JPH11219976A - Method for mounting semiconductor chip and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for filling under-fill resin and its device wherein, by shortening a filling time of an under-fill resin, production efficiency of a semiconductor chip is raised while occurrence of void is eliminated. SOLUTION: A semiconductor chip 1 is mounted on a base substrate 3 through a solder bump 2, and, while a dispenser syringe 4 is moved along three or more sides of the semiconductor chip 1, an under-fill resin 6 is filled in a gap between the semiconductor chip 1 and the base substrate 3. During the filling process, vacuum-suction is performed through a hole 9 opened around center of a part of the base substrate 3 where the semiconductor chip 1 is allocated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for mounting a semiconductor chip on a printed wiring board.

[0002]

2. Description of the Related Art Conventionally, in a multi-pin LSI package used for an MPU or a gate array, a eutectic solder bump is formed on a bonding pad portion of a semiconductor chip, and the terminal portion of the opposing ceramic substrate is face-down. Has been adopted in a flip chip mounting method of melting and bonding the components.

In mounting a flip chip element by this method, generally, solder bumps formed on the electrodes of the chip are joined to the electrode pads on the base substrate. However, the problem here is that the solder bump joint is easily broken by the stress of the solder bump joint caused by the difference in thermal expansion coefficient between the semiconductor chip and the base substrate. As a means for solving this problem, a method of filling a gap between the semiconductor chip and the base substrate with a liquid insulating resin (underfill resin) (hereinafter referred to as an underfill filling method) has been adopted.

FIG. 4 shows an underfill filling method.
As shown in FIG.
After mounting on the base substrate 3 through the above, a liquid underfill resin 6 is applied from one end of the needle 5 of the dispenser syringe 4 along one side or two sides of the semiconductor chip 1,
In general, a method of infiltrating the inside by capillary action and supplying the same is employed.

FIG. 5 shows this state, that is, a state in which the underfill resin 6 is applied along one side or two sides of the semiconductor chip 1, and FIG. 5A shows the dispenser syringe 4 connected to one side of the base substrate 3. In the state where the underfill resin 6 is applied by running upward in the direction indicated by arrow 7, the dispenser syringe 4 is driven in the direction indicated by arrow 8 on two sides of the base substrate 3 by applying the underfill resin 6. 6 shows a state where 6 is applied.

[0006]

However, in such a conventional coating method, the semiconductor chip 1 and the base substrate 3 are not provided.
Is very small, about 70 μm, so that it takes a long time to fill the entire surface of the semiconductor chip 1 with the underfill resin 6, which results in poor production efficiency and a long time for the filling. The gelation of the underfill resin 6 proceeds,
As a result, there is a problem that the viscosity is increased and a void is formed in the central portion of the semiconductor chip 1.

Accordingly, an object of the present invention is to provide a method and an apparatus for filling an underfill resin in which the production time of a semiconductor chip is increased by reducing the filling time of the underfill resin and the generation of voids is eliminated. It is in.

[0008]

According to the present invention, there is provided a semiconductor chip mounting method comprising the steps of mounting a semiconductor chip on a base substrate via solder bumps, and mounting the semiconductor chip on three or more sides of the semiconductor chip mounted on the base substrate. Filling the gap between the base substrate and the semiconductor chip with an underfill resin while moving the dispenser syringe along the side; and holes formed in the base substrate in the portion where the semiconductor chip is mounted during the filling step. And a step of vacuum suction via

Further, according to the semiconductor chip mounting method of the present invention, a gap between the base substrate and the semiconductor chip is filled with an underfill resin while moving a dispenser syringe along four sides of the semiconductor chip mounted on the base substrate. It is characterized by the following. A semiconductor device manufactured by the semiconductor chip mounting method of the present invention includes a semiconductor chip mounted on a base substrate via solder bumps, and a vacuum suction hole formed in a portion of the base substrate where the semiconductor chip is mounted. It is characterized by having.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a sectional view showing an embodiment of a semiconductor chip mounting method of the present invention, FIG. 2 is a plan view of a base substrate used in the mounting method of the present invention, and FIG. It is explanatory drawing which shows a filling method. In these drawings, the same components as those in FIGS. 4 and 5 are denoted by the same reference numerals, and a detailed description thereof will be omitted below.

In FIG. 1 and FIG. 2, a hole 9 is formed in a portion of the base substrate 3 where the semiconductor chip 1 is disposed, in a portion of the semiconductor chip 1 where no solder bump 2 is provided, and a dispenser syringe is provided. When the underfill resin 6 is filled in the gap between the semiconductor chip 1 and the base substrate 3 from 4, vacuum suction is performed by a vacuum device 10 provided on the back side of the base substrate 3, that is, on the lower surface of FIG. 1.

In such a configuration, the underfill resin 6 is transferred to the semiconductor chip 1 by the dispenser syringe 4.
Is filled in the gap between the semiconductor chip 1 and the base substrate 3 along the three or four sides. Then, the underfill resin 6 is filled with the dispenser syringe 4 and, at the same time, vacuum suction is performed through the hole 9 by the vacuum device 10.

By the vacuum suction from the holes 9, the filling speed of the underfill resin 6 into the central portion is accelerated, and as a result, the filling time of the underfill resin 6 is shortened.

Next, according to the present invention, the underfill resin 6
The state of filling along three or more sides of the semiconductor chip 1 on the base substrate 3 will be described with reference to FIG.

FIG. 3 shows a state in which the underfill resin 6 is filled along three or four sides of the semiconductor chip 1, and FIG. Along the arrow 11, the dispenser syringe 4 is run in the direction of arrow 11 to apply the underfill resin 6, and the spread state of the underfill resin 6 is shown. The spreading state of the underfill resin 6 when the underfill resin 6 is filled by running the dispenser syringe 4 in the direction of arrow 12 is shown.

As described above, the filling of the underfill resin 6 is performed by running the dispenser syringe 4 in one direction along the three sides or four sides of the semiconductor chip 1 as shown by arrows 11 or 12. In addition to the vacuum suction action by the step 10, the filling time of the underfill resin 6 is further reduced.

[0018]

According to the present invention described above, the underfill resin is provided on the side of the semiconductor chip with a very simple structure in which a hole for vacuum suction is provided substantially at the center of the portion of the base substrate on which the semiconductor chip is mounted. While filling the gap between the semiconductor chip and the base substrate along with, the vacuum suction from the hole accelerates the filling speed of the underfill resin, and as a result, the filling time of the underfill resin 6 is greatly reduced. In addition, it is possible to completely eliminate voids generated in the central portion.

Further, according to the present invention, the underfill resin is filled along three or more sides of the semiconductor chip mounted on the base substrate. As a result, the filling speed of the underfill resin is further promoted, the filling time is further reduced, the occurrence of bonds at the center of the base substrate can be more completely eliminated, and the reliability of the semiconductor chip is significantly improved. Can be done.

[Brief description of the drawings]

FIG. 1 is an explanatory sectional view showing a step of filling an underfill resin according to the present invention.

FIG. 2 is a plan view of a base substrate used in the present invention.

3A and 3B are diagrams showing a method of filling an underfill resin into a base substrate according to the present invention, wherein FIG. 3A is a plan view showing a state where the underfill resin is filled from three sides of a semiconductor chip;
(B) is a plan view showing a state where the underfill resin is filled from four sides of the semiconductor chip.

FIG. 4 is an explanatory sectional view showing a conventional underfill resin filling step.

5A and 5B are diagrams showing a state in which an underfill resin is filled in a base substrate according to the related art, wherein FIG. 5A is a plan view showing a state in which the underfill resin is filled from one side of a semiconductor chip, and FIG. FIG. 4 is a plan view showing a state where an underfill resin is filled from two sides of the semiconductor chip.

[Explanation of symbols]

 1. Semiconductor chip 2. Solder bump 3. Solder bump 3. Base substrate 4. Base board 4. …… Dispenser syringe 5 ………………… Needle 6 ………………………… Underfill resin 7, 8, 11, 12 …………… Hole 10 …………………… Vacuum device

Claims (3)

[Claims] 1. A solder bump on a base substrate,
Mounting a semiconductor chip, and filling an underfill resin into a gap between the base substrate and the semiconductor chip while moving a dispenser syringe along three or more sides of the semiconductor chip mounted on the base substrate When,
A step of performing vacuum suction through a hole formed in a portion of the base substrate where the semiconductor chip is mounted during the filling step. 2. A gap between the base substrate and the semiconductor chip is filled with an underfill resin while moving the dispenser syringe along four sides of the semiconductor chip mounted on the base substrate. Item 2. The semiconductor chip mounting method according to Item 1. 3. A semiconductor device comprising: a semiconductor chip mounted on a base substrate via solder bumps; and a vacuum suction hole formed in a portion of the base substrate where the semiconductor chip is mounted.