JPH11233457A - Semiconductor chip peeling equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent break of a semiconductor chip, by forming a recessed part on the surface of a suction nozzle, facilitating peeling of a semiconductor chip from a dicing tape, and preventing unnecessary load from being applied to the semiconductor chip. SOLUTION: A recessed part 2e is formed on a suction surface 2b. The recessed part 2e is constituted of a front side slant surface 2c which is inclined downward from a feed side of a dicing tape 4 toward the almost central part of the suction surface 2b, and a rear side slant surface 2 which is inclined upward from the almost central part of the suction surface 2b toward a roll-up side of the dicing tape 4. In a semiconductor chip 5, the front end part 5a and the rear end part 5b abut against the rear side slant surface 2d and the front side slant surface 2c, respectively, and the dicing tape 4 is peeled from the back of the semiconductor chip 5. In the above state, the semiconductor chip 5 is sucked with a collet 3 and transfered to a semiconductor IC manufacturing factory.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip peeling device for peeling a semiconductor chip attached to a dicing tape from the dicing tape.

[0002]

2. Description of the Related Art As a semiconductor chip peeling apparatus for peeling a semiconductor chip adhered to a dicing tape from the dicing tape, a semiconductor chip peeling apparatus shown in FIG. 6 is conventionally known.

That is, the flat suction surface 51 of the suction nozzle 51
a and fix the dicing tape 52 to the suction surface 51a.
The semiconductor chip 54 is peeled off from the dicing tape 52 by pushing up a push-up pin 53 disposed vertically below the dicing tape 52 from below the dicing tape 52, and is disposed above the suction surface 51a. The semiconductor chip 54 is held by the collet 55 and transported to a semiconductor IC manufacturing process. In the figure, 51
b is an adsorption hole.

[0004]

However, in the above-described conventional semiconductor chip peeling apparatus, when the semiconductor chip is peeled from the dicing tape, a push-up pin is pressed against the back surface of the semiconductor chip.

[0005] Therefore, a concentrated load is applied to the back surface of the semiconductor chip, and the semiconductor chip itself is damaged, or the circuit wiring on the surface of the semiconductor chip is damaged due to the deformation of the semiconductor chip when the push-up pin contacts. There was a risk of doing so.

[0006]

SUMMARY OF THE INVENTION Accordingly, in the present invention, a dicing tape is suctioned to and fixed to a suction surface of a suction nozzle, and a semiconductor chip peeling for peeling a semiconductor chip stuck on the dicing tape from the dicing tape is performed. In the apparatus, a concave portion is formed on the suction surface of the suction nozzle.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor chip peeling apparatus according to the present invention comprises a suction nozzle connected to a suction pump, a collet disposed above the suction nozzle, and a winding / unwinding device for sequentially feeding a dicing tape. And a delivery mechanism.

[0008] The suction nozzle has a suction surface formed at the upper end, and a concave portion is formed on the suction surface.

Then, a predetermined amount of the dicing tape having the semiconductor chip adhered to the upper surface thereof is fed out, and the semiconductor chip is positioned substantially at the center of the suction surface of the suction nozzle. Suction and fix the dicing tape.

Although the dicing tape is fixed by suction along the suction surface, since the concave portion is formed in the suction surface, only the front and rear end portions of the semiconductor chip are in contact with the suction surface. The dicing tape is peeled from the back surface.

Therefore, the semiconductor chip can be easily peeled off from the dicing tape simultaneously with the suction simply by sucking the dicing tape with the suction nozzle.

In addition, at this time, unnecessary load is not applied to the semiconductor chip, and damage to the semiconductor chip can be prevented.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a view showing a use state of a semiconductor chip peeling apparatus 1 according to the present invention. The semiconductor chip peeling apparatus 1 includes a suction nozzle 2 connected to a suction pump (not shown) and a suction nozzle 2 connected to the suction nozzle 2. It comprises a collet 3 disposed above the nozzle 2 and a winding / unwinding mechanism (not shown) for sequentially feeding out the dicing tape 4.

The suction nozzle 2 has a plurality of suction holes 2a at its upper end.
Is formed on the attraction surface 2b.

The suction surface 2b has a front inclined surface 2c inclined downward from the feeding side of the dicing tape 4 toward a substantially central portion of the suction surface 2b, and a winding of the dicing tape 4 from a substantially central portion of the suction surface 2b. Rear inclined surface that is inclined upward toward the taking side
From 2d, a recess 2e is formed. The angle between the front inclined surface 2c and the rear inclined surface 2d is set to 150 to 160 degrees.

Then, a predetermined amount of the dicing tape 4 with the semiconductor chip 5 adhered to the upper surface is fed out, and the suction nozzle 2
The semiconductor chip 5 is positioned substantially at the center of the suction surface 2b, and in this state, the suction pump is operated to suck and fix the dicing tape 4 on the suction surface 2b.

Then, as shown in FIG. 1, the dicing tape 4 is fixed by suction along the suction surface 2b.
Since the recess 2e is formed in 2b, the semiconductor chip 5
The front end 5a and the rear end 5b are in contact with the rear inclined surface 2d and the front inclined surface 2c, respectively, and the dicing tape 4 is separated from the back surface of the semiconductor chip 5.

In this state, the semiconductor chip 5 is sucked by the collet 3 and transported to a semiconductor IC manufacturing process.

As described above, since the concave portion 2e is formed in the suction surface 2b, the semiconductor chip 5 can be easily peeled off from the dicing tape 4 simultaneously with the suction simply by sucking the dicing tape 4 with the suction nozzle 2. At that time, unnecessary load is not applied to the semiconductor chip 5, and damage to the semiconductor chip 5 can be prevented.

Further, as shown in FIG. 2 or FIG. 3, even when the size of the semiconductor chip 5 to be peeled is changed, the semiconductor chip 5 has a front end 5a and a rear end 5b, respectively. It will come into contact with the inclined surface 2d and the front inclined surface 2c,
The semiconductor chip 5 can be reliably separated from the dicing tape 4 without changing the suction nozzle 2 according to the size of the semiconductor chip 5.

In this embodiment, the dicing tape 4
The front inclined surface 2c inclined downward from the feeding side toward the substantially central portion of the suction surface 2b, and the rear side inclined upward toward the winding side of the dicing tape 4 from the substantially central portion of the suction surface 2b. The recess 2e is formed from the inclined surface 2d, but the shape of the recess 2e is not limited to this.

For example, as shown in FIG.
Of the concave portion 2e may have a substantially conical shape.

As shown in FIG. 5, a front inclined surface 2c inclined downward from the feeding side of the dicing tape 4 toward a substantially central portion of the suction surface 2b, and a dicing tape from a substantially central portion of the suction surface 2b. A rear inclined surface 2d inclined upward toward the winding side of the dicing tape 4, and a suction surface from the left side of the dicing tape 4
Left inclined surface 2f inclined downward toward the approximate center of 2b
And a right inclined surface 2g inclined upward from a substantially central portion of the suction surface 2b toward the right side of the dicing tape 4 to form a concave portion 2e.
Can also be formed.

Further, a left inclined surface inclined downward from the left side of the dicing tape 4 toward a substantially central portion of the suction surface 2b.
2f and a right inclined surface 2g inclined upward from a substantially central portion of the suction surface 2b toward the right side of the dicing tape 4 to form a concave portion.
2e can also be formed.

[0026]

The present invention is embodied in the form described above and has the following effects.

That is, according to the present invention, in a semiconductor chip peeling apparatus for sucking and fixing a dicing tape on the suction surface of a suction nozzle and separating the semiconductor chip attached to the dicing tape from the dicing tape, Since the concave portion is formed on the suction surface, the semiconductor chip can be easily peeled off from the dicing tape simultaneously with the suction simply by sucking the dicing tape with the suction nozzle.

In addition, when the semiconductor chip is peeled off from the dicing tape, no unnecessary load is applied to the semiconductor chip, and the semiconductor chip can be prevented from being damaged.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a use state of a semiconductor chip peeling device according to the present invention.

FIG. 2 illustrates a case where the size of a semiconductor chip is small.
Explanatory drawing which shows the use condition of a semiconductor chip peeling apparatus.

FIG. 3 shows a case where the size of a semiconductor chip is small.
Explanatory drawing which shows the use condition of a semiconductor chip peeling apparatus.

FIG. 4 is a perspective view showing a suction nozzle as another embodiment.

FIG. 5 is a perspective view showing a suction nozzle as another embodiment.

FIG. 6 is an explanatory view showing a conventional semiconductor chip peeling apparatus.

[Explanation of symbols]

 Reference Signs List 1 semiconductor chip peeling device 2 suction nozzle 2a suction hole 2b suction surface 2c front inclined surface 2d rear inclined surface 2e recess 3 collet 4 dicing tape 5 semiconductor chip

Claims (1)

[Claims] 1. A dicing tape (4) is attracted and fixed to a suction surface (2b) of a suction nozzle (2).
The semiconductor chip (5) affixed to (4) is dicing tape
(4) A semiconductor chip peeling device for peeling off from a semiconductor chip, wherein a concave portion (2e) is formed in a suction surface (2b) of a suction nozzle (2).