JPH11256362A - Production of plate having metal faces with one face etched - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent warpage or curling caused in an etching process by laminating two plates each having metal faces on its surfaces with a thermoplastic resin layer into one body, etching the surfaces of the laminated body, and then dividing the laminated body into two plates. SOLUTION: For example, roughened surfaces of two sheets of electrolytic copper foil are subjected to release treatment, the roughened surfaces are faced to each other and laminated with a polyethylene film interposed, and further, the laminated sheets are inserted between two stainless plates, heated and pressed at a specified temp. and pressure for a specified time to produce a joined body of the two electrolytic copper foil sheets. Then photosensitive resist films are laminated on both surfaces of the joined body, which is then successively exposed, developed with a sodium carbonate aq. soln., etched with an etching liquid comprising copper (II) chloride and hydrochloric acid, and treated with a sodium hydroxide aq. soln. to remove the resist films. Finally, the joined body is divided into two sheets. Each separated electrolytic copper foil is in a normal state without warpage.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a plate having a metal surface having one surface etched. INDUSTRIAL APPLICABILITY The present invention is useful when a circuit is formed on one side of a double-sided copper-clad laminate by etching and the other side is entirely copper-coated and a double-sided printed wiring board is manufactured. In the present invention, the term “plate” also includes a thin plate which is generally called “foil”.

[0002]

2. Description of the Related Art In a double-sided printed wiring board, it is necessary to form a circuit by etching only one side and leave copper foil on the other side for the purpose of using one side as a ground layer or a heat radiation layer. is there. In addition, etching may be performed only on one side of the metal plate for the purpose of decoration or the like. In the present invention, a plate including a thin metal foil is also referred to as a plate.

[0003]

In such a case, a protective layer is formed on a surface which is not to be etched, and etching is performed one by one. However, when the thickness of the plate is reduced, the surface processed by etching and the surface not processed become uneven, so that warping or curling may occur even if the substrate is washed and dried after completion of etching. SUMMARY OF THE INVENTION It is an object of the present invention to prevent warpage and curl generated when only one side is etched.

[0004]

According to the present invention, two plates each having a metal surface on both sides are formed into a two-piece laminated body that is closely adhered and integrated via a thermoplastic resin layer. A method for producing a plate having a metal surface having one surface etched, characterized by performing etching and then separating into two pieces.

[0005]

DETAILED DESCRIPTION OF THE INVENTION Two plates having metal surfaces on both sides
As a method of forming a two-piece laminated body that is closely adhered and integrated via a thermoplastic resin layer, a method of sandwiching a thermoplastic resin film between two plates having metal surfaces on both sides, and heating and pressing,
Paste the adhesive film on the metal surface that is not to be etched, and place it so that the adhesive film is located between the two plates,
A method of applying heat and pressure, a method of applying a thermoplastic resin dissolved in a solvent to a metal surface to be etched and bringing the two plates into close contact and integration, and the like can be given. Examples of the plate having a metal surface on both sides include a double-sided copper-clad laminate, a copper foil and the like. From the viewpoint of workability, a method in which a thermoplastic resin film is sandwiched and heated and pressed is preferable. As a method of applying pressure, any of a method using a press, a method using a pressure roll, and the like may be used. The thickness of the thermoplastic resin layer is preferably from 10 to 500 μm, and more preferably from 30 to 200 μm. If it is less than 10 μm, the adhesion tends to be inferior, and it is not necessary to exceed 500 μm, and the cost tends to be high.

The thermoplastic resin used in the present invention includes:
Usually, a material having a melting point of about 20 to 250 ° C. can be used, but from the viewpoints of economy, workability, handleability, etc.
The thing of 0-150 ° C is preferred. Specifically, polyolefin resin, polystyrene resin, polyvinyl chloride resin, polyvinylidene chloride resin, polyvinyl acetate resin, acrylic resin, acrylonitrile resin, methacrylate resin, polyamide resin , Polyether-based resin, polyether-based resin, fluorine-based resin, polycarbonate-based resin, polyester-based resin, polyurethane-based resin, rubber-based resin, polyphenylene oxide-based resin, etc., alone, modified, mixed, composite, etc. Can be used as Inexpensive polyethylene, which is easy to peel off from the metal surface, is the most preferable material because it facilitates the separation operation after the completion of etching. In order to facilitate the separation operation after the end of the etching, it is preferable to perform a mold release treatment on the metal surface that is not etched.

[0007]

EXAMPLE 1 Two pieces of electrolytic copper foil having a thickness of 105 μm were subjected to a mold release treatment on the roughened surface, and the roughened surfaces were opposed to each other, and a polyethylene film (thickness of 100 μm, melting point of 95 mm) was interposed therebetween. ~ 105
C) was inserted between two stainless steel plates, which were inserted between two stainless steel plates, and heated and pressed at a temperature of 130 ° C. and a pressure of 3 MPa for 10 minutes to produce a two-piece body of electrolytic copper foil. Photosensitive resist films (made by Hitachi Chemical Co., Ltd., using PHOTEC (trade name), the same applies hereinafter) are laminated on both sides of the prepared two-piece electrolytic copper foil, and both sides are exposed,
The steps of developing with an aqueous solution of sodium carbonate, etching with an etching solution containing cupric chloride and hydrochloric acid (etching depth: about 50 μm), and removing the resist film with an aqueous solution of sodium hydroxide are performed in this order. The combined product was separated into two pieces. The separated electrolytic copper was normal without warp.

Example 2 An epoxy resin double-sided copper-clad laminate of 0.06 mm in thickness of an insulating layer and 12 μm of copper foil (MCL-E-67 (trade name) manufactured by Hitachi Chemical Co., Ltd.) On one side of the film, a polyethylene adhesive film (one-sided adhesive layer, base film thickness 30 μm, melting point 9)
At 5 to 105 ° C, Hitachi Chemical Co., Ltd., Hitalex film (trade name) was used. Two double-sided copper-clad laminates on which a polyethylene pressure-sensitive adhesive film is adhered are overlapped so that the polyethylene pressure-sensitive adhesive film faces each other, and this is inserted between the two stainless steel plates at a temperature of 130 ° C.
It was heated and pressed at a pressure of 3 MPa for 10 minutes to produce a double-sided copper-clad laminate. Laminating a photosensitive resist film on both sides of the two-sided copper-clad laminate, exposing both sides, developing with an aqueous solution of sodium carbonate, etching with an etching solution containing cupric chloride and hydrochloric acid (etching depth: 12 μm), The steps of removing the resist film using an aqueous sodium hydroxide solution were performed in this order, and finally, the double-sided copper-clad laminate was separated into two sheets. The double-sided copper-clad laminate was normal without warpage.

Comparative Example 1 A photosensitive resist film was laminated on both sides of the electrolytic copper foil used in Example 1, exposed only on the smooth surface, developed with an aqueous solution of sodium carbonate, and an etching solution composed of cupric chloride and hydrochloric acid. Etching (etching depth: about 5
0 μm), and a step of removing the resist film with an aqueous sodium hydroxide solution was performed in this order. Eight out of 100 electrolytic copper foils were curled.

Comparative Example 2 A photosensitive resist film was laminated on both surfaces of the double-sided copper-clad laminate used in Example 2, exposed only on the smooth surface, developed with an aqueous solution of sodium carbonate, and etched with an etching solution containing cupric chloride and hydrochloric acid. Etching (etching depth: 12
μm), the step of removing the resist film with an aqueous sodium hydroxide solution was performed in this order. The warpage of the double-sided copper-clad laminate was measured by the hanging method of JIS C-6481.
As a result, the warpage was 10%.

[0011]

According to the present invention, when manufacturing a plate having one surface etched and a metal surface on both surfaces, it is possible to eliminate warpage and curl due to unevenness of the etched surface and the non-etched surface. Can be.

Claims (1)

[Claims] 1. A two-piece laminated body in which two plates having metal surfaces on both sides are tightly integrated with a thermoplastic resin layer interposed therebetween, and both surfaces of the two-piece laminated body are subjected to an etching process. A method for producing a plate having a metal surface with one surface etched.