JPH1168390A - Component suction device - Google Patents

Component suction device

Info

Publication number
JPH1168390A
JPH1168390A JP9225449A JP22544997A JPH1168390A JP H1168390 A JPH1168390 A JP H1168390A JP 9225449 A JP9225449 A JP 9225449A JP 22544997 A JP22544997 A JP 22544997A JP H1168390 A JPH1168390 A JP H1168390A
Authority
JP
Japan
Prior art keywords
suction
vacuum
slider
component
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9225449A
Other languages
Japanese (ja)
Other versions
JP3891655B2 (en
Inventor
Ryuichi Hirano
龍一 平野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juki Corp filed Critical Juki Corp
Priority to JP22544997A priority Critical patent/JP3891655B2/en
Publication of JPH1168390A publication Critical patent/JPH1168390A/en
Application granted granted Critical
Publication of JP3891655B2 publication Critical patent/JP3891655B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • Automatic Assembly (AREA)
  • Manipulator (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a component suction device capable of securely sucking and holding an electronic component. SOLUTION: A slider 21 moves upward resisting an urging force of a spring 22 in an inner 20 with a vacuum force generated when sucking the electronic component. A pair of gripping hooks 26a and 26b rotatable around pins 27a and 27b fixed to the inner are installed at the lower part of the nozzle. As the other end of the gripping hook 26a and 26b are connected to a pin 28 fixed to the slider 21, the each gripping hook 26a and 26b rotates around the pin 27a and 27b when the slider 21 moves upward and grips an electronic component 30 vacuum sucked to the slider 21. The structure of gripping the component sucked to the vacuum suction nozzle by the gripping hooks 26a and 26b operating according to the vacuum suction makes it possible to hold the electronic component by the suction of vacuum suction and the grip by the gripping hooks 26a and 26b.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、部品吸着装置、更
に詳細には、電子部品を吸着して回路基板位置に搭載す
るチップマウンタに使用される部品吸着装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component suction device, and more particularly, to a component suction device used in a chip mounter for picking up an electronic component and mounting it on a circuit board.

【0002】[0002]

【従来の技術】チップマウンタは、部品供給装置から供
給される電子部品を回路基板の所定位置に搭載する。こ
のようなチップマウンタでは、電子部品は、XY方向に
移動可能な吸着ヘッドに取り付けられた吸着ノズルによ
り吸着され、吸着ヘッドが回路基板上に所定位置に移動
して吸着された電子部品を解放することにより電子部品
を回路基板に搭載している。
2. Description of the Related Art A chip mounter mounts electronic components supplied from a component supply device at predetermined positions on a circuit board. In such a chip mounter, the electronic component is sucked by a suction nozzle attached to a suction head movable in the XY directions, and the suction head moves to a predetermined position on the circuit board to release the sucked electronic component. Thus, the electronic components are mounted on the circuit board.

【0003】図3に示したこの種の吸着ノズルは、イン
ナ1内に取り付けられたばね2により下方向に付勢され
るスライダ3から構成されており、スライダの先端に穿
孔された部分3aが吸着部となっている。スライダ3と
インナ1との相対的な回転は、ピン4により制限されて
おり、この全体のノズルが保持具を介して吸着ヘッド
(不図示)に取り付けられる。
A suction nozzle of this type shown in FIG. 3 comprises a slider 3 which is urged downward by a spring 2 mounted in an inner 1, and a portion 3a pierced at the tip of the slider is sucked. Department. The relative rotation between the slider 3 and the inner 1 is restricted by the pin 4, and the entire nozzle is attached to a suction head (not shown) via a holder.

【0004】電子部品吸着時吸着ノズルは下方に移動
し、スライダ3の先端が電子部品に接触したときインナ
内に真空が発生し、矢印で示した向きの力により電子部
品が吸着されていた。このとき、スライダ3と電子部品
が接触することにより発生する衝撃はばね2により吸収
され、電子部品の破壊が保護されていた。
When the electronic component is attracted, the attracting nozzle moves downward, and when the tip of the slider 3 comes into contact with the electronic component, a vacuum is generated in the inner, and the electronic component is attracted by the force indicated by the arrow. At this time, the impact generated by the contact between the slider 3 and the electronic component is absorbed by the spring 2 and the destruction of the electronic component is protected.

【0005】[0005]

【発明が解決しようとする課題】このような従来の吸着
ノズルは、ノズル内に発生する真空による力のみで電子
部品を吸着していたため、電子部品上面の吸着可能な部
分の面積が小さいと、吸着ノズルの真空の力もそれに従
い小さくなってしまうため、コネクタ等電子部品の上面
の吸着可能な面積が小さく、かつ質量が大きい場合に
は、吸着が不可能になる、という問題があった。
In such a conventional suction nozzle, an electronic component is suctioned only by a force generated by a vacuum generated in the nozzle. Since the vacuum force of the suction nozzle is accordingly reduced, there is a problem that if the area on the upper surface of the electronic component such as a connector that can be suctioned is small and the mass is large, suction cannot be performed.

【0006】従って、本発明は、このような問題点を解
決するためになされたもので、部品を確実に吸着できる
部品吸着装置を提供することを課題とする。
SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve such a problem, and an object of the present invention is to provide a component sucking device capable of reliably sucking a component.

【0007】[0007]

【課題を解決するための手段】本発明は、このような課
題を解決するために、部品を真空吸着するためのノズル
部と、真空吸着動作に応じて動作する挟持部材とを設
け、真空吸着時動作する前記挟持部材によりノズル部に
吸着された部品を挟持する構成を採用した。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a nozzle portion for vacuum-sucking a component and a holding member which operates in accordance with the vacuum suction operation. A configuration is adopted in which the component adsorbed to the nozzle portion is clamped by the clamping member that operates at the time.

【0008】また、本発明では、部品を真空吸着するた
めのノズル部と、部品吸着時に発生する真空によりノズ
ル部を付勢力に抗して移動可能に保持する保持具と、真
空吸着時ノズル部の付勢力に抗した移動に応じて動作す
る挟持部材とを設け、真空吸着時動作する前記挟持部材
によりノズル部に吸着された部品を挟持する構成も採用
している。
According to the present invention, a nozzle unit for vacuum-sucking a component, a holder for movably holding the nozzle unit against a biasing force by a vacuum generated at the time of component suction, and a nozzle unit for vacuum-suction And a holding member that operates in response to the movement against the urging force, and that holds the component sucked to the nozzle portion by the holding member that operates at the time of vacuum suction.

【0009】このような構成では、真空吸着時ノズル部
に吸着された部品を真空吸着動作に応じて動作する挟持
部材により挟持するようにしているので、真空吸着によ
る吸着と挟持部材による挟持の方法により電子部品を保
持することができ、吸着面積が小さく質量の大きい電子
部品でも確実に保持することが可能になる。
In such a configuration, the components sucked by the nozzle portion at the time of vacuum suction are held by the holding member that operates in accordance with the vacuum suction operation. Therefore, a method of suctioning by vacuum suction and holding by the holding member is used. Accordingly, the electronic component can be held, and even an electronic component having a small suction area and a large mass can be reliably held.

【0010】[0010]

【発明の実施の形態】以下図面に示す実施の形態に従っ
て本発明を詳細に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in the drawings.

【0011】図1において、吸着ノズル10がヘッド1
2に取り付けられており、吸着ノズル10は上下動モー
タ13を駆動することによりピニオン13aとラック1
3bの噛み合せによりガイド14に沿って上下移動さ
れ、またモータ15を駆動することによりシャフト16
を中心に回動できるように構成されている。また、吸着
ノズル内には、パイプ17を真空源(不図示)と接続す
ることにより真空を発生することができる。この吸着ノ
ズルを取り付けたヘッド12は、その全体がXY駆動機
構(不図示)に取り付けられ、部品供給部と回路基板間
をXY移動できるように構成されている。
In FIG. 1, the suction nozzle 10 is a head 1
The suction nozzle 10 is driven by a vertically moving motor 13 to move the pinion 13a and the rack 1 together.
3b is moved up and down along the guide 14 by driving the motor 15, and the shaft 16 is moved by driving the motor 15.
It is configured to be able to rotate around. Further, a vacuum can be generated in the suction nozzle by connecting the pipe 17 to a vacuum source (not shown). The entire head 12 to which the suction nozzle is attached is attached to an XY drive mechanism (not shown), and is configured to be able to move XY between the component supply unit and the circuit board.

【0012】図2(A)〜(E)には、吸着ノズルの詳
細な構造が図示されており、吸着ヘッドのノズル保持部
(不図示)に結合されるインナ20の内部には電子部品
を真空吸着するノズル部となるスライダ21が収納され
ている。このスライダ21は、インナ内のばね22の付
勢力によりその大径部21aがインナの座部20aに当
接するように、またスライダ21の先端に上向きの力が
作用すると、ばね22の付勢力に抗してインナ内を上方
に移動できるようにインナ内に上下動可能に保持されて
いる。
FIGS. 2A to 2E show the detailed structure of the suction nozzle. Electronic components are provided inside the inner member 20 which is connected to a nozzle holder (not shown) of the suction head. A slider 21 serving as a nozzle for vacuum suction is housed. When the upward force acts on the tip of the slider 21 such that the large-diameter portion 21a comes into contact with the inner seat portion 20a by the urging force of the spring 22 inside the inner member, and the urging force of the spring 22, It is vertically movably held in the inner so that it can move upward in the inner in opposition.

【0013】スライダ21及びばね22は上方から抜け
ないようにするために、キャップ23で塞がれ、またキ
ャップ23はねじ24によりインナ20に固定される。
The slider 21 and the spring 22 are closed by a cap 23 to prevent the slider 21 and the spring 22 from coming off from above, and the cap 23 is fixed to the inner 20 by screws 24.

【0014】スライダ21の内部には穿孔21bが軸方
向に形成されており、この穿孔21bはキャップ23の
孔23aに連通していて、真空発生源(不図示)に接続
させることにより穿孔21bに真空を発生することがで
きる。穿孔21bを塞ぐときにノズル内に発生する真空
圧によりスライダ21が上方に移動しようとする力は、
ばね22の下方への付勢力より強く設定され、それによ
りスライダはばね22の付勢力に抗して上方に移動可能
になる。
A bore 21b is formed in the inside of the slider 21 in the axial direction. The bore 21b communicates with a hole 23a of the cap 23, and is connected to a vacuum source (not shown) to form the bore 21b. A vacuum can be generated. The force of the slider 21 to move upward due to the vacuum pressure generated in the nozzle when closing the perforation 21b is:
It is set stronger than the downward biasing force of the spring 22, so that the slider can move upward against the biasing force of the spring 22.

【0015】吸着ノズルの下方には、電子部品を掴む一
対の挟持爪26a、26bがインナ20下部に嵌入され
たピン27a、27bを中心に回動できるように取り付
けられている。また、各挟持爪26a、26bはコ字状
であり、その端部の溝31は図2(F)に図示したよう
にスライダ21に嵌入されたピン28と結合されるの
で、スライダが上下動すると、各挟持爪26a、26b
はピン27a、27bを中心に回動する。なお、ピン2
8の径はスライダ21の穿孔21bの逃げ孔21dより
細く形成されている。各挟持爪の先端にはクッション材
29a、29bが取り付けられており、挟持爪29a、
29bにより挟持される電子部品を保護する機能を果た
す。
Below the suction nozzle, a pair of holding claws 26a, 26b for gripping electronic components are attached so as to be rotatable about pins 27a, 27b fitted in the lower part of the inner 20. Each of the holding claws 26a and 26b has a U-shape, and the groove 31 at the end thereof is coupled to the pin 28 fitted in the slider 21 as shown in FIG. Then, each of the holding claws 26a, 26b
Rotates about the pins 27a and 27b. Note that pin 2
The diameter of 8 is formed smaller than the escape hole 21d of the hole 21b of the slider 21. Cushion material 29a, 29b is attached to the tip of each pinching claw,
29b serves to protect the electronic components held therebetween.

【0016】このような構成において、吸着ノズルは部
品供給部から供給される電子部品30を吸着すべくモー
タ13により下方に移動される。スライダ21が電子部
品と接触すると、電子部品は真空吸着され、そのときス
ライダの穿孔21bが部品により塞がれるので、ノズル
内の真空圧が上昇する。
In such a configuration, the suction nozzle is moved downward by the motor 13 to suck the electronic component 30 supplied from the component supply unit. When the slider 21 comes into contact with the electronic component, the electronic component is vacuum-sucked. At this time, the hole 21b of the slider is closed by the component, and the vacuum pressure in the nozzle increases.

【0017】このとき、ばね22の下方への付勢力は、
上昇した真空圧より小さく設定されているので、スライ
ダ21はばね22の付勢力に抗して上方に移動する。こ
のスライダの上方移動によりピン28を介してスライダ
と結合されている挟持爪26aは、図2(D)に示した
ように、ピン27aを中心に時計方向に、また挟持爪2
6bはピン27bを中心に反時計方向に回動し、スライ
ダ21の先端に真空吸着された電子部品30は、挟持爪
26a、26bにより挟持されるようになる。
At this time, the downward biasing force of the spring 22 is
Since the pressure is set to be smaller than the increased vacuum pressure, the slider 21 moves upward against the urging force of the spring 22. As shown in FIG. 2D, the holding claw 26a connected to the slider via the pin 28 by the upward movement of the slider causes the holding claw 2 to rotate clockwise around the pin 27a.
6b rotates counterclockwise about the pin 27b, and the electronic component 30 vacuum-adsorbed to the tip of the slider 21 is held by the holding claws 26a, 26b.

【0018】このように、本発明では、真空吸着による
「吸着」と挟持爪による「挟持」の方法により電子部品
を保持することになるので、吸着面積が小さく質量の大
きい電子部品でも確実に保持することが可能になる。
As described above, in the present invention, the electronic components are held by the method of "sucking" by vacuum suction and "holding" by the holding claws, so that even electronic components having a small suction area and a large mass can be reliably held. It becomes possible to do.

【0019】なお、真空吸着による保持だけであると、
供給される電子部品の状態に従って吸着姿勢にばらつき
が発生するが、挟持爪による挟持動作により吸着された
部品のセンタリングが可能になるので、電子部品の保持
姿勢が安定し、レーザによる吸着姿勢の認識あるいは認
識カメラによる吸着姿勢の認識が安定して行なえるよう
になる。
In addition, if only holding by vacuum suction is performed,
The suction posture varies depending on the state of the supplied electronic components. However, the holding operation of the electronic components is stabilized by the centering of the sucked components by the holding operation by the holding claws, and the suction posture is recognized by the laser. Alternatively, the recognition of the suction posture by the recognition camera can be stably performed.

【0020】また、挟持爪が挟持動作をするのは、ノズ
ル内に所定の真空圧が発生しスライダが上方に移動する
ときだけなので、スライダの上方移動あるいは挟持爪の
回動動作をチェックすることにより電子部品を保持する
かあるいは保持しないかを判断する真空チェックが可能
になる。
Also, since the gripping claw performs the gripping operation only when a predetermined vacuum pressure is generated in the nozzle and the slider moves upward, it is necessary to check the upward movement of the slider or the rotation operation of the gripping claw. This enables a vacuum check to determine whether to hold the electronic component or not.

【0021】また、吸着面が全くない電子部品の場合に
おいては、何らかの方法でスライダ先端の孔を埋めるこ
とで、挟持爪を動作させ、挟持爪による「挟持」方式の
みで電子部品を保持することも可能である。
In the case of an electronic component having no suction surface, the hole at the tip of the slider is filled in some way to operate the holding claw, and the electronic component is held only by the “holding” method using the holding claw. Is also possible.

【0022】[0022]

【発明の効果】以上説明したように、本発明では、真空
吸着時ノズル部に吸着された部品を真空吸着動作に応じ
て動作する挟持部材により挟持するようにしているの
で、真空吸着による吸着と挟持爪による挟持の方法によ
り電子部品を保持することができ、吸着面積が小さく質
量の大きい電子部品でも確実に保持することが可能にな
る。
As described above, according to the present invention, the components sucked by the nozzle portion at the time of vacuum suction are held by the holding member which operates in accordance with the vacuum suction operation. The electronic component can be held by the method of being held by the holding claws, and even an electronic component having a small suction area and a large mass can be reliably held.

【図面の簡単な説明】[Brief description of the drawings]

【図1】吸着ノズルを取り付けた吸着ヘッドの外観を示
した斜視図である。
FIG. 1 is a perspective view showing the appearance of a suction head to which a suction nozzle is attached.

【図2】(A)は吸着ノズルの側面図、(B)はその内
部構造を示した断面図、(C)は挟持爪が挟持動作をす
る前の吸着ノズルの状態を示した正面図、(D)は挟持
爪が挟持動作をした後の吸着ノズルの状態を示した正面
図、(E)は吸着ノズルを下方から見た底面図、(F)
は挟持爪の外観を示す斜視図である。
2A is a side view of the suction nozzle, FIG. 2B is a cross-sectional view showing an internal structure thereof, FIG. 2C is a front view showing a state of the suction nozzle before a holding claw performs a holding operation, (D) is a front view showing the state of the suction nozzle after the holding claw has performed the holding operation, (E) is a bottom view of the suction nozzle viewed from below, and (F).
FIG. 4 is a perspective view showing an appearance of a holding claw.

【図3】従来の吸着ノズルの構造を示した断面図であ
る。
FIG. 3 is a cross-sectional view showing a structure of a conventional suction nozzle.

【符号の説明】[Explanation of symbols]

20 インナ 21 スライダ 22 ばね 23 キャップ 26a、26b 挟持爪 27a、27b、28 ピン Reference Signs List 20 inner 21 slider 22 spring 23 cap 26a, 26b pinching claw 27a, 27b, 28 pin

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 部品を真空吸着するためのノズル部と、 真空吸着動作に応じて動作する挟持部材とを設け、 真空吸着時動作する前記挟持部材によりノズル部に吸着
された部品を挟持することを特徴とする部品吸着装置。
1. A nozzle part for vacuum-sucking a component, and a holding member that operates in response to a vacuum suction operation, wherein the part sucked by the nozzle part is held by the holding member that operates during vacuum suction. A component suction device.
【請求項2】 部品を真空吸着するためのノズル部と、 部品吸着時に発生する真空によりノズル部を付勢力に抗
して移動可能に保持する保持具と、 真空吸着時ノズル部の付勢力に抗した移動に応じて動作
する挟持部材とを設け、 真空吸着時動作する前記挟持部材によりノズル部に吸着
された部品を挟持することを特徴とする部品吸着装置。
2. A nozzle portion for vacuum-sucking a component, a holder for movably holding the nozzle portion against a biasing force by a vacuum generated at the time of component suction, and a nozzle for vacuum-sucking the component during vacuum suction. A component suction device, comprising: a holding member that operates in response to the movement of the holding member; and a component that is suctioned to the nozzle portion by the holding member that operates during vacuum suction.
JP22544997A 1997-08-22 1997-08-22 Component adsorption device Expired - Fee Related JP3891655B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22544997A JP3891655B2 (en) 1997-08-22 1997-08-22 Component adsorption device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22544997A JP3891655B2 (en) 1997-08-22 1997-08-22 Component adsorption device

Publications (2)

Publication Number Publication Date
JPH1168390A true JPH1168390A (en) 1999-03-09
JP3891655B2 JP3891655B2 (en) 2007-03-14

Family

ID=16829533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22544997A Expired - Fee Related JP3891655B2 (en) 1997-08-22 1997-08-22 Component adsorption device

Country Status (1)

Country Link
JP (1) JP3891655B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010036265A (en) * 2008-07-31 2010-02-18 Juki Corp Device and method for holding electronic parts
CN103538055A (en) * 2013-09-29 2014-01-29 昆山中士设备工业有限公司 Mechanical arm suitable for various parts
CN103538073A (en) * 2013-09-29 2014-01-29 昆山中士设备工业有限公司 Sucker special for threaded rod
CN103538074A (en) * 2013-10-22 2014-01-29 昆山中士设备工业有限公司 Mechanical arm capable of preventing screw rolling during conveying
CN103538056A (en) * 2013-10-22 2014-01-29 昆山中士设备工业有限公司 Manipulator beneficial to stable transporting of screws
CN105215931A (en) * 2015-11-09 2016-01-06 中山联合光电科技股份有限公司 The automatic press-in device of a kind of pin
CN108738294A (en) * 2017-04-19 2018-11-02 松下知识产权经营株式会社 Part carrying device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010036265A (en) * 2008-07-31 2010-02-18 Juki Corp Device and method for holding electronic parts
CN103538055A (en) * 2013-09-29 2014-01-29 昆山中士设备工业有限公司 Mechanical arm suitable for various parts
CN103538073A (en) * 2013-09-29 2014-01-29 昆山中士设备工业有限公司 Sucker special for threaded rod
CN103538074A (en) * 2013-10-22 2014-01-29 昆山中士设备工业有限公司 Mechanical arm capable of preventing screw rolling during conveying
CN103538056A (en) * 2013-10-22 2014-01-29 昆山中士设备工业有限公司 Manipulator beneficial to stable transporting of screws
CN105215931A (en) * 2015-11-09 2016-01-06 中山联合光电科技股份有限公司 The automatic press-in device of a kind of pin
CN108738294A (en) * 2017-04-19 2018-11-02 松下知识产权经营株式会社 Part carrying device
CN108738294B (en) * 2017-04-19 2021-08-17 松下知识产权经营株式会社 Component mounting device

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