JPH1126120A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance mounting efficiency and productivity by arranging a socket main body surface mounted on a printed circuit board and having a contact part capable of connecting an IC on the inside, and a cover body detachably fit to the socket main body and capable of being sucked with an automatic component mounting machine. SOLUTION: A cover body 3 has a shape for covering a contact part 8, capable of being sucked with an automatic component mounting machine 9, and is detachably fit to a socket main body 2. The cover body 3 has a recessed groove fitting so as to be capable of sliding on rails 2a, 2b, is fit to the socket min body 2 to obstruct the entry of foreign matters and to protect a contact part 8. In automatic mounting, a suction nozzle 9a of an automatic component mounting machine 9 sucks the cover body 3, holds the socket main body 2, and surface mounts an IC socket 1 on a circuit board 5. After that, the cover body 3 is moved in the arrowed a-direction to be separated from the socket main body 2, and an IC 7 is moved in the arrowed b-direction and inserted into the socket main body 2 for connection.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket used for connecting an integrated circuit device (hereinafter referred to as "IC") on a circuit board.

[0002]

2. Description of the Related Art Generally, this type of IC socket is not handled as an automatic mounting component because it has a special shape, and a special facility is required if the IC socket is automatically mounted on a circuit board. It is said.

Conventionally, this type of IC socket is a DIP
(Dual In-Line Package) A component provided with a lead having the same configuration as that of a component is employed. On the other hand, a circuit board on which such an IC socket is mounted is provided with through holes for mechanically and electrically connecting leads.

[0004]

By the way, this kind of I
Since the C socket has the same lead configuration as the lead configuration of the DIP components, it is necessary to provide a through hole in the circuit board corresponding to the lead shape when mounted on the circuit board. As a result, components cannot be mounted in the opening of the through hole and the periphery of the opening, and there is a problem that mounting efficiency is reduced due to restrictions on mounting design.

In a conventional IC socket, DI
That the lead configuration is the same as the lead configuration of the P component
When mounting on a circuit board, it has to be performed manually, and there has been a problem that productivity is reduced.

[0006] The present invention has been made in view of such circumstances, and has as its object to provide an IC socket capable of improving mounting efficiency and increasing productivity.

[0007]

To achieve the above object, an IC socket according to claim 1 of the present invention is a socket body having a contact portion mounted on a surface of a circuit board and to which an IC can be connected. And a lid detachably provided on the socket body and capable of being sucked by an automatic component mounting machine. Therefore, at the time of automatic mounting, the lid mounted on the socket body is sucked by the automatic component mounting machine, and this is surface-mounted on the circuit board.

[0008] The invention according to claim 2 is the invention according to claim 1.
In the C socket, a gull-wing-shaped lead for connecting a contact portion and a circuit board is attached to a socket body. Therefore, the automatic component mounting is performed in the same process as the SOP component and the QFP component.

The invention described in claim 3 is the first or second invention.
In the above described IC socket, the lid is constituted by a lid covering the contact portion. Therefore, by attaching the lid to the socket main body, foreign matter intrusion into the socket main body is prevented and the contact portion is protected.

According to a fourth aspect of the present invention, in the IC socket according to the first, second or third aspect, the lid is detachably provided on the socket body. Therefore, when the 1C is connected to the socket body on the circuit board, the lid body is slid in the direction of detaching from the socket body, and when the IC is not connected, the lid body is slid in the direction of mounting on the socket body. Operation.

According to a fifth aspect of the present invention, there is provided the IC socket according to any one of the first to fourth aspects, wherein the cover has a deflected flat surface exposed to the outside. Therefore, the offset plane of the lid is sucked by the automatic component mounting machine during the automatic socket mounting.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described.
This will be described with reference to the drawings. FIG. 1 is an exploded perspective view showing an IC socket according to a first embodiment of the present invention, and FIGS.
FIG. 3C is a perspective view for explaining a procedure for automatically mounting the IC socket according to the first embodiment of the present invention. In FIG. 1, an IC socket denoted by reference numeral 1 includes a socket body 2, a lid 3, and leads 4.

The socket body 2 has two rails 2 which are parallel to each other and extend in the direction in which the leads 4 are arranged in parallel.
a, 2b, and a lead 4 is formed on a circuit board 5 by a pad 5a.
Surface mounting. The socket body 2 is provided with a large number of recesses 6 which are arranged in parallel in the same direction as the arrangement direction of the leads 4 at a predetermined interval and which are opened at the upper end surfaces of the rails 2a and 2b. In each of these recesses 6,
Contact section 8 to which IC 7 such as ROM, PAL, etc. can be connected
Is provided.

The lid 3 has a shape that covers the contact portion 8 and the like, and is made of a lid that can be sucked by the automatic component mounting machine 9 and is detachably provided on the socket body 2. As a result, the cover 3 is attached to the socket body 2 to prevent foreign matter from entering the socket body 2 and the contact portion 8 is protected.

The cover 3 is provided with concave grooves 3a and 3b which are slidably fitted to the rails 2a and 2b. Thus, when the IC 7 is connected to the socket body 2 on the circuit board 5, the direction in which the IC 7 is detached from the socket body 2 (FIG. 2).
The lid 3 is slid in the direction of the arrow a), and when the IC 7 is not connected, the lid 3 is slid in the direction of attachment to the socket body 2 (the direction opposite to the arrow a in the figure).

The upper surface of the lid 3 is formed with a deviated flat surface 3c exposed to the outside. Thereby, the suction nozzle 9a of the automatic component mounting machine 9 comes into contact with the uneven flat surface 3c during the automatic socket mounting, and the IC socket 1 is sucked.

The lead 4 has a contact portion 8 and a pad 5a.
And a gull-wing-shaped lead for connecting the lead and a part of the lead to the socket body 2 so as to be exposed to the outside. Thereby, SOP (Small Out-L)
Line Package) and QFP (Quad)
Flat package) automatic component mounting is performed in the same process as that of the component.

The lead arrangement of the lead 4 is
When the lead arrangement of the IC 7 mounted on the SOP component is the same as the lead arrangement of the DIP component, the same lead arrangement as the SOP component is adopted.

In the IC socket configured as described above, the lid 3 attached to the socket body 2 during automatic mounting is provided.
Is picked up by the automatic component mounting machine 9, and this is
Since it is surface-mounted on top, it can be mounted automatically.

Further, in this embodiment, the surface mounting of the socket body 2 on the circuit board 5 is not restricted by the mounting design as in the case of the conventional through-hole.

Next, a procedure for automatically mounting the IC socket according to the present embodiment will be described with reference to FIG. First,
A lid 3 previously mounted on the socket body 2 on a tray used for automatically mounting SOP, QFP components, etc.
(IC socket 1) is placed.

Next, as shown in FIG.
The lid 3 is sucked by the suction nozzle 9a of the automatic component mounting machine 9 used when automatically mounting FP components and the like. At this time, since the lid 3 is mounted on the socket main body 2, the socket main body 2 is held together with the lid 3 by the suction nozzle 9a.

Then, the IC socket 1 is surface-mounted on the circuit board 5 as shown in FIG. In this way, the IC socket can be securely mounted. Thereafter, the cover 3 is moved away from the socket body 2 by moving the cover body 3 in the direction of arrow a as shown in FIG. 4B, and the IC 7 is moved into the socket body 2 as shown in FIG. ) To make a mechanical and electrical connection.

In this embodiment, an example in which the present invention is applied to a case where the target IC is a DIP component has been described. However, the present invention is not limited to this, and as shown in FIG. (Plastic Lead
(Ed Chip Carrier) parts and QFP parts can be applied similarly to the embodiment. In this case, the contact portion 32 of the socket body 31 is made to correspond to the PLCC component or the QFP component, and the lead 33 is
Correspond to the lead of the FP component.

[0025]

As described above, according to the present invention, there is provided a socket body having a contact portion mounted on a surface of a circuit board and capable of connecting an IC therein, and an automatic component detachably provided on the socket body. Since the cover is provided with a lid that can be sucked by the mounting machine, the lid mounted on the socket body is sucked by the automatic component mounting machine during automatic mounting, and the surface is mounted on the circuit board.

Therefore, since the automatic component mounting can be performed, the productivity can be improved.

Further, since the socket body is surface-mounted on the circuit board, there is no restriction on the mounting design as in the case of the conventional through-hole, so that the mounting efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an IC socket according to a first embodiment of the present invention.

FIGS. 2A to 2C are perspective views showing a procedure for automatically mounting an IC socket according to the first embodiment of the present invention.

FIG. 3 is a perspective view showing an IC socket according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC socket 2 Socket main body 3 Lid 4 Lead 5 Circuit board 5a Pad 7 IC 8 Contact part 9 Automatic component mounting machine 9a Suction nozzle

Claims (5)

[Claims] 1. A socket body surface-mounted on a circuit board and having therein a contact portion to which an integrated circuit element can be connected, and a lid detachably provided on the socket body and adsorbable by an automatic component mounting machine. An IC socket comprising a body. 2. The I according to claim 1, wherein a gull-wing-shaped lead for connecting said contact portion and said circuit board is attached to said socket body.
C socket. 3. The IC according to claim 1, wherein the lid comprises a lid for covering the contact portion.
socket. 4. The IC socket according to claim 1, wherein said lid is detachably provided on said socket body. 5. The IC socket according to claim 1, wherein the lid has a deflected flat surface exposed to the outside.