JPH1168390A - Component suction device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component suction device capable of securely sucking and holding an electronic component. SOLUTION: A slider 21 moves upward resisting an urging force of a spring 22 in an inner 20 with a vacuum force generated when sucking the electronic component. A pair of gripping hooks 26a and 26b rotatable around pins 27a and 27b fixed to the inner are installed at the lower part of the nozzle. As the other end of the gripping hook 26a and 26b are connected to a pin 28 fixed to the slider 21, the each gripping hook 26a and 26b rotates around the pin 27a and 27b when the slider 21 moves upward and grips an electronic component 30 vacuum sucked to the slider 21. The structure of gripping the component sucked to the vacuum suction nozzle by the gripping hooks 26a and 26b operating according to the vacuum suction makes it possible to hold the electronic component by the suction of vacuum suction and the grip by the gripping hooks 26a and 26b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component suction device, and more particularly, to a component suction device used in a chip mounter for picking up an electronic component and mounting it on a circuit board.

[0002]

2. Description of the Related Art A chip mounter mounts electronic components supplied from a component supply device at predetermined positions on a circuit board. In such a chip mounter, the electronic component is sucked by a suction nozzle attached to a suction head movable in the XY directions, and the suction head moves to a predetermined position on the circuit board to release the sucked electronic component. Thus, the electronic components are mounted on the circuit board.

A suction nozzle of this type shown in FIG. 3 comprises a slider 3 which is urged downward by a spring 2 mounted in an inner 1, and a portion 3a pierced at the tip of the slider is sucked. Department. The relative rotation between the slider 3 and the inner 1 is restricted by the pin 4, and the entire nozzle is attached to a suction head (not shown) via a holder.

When the electronic component is attracted, the attracting nozzle moves downward, and when the tip of the slider 3 comes into contact with the electronic component, a vacuum is generated in the inner, and the electronic component is attracted by the force indicated by the arrow. At this time, the impact generated by the contact between the slider 3 and the electronic component is absorbed by the spring 2 and the destruction of the electronic component is protected.

[0005]

In such a conventional suction nozzle, an electronic component is suctioned only by a force generated by a vacuum generated in the nozzle. Since the vacuum force of the suction nozzle is accordingly reduced, there is a problem that if the area on the upper surface of the electronic component such as a connector that can be suctioned is small and the mass is large, suction cannot be performed.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve such a problem, and an object of the present invention is to provide a component sucking device capable of reliably sucking a component.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a nozzle portion for vacuum-sucking a component and a holding member which operates in accordance with the vacuum suction operation. A configuration is adopted in which the component adsorbed to the nozzle portion is clamped by the clamping member that operates at the time.

According to the present invention, a nozzle unit for vacuum-sucking a component, a holder for movably holding the nozzle unit against a biasing force by a vacuum generated at the time of component suction, and a nozzle unit for vacuum-suction And a holding member that operates in response to the movement against the urging force, and that holds the component sucked to the nozzle portion by the holding member that operates at the time of vacuum suction.

In such a configuration, the components sucked by the nozzle portion at the time of vacuum suction are held by the holding member that operates in accordance with the vacuum suction operation. Therefore, a method of suctioning by vacuum suction and holding by the holding member is used. Accordingly, the electronic component can be held, and even an electronic component having a small suction area and a large mass can be reliably held.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in the drawings.

In FIG. 1, the suction nozzle 10 is a head 1
The suction nozzle 10 is driven by a vertically moving motor 13 to move the pinion 13a and the rack 1 together.
3b is moved up and down along the guide 14 by driving the motor 15, and the shaft 16 is moved by driving the motor 15.
It is configured to be able to rotate around. Further, a vacuum can be generated in the suction nozzle by connecting the pipe 17 to a vacuum source (not shown). The entire head 12 to which the suction nozzle is attached is attached to an XY drive mechanism (not shown), and is configured to be able to move XY between the component supply unit and the circuit board.

FIGS. 2A to 2E show the detailed structure of the suction nozzle. Electronic components are provided inside the inner member 20 which is connected to a nozzle holder (not shown) of the suction head. A slider 21 serving as a nozzle for vacuum suction is housed. When the upward force acts on the tip of the slider 21 such that the large-diameter portion 21a comes into contact with the inner seat portion 20a by the urging force of the spring 22 inside the inner member, and the urging force of the spring 22, It is vertically movably held in the inner so that it can move upward in the inner in opposition.

The slider 21 and the spring 22 are closed by a cap 23 to prevent the slider 21 and the spring 22 from coming off from above, and the cap 23 is fixed to the inner 20 by screws 24.

A bore 21b is formed in the inside of the slider 21 in the axial direction. The bore 21b communicates with a hole 23a of the cap 23, and is connected to a vacuum source (not shown) to form the bore 21b. A vacuum can be generated. The force of the slider 21 to move upward due to the vacuum pressure generated in the nozzle when closing the perforation 21b is:
It is set stronger than the downward biasing force of the spring 22, so that the slider can move upward against the biasing force of the spring 22.

Below the suction nozzle, a pair of holding claws 26a, 26b for gripping electronic components are attached so as to be rotatable about pins 27a, 27b fitted in the lower part of the inner 20. Each of the holding claws 26a and 26b has a U-shape, and the groove 31 at the end thereof is coupled to the pin 28 fitted in the slider 21 as shown in FIG. Then, each of the holding claws 26a, 26b
Rotates about the pins 27a and 27b. Note that pin 2
The diameter of 8 is formed smaller than the escape hole 21d of the hole 21b of the slider 21. Cushion material 29a, 29b is attached to the tip of each pinching claw,
29b serves to protect the electronic components held therebetween.

In such a configuration, the suction nozzle is moved downward by the motor 13 to suck the electronic component 30 supplied from the component supply unit. When the slider 21 comes into contact with the electronic component, the electronic component is vacuum-sucked. At this time, the hole 21b of the slider is closed by the component, and the vacuum pressure in the nozzle increases.

At this time, the downward biasing force of the spring 22 is
Since the pressure is set to be smaller than the increased vacuum pressure, the slider 21 moves upward against the urging force of the spring 22. As shown in FIG. 2D, the holding claw 26a connected to the slider via the pin 28 by the upward movement of the slider causes the holding claw 2 to rotate clockwise around the pin 27a.
6b rotates counterclockwise about the pin 27b, and the electronic component 30 vacuum-adsorbed to the tip of the slider 21 is held by the holding claws 26a, 26b.

As described above, in the present invention, the electronic components are held by the method of "sucking" by vacuum suction and "holding" by the holding claws, so that even electronic components having a small suction area and a large mass can be reliably held. It becomes possible to do.

In addition, if only holding by vacuum suction is performed,
The suction posture varies depending on the state of the supplied electronic components. However, the holding operation of the electronic components is stabilized by the centering of the sucked components by the holding operation by the holding claws, and the suction posture is recognized by the laser. Alternatively, the recognition of the suction posture by the recognition camera can be stably performed.

Also, since the gripping claw performs the gripping operation only when a predetermined vacuum pressure is generated in the nozzle and the slider moves upward, it is necessary to check the upward movement of the slider or the rotation operation of the gripping claw. This enables a vacuum check to determine whether to hold the electronic component or not.

In the case of an electronic component having no suction surface, the hole at the tip of the slider is filled in some way to operate the holding claw, and the electronic component is held only by the “holding” method using the holding claw. Is also possible.

[0022]

As described above, according to the present invention, the components sucked by the nozzle portion at the time of vacuum suction are held by the holding member which operates in accordance with the vacuum suction operation. The electronic component can be held by the method of being held by the holding claws, and even an electronic component having a small suction area and a large mass can be reliably held.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the appearance of a suction head to which a suction nozzle is attached.

2A is a side view of the suction nozzle, FIG. 2B is a cross-sectional view showing an internal structure thereof, FIG. 2C is a front view showing a state of the suction nozzle before a holding claw performs a holding operation, (D) is a front view showing the state of the suction nozzle after the holding claw has performed the holding operation, (E) is a bottom view of the suction nozzle viewed from below, and (F).
FIG. 4 is a perspective view showing an appearance of a holding claw.

FIG. 3 is a cross-sectional view showing a structure of a conventional suction nozzle.

[Explanation of symbols]

 Reference Signs List 20 inner 21 slider 22 spring 23 cap 26a, 26b pinching claw 27a, 27b, 28 pin

Claims (2)

[Claims] 1. A nozzle part for vacuum-sucking a component, and a holding member that operates in response to a vacuum suction operation, wherein the part sucked by the nozzle part is held by the holding member that operates during vacuum suction. A component suction device. 2. A nozzle portion for vacuum-sucking a component, a holder for movably holding the nozzle portion against a biasing force by a vacuum generated at the time of component suction, and a nozzle for vacuum-sucking the component during vacuum suction. A component suction device, comprising: a holding member that operates in response to the movement of the holding member; and a component that is suctioned to the nozzle portion by the holding member that operates during vacuum suction.