JP3891655B2 - Component adsorption device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component suction device, and more particularly to a component suction device used for a chip mounter that sucks and mounts an electronic component at a circuit board position.
[0002]
[Prior art]
The chip mounter mounts electronic components supplied from the component supply device at predetermined positions on the circuit board. In such a chip mounter, the electronic component is sucked by a suction nozzle attached to a suction head movable in the XY directions, and the suction head moves to a predetermined position on the circuit board to release the sucked electronic component. Thus, electronic components are mounted on the circuit board.
[0003]
This kind of suction nozzle shown in FIG. 3 is composed of a slider 3 urged downward by a spring 2 mounted in the inner 1, and a portion 3a drilled at the tip of the slider serves as a suction portion. ing. The relative rotation between the slider 3 and the inner 1 is limited by a pin 4, and the entire nozzle is attached to a suction head (not shown) via a holder.
[0004]
When the electronic component was sucked, the suction nozzle moved downward, and when the tip of the slider 3 contacted the electronic component, a vacuum was generated in the inner, and the electronic component was sucked by the force in the direction indicated by the arrow. At this time, the impact generated by the contact between the slider 3 and the electronic component was absorbed by the spring 2, and the destruction of the electronic component was protected.
[0005]
[Problems to be solved by the invention]
Such a conventional suction nozzle sucks an electronic component only by the vacuum force generated in the nozzle. Therefore, if the area of the suckable portion on the upper surface of the electronic component is small, the vacuum force of the suction nozzle decreases accordingly. For this reason, there is a problem that if the area that can be adsorbed on the upper surface of an electronic component such as a connector is small and the mass is large, the adsorption cannot be performed.
[0006]
Accordingly, the present invention has been made to solve such problems, and an object of the present invention is to provide a component adsorption device that can reliably adsorb components.
[0007]
[Means for Solving the Problems]
In order to solve such problems, the present invention provides:
In the component adsorption device,
A nozzle for vacuum-sucking the components;
A holder for holding the nozzle part so as to be movable up and down;
A spring for urging the nozzle portion downward;
It has a clamping member that rotates by the vertical movement of the nozzle part,
When the parts are vacuum-sucked by the nozzle part, the nozzle part moves upward against the urging force of the spring by the rising vacuum pressure, so that the holding member rotates to hold the sucked part. The configuration to adopt was adopted.
[0009]
In such a configuration, when the part is vacuum-sucked by the nozzle part, the nozzle part moves upward against the urging force of the spring by the rising vacuum pressure, so that the sandwiched member holds the sucked part. Therefore, it is possible to hold the electronic component by a method of suction by vacuum suction and clamping by a clamping member, and it is possible to securely hold an electronic component having a small suction area and a large mass.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail according to embodiments shown in the drawings.
[0011]
In FIG. 1, a suction nozzle 10 is attached to a head 12, and the suction nozzle 10 is moved up and down along a guide 14 by engaging a pinion 13a and a rack 13b by driving a vertical movement motor 13. It is configured to be able to rotate around the shaft 16 by being driven. Further, a vacuum can be generated in the suction nozzle by connecting the pipe 17 to a vacuum source (not shown). The head 12 to which the suction nozzle is attached is entirely attached to an XY drive mechanism (not shown), and is configured to be able to move XY between the component supply unit and the circuit board.
[0012]
2A to 2E show the detailed structure of the suction nozzle, and an electronic component is vacuum-sucked inside the inner 20 coupled to the nozzle holding portion (not shown) of the suction head. A slider 21 serving as a nozzle portion is accommodated. When the slider 21 has a large-diameter portion 21a abutting against the seat portion 20a of the inner due to the biasing force of the spring 22 in the inner part, and when an upward force acts on the tip of the slider 21, the biasing force of the spring 22 is exerted. The inner part is held so as to be movable up and down so that it can move upward in the inner part.
[0013]
The slider 21 and the spring 22 are closed with a cap 23 so as not to come out from above, and the cap 23 is fixed to the inner 20 with a screw 24.
[0014]
A perforation 21b is formed in the slider 21 in the axial direction. The perforation 21b communicates with the hole 23a of the cap 23 and is connected to a vacuum generation source (not shown) to generate a vacuum in the perforation 21b. can do. The force that the slider 21 tries to move upward due to the vacuum pressure generated in the nozzle when the perforation 21 b is closed is set to be stronger than the downward biasing force of the spring 22, so that the slider resists the biasing force of the spring 22. And can be moved upward.
[0015]
Below the suction nozzle, a pair of clamping claws 26a and 26b for gripping electronic components are attached so as to be rotatable around pins 27a and 27b fitted in the lower part of the inner 20. Further, each clamping claw 26a, 26b is U-shaped, and the groove 31 at the end thereof is coupled to the pin 28 fitted in the slider 21 as shown in FIG. Then, each clamping nail | claw 26a, 26b rotates centering on pin 27a, 27b. The diameter of the pin 28 is narrower than the escape hole 21d of the perforation 21b of the slider 21. Cushion materials 29a and 29b are attached to the front ends of the respective clamping claws, and function to protect electronic components sandwiched by the clamping claws 29a and 29b.
[0016]
In such a configuration, the suction nozzle is moved downward by the motor 13 to suck the electronic component 30 supplied from the component supply unit. When the slider 21 comes into contact with the electronic component, the electronic component is vacuum-sucked. At that time, the perforation 21b of the slider is closed by the component, and the vacuum pressure in the nozzle increases.
[0017]
At this time, since the downward biasing force of the spring 22 is set to be smaller than the increased vacuum pressure, the slider 21 moves upward against the biasing force of the spring 22. As shown in FIG. 2D, the clamping claw 26a coupled to the slider via the pin 28 by the upward movement of the slider is clockwise around the pin 27a, and the clamping claw 26b is connected to the pin 27b. The electronic component 30 that rotates counterclockwise about the center and is vacuum-adsorbed to the tip of the slider 21 is clamped by the clamping claws 26a and 26b.
[0018]
As described above, in the present invention, the electronic component is held by the method of “adsorption” by vacuum adsorption and “clamping” by the clamping claws, so that even an electronic component having a small adsorption area and a large mass can be securely held. It becomes possible.
[0019]
Note that if only holding by vacuum suction is performed, the suction posture varies depending on the state of the electronic component supplied, but the centering of the sucked component by the clamping operation by the clamping claws becomes possible, so the holding of the electronic component is possible. The posture is stabilized, and the suction posture recognition by the laser or the suction posture recognition by the recognition camera can be stably performed.
[0020]
In addition, the clamping claw performs the clamping operation only when a predetermined vacuum pressure is generated in the nozzle and the slider moves upward. By checking the upward movement of the slider or the rotation of the clamping claw, the electronic component It is possible to perform a vacuum check for determining whether to hold or not.
[0021]
Also, in the case of electronic components that do not have any suction surface, it is possible to hold the electronic component only by “clamping” using the clamping claw by operating the clamping claw by filling the hole at the tip of the slider in some way. is there.
[0022]
【The invention's effect】
As described above, in the component suction device according to the present invention , when the component is vacuum-sucked by the nozzle part, the nozzle part moves upward against the urging force of the spring by the rising vacuum pressure, so that the clamping member Is rotated so as to hold the sucked component, so that the electronic component can be held by the suction method by vacuum suction and the holding method by the holding member, and the electronic component having a small suction area and a large mass can be securely held. It becomes possible.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an appearance of a suction head to which a suction nozzle is attached.
2A is a side view of the suction nozzle, FIG. 2B is a cross-sectional view showing the internal structure thereof, and FIG. 2C is a front view showing the state of the suction nozzle before the clamping claw performs a clamping operation; (D) is a front view showing the state of the suction nozzle after the clamping claw has performed a clamping operation, (E) is a bottom view of the suction nozzle as seen from below, and (F) is a perspective view showing the appearance of the clamping claw. is there.
FIG. 3 is a cross-sectional view showing the structure of a conventional suction nozzle.
[Explanation of symbols]
20 Inner 21 Slider 22 Spring 23 Cap 26a, 26b Claw 27a, 27b, 28 Pin

Claims (1)

A nozzle for vacuum-sucking the components;
A holder for holding the nozzle part so as to be movable up and down ;
A spring for urging the nozzle portion downward;
It has a clamping member that rotates by the vertical movement of the nozzle part,
When the part is vacuum-sucked by the nozzle part, the nozzle part moves upward against the urging force of the spring by the rising vacuum pressure, so that the holding member rotates to hold the sucked part. A component adsorbing device.

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