JPH11233551A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPH11233551A
JPH11233551A JP4869098A JP4869098A JPH11233551A JP H11233551 A JPH11233551 A JP H11233551A JP 4869098 A JP4869098 A JP 4869098A JP 4869098 A JP4869098 A JP 4869098A JP H11233551 A JPH11233551 A JP H11233551A
Authority
JP
Japan
Prior art keywords
wire
air
capillary
tip
ultrasonic horn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4869098A
Other languages
Japanese (ja)
Inventor
Katsuhiro Matsumura
勝弘 松村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP4869098A priority Critical patent/JPH11233551A/en
Publication of JPH11233551A publication Critical patent/JPH11233551A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H01L2224/78631—Means for wire tension adjustments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

PROBLEM TO BE SOLVED: To automatically extend a wire to the tip of a capillary when the wire is cut, to form a ball at the tip of the wire and to continue bonding. SOLUTION: An air tension part 5 is provided just above a wire clamp 1 and air is absorbed from the air supply discharge port of the air tension part 5. Thus, the wire 1 is fed out downward and conduction between the wire which is fed out from the tip of the capillary 2 and a discharge electrode 4 is detected. Then, a part between the tip of the wire 1 and the discharge electrode 4 is set to prescribed gap length. Even if the wire is cut during bonding, the wire 1 is automatically extended to the tip of the capillary 2, the ball is formed at the time of the wire 1 and bonding can be continued. Thus, effect that work efficiency improves is given.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、半導体デバイスの
組立工程において、第１ボンディング点、例えば半導体
部品としての半導体チップ（ＩＣチップ）上の電極（パ
ッド）と、第２ボンディング点、例えばフレームとして
のリードフレーム上の外部リードとをワイヤを用いて接
続するワイヤボンディング装置に関し、特にワイヤボン
ディングにおけるワイヤ切れ発生時の自動復帰が可能な
ワイヤボンディング装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for assembling a semiconductor device in which a first bonding point, for example, an electrode (pad) on a semiconductor chip (IC chip) as a semiconductor component, and a second bonding point, for example, a frame. In particular, the present invention relates to a wire bonding apparatus capable of automatically returning when a wire break occurs in wire bonding.

【０００２】[0002]

【従来の技術】従来、金線、アルミニウムなどからなる
ワイヤを用いて第１ボンディング点となる半導体チップ
上の電極と、第２ボンディング点となるリードとを接続
するワイヤボンディング装置は、二次元方向に移動可能
なＸＹテーブル上に搭載したボンディングヘッドのリニ
アモータ若しくはモータ軸に連結したカムなどの駆動力
により上下に揺動運動を行うボンディングアームの超音
波ホーンの先端に取り付けられたキャピラリから送り出
されたワイヤの先端と放電電極（以下、トーチロッドと
称する）との間に高電圧を印加することにより放電を起
こさせ、その放電エネルギーによりワイヤの先端を溶融
してキャピラリ内に挿通させたワイヤの先端にボールを
形成する。2. Description of the Related Art Conventionally, a wire bonding apparatus for connecting an electrode on a semiconductor chip serving as a first bonding point and a lead serving as a second bonding point using a wire made of gold wire, aluminum, or the like has been known in a two-dimensional direction. A linear motor of a bonding head mounted on a movable XY table or a cam connected to a motor shaft, etc., is sent out from a capillary attached to the tip of an ultrasonic horn of a bonding arm that swings up and down by a driving force. A discharge is caused by applying a high voltage between the tip of the wire and a discharge electrode (hereinafter, referred to as a torch rod), and the discharge energy melts the tip of the wire and inserts the wire into the capillary. Form a ball at the tip.

【０００３】そして、キャピラリの先端に保持されたボ
ールを第１ボンディング点である半導体チップ上の電極
にボンディングアームを揺動させて機械的な加圧力によ
り押しつけつつ、超音波及び加熱手段を併用して熱圧着
を行い第１ボンディング点に対してワイヤを接続する。The ball held at the tip of the capillary is pressed against the electrode on the semiconductor chip, which is the first bonding point, by swinging the bonding arm and pressing with mechanical force, while using ultrasonic waves and heating means together. Thermocompression bonding to connect a wire to the first bonding point.

【０００４】図８（ａ）乃至（ｄ）は、従来のワイヤボ
ンディング装置によるワイヤボンディング工程の説明図
である。FIGS. 8A to 8D are diagrams for explaining a wire bonding process by a conventional wire bonding apparatus.

【０００５】図８（ａ）及び（ｂ）に示すように、キャ
ピラリ２の先端に送り出したワイヤ１の先端とトーチロ
ッド４との間で放電を一定の時間起こさせてワイヤ１の
先端を溶融してボール２０を形成する。そして、図８
（ｃ）に示すように、キャピラリ２の先端で保持してキ
ャピラリ２を第１ボンディング点１５なる半導体チップ
１３上の電極１２の上方に位置させ、キャピラリ２を下
降させてボール２０を電極１２に押しつけて加圧を加え
ると同時にキャピラリ２の先端に対して前記ボンディン
グアームの超音波ホーンを介して超音波振動を印加して
半導体チップ１３上の電極１２にワイヤ１をボンディン
グ接続する。As shown in FIGS. 8A and 8B, a discharge is caused between the tip of the wire 1 sent to the tip of the capillary 2 and the torch rod 4 for a certain period of time to melt the tip of the wire 1. Thus, the ball 20 is formed. And FIG.
As shown in (c), the capillary 2 is held at the tip of the capillary 2 to position the capillary 2 above the electrode 12 on the semiconductor chip 13 at the first bonding point 15, and the capillary 2 is lowered to move the ball 20 to the electrode 12. At the same time as pressing and applying pressure, ultrasonic vibration is applied to the tip of the capillary 2 via the ultrasonic horn of the bonding arm to bond and connect the wire 1 to the electrode 12 on the semiconductor chip 13.

【０００６】そして、図８（ｄ）に示すように、キャピ
ラリ２を所定のループコントロールに従って所定の高さ
まで上昇させた後、第２ボンディング点１６となるリー
ド１４方向に移動させつつキャピラリ２を下降させてワ
イヤ１をリード１４に押しつけて加圧し同時にキャピラ
リ２の先端に対して超音波ホーンを介して超音波振動を
印加してリード１４に対しワイヤ１をボンディング接続
する。[0008] Then, as shown in FIG. 8 (d), after raising the capillary 2 to a predetermined height according to a predetermined loop control, the capillary 2 is lowered while being moved in the direction of the lead 14 which becomes the second bonding point 16. Then, the wire 1 is pressed against the lead 14 and pressurized. At the same time, the ultrasonic vibration is applied to the tip of the capillary 2 via an ultrasonic horn to bond the wire 1 to the lead 14.

【０００７】この後キャピラリ２を上昇させ、キャピラ
リ２の先端にワイヤ１を所定の長さまで送り出し、あら
かじめ設定したキャピラリ２の上昇位置でワイヤクラン
プ３を閉じ、リード１４上のワイヤをカットしてキャピ
ラリ２の先端にワイヤ１を所定の長さ伸長して、図８
（ａ）及び（ｂ）に示したように、キャピラリ２の先端
に送り出したワイヤ１の先端とトーチロッド４との間で
放電を一定の時間起こさせてワイヤ１の先端を溶融して
ボール２０を形成する。After that, the capillary 2 is raised, the wire 1 is sent out to the tip of the capillary 2 to a predetermined length, the wire clamp 3 is closed at a predetermined rising position of the capillary 2, the wire on the lead 14 is cut, and the capillary is cut. The wire 1 is extended to the tip of the wire 2 by a predetermined length, and FIG.
As shown in (a) and (b), a discharge is caused between the tip of the wire 1 sent out to the tip of the capillary 2 and the torch rod 4 for a certain period of time to melt the tip of the wire 1 and melt the ball 20. To form

【０００８】[0008]

【発明が解決しようとする課題】しかしながら、従来の
ワイヤボンディング装置は、前記トーチロッド４とワイ
ヤ１との間で高電圧を印加してボール２０を形成する際
に、キャピラリ２の先端からのワイヤ１の長さが所定の
長さより短い場合には、ワイヤ１の先端とトーチロッド
４とのギャップが大きくなり、ワイヤ１の先端とトーチ
ロッド４との間の絶縁を破壊することができず放電が発
生しないためボール２０が形成されない。この時、高電
圧を印加する装置である電気トーチ（図示せず）よりワ
イヤ切れのエラーが発生したものとワイヤボンディング
装置の制御手段としての制御回路が判定してワイヤボン
ディング装置は停止する。However, in the conventional wire bonding apparatus, when a high voltage is applied between the torch rod 4 and the wire 1 to form the ball 20, the wire from the tip of the capillary 2 is formed. If the length of the wire 1 is shorter than the predetermined length, the gap between the tip of the wire 1 and the torch rod 4 becomes large, so that the insulation between the tip of the wire 1 and the torch rod 4 cannot be broken, and the electric discharge occurs. No ball 20 is formed because no ball is generated. At this time, the control circuit as the control means of the wire bonding apparatus determines that an error of the wire breakage has occurred from the electric torch (not shown) which is a device for applying a high voltage, and the wire bonding apparatus stops.

【０００９】図８（ｃ）に示すように、ワイヤ１は、ボ
ール２０が形成されるとキャピラリ２の先端部に係止さ
れるが、このボール２０が正常に形成されないと図８
（ｃ）に示すように、ワイヤクランプ３は開となるので
ワイヤ１はキャピラリ２の先端部に係止することができ
ずキャピラリ２内から上方に抜けてしまい、ワイヤ切れ
となる。As shown in FIG. 8C, the wire 1 is locked at the tip of the capillary 2 when the ball 20 is formed.
As shown in (c), since the wire clamp 3 is opened, the wire 1 cannot be locked at the tip of the capillary 2 and falls out of the capillary 2 upward, resulting in a broken wire.

【００１０】このようなワイヤ切れのエラーが発生して
ワイヤボンディング装置が停止すると、装置の作業者は
キャピラリ２にワイヤ通しの作業を行う。そして、この
ワイヤ通しの作業が完了後、ワイヤ１の先端に正常にボ
ール２０が形成されるかどうかを試験するために、前記
ワイヤ切れ発生時のボンディング点とは異なる処に仮ボ
ンディングを行う。このキャピラリ２へのワイヤ通しの
作業は作業者の熟練を要すると共に作業に時間がかか
り、作業効率が低下するという課題がある。When such a wire breakage error occurs and the wire bonding apparatus is stopped, an operator of the apparatus performs a wire passing operation through the capillary 2. After the completion of the wire passing operation, temporary bonding is performed at a place different from the bonding point at the time of occurrence of the wire breakage in order to test whether or not the ball 20 is normally formed at the tip of the wire 1. The operation of passing the wire through the capillary 2 requires the skill of an operator, and takes a long time, which causes a problem that the operation efficiency is reduced.

【００１１】そこで、本発明は上記従来技術の欠点に鑑
みてなされたものであり、ワイヤ切れ発生時、自動的に
キャピラリの先端にワイヤを伸長し、ワイヤの先端にボ
ールを形成してボンディングを続行することが可能なワ
イヤボンディング装置を提供することを目的とする。In view of the above, the present invention has been made in view of the above-mentioned drawbacks of the prior art. When a wire break occurs, the wire is automatically extended to the tip of the capillary, and a ball is formed at the tip of the wire to perform bonding. It is an object of the present invention to provide a wire bonding apparatus capable of continuing.

【００１２】[0012]

【課題を解決するための手段】本発明によるワイヤボン
ディング装置は、先端にキャピラリが取り付けられた超
音波ホーンと、前記超音波ホーンを上下に揺動運動させ
る駆動手段と、前記駆動手段により揺動運動を行う超音
波ホーンの先端に取り付けられたキャピラリの位置を検
出する位置検出手段と、前記キャピラリの直上に配置さ
れ前記超音波ホーンと連動して揺動運動を行い前記ワイ
ヤの保持及び解放可能なワイヤクランプと、前記ワイヤ
へのエアーの方向及び流量を制御するエアー方向流量制
御手段と、前記キャピラリの下方に配置されて回動可能
な放電電極及び該放電電極に前記ワイヤが接触したこと
を検知する検知手段とを含む電気−放電発生手段とを備
えてなるものである。According to the present invention, there is provided a wire bonding apparatus comprising: an ultrasonic horn having a capillary mounted at a tip thereof; a driving unit for oscillating the ultrasonic horn up and down; Position detecting means for detecting the position of a capillary attached to the tip of the ultrasonic horn performing the movement, and a swinging movement interlocked with the ultrasonic horn disposed directly above the capillary and capable of holding and releasing the wire A wire clamp, air-direction flow control means for controlling the direction and flow rate of air to the wire, a rotatable discharge electrode disposed below the capillary, and a contact between the discharge electrode and the wire. And an electric-discharge generating means including a detecting means for detecting.

【００１３】また、本発明によるワイヤボンディング装
置の前記エアー方向流量制御手段は、前記ワイヤに所定
のテンションを加えるエアー供給手段と、前記ワイヤを
前記キャピラリの先端方向に向かって前記ワイヤを繰り
出すエアー吸引手段とを有するものである。In the wire bonding apparatus according to the present invention, the air-direction flow control means includes an air supply means for applying a predetermined tension to the wire, and an air suction for feeding the wire toward a tip end of the capillary. Means.

【００１４】また、本発明によるワイヤボンディング装
置の前記検知手段は、前記エアー方向流量制御手段のエ
アー吸引手段により繰り出されたワイヤを前記放電電極
に接触させて前記放電電極とワイヤ端との間を所定のギ
ャップ長で設定してなるものである。Further, the detecting means of the wire bonding apparatus according to the present invention may be arranged such that the wire drawn out by the air suction means of the air direction flow control means is brought into contact with the discharge electrode so that a gap between the discharge electrode and the wire end is provided. It is set with a predetermined gap length.

【００１５】また、本発明によるワイヤボンディング装
置の前記エアー方向流量制御手段は、エアーの方向及び
流量を可変してワイヤへの張力を制御する制御手段を備
えたものである。Further, the air direction flow control means of the wire bonding apparatus according to the present invention includes control means for controlling the tension to the wire by changing the direction and flow rate of air.

【００１６】また、本発明によるワイヤボンディング装
置の前記超音波ホーンは、前記エアー方向流量制御手段
のエアー吸引手段により前記ワイヤをキャピラリ先端か
ら繰り出す場合に超音波振動を印加してなるものであ
る。The ultrasonic horn of the wire bonding apparatus according to the present invention is configured such that ultrasonic vibration is applied when the wire is drawn out from the tip of the capillary by the air suction means of the air direction flow rate control means.

【００１７】[0017]

【発明の実施の形態】以下図面を参照して、本発明によ
るワイヤボンディング装置の実施例を説明する。従来の
装置と同一の構造及び機能を有する部分については要部
のみを説明し、詳細は省略する。なお、従来の装置と同
一の構造及び機能を有する部分には同じ符号を使用す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a wire bonding apparatus according to the present invention will be described below with reference to the drawings. As for portions having the same structure and function as those of the conventional device, only the main portions will be described, and the details will be omitted. Note that the same reference numerals are used for parts having the same structure and function as those of the conventional device.

【００１８】図１は、本発明によるワイヤボンディング
装置の主要部分の構成を示した図である。FIG. 1 is a diagram showing a configuration of a main part of a wire bonding apparatus according to the present invention.

【００１９】図１に示すように、このワイヤボンディン
グ装置は、二次元方向に移動可能なＸＹテーブルに搭載
したボンディングヘッドに支持され超音波振動子及び超
音波ホーン６を有するボンディングアームをリニアモー
タ若しくはモータ軸に連結したカムなどで上下に揺動運
動を行う駆動力を付与する駆動手段（図示せず）と、前
記超音波ホーン６の先端に取り付けられたキャピラリ２
と、キャピラリ２の直上に配置され超音波ホーン６と連
動して上下に揺動運動を行うワイヤクランプ３と、ワイ
ヤクランプ３の上方に配置されたエアーテンション部５
と、エアーテンション部５を制御するエアー方向流量制
御手段としてのエアー方向流量制御装置７と、ワイヤ１
を案内するワイヤガイド１１と、ワイヤ１が巻回され該
ワイヤ１を繰り出すスプール１７と、キャピラリ２の下
方にあって高電圧を印加する装置である電気トーチ８及
び放電電極であるトーチロッド４とを含む電気−放電発
生手段とからなっている。As shown in FIG. 1, this wire bonding apparatus includes a linear motor or a bonding arm supported by a bonding head mounted on a two-dimensionally movable XY table and having an ultrasonic vibrator and an ultrasonic horn 6. A driving means (not shown) for applying a driving force for performing a vertical swing motion by a cam or the like connected to a motor shaft, and a capillary 2 attached to the tip of the ultrasonic horn 6
A wire clamp 3 disposed directly above the capillary 2 and swinging up and down in conjunction with the ultrasonic horn 6; and an air tension unit 5 disposed above the wire clamp 3.
An air-direction flow control device 7 as air-direction flow control means for controlling the air tension unit 5;
, A spool 17 around which the wire 1 is wound and unreeled from the wire 1, an electric torch 8 below the capillary 2 for applying a high voltage, and a torch rod 4 as a discharge electrode. And an electric-discharge generating means.

【００２０】前記ボンディングアームを揺動可能に支持
するボンディングヘッドは、ボンディングアームの動き
を検出する位置検出手段としてのエンコーダ（図示せ
ず）を有しており、ボンディングアームの超音波ホーン
６に取り付けられたキャピラリ２の先端の位置は、エン
コーダからのパルス数をカウントして求めるようになっ
ている。The bonding head for swingably supporting the bonding arm has an encoder (not shown) as position detecting means for detecting the movement of the bonding arm, and is attached to the ultrasonic horn 6 of the bonding arm. The position of the tip of the capillary 2 thus obtained is obtained by counting the number of pulses from the encoder.

【００２１】電気−放電発生手段は、放電電極としての
トーチロッド４と電気トーチ８とからなり、トーチロッ
ド４は、図示せぬアクチュエータ等の作用によりキャピ
ラリ２の直下に回動可能な構成であり、検知手段として
の電気トーチ８は、トーチロッド４とキャピラリ２の先
端に繰り出されたワイヤ１の先端との間で放電を一定時
間行い、ワイヤ１の先端を溶融してボールを形成する
他、ワイヤ１がトーチロッド４に接触したかどうかを検
知する導通検知回路８ａを有している。The electric-discharge generating means comprises a torch rod 4 as a discharge electrode and an electric torch 8, and the torch rod 4 is configured to be rotatable immediately below the capillary 2 by the action of an actuator (not shown) or the like. The electric torch 8 as a detecting means performs discharge for a certain time between the torch rod 4 and the tip of the wire 1 fed to the tip of the capillary 2, melts the tip of the wire 1 to form a ball, A continuity detecting circuit 8a for detecting whether the wire 1 has contacted the torch rod 4 is provided.

【００２２】また、電気トーチ８は、トーチロッド４と
ワイヤ１間の電圧を検知し、この電圧の変化によってワ
イヤ切れかどうかを図示せぬ制御回路により判定するこ
とも可能な構成になっている。Further, the electric torch 8 has a structure in which a voltage between the torch rod 4 and the wire 1 is detected, and whether or not the wire is broken can be determined by a control circuit (not shown) based on a change in the voltage. .

【００２３】また、ワイヤ１の保持及び解放を行うワイ
ヤクランプ３は、ソレノイド及びバネ等の開閉機構から
なり、ボンディングアームと一体で上下に揺動運動を行
う。The wire clamp 3 for holding and releasing the wire 1 comprises an opening and closing mechanism such as a solenoid and a spring, and swings up and down integrally with the bonding arm.

【００２４】次に、本発明によるワイヤボンディング装
置のエアーテンション部５の詳細を図２及び図３を参照
して説明する。図２は、エアテンション部５の斜視図で
あり、図３は、図２の断面図である。Next, the details of the air tension portion 5 of the wire bonding apparatus according to the present invention will be described with reference to FIGS. FIG. 2 is a perspective view of the air tension unit 5, and FIG. 3 is a cross-sectional view of FIG.

【００２５】図２及び図３に示すように、エアーテンシ
ョン部５の外枠５ｄは略角柱状でなり、外枠５ｄの側面
には外部よりエアーテンション部５にエアーの供給又は
排出を行うためのエアー供給排出口５ａが設けられてい
る。As shown in FIGS. 2 and 3, the outer frame 5d of the air tension portion 5 has a substantially prismatic shape, and the side of the outer frame 5d is used to supply or discharge air to the air tension portion 5 from outside. Are provided.

【００２６】エアーテンション部５の外枠５ｄの内部
は、円筒状の内筒５ｂ及び内筒５ｃからなっており、内
筒５ｂの下部の一部は開口してエアー供給排出口５ａと
接続している。また、内筒５ｃはエアー供給排出口５ａ
の下部に嵌挿されている。従って、エアー供給排出口５
ａの先端部は内筒５ｂの下部の一部及び内筒５ｃの上端
部と連通している。The inside of the outer frame 5d of the air tension portion 5 is composed of a cylindrical inner cylinder 5b and an inner cylinder 5c, and a part of the lower part of the inner cylinder 5b is opened and connected to the air supply / exhaust port 5a. ing. The inner cylinder 5c is provided with an air supply / exhaust port 5a.
It is inserted in the lower part of. Therefore, the air supply / exhaust port 5
The leading end of a communicates with a part of the lower part of the inner cylinder 5b and the upper end of the inner cylinder 5c.

【００２７】エアーテンション部５の内筒５ｂの内径は
ワイヤ１の径の数十倍の大きさとなっており、また、内
筒５ｃの内径はワイヤ１が内筒５ｃの空洞をスムーズに
通る大きさで、かつワイヤ１の径よりも多少大きい径と
なっている。これは内筒５ｃに流れ込むエアーの流量を
極力少なくするためである。The inner diameter of the inner cylinder 5b of the air tension portion 5 is several tens of times the diameter of the wire 1, and the inner diameter of the inner cylinder 5c is large enough for the wire 1 to smoothly pass through the cavity of the inner cylinder 5c. Now, the diameter is slightly larger than the diameter of the wire 1. This is to minimize the flow rate of the air flowing into the inner cylinder 5c.

【００２８】図２及び図３に示すように、ワイヤ１は、
エアーテンション部５の内筒５ｂの内部及び内筒５ｃの
内部をそれぞれ貫通している。従って、図１に示すよう
に、スプール１７に巻回されているワイヤ１は、ワイヤ
ガイド１１を通りエアーテンション部５内を貫通し、ワ
イヤクランプ３の開閉部となる狭持部及びキャピラリ２
を経てキャピラリ２の先端から繰り出している。As shown in FIGS. 2 and 3, the wire 1
The air tension portion 5 penetrates through the inside of the inner cylinder 5b and the inside of the inner cylinder 5c. Therefore, as shown in FIG. 1, the wire 1 wound on the spool 17 passes through the air tension portion 5 through the wire guide 11, and the holding portion and the capillary 2 serving as the opening / closing portion of the wire clamp 3.
Through the end of the capillary 2.

【００２９】次に、本発明によるワイヤボンディング装
置のエアーテンション部５の作用について図４（ａ）及
び（ｂ）を参照して説明する。Next, the operation of the air tension unit 5 of the wire bonding apparatus according to the present invention will be described with reference to FIGS. 4 (a) and 4 (b).

【００３０】図４（ａ）に示すように、エアー供給排出
口５ａ内へ外部よりエアーを供給すると、エアー供給排
出口５ａより供給されたエアーａ1の流れは、内筒５ｂ
を通って上昇して流れるエアーｂ1と、内筒５ｃを通っ
て下降して流れるエアーｃ1とに分流する。内筒５ｂの
内径は内筒５ｃの内径より数十倍大きい径となっている
ため、内筒５ｂを流れる流量は内筒５ｃを流れる流量よ
りも数十倍大きく、ワイヤ１を上方に押し上げる力、す
なわちテンションを加える力が作用する。As shown in FIG. 4 (a), when supplying air from the outside to the air supply outlet 5a within the flow air a 1 supplied from the air supply and discharge port 5a is inner cylinder 5b
An air b 1 flows rises and through, shunted to an air c 1 flowing downward through the inner cylinder 5c. Since the inner diameter of the inner cylinder 5b is several tens times larger than the inner diameter of the inner cylinder 5c, the flow rate flowing through the inner cylinder 5b is several tens times larger than the flow rate flowing through the inner cylinder 5c, and the force for pushing the wire 1 upward. That is, a force for applying tension acts.

【００３１】逆に、図４（ｂ）に示すように、エアー供
給排出口５ａより外部へエアーを排出する。すなわち吸
引すると、エアー供給排出口５ａより排出されるエアー
ａ2の流れは、内筒５ｂの上端面より吸い込まれるエア
ーｂ2と、内筒５ｃの下端面より吸い込まれるエアーｃ2
の合計した流量の流れとなる。内筒５ｂの内径は内筒５
ｃの内径より数十倍大きい径となっているため、内筒５
ｂ内を流れる流量は内筒５ｃ内を流れる流量よりも数十
倍大きく、ワイヤ１を下方に押し下げる力が作用する。On the contrary, as shown in FIG. 4B, the air is discharged to the outside through the air supply / discharge port 5a. I.e. aspirating, flow air a 2 discharged from the air supply and discharge port 5a is provided with air b 2 being drawn from the upper end surface of the inner cylinder 5b, air c 2 which is sucked from the lower end surface of the inner cylinder 5c
Of the total flow rate. The inner diameter of the inner cylinder 5b is
c is several tens times larger than the inner diameter of the inner cylinder 5.
The flow rate flowing through the inside b is several tens times larger than the flow rate flowing through the inner cylinder 5c, and a force for pushing the wire 1 downward acts.

【００３２】次に、図１に示すエアー方向流量制御装置
７の構成の詳細を図５を参照して説明する。Next, the configuration of the air-direction flow control device 7 shown in FIG. 1 will be described in detail with reference to FIG.

【００３３】図５に示すように、エアー方向流量制御装
置７のエアー供給口７ａは、外部よりエアーを供給する
接続口であり、エアーを発生するコンプレッサー２５等
と接続している。また、エアー排出口７ｂは、外部にエ
アーを吸引して排出するための接続口であり、エアーを
吸引排出する真空ポンプ２６等と接続している。As shown in FIG. 5, the air supply port 7a of the air direction flow control device 7 is a connection port for supplying air from the outside, and is connected to a compressor 25 for generating air. The air discharge port 7b is a connection port for sucking and discharging air to the outside, and is connected to a vacuum pump 26 for suctioning and discharging air.

【００３４】エアー流量調節器７ｃは、エアー供給口７
ａより供給されるエアーの流量を調整するものであり、
このエアー流量調節器７ｃはニードルバルブなどの絞り
弁でなっている。このエアー流量調節器７ｃは、ワイヤ
ボンディングでのエアーテンション部内のワイヤ１を上
方に押し上げるのに必要な流量を設定している。そし
て、このエアー流量調節器７ｃからのエアーは、エアー
ＯＮ／ＯＦＦ切替器７ｅに入る。このエアーＯＮ／ＯＦ
Ｆ切替器７ｅは、電磁弁を使用したエアバルブ等でなっ
ており、図示せぬ制御手段としての制御装置より出力さ
れるエアー切替信号７ｇにより、エアーテンション部５
へのエアーの供給と遮断を行う。制御手段は、エアーの
方向及び流量を制御してワイヤ１への張力の制御を行
う。The air flow controller 7c has an air supply port 7
a to adjust the flow rate of the air supplied from a.
The air flow controller 7c is a throttle valve such as a needle valve. The air flow controller 7c sets a flow rate necessary for pushing up the wire 1 in the air tension portion by wire bonding. The air from the air flow controller 7c enters the air ON / OFF switch 7e. This air ON / OF
The F switching device 7e is an air valve or the like using an electromagnetic valve, and receives an air switching signal 7g output from a control device (not shown) as a control unit, thereby controlling an air tension unit 5e.
Supply and shut off air to The control means controls the tension on the wire 1 by controlling the direction and flow rate of air.

【００３５】また、エアー流量調節器７ｄは、エアー排
出口７ｂより排出されるエアーの流量を調整するもので
あり、このエアー流量調節器７ｄはボンディング中に発
生したワイヤ切れ時、エアーテンション部５内のワイヤ
１を下方に押し下げるのに必要な流量を設定している。
そして、このエアーＯＮ／ＯＦＦ切替器７ｆは、電磁弁
を使用したエアバルブ等でなっており、前記制御手段と
しての制御装置は、エアー切替信号７ｈを出力すること
によりエアーテンション部５からのエアーの吸引排出と
遮断を行う。この制御手段は、エアーの方向及び流量を
制御してワイヤ１への吸引力の制御を行う。The air flow controller 7d adjusts the flow rate of the air discharged from the air discharge port 7b. The air flow controller 7d operates when the wire breaks during bonding and the air tension unit 5d. The flow rate required to push down the wire 1 inside is set.
The air ON / OFF switch 7f is an air valve or the like using an electromagnetic valve, and the control device as the control means outputs the air switching signal 7h to control the air from the air tension unit 5. Perform suction and discharge and shut off. This control means controls the suction force to the wire 1 by controlling the direction and flow rate of air.

【００３６】エアーＯＮ／ＯＦＦ切替器７ｅのエアー出
口とエアーＯＮ／ＯＦＦ切替器７ｆのエアー入口とは配
管用継手等でエアー入出口７ｉに固定接続されている。
エアー方向流量制御装置７のエアー入出口７ｉは、エア
ー用チューブ等でエアーテンション部５のエアー供給排
出口５ａに接続されている。次に、エアー方向流量制御
装置７内でのエアーの流れについて、流れの方向を示す
７ｊと７ｋを用いて説明する。The air outlet of the air ON / OFF switch 7e and the air inlet of the air ON / OFF switch 7f are fixedly connected to the air inlet / outlet 7i by a pipe joint or the like.
An air inlet / outlet 7i of the air direction flow control device 7 is connected to an air supply / exhaust port 5a of the air tension unit 5 by an air tube or the like. Next, the flow of air in the air direction flow control device 7 will be described using 7j and 7k indicating the direction of flow.

【００３７】一方の、エアーの流れ７ｊは、コンプレッ
サー２５より供給されるエアーがエアー方向流量制御装
置７のエアー供給口７ａより供給され、エアー流量調整
器７ｃを通り、エアーＯＮ／ＯＦＦ切替器７ｅを経由し
エアー入出口７ｉよりエアーテンション部５に供給され
ることを示している（この時エアーＯＮ／ＯＦＦ切替器
７ｆは遮断状態）。On the other hand, in the air flow 7j, the air supplied from the compressor 25 is supplied from the air supply port 7a of the air-direction flow control device 7, passes through the air flow regulator 7c, and passes through the air ON / OFF switch 7e. Through the air inlet / outlet 7i to the air tension unit 5 (at this time, the air ON / OFF switch 7f is in a cut-off state).

【００３８】他方の、エアーの流れ７ｋは エアーテン
ション部５より吸引されたエアーがエアー入出口７ｉよ
りエアーＯＮ／ＯＦＦ切替器７ｆを経由しエアー流量調
整器７ｄを通り、エアー排出口７ｂより真空ポンプ２６
で吐き出されることを示している（この時エアーＯＮ／
ＯＦＦ切替器７ｅは遮断状態）。On the other hand, the air flow 7k is such that the air sucked from the air tension portion 5 passes through the air inlet / outlet 7i, passes through the air ON / OFF switch 7f, passes through the air flow regulator 7d, and is evacuated from the air outlet 7b. Pump 26
Indicates that it is exhaled (air ON /
The OFF switch 7e is in a cutoff state).

【００３９】前記エアーテンション部５及びエアー方向
流量制御装置７とをエアー方向流量制御手段と称する。
このエアー方向流量制御手段は、一方のエアーの流れ７
ｊ、すなわちエアー流量調節器７ｃ、エアーＯＮ／ＯＦ
Ｆ切替器７ｅ、エアーテンション部５をエアー供給手段
と、他方のエアーの流れ７ｋ、すなわちエアーテンショ
ン部５、エアーＯＮ／ＯＦＦ切替器７ｆ、エアー流量調
節器７ｄをエアー吸引手段とを含む。The air tension section 5 and the air direction flow control device 7 are referred to as air direction flow control means.
This air direction flow control means is used to control one air flow 7
j, ie, air flow controller 7c, air ON / OF
The F switch 7e and the air tension unit 5 include an air supply unit, and the other air flow 7k, that is, the air tension unit 5, the air ON / OFF switch 7f, and the air flow controller 7d include an air suction unit.

【００４０】以下に、本発明によるワイヤボンディング
装置のボンディング中にワイヤ切れエラーが発生した場
合の自動復帰動作について図６及び図７を参照して説明
する。図７は、ワイヤ切れエラーでの自動復帰動作のフ
ローチャートを示す。The automatic return operation when a wire break error occurs during bonding of the wire bonding apparatus according to the present invention will be described below with reference to FIGS. FIG. 7 shows a flowchart of the automatic return operation in the event of a wire break error.

【００４１】今、図６（ａ）は、キャピラリ２の先端か
ら送り出されたワイヤ１が短いためにワイヤ切れエラー
が発生して停止した状態を示しており、ワイヤクランプ
３は閉となっている（図７、ステップＳ1）。このワイ
ヤ切れエラー発生時、エアーＯＮ／ＯＦＦ切替器７ｅ
は、エアー切替信号７ｇ（図５参照）を“ＯＦＦ”にし
てエアーの供給を遮断する。FIG. 6 (a) shows a state where the wire 1 sent from the tip of the capillary 2 is short and a wire break error has occurred and stopped, and the wire clamp 3 is closed. (FIG. 7, step S 1 ). When this wire breakage error occurs, the air ON / OFF switch 7e
Turns off the air switching signal 7g (see FIG. 5) and shuts off the air supply.

【００４２】次に、図６（ｂ）に示すように、トーチロ
ッド４をキャピラリ２の真下に回動させ（図７、ステッ
プＳ2）、ワイヤクランプ３を開とし（ステップＳ3）、
エアー方向流量制御装置７のエアーＯＮ／ＯＦＦ切替器
７ｆを一定時間“ＯＮ”状態（ステップＳ4）にしてエ
アーテンション部５のエアー供給排出口５ａよりエアー
を吸引し（図５のエアーの流れ７ｋ参照）、ワイヤ１を
キャピラリ２の下方に繰り出す。この時、図７のステッ
プＳ5に示すように、超音波ホーン６（図１に図示）に
超音波振動を印加してキャピラリ２に振動を付与する。
これはワイヤ１をキャピラリ２より繰り出しやすくする
ためである。なお、図７のステップＳ5は、超音波振動
を超音波ホーン６に印加するようにしているが、超音波
振動を印加しなくてもよい。この場合には、図７のステ
ップＳ5は省略される。Next, as shown in FIG. 6B, the torch rod 4 is rotated just below the capillary 2 (FIG. 7, step S 2 ), and the wire clamp 3 is opened (step S 3 ).
Air directional flow control apparatus 7 air ON / OFF switch 7f was in the predetermined time "ON" state (Step S 4) sucking air from the air supply and discharge port 5a of the air tension section 5 of the (air flow 5 7k), and the wire 1 is paid out below the capillary 2. At this time, as shown in step S 5 of FIG. 7, by applying ultrasonic vibration to the ultrasonic horn 6 (shown in Figure 1) to impart vibration to the capillary 2.
This is to make the wire 1 easier to draw out than the capillary 2. Note that steps S 5 in FIG. 7, but so as to apply the ultrasonic vibration to the ultrasonic horn 6, it is not necessary to apply the ultrasonic vibration. In this case, step S 5 of FIG. 7 is omitted.

【００４３】次に、エアー方向流量制御装置７のエアー
ＯＮ／ＯＦＦ切替器７ｆが一定時間経過後ワイヤクラン
プ３を閉じ、エアー方向流量制御装置７のエアーＯＮ／
ＯＦＦ切替器７ｆを“ＯＦＦ”状態にする。また同時に
超音波ホーン６への超音波振動の印加も“ＯＦＦ”にす
る（ステップＳ6）。Next, the air ON / OFF switch 7f of the air direction flow control device 7 closes the wire clamp 3 after a lapse of a predetermined time, and the air ON / OFF of the air direction flow control device 7 is closed.
The OFF switch 7f is turned "OFF". The application of the ultrasonic vibration to the ultrasonic horn 6 simultaneously to "OFF" (Step S 6).

【００４４】次に、図６（ｃ）に示すように、超音波ホ
ーン６をワイヤ１がトーチロッド４に接触するまで下降
させる（ステップＳ7）。ワイヤ１のトーチロッド４へ
の接触判断は、検知手段としての電気トーチ８に内蔵さ
れている導通検知回路８ａにより行う。Next, as shown in FIG. 6C, the ultrasonic horn 6 is lowered until the wire 1 comes into contact with the torch rod 4 (Step S 7 ). The contact of the wire 1 with the torch rod 4 is determined by a conduction detecting circuit 8a built in the electric torch 8 as a detecting means.

【００４５】次に、超音波ホーン６に取り付けられたキ
ャピラリ２の先端がトーチロッド４の表面に接触する位
置、すなわち高さ位置の検出は、ボンディングアームの
動きを検出する位置検出手段としてのエンコーダにより
検出する。そして、トーチロッド４の表面に前記キャピ
ラリ２が接触する高さ（位置）は、予め設定されてお
り、ワイヤボンディング装置が備える図示せぬマイクロ
コンピュータを内蔵した制御手段としての制御装置内の
記憶手段としてのメモリ（リードオンリーメモリＲＯ
Ｍ）に記憶されている。従って、超音波ホーン６が図６
（ａ）の停止位置よりワイヤ１がトーチロッド４の表面
に接触するまでの下降した移動量によりワイヤ１のキャ
ピラリ２からの繰り出し量（フィード量）を算出してい
る。Next, the position where the tip of the capillary 2 attached to the ultrasonic horn 6 comes into contact with the surface of the torch rod 4, that is, the height position is detected by an encoder as position detecting means for detecting the movement of the bonding arm. Is detected by The height (position) at which the capillary 2 comes into contact with the surface of the torch rod 4 is set in advance, and is stored in a control device as a control device having a built-in microcomputer (not shown) provided in the wire bonding apparatus. As a memory (read only memory RO
M). Thus, the ultrasonic horn 6 is
The amount of feed (feed amount) of the wire 1 from the capillary 2 is calculated based on the amount of downward movement from the stop position of (a) until the wire 1 comes into contact with the surface of the torch rod 4.

【００４６】このように算出したワイヤ１のフィード量
が所定のフィード量より少ないときにはキャピラリ２を
図６（ｂ）の位置まで上昇させ、図６（ｂ）からの動作
を繰り返す。すなわち、図７のステップＳ9により所定
のフィード量かどうかを判定し、所定のフィード量でな
いとき、すなわちｎｏである場合にはステップＳ10に戻
りステップＳ3からの工程を繰り返す。When the calculated feed amount of the wire 1 is smaller than the predetermined feed amount, the capillary 2 is raised to the position shown in FIG. 6B, and the operation from FIG. 6B is repeated. That is, to determine whether a predetermined feed amount in step S 9 in FIG. 7, when not the predetermined feed amount, that is, when it is no repeats the steps from Step S 3 returns to step S 10.

【００４７】ワイヤ１のキャピラリ２からのフィード量
が所定の量であれば、キャピラリ２をスパーク位置まで
上昇させ停止する（ステップＳ11）。If the feed amount of the wire 1 from the capillary 2 is a predetermined amount, the capillary 2 is raised to the spark position and stopped (step S 11 ).

【００４８】以上の動作により、キャピラリ２の先端か
らのワイヤ１の長さは所定の長さに設定され、トーチロ
ッド４とキャピラリ２の先端に送り出されたワイヤ１の
先端との間で放電を一定時間行い、ワイヤ１の先端を溶
融しボールを形成してボンディングを自動的に再開する
（ステップＳ12及びＳ13）。With the above operation, the length of the wire 1 from the tip of the capillary 2 is set to a predetermined length, and discharge is caused between the torch rod 4 and the tip of the wire 1 sent to the tip of the capillary 2. performs a certain time, automatically resumes the bonding by melting a tip end of the wire 1 to form a ball (step S 12 and S 13).

【００４９】なお、本発明によるワイヤボンディング装
置のエアーテンション部５は、エアー供給排出口５ａへ
のエアー供給量又はエアー排出量を変えることにより、
内筒５ｂ及び内筒５ｃを流れるエアーの流量を変えてワ
イヤ１への張力を可変することも可能である。なお、エ
アー切替信号７ｇとエアー切替信号７ｈを出力する制御
手段としての制御装置は、エアー方向流量制御装置７内
に組み込んで構成してもよい。また、本発明の趣旨を変
更しない範囲で適宜変えて行うことは勿論可能である。The air tension unit 5 of the wire bonding apparatus according to the present invention can change the amount of air supplied or discharged to the air supply / discharge port 5a by changing
It is also possible to change the tension on the wire 1 by changing the flow rate of the air flowing through the inner cylinder 5b and the inner cylinder 5c. Note that a control device serving as a control unit that outputs the air switching signal 7g and the air switching signal 7h may be configured to be incorporated in the air direction flow control device 7. Of course, it is of course possible to perform the present invention appropriately without departing from the scope of the present invention.

【００５０】[0050]

【発明の効果】以上説明したように本発明によるワイヤ
ボンディング装置によれば、ボンディング中にワイヤ切
れが発生しても、自動的にキャピラリの先端にワイヤが
伸長されワイヤの先端にボールを形成しボンディングを
続行できるため、作業効率が向上する効果がある。As described above, according to the wire bonding apparatus of the present invention, even if a wire break occurs during bonding, the wire is automatically extended at the tip of the capillary and a ball is formed at the tip of the wire. Since the bonding can be continued, there is an effect that work efficiency is improved.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明によるワイヤボンディング装置の主要部
分の構成を示した図である。FIG. 1 is a diagram showing a configuration of a main part of a wire bonding apparatus according to the present invention.

【図２】エアーテンション部の外形を示す斜視図であ
る。FIG. 2 is a perspective view illustrating an outer shape of an air tension unit.

【図３】図２に示すエアーテンション部の断面図であ
る。FIG. 3 is a sectional view of an air tension unit shown in FIG. 2;

【図４】（ａ）は、エアーテンション部のエアーを外部
より供給したときのエアーの流れ、（ｂ）はエアーテン
ション部のエアーを外部へ排出したときのエアーの流れ
を示す説明図である。4A is an explanatory diagram showing an air flow when air in an air tension unit is supplied from outside, and FIG. 4B is an explanatory diagram showing an air flow when air in an air tension unit is discharged to the outside; .

【図５】エアー方向流量制御装置の回路構成を示す図で
ある。FIG. 5 is a diagram showing a circuit configuration of an air direction flow control device.

【図６】（ａ）乃至（ｃ）は、ワイヤ切れエラー発生時
の自動復帰動作を示す図である。FIGS. 6A to 6C are diagrams showing an automatic return operation when a wire disconnection error occurs.

【図７】ワイヤ切れエラー発生時の自動復帰動作を示す
フローチャートである。FIG. 7 is a flowchart illustrating an automatic return operation when a wire disconnection error occurs.

【図８】（ａ）乃至（ｄ）はワイヤボンディングの工程
を説明する一部断面を含む図である。FIGS. 8A to 8D are views including a partial cross section for explaining a wire bonding step.

【符号の説明】[Explanation of symbols]

１ ワイヤ ２ キャピラリ ３ ワイヤクランプ ４ 放電電極（トーチロッド） ５ エアーテンション部 ５ａ エアー供給排出口 ５ｂ 内筒 ５ｃ 内筒 ５ｄ 外枠 ６ 超音波ホーン ７ エアー方向流量制御装置 ７ａ エアー供給口 ７ｂ エラー排出口 ７ｃ エアー流量調整器 ７ｄ エアー流量調整器 ７ｅ エアーＯＮ／ＯＦＦ切替器 ７ｆ エアーＯＮ／ＯＦＦ切替器 ７ｇ エアー切替信号 ７ｈ エアー切替信号 ７ｉ エアー入出口 ７ｊ エアーの流れ ７ｋ エアーの流れ ８ 電気トーチ ８ａ 導通検知回路 １１ ワイヤガイド １２ 半導体チップの電極 １３ 半導体チップ １４ リード １５ 第１ボンディング点 １６ 第２ボンディング点 １７ スプール ２０ ボール DESCRIPTION OF SYMBOLS 1 Wire 2 Capillary 3 Wire clamp 4 Discharge electrode (torch rod) 5 Air tension part 5a Air supply / discharge port 5b Inner cylinder 5c Inner cylinder 5d Outer frame 6 Ultrasonic horn 7 Air direction flow control device 7a Air supply port 7b Error discharge port 7c Air flow regulator 7d Air flow regulator 7e Air ON / OFF switch 7f Air ON / OFF switch 7g Air switch signal 7h Air switch signal 7i Air inlet / outlet 7j Air flow 7k Air flow 8 Electric torch 8a Conduction detection Circuit 11 Wire guide 12 Electrode of semiconductor chip 13 Semiconductor chip 14 Lead 15 First bonding point 16 Second bonding point 17 Spool 20 Ball

Claims (5)

【特許請求の範囲】[Claims] 【請求項１】 先端にキャピラリが取り付けられた超音
波ホーンと、 前記超音波ホーンを上下に揺動運動させる駆動手段と、 前記駆動手段により揺動運動を行う超音波ホーンの先端
に取り付けられたキャピラリの位置を検出する位置検出
手段と、 前記キャピラリの直上に配置され前記超音波ホーンと連
動して揺動運動を行い前記ワイヤの保持及び解放可能な
ワイヤクランプと、 前記ワイヤへのエアーの方向及び流量を制御するエアー
方向流量制御手段と、 前記キャピラリの下方に配置されて回動可能な放電電極
及び該放電電極に前記ワイヤが接触したことを検知する
検知手段とを含む電気−放電発生手段とを備えたことを
特徴とするワイヤボンディング装置。1. An ultrasonic horn having a capillary mounted at a tip thereof, a driving unit for oscillating the ultrasonic horn up and down, and an ultrasonic horn being oscillated by the driving unit. Position detecting means for detecting the position of the capillary; a wire clamp disposed directly above the capillary and capable of holding and releasing the wire by swinging in conjunction with the ultrasonic horn; and a direction of air to the wire. And an air-direction flow rate control means for controlling the flow rate, an electric-discharge generation means including: a discharge electrode disposed below the capillary and rotatable; and a detection means for detecting that the wire comes into contact with the discharge electrode. And a wire bonding apparatus. 【請求項２】 前記エアー方向流量制御手段は、前記ワ
イヤに所定のテンションを加えるエアー供給手段と、前
記ワイヤを前記キャピラリの先端方向に向かって前記ワ
イヤを繰り出すエアー吸引手段とを有することを特徴と
する請求項１に記載のワイヤボンディング装置。2. The air flow rate control means includes an air supply means for applying a predetermined tension to the wire, and an air suction means for feeding the wire toward the tip of the capillary. The wire bonding apparatus according to claim 1, wherein 【請求項３】 前記検知手段は、前記エアー方向流量制
御手段のエアー吸引手段により繰り出されたワイヤを前
記放電電極に接触させて前記放電電極とワイヤ端との間
を所定のギャップ長で設定してなることを特徴とする請
求項１又は請求項２に記載のワイヤボンディング装置。3. The detecting means contacts a wire fed by an air suction means of the air direction flow control means with the discharge electrode to set a predetermined gap length between the discharge electrode and a wire end. The wire bonding apparatus according to claim 1 or 2, wherein 【請求項４】 前記エアー方向流量制御手段は、エアー
の方向及び流量を可変してワイヤへの張力を制御する制
御手段を備えたことを特徴とする請求項１に記載のワイ
ヤボンディング装置。4. The wire bonding apparatus according to claim 1, wherein said air direction flow rate control means includes a control means for changing a direction and a flow rate of air to control a tension on a wire. 【請求項５】 前記超音波ホーンは、前記エアー方向流
量制御手段のエアー吸引手段により前記ワイヤをキャピ
ラリ先端から繰り出す場合に超音波振動を印加してなる
ことを特徴とする請求項１又は請求項２に記載のワイヤ
ボンディング装置。5. The ultrasonic horn according to claim 1, wherein the ultrasonic horn is configured to apply ultrasonic vibration when the wire is fed out from the tip of the capillary by the air suction means of the air direction flow control means. 3. The wire bonding apparatus according to 2.
JP4869098A 1998-02-13 1998-02-13 Wire bonding device Pending JPH11233551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4869098A JPH11233551A (en) 1998-02-13 1998-02-13 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4869098A JPH11233551A (en) 1998-02-13 1998-02-13 Wire bonding device

Publications (1)

Publication Number Publication Date
JPH11233551A true JPH11233551A (en) 1999-08-27

Family

ID=12810322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4869098A Pending JPH11233551A (en) 1998-02-13 1998-02-13 Wire bonding device

Country Status (1)

Country Link
JP (1) JPH11233551A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100449720C (en) * 2004-05-20 2009-01-07 三星Techwin株式会社 Wire welding method and wire welding employing the same
US7481351B2 (en) 2003-12-23 2009-01-27 Samsung Electronics Co., Ltd. Wire bonding apparatus and method for clamping a wire
KR100960027B1 (en) 2007-02-15 2010-05-28 가부시키가이샤 신가와 Wire cleaning guide

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7481351B2 (en) 2003-12-23 2009-01-27 Samsung Electronics Co., Ltd. Wire bonding apparatus and method for clamping a wire
CN100449720C (en) * 2004-05-20 2009-01-07 三星Techwin株式会社 Wire welding method and wire welding employing the same
KR100960027B1 (en) 2007-02-15 2010-05-28 가부시키가이샤 신가와 Wire cleaning guide

Similar Documents

Publication Publication Date Title
US7893383B2 (en) Bonding apparatus and method for cleaning tip of a bonding tool
KR101378324B1 (en) Automatic wire tail adjustment system for wire bonders
JP4817341B2 (en) Wire bonding equipment
US5685476A (en) Wire guiding apparatus, wire guiding method and a wire bonder equipped with said apparatus
WO2016021251A1 (en) Bonding method and bonding device
US7025243B2 (en) Bondhead for wire bonding apparatus
JPH11233551A (en) Wire bonding device
US20050167473A1 (en) Method for producing wedge-wedge wire connection
KR0178425B1 (en) Wire bonding apparatus and wire bonding method
JPH11312707A (en) Wire bonding device
EP0494510A2 (en) Bonding head
JPH02100828A (en) Automatic wire connection defect detection method
US4878609A (en) Apparatus for manual wire bonding
EP0447085B1 (en) Device for monotoring wire supply and consumption
JPH02199846A (en) Wire bonding
JP3478510B2 (en) Wire bonding equipment
JP2885242B1 (en) Wire bonding method and apparatus
JPS62179733A (en) Wire bonding system
JPH0236064B2 (en)
JPH10107059A (en) Wire bonder
SU1569146A1 (en) Apparatus for ultrasonic welding
JP2506904B2 (en) Wire bonding equipment
JP2586679B2 (en) Wire bonding method
JPH03263844A (en) Insertion of wire into capillary in wire bonder
JP3417659B2 (en) Wire bonding equipment