 (a) to 1 within the dotted line in FIG.
FIG. 1F shows a transfer process using the transfer master 201 (S11).
0 is a process cross-sectional view illustrating a schematic process (a transfer process of No. 0), and S110 to S130 indicate processing steps. 2 shows the area of the wiring section, the area 210A in the dotted line in FIG. 3 shows the size of the area of the wiring section, and the area 200A in the dotted line shows the size of the area of the transfer original. It is shown. 1 to 3, reference numeral 110 denotes a support (of a transfer original), 120 denotes a resist, 125 denotes an opening, 130 denotes a conductive layer, 131 denotes a wiring, 135 denotes a waste wiring pattern, 140 denotes an insulating resin layer, 160 Is a masking material, 180 is a base substrate (for a multilayer wiring board), 200, 201, 202, and 203 are transfer masters, 200A is a transfer master area size, 210
Indicates the area of the wiring section, and 210A indicates the area size of the wiring section.

One embodiment of a method for manufacturing a multilayer wiring board according to the present invention will be described with reference to FIG. In the example shown in FIG. 1, a transfer master having a wiring portion made of a conductive layer having a predetermined shape provided on a support is prepared in three plates (201, 202, and 203).
An example of a method for manufacturing a multilayer wiring board in which each transfer master is sequentially pressed on one surface of a base substrate 180 for a multilayer wiring board to form wiring by sequentially transferring each wiring portion to the base substrate side. In the transfer step of pressing each transfer master to the base substrate 180 side and peeling the support of the transfer master to transfer the wiring section of the transfer master to the base substrate side, the wiring on the wiring section side of the transfer master is used. The region other than the region is covered with the masking material 160 and pressure-bonded to the base substrate 180. Each transfer original used here is provided with a discarded wiring pattern made of the same conductive layer as that for forming the wiring portion around a predetermined wiring portion to be transferred together with the wiring portion for transfer. Further, an insulating resin layer having tackiness or adhesiveness is laminated on the wiring portion on the support and the discarded wiring pattern. During transfer, the discarded wiring pattern portion other than the wiring portion region on the wiring portion side of each transfer master is covered with a masking material to prevent transfer of the discarded wiring pattern portion to the base substrate.

In the example shown in FIG. 1, the transfer master 201 is first pressed against one surface of the base substrate 180, the support is peeled off, and the wiring portion is transferred to the base substrate 180 (S110). Similarly, the wiring portion of the transfer original plate 202 is transferred to the surface of the transfer original plate 201 on the side where the wiring portion is formed (S120).
Similarly, the wiring portions of the transfer master 203 are transferred and formed on the surface of the transfer masters 201 and 202 on which the wiring portions are formed (S130), thereby forming a multilayer wiring board having three wiring portions. However, in any of the transfer steps, the discarded wiring pattern portion is covered with a masking material and pressed to transfer only the wiring portion.
Only the transfer step 1 will be described with reference to FIGS.
The transfer process of the transfer masters 202 and 203 is similar to this, and the description thereof is omitted.

The transfer step of the transfer master 201 (the transfer step of S110) is performed as follows. First, a plating-resistant resist 120 is formed on a support 110 having a conductive surface (FIG. 1A) in a predetermined shape corresponding to the shape of the wiring portion. (FIG. 1 (b)) As the support, a stainless steel substrate (SUS304) or the like is used. However, the support is not particularly limited, but a material having good wiring releasability is preferable. As the resist 120, a resist having plating resistance and good processability is preferable. Next, a conductive layer is formed in the opening 125 of the resist by plating. (FIG. 1C) The wiring portion 131 and the discarded wiring pattern 135 are simultaneously formed by plating. As the conductive layer 130 forming the wiring portion and the like, plated copper is preferable in terms of conductivity and cost, but if necessary, Ni (nickel), Au (gold),
Cr (chromium), Ag (silver), Pt (platinum) or the like may be used, and its thickness depends on the width of the wiring, but needs to be 1 μm or more. Next, an insulating resin layer 140 is electrodeposited on the wiring 131 and the discarded wiring pattern 135 made of the conductive layer 130. (Fig. 1 (d))

The insulating resin layer 140 is formed by using an electrode layer provided on the wiring 131 by electrodeposition as it is as an adhesive layer.
Can be continuously formed, thereby improving mass productivity. The insulating resin layer 140 has an electrodeposition property,
Any polymer may be used as long as it exhibits tackiness at normal temperature or when heated, and examples of the polymer used include anionic or cationic synthetic polymer resins having tackiness.

As the anionic synthetic polymer resin, an acrylic resin, a polyester resin, a maleated oil resin, a polybutadiene resin, an epoxy resin, a polyamide resin, a polyimide resin, etc., alone or in any combination of these resins Can be used as a mixture. Further, the above-mentioned anionic synthetic resin may be used in combination with a crosslinkable resin such as a melamine resin, a phenol resin and a urethane resin.
In addition, as the cationic synthetic polymer resin, an acrylic resin, an epoxy resin, a urethane resin, a polybutadiene resin, a polyamide resin, a polyimide resin, or the like can be used alone or as a mixture of any combination thereof. Further, the above cationic synthetic polymer resin and a crosslinkable resin such as a polyester resin and a urethane resin may be used in combination. Further, in order to impart tackiness to the polymer resin, a tackifying resin such as a rosin-based resin, a terpene-based resin, or a petroleum resin can be added as necessary. The polymer resin is subjected to an electrodeposition method in a state of being neutralized by an alkaline or acidic substance and solubilized in water, or in a water-dispersed state. That is, the anionic synthetic polymer resin is neutralized with amines such as trimethylamine, diethylamine, dimethylethanolamine, and diisopropanolamine, and with an inorganic alkali such as ammonia and potassium hydroxide. The cationic synthetic polymer resin is neutralized with an acid such as acetic acid, formic acid, propionic acid, and lactic acid. Then, the polymer resin solubilized in the neutralized water is used in a state of being diluted with water as a water dispersion type or a solution type.

Next, the wiring portion side of the transfer original plate 100 formed in FIG.
Transfer master 1 via masking material 160 toward 0
00 and the base substrate 180 are crimped. (FIG. 1E) The masking material 160 is provided around the wiring portion.
Thereby, it is possible to perform pressure bonding on the entire area of the wiring portion while keeping the distance between the surface of the support and the surface of the base substrate substantially the same. As a masking material, a metal foil having an opening in the wiring region of the wiring portion having a thickness of 10 to 100 μm having a good uniformity, and a thickness of 10 to 10 μm having an opening in the wiring region of the wiring portion.
A polymer film having a uniform thickness of 100 μm or the like can be applied. In particular, in order to increase the heat resistance against the temperature at the time of pressing, the polymer film has a heat resistance of 200 ° C. or higher. This is preferable from the viewpoint of transferability of the wiring portion made of a conductive layer.

Next, the support 110 side is connected to the base substrate 110.
By separating from the side, only the wiring portion (wiring 131) can be transferred and formed on the base substrate side via the insulating resin layer 140. (FIG. 1F) The masking material 160 is adhered to the disposal pattern 135 side via the insulating resin layer 140 and does not remain on the base substrate 110. In this way, the transfer can be performed uniformly over the entire area of the wiring portion.

After the wiring portion of the transfer master 201 has been transferred to the base substrate in this manner, the wiring portion of the transfer master 202 is similarly transferred to the transfer master 20 of the base substrate 180.
1 is transferred to the surface on which the wiring portion 1 is formed (S120).
In the same manner, the wiring portions of the transfer master 203 are transferred to the transfer masters 201 and 202 of the base substrate 180.
Is formed on the surface on the side where the wiring portion is formed. (S13
0 transfer process) In this way, a multilayer wiring board having three wiring portions is obtained.

(Modification) In the example shown in FIG. 1, the wiring portion has three layers. However, as a modification, the transfer master may be formed by using two plates and the wiring portion may be formed by two layers. 4 for master
It is also possible to use four or more layers by using a plate or more. Of course, in the same manner, it is also possible to manufacture a wiring board having only one wiring master and a wiring portion using only one transfer master.

In the case of the example shown in FIG. 1, it is necessary that the surface of the support has conductivity. For example, by transferring a wiring portion or a discarded wiring pattern from another transfer master onto the support. When formed, the support does not necessarily need to have conductivity. In this case, the support is not particularly limited, such as a polymer film, a metal substrate, and a glass substrate. In addition, the support in the example of FIG. 1 may be processed so that only the surface on which the wiring portion is to be formed has conductivity without making the whole conductive. The masking effect can be obtained even if the insulating resin layer 140 in the example of FIG. 1 is formed by a method other than electrodeposition, for example, by a dispensing method or a printing method.

FIG. 2 shows the arrangement of the wiring section area 210 and the discard pattern area 220 in the transfer master 200. The discard pattern area 220 is provided all around the wiring section area 210. FIG. 3 shows the shape and size of the masking material in comparison with the wiring section area size 210A and the transfer original area size 200A. The masking material is a discarded wiring pattern 2 of the transfer master 200.
20 and does not reach the wiring area 210A, thereby preventing the transfer of the discarded pattern around the wiring section to the base substrate 110 during the transfer.

[0026]

(Example) In the example, according to the process shown in FIG. 1, the transfer wiring board is used in three plates (corresponding to 201, 202 and 203), and the wiring portions of each transfer master are sequentially placed on the base substrate side. The multilayer wiring board is formed by transfer. This will be described below with reference to FIG. First, each transfer master 201 was prepared as follows. A 0.1 mm-thick stainless steel plate was prepared as the support 110 of the transfer master (FIG. 1).
(A)) Commercially available photoresist on this stainless plate
(OMR-85, manufactured by Tokyo Ohka Kogyo Co., Ltd.) is applied to a thickness of about 1 μm by spin coating, and then 85 ° in an oven.
C, after drying for 30 minutes, using a photomask provided with a predetermined pattern, performing contact exposure with an exposure device P-202-G (manufactured by Dainippon Screen Mfg. Co., Ltd.), and then developing, washing with water, Drying was performed, and a resist 120 was formed on a predetermined pattern so as to expose only a wiring portion and a region where a discarded wiring pattern was formed (FIG. 1B). Exposure conditions are
30 count was set. Next, the support 110 on which the resist 120 is formed and the phosphor-containing copper electrode are opposed to each other, and immersed in a copper sulfate plating bath having the following composition, and the phosphor-containing copper electrode is connected to the anode of the DC power supply, and the support 110 is connected to the cathode. , Current density 2A / d
A current of m ² was applied for 24 minutes, and a copper plating film having a thickness of about 10 μm was formed on the exposed portion of the support 110 which was not covered with the resist 120 by plating. (FIG. 1 (c)) ₂ (sulfate copper composition of the plating _{bath) CuSO 4 · 5H O 200g /} l H 2 SO 4 50g / l HCl 0.15ml / l (60ppm as Cl)

Next, an insulating adhesive layer (insulating resin layer 140) was formed by electrodeposition on the plated conductive layer, and a transfer master plate 200 was prepared. (FIG. 1 (d)) The electrodeposition of the insulating resin layer 140 is performed by immersing the support 110 on which the conductive layer 140 is formed and the platinum electrode to face each other, and immersing the electrodepositing solution prepared as described below. The support 110 was connected to the anode of the DC power supply, the platinum electrode was connected to the cathode,
Electrodeposition for 10 minutes at 150 ° C, 5
Dried on a hot plate for 30 minutes,
A μm insulating resin layer 140 (insulating adhesive layer) was formed.

A polyimide varnish was prepared as follows.
The electrodeposition liquid was adjusted. <Production of Polyimide Varnish> A stainless steel squirrel stirrer, a nitrogen inlet tube, and a reflux condenser equipped with a cooling tube with a ball on a trap with a stopcock are attached to an 11-volume three-neck separable flask. While flowing in a nitrogen stream, the separable flask was placed in a silicone bath equipped with a temperature controller and heated. The reaction temperature is indicated by bath temperature. 3,
32.22 g (0.1 mol) of 4,3 ′, 4′-benzophenonetetracarboxylic dianhydride (hereinafter referred to as BTDA), bis (4- (3-aminophenoxy) phenyl)
21.63 g (0.05 mol) of sulfone (m-BAPS), 1.5 g (0.015 mol) of palerolactone, 2.4 g (0.03 mol) of pyridine, NMP (N methyl 2
200 g of toluene and 30 g of toluene,
Stir at room temperature for 30 minutes in a silicon bath while passing nitrogen (2
00 rpm), and then the temperature was raised to 180 ° C. for 1 hour for 20 hours.
The reaction is carried out while stirring at 0 rpm. After removing 15 ml of toluene-water effluent, air-cooled and 6.11 g of BTDA
(0.05 mol) 3,5 diaminobenzoic acid (DA
15.216 g (0.1 mol), NMP1
19 g and 30 g of toluene are added, and the mixture is stirred at room temperature for 30 minutes (200 rpm). Then, the temperature is raised and the mixture is heated and stirred at 180 ° C. to remove 15 ml of toluene-water effluent. Then, while removing the toluene-water effluent from the system, 180
The reaction was completed by heating and stirring at 3 ° C. for 3 hours. A 20% polyimide varnish was obtained. The acid equivalent (the amount of polymer per 1 C00H is 1554) is 70. <Preparation of electrodeposition liquid> 100 g of 20% concentration polyimide varnish
3SN (NMP: tetrahydrothiophene-1, l-
Dioxide = 1: 3 (weight) mixed solution) 150 g, benzyl alcohol 75 g, methylmorpholine 5.0 g
(Neutralization rate: 200%) and 30 g of water are stirred to prepare an aqueous electrodeposition solution. The obtained aqueous electrodeposition solution was prepared using polyimide 7.4.
%, PH 7.8, is a dark reddish brown transparent liquid.

Next, the transfer master plate 200 prepared above is prepared.
Is a base substrate 1 made of a 100 μm thick stainless steel substrate.
(FIG. 1E) At the time of pressure bonding, as a masking material 160, a necessary wiring portion region is opened as shown in FIG. 3 and a discarded wiring pattern around the wiring portion region is formed. The insertion was performed between the 25 μm-thick polyimide film transfer master 200 and the base substrate 180. The pressure bonding was performed at a temperature of 200 ° C. and a pressure of 10 kgf / cm ² . Next, the support 110 side of the transfer master is separated from the base substrate 180 at room temperature,
A wiring pattern was formed on the base substrate 180. (Figure 1
(F))

Next, in the same manner as in the production of the transfer master 201, transfer masters 202 and 203 are formed, and the base plate 180 is sequentially placed on the surface of the transfer master 201 on which the wiring portion has been formed by transfer. Was transferred to form a multilayer wiring board. The transfer of the transfer masters 202 and 203
The transfer was performed under the same conditions as the transfer conditions of the transfer master 201.

[0031]

As described in detail above, according to the present invention,
By covering the area around the wiring section area on the wiring section side of the transfer original plate with a masking material and pressing it on a base substrate for a multilayer wiring board, the transfer can be performed evenly. The wiring part on the support of the transfer master is formed by selective plating, and at the time of selective plating for making the wiring part, around the wiring part together with the wiring part,
A discarded wiring pattern having a predetermined shape is formed by plating, and when the wiring portion is transferred to the base substrate side, the discarded wiring pattern portion is covered with a masking material to prevent transfer of the discarded wiring pattern portion to the base substrate. By performing the transfer, the uniformity of the film thickness of the wiring part can be improved, and the transfer of only the wiring part can be performed. As a result, the present invention is a method for manufacturing a multilayer wiring board using a transfer master, which does not require a complicated process and is suitable for mass production with good productivity. This makes it possible to provide a method for manufacturing a multilayer wiring board capable of manufacturing a wiring board having a high uniform film thickness in a portion.

[Brief description of the drawings]

FIG. 1 is a process sectional view of an example of an embodiment of a method for manufacturing a multilayer wiring board of the present invention.

FIG. 2 is a plan view of the transfer master for explaining the transfer master.

FIG. 3 is a plan view for explaining the shape and size of a masking material.

[Explanation of symbols]

110 Support 120 Resist 125 Opening 130 Conductive Layer 131 Wiring 135 Discarded Wiring Pattern 140 Insulating Resin Layer 160 Masking Material 180 Base Substrate 200, 201, 202, 203 Transfer Master 200A Transfer Master Region Size 210 Wiring Area 210A Wiring area size 220 Discarded wiring pattern area

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[Procedure amendment]

[Submission date] May 22, 1998

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0028

[Correction method] Change

[Correction contents]

A polyimide varnish was prepared as follows.
The electrodeposition liquid was adjusted. <Manufacture of Polyimide Varnish> A 3-liter separable flask with a capacity of 1 liter was equipped with a stainless steel squirrel stirrer, a nitrogen inlet tube, and a reflux condenser equipped with a cooling tube with a ball on a trap with a stopcock. While flowing in a nitrogen stream, the separable flask was placed in a silicone bath equipped with a temperature controller and heated. The reaction temperature is indicated by bath temperature. 3,
32.22 g (0.1 mol) of 4,3 ′, 4′-benzophenonetetracarboxylic dianhydride (hereinafter referred to as BTDA), bis (4- (3-aminophenoxy) phenyl)
21.63 g (0.05 mol) of sulfone (m-BAPS), 1.5 g (0.015 mol) of γ-valerolactone, 2.4 g (0.03 mol) of pyridine, NMP (N
-Methyl-2-pyrrolidone) 200 g, toluene 3
0 g, stirred at room temperature for 30 minutes (200 rpm) in a silicon bath while passing nitrogen, and then heated to 180
The reaction is carried out at 200 ° C. for 1 hour with stirring.
After removing 15 ml of toluene-water distillate, air-cooled,
16.11 g (0.05 mol) of DA, 15.216 g (0.1%) of 3,5 diaminobenzoic acid (hereinafter referred to as DABz)
Mol), NMP (119 g) and toluene (30 g) were added, and the mixture was stirred at room temperature for 30 minutes (200 rpm).
Was removed. Thereafter, the reaction was terminated by heating and stirring at 180 ° C. for 3 hours while removing the toluene-water distillate outside the system. A 20% polyimide varnish was obtained. The acid equivalent (the amount of polymer per C00H is 1554) is 70. <Preparation of electrodeposition liquid> 100 g of 20% concentration polyimide varnish
3SN (NMP: tetrahydrothiophen-1,1-
Dioxide = 1: 3 (weight) mixed solution) 150 g, benzyl alcohol 75 g, methylmorpholine 5.0 g
(Neutralization rate: 200%) and 30 g of water were stirred to prepare an aqueous electrodeposition solution. The obtained aqueous electrodeposition solution was prepared using polyimide 7.4.
%, PH 7.8, and a dark reddish brown transparent liquid.

Claims (6)

[Claims] 1. A plurality of transfer masters provided with a wiring portion made of a conductive layer having a predetermined shape on a support, and each transfer master is sequentially pressed on one surface of a base substrate for a multilayer wiring board. A method for manufacturing a multilayer wiring board in which each wiring portion is sequentially transferred to a base substrate side to form wiring, wherein a transfer original plate is pressure-bonded to the base substrate side and transferred by peeling a support of the transfer original plate. In a transfer step of transferring a wiring portion of the original master to the base substrate side, a multi-layer wiring board characterized in that a peripheral region of a wiring portion region on the wiring portion side of the transfer original master is covered with a masking material and pressure-bonded to the base substrate. Manufacturing method. 2. The wiring portion according to claim 1, wherein the wiring portion on the support of the transfer original plate is formed by selective plating, and at the time of selective plating for forming the wiring portion, the wiring portion is formed around the wiring portion together with the wiring portion. When a wiring pattern of a predetermined shape is formed by plating and the wiring part is transferred to the base substrate side, the waste wiring pattern part is covered with a masking material to prevent the transfer of the waste wiring pattern part to the base substrate. A method for producing a multilayer wiring board, while performing transfer. 3. The transfer master according to claim 1, wherein at least a surface portion of the transfer master is provided with a conductive portion having a predetermined shape on a conductive support, or a wiring portion and a waste wiring pattern. In addition, an insulating resin layer or a conductive resin layer having tackiness or adhesiveness is laminated on the conductive layer, and (a) a wiring portion or a wiring portion and a discarded wiring pattern are formed on one surface of a support by selective plating. A selective plating step of forming a conductive layer to be formed, and (b) a resin layer forming step of forming an insulating resin layer or a conductive resin layer by electrodeposition on the conductive layer formed by the selective plating step. A method for manufacturing a multilayer wiring board. 4. The semiconductor device according to claim 1, wherein the masking material has an opening in a wiring region of the wiring portion.
A method for producing a multilayer wiring substrate, comprising using a metal foil having a thickness of 100 μm. 5. The semiconductor device according to claim 1, wherein the masking material has an opening in a wiring region of the wiring portion.
A method for producing a multilayer wiring substrate, comprising using a polymer film having a thickness of from 100 μm to 100 μm. 6. The polymer film according to claim 5, wherein
A method for producing a multilayer wiring board, having a heat resistance of at least 00 ° C.