JPH11260865A5 - - Google Patents

Info

Publication number
JPH11260865A5
JPH11260865A5 JP1998059877A JP5987798A JPH11260865A5 JP H11260865 A5 JPH11260865 A5 JP H11260865A5 JP 1998059877 A JP1998059877 A JP 1998059877A JP 5987798 A JP5987798 A JP 5987798A JP H11260865 A5 JPH11260865 A5 JP H11260865A5
Authority
JP
Japan
Prior art keywords
tab
adhesive
adhesive layer
adhesive tape
integer satisfying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998059877A
Other languages
English (en)
Japanese (ja)
Other versions
JP3951418B2 (ja
JPH11260865A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP05987798A priority Critical patent/JP3951418B2/ja
Priority claimed from JP05987798A external-priority patent/JP3951418B2/ja
Publication of JPH11260865A publication Critical patent/JPH11260865A/ja
Publication of JPH11260865A5 publication Critical patent/JPH11260865A5/ja
Application granted granted Critical
Publication of JP3951418B2 publication Critical patent/JP3951418B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP05987798A 1998-03-11 1998-03-11 Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置 Expired - Fee Related JP3951418B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05987798A JP3951418B2 (ja) 1998-03-11 1998-03-11 Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05987798A JP3951418B2 (ja) 1998-03-11 1998-03-11 Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置

Publications (3)

Publication Number Publication Date
JPH11260865A JPH11260865A (ja) 1999-09-24
JPH11260865A5 true JPH11260865A5 (enrdf_load_stackoverflow) 2005-09-02
JP3951418B2 JP3951418B2 (ja) 2007-08-01

Family

ID=13125831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05987798A Expired - Fee Related JP3951418B2 (ja) 1998-03-11 1998-03-11 Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置

Country Status (1)

Country Link
JP (1) JP3951418B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003327669A (ja) 2002-05-13 2003-11-19 Hitachi Chem Co Ltd エポキシ樹脂組成物及び接着剤
KR100860098B1 (ko) 2008-02-29 2008-09-26 주식회사 이녹스 반도체 패키지용 접착 필름
JP5934171B2 (ja) 2013-11-29 2016-06-15 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ インターボーザの厚さ決定方法、コンピュータプログラム、インターボーザおよびチップ実装構造体
CN113801605B (zh) * 2021-11-10 2022-03-25 宁波申山新材料科技有限公司 一种低表面能压敏胶粘带及其加工方法

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