JPH11233312A - Electrical component - Google Patents

Electrical component

Info

Publication number
JPH11233312A
JPH11233312A JP10028146A JP2814698A JPH11233312A JP H11233312 A JPH11233312 A JP H11233312A JP 10028146 A JP10028146 A JP 10028146A JP 2814698 A JP2814698 A JP 2814698A JP H11233312 A JPH11233312 A JP H11233312A
Authority
JP
Japan
Prior art keywords
insulating substrate
printing
terminal
conductive
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10028146A
Other languages
Japanese (ja)
Other versions
JP3607068B2 (en
Inventor
Seiya Sasaki
誠也 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP02814698A priority Critical patent/JP3607068B2/en
Publication of JPH11233312A publication Critical patent/JPH11233312A/en
Application granted granted Critical
Publication of JP3607068B2 publication Critical patent/JP3607068B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Manufacture Of Switches (AREA)
  • Details Of Resistors (AREA)
  • Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electrical components which is capable of preventing continuity between terminal sections due to bleeding of paste, resulting in few detective products, and can be manufactured at good productivity. SOLUTION: An electrical component is constituted by forming a film section having irregularities 4e on its end face section on an insulating substrate 1 and positioning a terminal sections 6a of a conductive section 6, formed in the film section 4 to the recesses 4c of the irregularities 4e at intervals from the front ends of projecting sections 4d. Therefore, bleeding of paste which occurs when the terminal sections 6a are formed by printing, etc., can be prevented from reaching the adjacent terminal section 6a by the projecting sections 4d and few defective electrical components results, and satisfactory electric components can be manufactured at high productivity.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、印刷などによって
導電部が形成される可変抵抗器、スイッチ等に使用して
好適な電気部品に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric component suitable for use in a variable resistor, a switch, and the like having a conductive portion formed by printing or the like.

【0002】[0002]

【従来の技術】従来における電気部品、例えばタップ付
二連可変抵抗器は、図7、図8に示すように、中心部に
孔21aを有するフェノール樹脂からなる絶縁基板21
上に、先ず、銀ペーストを印刷して第1と第2のタップ
電極22、23を形成する。次に、絶縁基板21上に、
タップ電極22、23の両端部22a、22b、及び2
3a、23bを露出した状態で絶縁材のペーストを印刷
して皮膜部24を形成する。この時、タップ電極22、
23の一端部22b、23bは、皮膜部24に設けられ
た孔24a、24bによって、露出した状態となってい
る。そして、この皮膜部24上に、外周側から順次、銀
ペーストの印刷で形成した第1の導電部25と、抵抗ペ
ーストの印刷で形成した第1と第2の抵抗体26、27
と、銀ペーストの印刷で形成した第2の導電部28が形
成されている。この時、第1の抵抗体26の中間部はタ
ップ電極22の端部22bと接続され、また、第2の抵
抗体27の中間部はタップ電極23の端部23bと接続
されて、その他の抵抗体26、27、及び導電部25、
28は皮膜部24によって、タップ電極22、23から
絶縁された状態となっている。
2. Description of the Related Art As shown in FIGS. 7 and 8, a conventional electric component, for example, a double variable resistor with a tap, is an insulating substrate 21 made of a phenol resin having a hole 21a at the center.
First, first and second tap electrodes 22 and 23 are formed by printing a silver paste. Next, on the insulating substrate 21,
Both ends 22a, 22b, and 2 of the tap electrodes 22, 23
The coating 24 is formed by printing the paste of the insulating material with the portions 3a and 23b exposed. At this time, the tap electrode 22,
One end portions 22b and 23b of 23 are exposed by holes 24a and 24b provided in the film portion 24. Then, a first conductive portion 25 formed by printing a silver paste and first and second resistors 26 and 27 formed by printing a resistive paste are sequentially formed on the coating portion 24 from the outer peripheral side.
And a second conductive portion 28 formed by printing silver paste. At this time, the middle part of the first resistor 26 is connected to the end 22b of the tap electrode 22, and the middle part of the second resistor 27 is connected to the end 23b of the tap electrode 23, and other parts are connected. Resistors 26 and 27, and conductive portion 25,
Reference numeral 28 is insulated from the tap electrodes 22 and 23 by the coating 24.

【0003】また、絶縁基板21上には、タップ電極2
2、23の端部22a、23aのそれぞれ接続され、銀
ペーストの印刷で形成された端子部22c,23cが形
成されている。また、第1と第2の導電部25、28の
端部、及び第1と第2の抵抗体26、27の端部には、
それぞれに接続された状態で、銀ペーストの印刷で形成
された端子部25a、28a、及び26a、26b、2
7a、27bが形成されている。そして、これらの端子
部は、皮膜部24上から皮膜部24の直線状の端面部2
4cを越えて絶縁基板21上に延設されている。このよ
うに、タップ電極22、23、第1と第2の導電部2
5、28、及び第1と第2の抵抗体26、27のそれぞ
れの端子部には、金属製の端子(図示せず)が取り付け
られるが、プリント基板(図示せず)等への接続を容易
にするため、或いは絶縁基板21の小型化の為に、前記
端子部は絶縁基板21の一端面部側に集中して配設され
たものとなっている。
On the insulating substrate 21, a tap electrode 2
Terminal portions 22c, 23c formed by printing silver paste are formed, which are respectively connected to the end portions 22a, 23a of 2, 23. Also, the ends of the first and second conductive portions 25 and 28 and the ends of the first and second resistors 26 and 27
The terminal portions 25a, 28a, 26a, 26b, and 2 formed by printing silver paste are connected to each other.
7a and 27b are formed. Then, these terminal portions are connected to the linear end face portion 2 of the film portion 24 from above the film portion 24.
4c and extends over the insulating substrate 21. Thus, the tap electrodes 22 and 23, the first and second conductive portions 2
Metal terminals (not shown) are attached to the terminal portions of the first and second resistors 5 and 28 and the first and second resistors 26 and 27, respectively, and are connected to a printed circuit board (not shown). For ease or miniaturization of the insulating substrate 21, the terminal portions are arranged concentratedly on one end surface side of the insulating substrate 21.

【0004】そして、このようなタップ付二連可変抵抗
器は、第1の導電部25と第1の抵抗体26に摺動子
(図示せず)を摺接させることにより第1の可変抵抗器
を、また、第2の導電部28と第2の抵抗体27に摺動
子(図示せず)を摺接させることにより第2の可変抵抗
器を構成するようになっている。
[0004] Such a dual variable resistor with tap is provided with a first variable resistor by sliding a slider (not shown) between the first conductive portion 25 and the first resistor 26. A second variable resistor is formed by sliding a slider (not shown) between the second conductive portion 28 and the second resistor 27.

【0005】また、図9はもう一つの従来の電気部品で
ある二連可変抵抗器を示し、この二連可変抵抗器は、中
央部に孔31aを有するセラミックからなる絶縁基板3
1上に、絶縁基板31の上面を平滑にして印刷を容易、
且つ、精度良くするため、絶縁材のペーストを印刷して
皮膜部32が形成されている。そして、この皮膜部32
上に、外周側から順次、銀ペーストの印刷で形成した第
1の導電部33と、抵抗ペーストの印刷で形成した第1
と第2の抵抗体34、35と、銀ペーストの印刷で形成
した第2の導電部36が形成されている。また、第1と
第2の導電部33、36の端部、及び第1と第2の抵抗
体34、35の端部には、それぞれに接続された状態
で、銀ペーストの印刷で形成された端子部33a、36
a、及び34a、34b,35a,35bが形成されて
いる。そして、これらの端子部は、皮膜部32上から皮
膜部32の直線状の端面部32aを越えて絶縁基板31
上に延設されている。このように、第1と第2の導電部
33、36、及び第1と第2の抵抗体34、35のそれ
ぞれの端子部は、前記の従来例と同様の理由で、絶縁基
板31の一端面部側に集中して配設されたものとなって
いる。
FIG. 9 shows a dual variable resistor as another conventional electric component. The dual variable resistor is composed of a ceramic insulating substrate 3 having a hole 31a in the center.
1 on the upper surface of the insulating substrate 31 to facilitate printing,
Further, in order to improve the precision, the coating 32 is formed by printing a paste of an insulating material. And, this coating part 32
A first conductive portion 33 formed by printing a silver paste and a first conductive portion formed by printing a resistive paste are sequentially formed on the upper side.
And second resistors 34 and 35, and a second conductive portion 36 formed by printing silver paste. The ends of the first and second conductive portions 33 and 36 and the ends of the first and second resistors 34 and 35 are formed by printing silver paste in a state where they are connected to each other. Terminal portions 33a, 36
a, and 34a, 34b, 35a, 35b are formed. Then, these terminal portions extend from above the film portion 32 over the linear end surface portion 32a of the film portion 32 to the insulating substrate 31.
It is extended above. As described above, the respective terminals of the first and second conductive portions 33 and 36 and the first and second resistors 34 and 35 are connected to one end of the insulating substrate 31 for the same reason as in the above-described conventional example. It is arranged in a concentrated manner on the surface side.

【0006】そして、このような二連可変抵抗器は、第
1の導電部33と第1の抵抗体34に摺動子(図示せ
ず)を摺接させることにより第1の可変抵抗器を、ま
た、第2の導電部36と第2の抵抗体35に摺動子(図
示せず)を摺接させることにより第2の可変抵抗器を構
成するようになっている。
[0006] In such a dual variable resistor, a first variable resistor is brought into sliding contact with a first conductive portion 33 and a first resistor 34 by a slider (not shown). Further, a second variable resistor is formed by sliding a slider (not shown) between the second conductive portion 36 and the second resistor 35.

【0007】[0007]

【発明が解決しようとする課題】従来の電気部品におい
ては、絶縁基板21上に設けられた皮膜部24上に、導
電部25、28と抵抗体26、27を形成し、これらの
端子部が、皮膜部24上から皮膜部24の直線状の端面
部24cを越えて絶縁基板21に延設されているため、
端子部を印刷等によって形成する時、端面部24cの段
部でペーストが毛細管現象によって、該段部コーナー部
分をつたわり、所定の形状からはみ出しにじみが生じ、
隣り合う端子部間が導通するという問題がある。また、
端子部が絶縁基板21の一端面部側に集中して配設され
いるため、上述のように印刷工程において、導通に至ら
なくとも端子部間が近接し、端子部間の端面部24cの
縁面距離が短くなるので、従って、使用途上において、
マイグレーションによって端子部間が導通するという問
題がある。
In a conventional electric component, conductive portions 25 and 28 and resistors 26 and 27 are formed on a film portion 24 provided on an insulating substrate 21, and these terminal portions are formed. , Extending from the coating portion 24 to the insulating substrate 21 beyond the linear end face portion 24c of the coating portion 24,
When the terminal portion is formed by printing or the like, the paste at the step portion of the end face portion 24c is connected to the step portion corner portion by a capillary phenomenon, and bleeds out from a predetermined shape,
There is a problem that conduction is made between adjacent terminals. Also,
Since the terminal portions are concentrated on one end surface side of the insulating substrate 21, the terminal portions are close to each other in the printing process even if conduction does not occur as described above, and the edge surface of the end surface portion 24c between the terminal portions is formed. Since the distance becomes shorter, therefore, during use,
There is a problem that conduction occurs between the terminals due to migration.

【0008】[0008]

【課題を解決するための手段】上記課題を解決するため
の第1の解決手段として、フェノール樹脂、セラミック
等の材料からなる絶縁基板と、該絶縁基板上に印刷等に
より形成され、端面部に凹凸状部を設けた絶縁材からな
る皮膜部と、前記皮膜部上、及び前記端面部を越えて前
記絶縁基板上に印刷等により形成され、端子部を有する
抵抗体、良導電体等からなる導電部とを備え、前記導電
部の端部に形成された前記端子部を、前記凹凸状部の凹
部に位置させると共に、前記凹凸状部の凸部の先端から
間隔を置いて形成した構成とした。また、第2の解決手
段として、前記凹凸状部の凹部を円弧状に形成した構成
とした。また、第3の解決手段として、絶縁材からなる
前記皮膜部を2層で構成すると共に、前記凹凸状部の凸
部を1層で構成した。また、第4の解決手段として、前
記上層の皮膜部の前記凹凸状部の凸部を、前記下層の皮
膜部の前記凹凸状部の凸部上を越えて延設した構成とし
た。
As a first means for solving the above-mentioned problems, an insulating substrate made of a material such as phenolic resin or ceramic, an insulating substrate formed by printing or the like on the insulating substrate, A film portion made of an insulating material provided with an uneven portion, and a resistor, a good conductor, or the like formed on the insulating substrate by printing or the like over the film portion and beyond the end surface portion and formed on the insulating substrate. A conductive portion, wherein the terminal portion formed at the end of the conductive portion is positioned in the concave portion of the concave-convex portion, and is formed at an interval from the tip of the convex portion of the concave-convex portion. did. Further, as a second solution, the concave portion of the uneven portion is formed in an arc shape. As a third solution, the film portion made of an insulating material is composed of two layers, and the projections of the uneven portion are composed of one layer. As a fourth solution, a configuration is adopted in which the convex portion of the uneven portion of the upper film portion extends beyond the convex portion of the uneven portion of the lower film portion.

【0009】[0009]

【発明の実施の形態】本発明の電気部品、例えば、タッ
プ付二連可変抵抗器を例に図1〜図4に基づいて説明す
ると、図1は本発明の電気部品に係る絶縁基板の平面
図、図2は図1の2ー2線における断面図、図3は本発
明の電気部品に係る絶縁基板の要部の断面図、図4のA
〜Jは本発明の電気部品の製造を示す説明図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An electric component of the present invention, for example, a double variable resistor with a tap will be described with reference to FIGS. FIG. 2 is a cross-sectional view taken along line 2-2 of FIG. 1, FIG. 3 is a cross-sectional view of a main part of an insulating substrate according to the electric component of the present invention, and FIG.
FIGS. 7A to 7J are explanatory views showing the production of the electric component of the present invention.

【0010】そして、本発明の電気部品であるタップ付
二連可変抵抗器は、図1〜図4に示すように、中心部に
孔1aを有するフェノール樹脂からなる絶縁基板1上
に、先ず、フェノール系のバインダー樹脂を有する銀ペ
ーストを印刷して第1と第2のタップ電極2、3を形成
する。次に、絶縁基板1上に、タップ電極2、3の両端
部2a、2b、及び3a、3bを露出した状態で、絶縁
性に優れたエポキシ樹脂系の絶縁材からなるペーストを
印刷して下層である1層目の皮膜部4を形成する。この
時、タップ電極2、3の一端部2b、3bは、皮膜部4
に設けられた孔4a、4bによって、露出した状態とな
っていると共に、皮膜部4の一端面部には、凹部4cが
円弧状であり、凸部4dを短寸にした凹凸状部4eが形
成されている。次に、この1層目の皮膜部4上には、皮
膜部4とほぼ同じ形状で、若干外形が大きいエポキシ樹
脂系の絶縁材からなるペーストを印刷して上層である2
層目の皮膜部5を形成する。この時、皮膜部5に設けら
れた孔5a、5bは、皮膜部4の孔4a、4bと合致
し、タップ電極2、3の一端部2b、3bは、皮膜部5
に設けられた孔5a、5bによって、露出した状態とな
っていると共に、皮膜部5の一端面部には、凹部5cが
円弧状であり、凸部5dを長寸にした凹凸状部5eが形
成されていて、凸部5dは、1層目の凸部4d上を越え
て絶縁基板1上まで延設されている。
As shown in FIGS. 1 to 4, the dual variable resistor with a tap, which is an electric component of the present invention, is formed on an insulating substrate 1 made of a phenol resin having a hole 1a at the center. The first and second tap electrodes 2 and 3 are formed by printing a silver paste having a phenolic binder resin. Next, a paste made of an epoxy resin-based insulating material having excellent insulation properties is printed on the insulating substrate 1 in a state where both ends 2a, 2b and 3a, 3b of the tap electrodes 2, 3 are exposed. Is formed as the first layer 4. At this time, one end portions 2b and 3b of the tap electrodes 2 and 3 are
Are formed by the holes 4a and 4b provided in the inner surface, and the concave portion 4c is formed in an arc shape on one end surface portion of the coating portion 4, and the concave and convex portion 4e in which the convex portion 4d is made short is formed. Have been. Next, a paste made of an epoxy resin-based insulating material having substantially the same shape as the film portion 4 and having a slightly larger outer shape is printed on the first film portion 4 to form an upper layer 2.
A layered film portion 5 is formed. At this time, the holes 5a and 5b provided in the film portion 5 match the holes 4a and 4b of the film portion 4, and the one end portions 2b and 3b of the tap electrodes 2 and 3 are
Are formed by the holes 5a and 5b provided in the film 5, and a concave-convex portion 5e in which the concave portion 5c has an arc shape and the convex portion 5d is elongated is formed on one end surface portion of the film portion 5. The protrusions 5d extend to over the insulating substrate 1 beyond the protrusions 4d of the first layer.

【0011】そして、この2層目の皮膜部5上に、外周
側から順次、フェノール系のバインダー樹脂を含む銀ペ
ーストの印刷で形成した第1の導電部6と、フェノール
系のバインダー樹脂を含む抵抗ペーストの印刷で形成し
た導電部である第1と第2の抵抗体7、8と、銀ペース
トの印刷で形成した第2の導電部9が形成されている。
この時、第1の抵抗体7の中間部はタップ電極2の端部
2bと接続され、また、第2の抵抗体8の中間部はタッ
プ電極3の端部3bと接続されて、その他の抵抗体6、
7、及び導電部5、8は皮膜部4によって、タップ電極
2、3から絶縁された状態となると共に、2層の皮膜部
4と5によって確実な絶縁状態となっている。
A first conductive portion 6 formed by printing a silver paste containing a phenolic binder resin and a phenolic binder resin are sequentially formed on the second film portion 5 from the outer peripheral side. First and second resistors 7 and 8, which are conductive portions formed by printing a resistive paste, and a second conductive portion 9 formed by printing a silver paste are formed.
At this time, the middle part of the first resistor 7 is connected to the end 2b of the tap electrode 2, and the middle part of the second resistor 8 is connected to the end 3b of the tap electrode 3, and the other parts are connected. Resistor 6,
7 and the conductive portions 5 and 8 are insulated from the tap electrodes 2 and 3 by the coating portion 4 and are reliably insulated by the two coating portions 4 and 5.

【0012】また、絶縁基板1上には、タップ電極2、
3の端部2a、3aのそれぞれ接続され、銀ペーストの
印刷で形成された端子部2c,3cが形成されている。
また、第1と第2の導電部6、9の端部、及び第1と第
2の抵抗体7、8の端部には、それぞれに接続された状
態で、銀ペーストの印刷で形成された端子部6a、9
a、及び7a、7b、8a、8bが形成されている。そ
して、これらの端子部は、皮膜部4、5上から凹凸状部
4e、5eの凹部4c,5cの端面部を越えて絶縁基板
1上に延設されると共に、これらの端子部は、凹部4
c,5cに位置し、凸部4d,5dの先端から間隔を置
いて形成されている。このように、タップ電極2、3、
第1と第2の導電部6、9、及び第1と第2の抵抗体
7、8のそれぞれの端子部には、金属製の端子(図示せ
ず)が取り付けられるが、プリント基板(図示せず)等
への接続を容易にするため、或いは絶縁基板1の小型化
の為に、前記端子部は絶縁基板1の一端面部側に集中し
て配設されたものとなっている。
On the insulating substrate 1, a tap electrode 2,
The terminal portions 2c and 3c are formed by printing silver paste and connected to the ends 2a and 3a, respectively.
The ends of the first and second conductive portions 6 and 9 and the ends of the first and second resistors 7 and 8 are formed by printing silver paste in a state where they are connected to each other. Terminal portions 6a, 9
a and 7a, 7b, 8a, 8b are formed. These terminal portions are extended from the coating portions 4 and 5 on the insulating substrate 1 beyond the end surfaces of the concave portions 4c and 5c of the concave and convex portions 4e and 5e. 4
c, 5c, and are formed at an interval from the tips of the protrusions 4d, 5d. Thus, the tap electrodes 2, 3,.
Metal terminals (not shown) are attached to the terminal portions of the first and second conductive portions 6, 9 and the first and second resistors 7, 8, respectively. In order to facilitate connection to an unillustrated substrate or the like, or to reduce the size of the insulating substrate 1, the terminal portions are disposed in a concentrated manner on one end surface side of the insulating substrate 1.

【0013】次に、このような部品の製造方法を図4に
基づいて説明すると、先ず、図4のAに示すような大き
なフェノール基板上に、多数の同図Bに示すようなタッ
プ電極2、3を銀ペーストで印刷形成する。次いで、そ
れぞれに同図Cに示すような下層の皮膜部4を絶縁材の
ペーストで印刷形成し、次に、同図Dに示すような上層
の皮膜部5を絶縁材のペーストで印刷形成した後、同図
Eに示すような形状で、それぞれの端子部2c、3c、
6a、7a、7b,8a、8b,9a、及び第1と第2
の導電部6、9を銀ペーストで印刷形成する。次に、そ
れぞれに同図Fに示すような形状で、同図Eで形成した
それぞれの端子部上に、2度目の銀ペーストの印刷を行
って2層目の端子部を形成した後、同図G、H,Iに示
した順に中抵抗、高抵抗、低抵抗の抵抗ペーストを印刷
して第1と第2の抵抗体7、8を形成する。なお、G,
H,Iの工程は、JISのAカーブを得るために行って
いる。そして、最後に、同図Jに示すような形状で、前
工程で形成されたそれぞれの端子部、第1と第2の導電
部6、9、及び第1と第2の抵抗体7、8上に、極めて
抵抗値の低い抵抗ペーストの印刷を施す。そして、最後
に、孔1a、絶縁基板1の外形をプレスで抜いて、多数
個の抵抗基板を製造するものである。
Next, a method of manufacturing such a component will be described with reference to FIG. 4. First, a large number of tap electrodes 2 as shown in FIG. 3 is formed by printing with silver paste. Next, a lower film portion 4 as shown in FIG. C was formed by printing with an insulating paste, and an upper film portion 5 as shown in FIG. D was formed by printing with an insulating material paste. Thereafter, each terminal portion 2c, 3c,
6a, 7a, 7b, 8a, 8b, 9a, and first and second
Are formed by printing with silver paste. Next, a second silver paste is printed on each of the terminal portions formed in FIG. E in the shape shown in FIG. The first and second resistors 7 and 8 are formed by printing medium-resistance, high-resistance, and low-resistance resistor pastes in the order shown in FIGS. G,
Steps H and I are performed to obtain a JIS A curve. Finally, the terminal portions, the first and second conductive portions 6, 9 and the first and second resistor members 7, 8 formed in the previous step are formed in the shape shown in FIG. A resist paste having a very low resistance value is printed thereon. Then, finally, the holes 1a and the outer shape of the insulating substrate 1 are punched out by a press to manufacture a large number of resistance substrates.

【0014】そして、このようなタップ付二連可変抵抗
器は、第1の導電部6と第1の抵抗体7に摺動子(図示
せず)を摺接させることにより第1の可変抵抗器を、ま
た、第2の導電部9と第2の抵抗体8に摺動子(図示せ
ず)を摺接させることにより第2の可変抵抗器を構成す
るようになっている。なお、該実施例においては、エポ
キシ系の皮膜部4、5を使用し、これによってピンホー
ルがなく、十分な絶縁を得ることが出来、更に、皮膜部
4、5を絶縁基板1の外形の内側に設けてあるので、非
常に硬いエポキシ系の皮膜部4、5を、プレス工程でプ
レス金型で切断しないので、金型寿命が低下することが
なく、また、絶縁基板1にクラックが入ることがない。
また、端子部は、絶縁基板1の縁にまで設けてあるの
で、絶縁基板1表面を最大限活用することが出来、絶縁
基板1の外形を小さくできる。
Such a dual variable resistor with tap is provided with a first variable resistor by sliding a slider (not shown) between the first conductive portion 6 and the first resistor 7. A second variable resistor is formed by bringing a slider (not shown) into sliding contact with the second conductive portion 9 and the second resistor 8. In this embodiment, the epoxy-based coating portions 4 and 5 are used, so that there is no pinhole and sufficient insulation can be obtained. Since it is provided on the inner side, the very hard epoxy-based coating portions 4 and 5 are not cut by a pressing die in a pressing process, so that the life of the die is not reduced and the insulating substrate 1 is cracked. Nothing.
Further, since the terminal portion is provided up to the edge of the insulating substrate 1, the surface of the insulating substrate 1 can be utilized to the maximum, and the outer shape of the insulating substrate 1 can be reduced.

【0015】また、図5、図6は本発明の電気部品であ
る第2の実施例を示す二連可変抵抗器を示し、この二連
可変抵抗器は、中央部に孔11aを有するセラミックか
らなる絶縁基板11上に、絶縁基板11の上面を平滑に
して印刷を容易、且つ、精度良くするため、絶縁材のペ
ーストを印刷して2層の皮膜部12、13が形成されて
いる。そして、1層目の下層である皮膜部12は、図6
のAに示すように、皮膜部12の一端面部に、凹部12
aが円弧状でり、凸部12bが短寸にした凹凸状部12
cが形成されている。また、2層目の上層である皮膜部
13は、図6のBに示すように皮膜部12とほぼ同型
で、その一端面部には、凹部13aが円弧状であり凸部
13bが長寸にした凹凸状部13cが形成されていて、
凸部13bは、1層目の凸部12b上を越えて絶縁基板
11上まで延設されている。
FIGS. 5 and 6 show a double variable resistor according to a second embodiment which is an electric component of the present invention. This double variable resistor is made of ceramic having a hole 11a in the center. In order to make the upper surface of the insulating substrate 11 smooth and to make printing easier and more accurate, an insulating material paste is printed on the insulating substrate 11 to form two layers 12 and 13. The film portion 12 as the lower layer of the first layer is as shown in FIG.
As shown in A of FIG.
a is an arc-shaped portion, and the convex portion 12b is a short-shaped uneven portion 12.
c is formed. As shown in FIG. 6B, the film portion 13 which is the second upper layer has almost the same shape as the film portion 12, and has a concave portion 13a having an arc shape and a convex portion 13b having an elongated shape on one end surface thereof. Formed uneven portion 13c,
The convex portion 13b extends over the insulating substrate 11 over the first layer convex portion 12b.

【0016】そして、この皮膜部13上に、外周側から
順次、銀ペーストの印刷で形成した第1の導電部14
と、抵抗ペーストの印刷で形成した導電部である第1と
第2の抵抗体15、16と、銀ペーストの印刷で形成し
た第2の導電部17が形成されている。また、第1と第
2の導電部14、17の端部、及び第1と第2の抵抗体
15、16の端部には、それぞれに接続された状態で、
銀ペーストの印刷で形成された端子部14a、17a、
及び15a、15b,16a,16bが形成されてい
る。そして、これらの端子部は、皮膜部12、13上か
ら凹凸状部12c,13cの凹部12a、13aの端面
部を越えて絶縁基板11上に延設されると共に、凹部1
2a、13aに位置し、凸部12b,13bの先端から
間隔を置いて形成されている。このように、第1と第2
の導電部14、17、及び第1と第2の抵抗体15、1
6のそれぞれの端子部には、金属製の端子(図示せず)
が取り付けられるが、プリント基板(図示せず)等への
接続を容易にするため、或いは絶縁基板1の小型化の為
に、前記端子部は絶縁基板11の一端面部側に集中して
配設されたものとなっている。
A first conductive portion 14 formed by printing a silver paste on the film portion 13 sequentially from the outer peripheral side.
And first and second resistors 15 and 16, which are conductive portions formed by printing a resist paste, and a second conductive portion 17 formed by printing a silver paste. In addition, the ends of the first and second conductive portions 14 and 17 and the ends of the first and second resistors 15 and 16 are connected to each other,
Terminal portions 14a, 17a formed by printing silver paste,
And 15a, 15b, 16a and 16b are formed. These terminal portions extend from the coating portions 12 and 13 over the insulating substrate 11 beyond the end surfaces of the concave portions 12a and 13a of the concave and convex portions 12c and 13c.
It is located at 2a, 13a, and is formed at a distance from the tip of the projection 12b, 13b. Thus, the first and second
And the first and second resistors 15, 1
Metal terminals (not shown) are provided on each of the terminal portions 6.
However, in order to facilitate connection to a printed board (not shown) or the like, or to reduce the size of the insulating substrate 1, the terminal portions are concentrated on one end surface side of the insulating substrate 11. It has been done.

【0017】そして、このような二連可変抵抗器は、第
1の導電部14と第1の抵抗体15に摺動子(図示せ
ず)を摺接させることにより第1の可変抵抗器を、ま
た、第2の導電部17と第2の抵抗体16に摺動子(図
示せず)を摺接させることにより第2の可変抵抗器を構
成するようになっている。
In such a double variable resistor, the first variable resistor is brought into sliding contact with the first conductive portion 14 and the first resistor 15 by a slider (not shown). A second variable resistor is formed by sliding a slider (not shown) between the second conductive portion 17 and the second resistor 16.

【0018】なお、上記実施例においては、皮膜部を2
層形成したもので示したが、1層の皮膜部でも良く、ま
た、導電部の形成はスクリーン印刷に限らず、タンポ印
刷、或いは吹き付けでも良く、即ち、流動性のあるイン
クを使用した場合に有効である。また、導電部は、銀等
の良導電体の他に抵抗体を使用しても良く、更に、導電
部に形成された端子部は、銀等の良導電体の他に抵抗体
を使用しても良い。更に、絶縁基板は、エポキシ樹脂
系、PPS等の材料で構成しても良く、また、可変抵抗
器の他に、プリント配線のため等において、端子部を絶
縁基板の一端面に集中して配設するロータリスイッチ、
ロータリエンコーダ等の電気部品に適用しても良い。
In the above-described embodiment, the film portion is 2
Although shown in the form of a layer, a single-layer film portion may be used, and the formation of the conductive portion is not limited to screen printing, but may be tampo printing or spraying, that is, when a fluid ink is used. It is valid. The conductive portion may use a resistor in addition to a good conductor such as silver.Furthermore, the terminal portion formed in the conductive portion may use a resistor in addition to the good conductor such as silver. May be. Further, the insulating substrate may be made of a material such as epoxy resin or PPS. In addition to the variable resistor, the terminals are concentrated on one end surface of the insulating substrate for printing wiring or the like. Rotary switch,
The present invention may be applied to electric components such as a rotary encoder.

【0019】[0019]

【発明の効果】本発明の電気部品は、端面部に凹凸状部
4eを有する皮膜部4を絶縁基板1上に形成し、皮膜部
4に形成した導電部6の端子部6aを、凹凸状部4eの
凹部4cに位置させると共に、凸部4dの先端から間隔
を置いて形成したため、印刷等によって端子部6aを形
成したときに生じるペーストのにじみが、凸部4dの存
在によって隣り合う端子部6aまで至るのを防止し、不
良品が少なく、生産性の良好な電気部品を提供できる。
また、端子部間が近接しても、凸部4dによって端子部
間の縁面距離を長くでき、マイグレーションによる端子
部間の導通の生じない電気部品を提供できる。
According to the electric component of the present invention, the coating portion 4 having the uneven portion 4e on the end surface is formed on the insulating substrate 1, and the terminal portion 6a of the conductive portion 6 formed on the coating portion 4 is replaced with the uneven portion. Since it is located in the concave portion 4c of the portion 4e and is formed at an interval from the tip of the convex portion 4d, the bleeding of the paste generated when the terminal portion 6a is formed by printing or the like is reduced by the presence of the convex portion 4d. 6a can be prevented, and there can be provided an electric part with less defective products and good productivity.
Further, even when the terminals are close to each other, the edge surface distance between the terminals can be increased by the protrusions 4d, and an electrical component that does not cause conduction between the terminals due to migration can be provided.

【0020】また、凹部4cを円弧状に形成することに
よって、導電部6の端子部6aの印刷形成時、そのにじ
みが円弧状部に沿って効果的に流れ易く、端面部の段部
に溜まることがなく、精度の良好な電気部品を提供でき
る。また、皮膜部を2層で構成すると共に、凹凸状部の
凸部を1層で構成することにより、絶縁基板上に設けた
導電部と皮膜部上に設けた導電部との絶縁を確実に出来
ると共に、スクリーン印刷で形成した場合には、端子部
の印刷工程において、印刷用のマスクと絶縁基板1の距
離を短くできるので、端子部インクが凹凸状部で溜まり
にくく、信頼性に優れた電気部品を提供できる。また、
上層の皮膜部の凹凸状部の凸部を、下層の皮膜部の凹凸
状部の凸部上を越えて延設することによって、凸部にお
ける上層と下層の境界面なくすることが出来、にじみが
境界面から隣り合う端子部間に至るのを防止できると共
に、端子部が凹凸状部で溜まりにくい電気部品を提供で
きる。
Further, by forming the concave portion 4c in an arc shape, when the terminal portion 6a of the conductive portion 6 is formed by printing, the bleeding easily flows effectively along the arc portion, and accumulates on the step portion of the end surface portion. Thus, it is possible to provide a high-precision electric component without any problem. In addition, since the film portion is composed of two layers and the convex portion of the uneven portion is composed of one layer, insulation between the conductive portion provided on the insulating substrate and the conductive portion provided on the film portion is ensured. In addition, when formed by screen printing, the distance between the printing mask and the insulating substrate 1 can be shortened in the step of printing the terminal portion, so that the terminal portion ink is less likely to accumulate in the uneven portions and has excellent reliability. We can provide electrical components. Also,
By extending the convex portion of the uneven portion of the upper film portion over the convex portion of the uneven portion of the lower film portion, it is possible to eliminate the boundary surface between the upper layer and the lower layer in the convex portion, and bleeding Can be prevented from reaching from the boundary surface to between the adjacent terminal portions, and an electric component in which the terminal portions are less likely to accumulate in the uneven portions can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の電気部品に係る絶縁基板の平面図。FIG. 1 is a plan view of an insulating substrate according to an electric component of the present invention.

【図2】図1の2ー2線における断面図。FIG. 2 is a sectional view taken along line 2-2 in FIG. 1;

【図3】本発明の電気部品に係る絶縁基板の要部の断面
図。
FIG. 3 is a sectional view of a main part of an insulating substrate according to the electric component of the present invention.

【図4】本発明の電気部品の製造を示す説明図。FIG. 4 is an explanatory view showing the production of the electric component of the present invention.

【図5】本発明の電気部品に係り、他の実施例を示す絶
縁基板の平面図。
FIG. 5 is a plan view of an insulating substrate according to another embodiment of the electric component of the present invention.

【図6】本発明の電気部品に係り、他の実施例を示す皮
膜部の平面図。
FIG. 6 is a plan view of a coating portion according to another embodiment of the electric component of the present invention.

【図7】従来の電気部品に係る絶縁基板の平面図。FIG. 7 is a plan view of an insulating substrate according to a conventional electric component.

【図8】図7の8ー8線における断面図。FIG. 8 is a sectional view taken along line 8-8 in FIG. 7;

【図9】従来のもう一つの電気部品に係る絶縁基板の平
面図。
FIG. 9 is a plan view of an insulating substrate according to another conventional electric component.

【符号の説明】[Explanation of symbols]

1 絶縁基板 1a 孔 2 第1のタップ電極 2a、2b 端部 2c 端子部 3 第2のタップ電極 3a、3b 端部 3c 端子部 4 皮膜部 4a、4b 孔 4c 凹部 4d 凸部 4e 凹凸状部 5 皮膜部 5a、5b 孔 5c 凹部 5d 凸部 5e 凹凸状部 6 第1の導電部 6a 端子部 7 第1の抵抗体 7a、7b 端子部 8 第2の抵抗体 8a、8b 端子部 9 第2の導電部 9a 端子部 11 絶縁基板 11a 孔 12 皮膜部 12a 凹部 12b 凸部 12c 凹凸状部 13 皮膜部 13a 凹部 13b 凸部 13c 凹凸状部 14 第1の導電部 14a 端子部 15 第1の抵抗体 15a、15b 端子部 16 第2の抵抗体 16a、16b 端子部 17 第2の導電部 17a 端子部 REFERENCE SIGNS LIST 1 insulating substrate 1a hole 2 first tap electrode 2a, 2b end 2c terminal 3 second tap electrode 3a, 3b end 3c terminal 4 coating 4a, 4b hole 4c concave 4d convex 4e uneven portion 5 Film part 5a, 5b hole 5c concave part 5d convex part 5e uneven part 6 first conductive part 6a terminal part 7 first resistor 7a, 7b terminal part 8 second resistor 8a, 8b terminal part 9 second Conductive portion 9a Terminal portion 11 Insulating substrate 11a Hole 12 Coating portion 12a Concave portion 12b Convex portion 12c Concavo-convex portion 13 Coating portion 13a Concavo 13b Convex portion 13c Concavo-convex portion 14 First conductive portion 14a Terminal portion 15 First resistor 15a , 15b terminal portion 16 second resistor 16a, 16b terminal portion 17 second conductive portion 17a terminal portion

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI H01H 11/00 H01H 11/00 A H05K 1/11 H05K 1/11 C 3/12 610 3/12 610 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification code FI H01H 11/00 H01H 11/00 A H05K 1/11 H05K 1/11 C 3/12 610 3/12 610

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 フェノール樹脂、セラミック等の材料か
らなる絶縁基板と、該絶縁基板上に印刷等により形成さ
れ、端面部に凹凸状部を設けた絶縁材からなる皮膜部
と、前記皮膜部上、及び前記端面部を越えて前記絶縁基
板上に印刷等により形成され、端子部を有する抵抗体、
良導電体等からなる導電部とを備え、前記導電部の端部
に形成された前記端子部を、前記凹凸状部の凹部に位置
させると共に、前記凹凸状部の凸部の先端から間隔を置
いて形成したことを特徴とする電気部品。
1. An insulating substrate made of a material such as phenolic resin or ceramic; a film portion formed of an insulating material formed on the insulating substrate by printing or the like and having an uneven portion on an end face; And a resistor formed on the insulating substrate by printing or the like over the end face portion and having a terminal portion,
A conductive portion made of a good conductor or the like, and the terminal portion formed at an end portion of the conductive portion is positioned in a concave portion of the uneven portion, and an interval from a tip of a convex portion of the uneven portion is set. An electric component characterized by being placed and formed.
【請求項2】 前記凹凸状部の凹部を円弧状に形成した
ことを特徴とする請求項1記載の電気部品。
2. The electric component according to claim 1, wherein the concave portion of the concave-convex portion is formed in an arc shape.
【請求項3】 絶縁材からなる前記皮膜部を2層で構成
すると共に、前記凹凸状部の凸部を1層で構成したこと
を特徴とする請求項1、又は2記載の電気部品。
3. The electric component according to claim 1, wherein the film portion made of an insulating material is constituted by two layers, and the projections of the uneven portion are constituted by one layer.
【請求項4】 前記上層の皮膜部の前記凹凸状部の凸部
を、前記下層の皮膜部の前記凹凸状部の凸部上を越えて
延設したことを特徴とする請求項3記載の電気部品。
4. The method according to claim 3, wherein the convex portion of the uneven portion of the upper film portion extends beyond the convex portion of the uneven portion of the lower film portion. Electrical component.
JP02814698A 1998-02-10 1998-02-10 Electrical component Expired - Fee Related JP3607068B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP02814698A JP3607068B2 (en) 1998-02-10 1998-02-10 Electrical component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP02814698A JP3607068B2 (en) 1998-02-10 1998-02-10 Electrical component

Publications (2)

Publication Number Publication Date
JPH11233312A true JPH11233312A (en) 1999-08-27
JP3607068B2 JP3607068B2 (en) 2005-01-05

Family

ID=12240633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP02814698A Expired - Fee Related JP3607068B2 (en) 1998-02-10 1998-02-10 Electrical component

Country Status (1)

Country Link
JP (1) JP3607068B2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281604A (en) * 1989-04-21 1990-11-19 Matsushita Electric Ind Co Ltd Printed resistance substrate
JPH0531205U (en) * 1991-09-30 1993-04-23 帝国通信工業株式会社 Variable resistor
JPH05182805A (en) * 1991-12-27 1993-07-23 Aichi Electric Co Ltd Smoothing wiring circuit board and manufacture thereof
JPH06326445A (en) * 1993-05-10 1994-11-25 Noriyuki Yoshida Manufacture of circuit board solder resist
JPH0918108A (en) * 1995-06-27 1997-01-17 Sankyo Seiki Mfg Co Ltd Connection structure for flexible printed board
JPH09214113A (en) * 1996-02-05 1997-08-15 Internatl Business Mach Corp <Ibm> Forming method for layer having high-density pattern

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281604A (en) * 1989-04-21 1990-11-19 Matsushita Electric Ind Co Ltd Printed resistance substrate
JPH0531205U (en) * 1991-09-30 1993-04-23 帝国通信工業株式会社 Variable resistor
JPH05182805A (en) * 1991-12-27 1993-07-23 Aichi Electric Co Ltd Smoothing wiring circuit board and manufacture thereof
JPH06326445A (en) * 1993-05-10 1994-11-25 Noriyuki Yoshida Manufacture of circuit board solder resist
JPH0918108A (en) * 1995-06-27 1997-01-17 Sankyo Seiki Mfg Co Ltd Connection structure for flexible printed board
JPH09214113A (en) * 1996-02-05 1997-08-15 Internatl Business Mach Corp <Ibm> Forming method for layer having high-density pattern

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