JP3328598B2 - Method for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device, and more particularly, to a method of forming a flip-chip mounted body by bonding a semiconductor element to a substrate and injecting an underfill resin into the flip-chip mounted body. The present invention relates to a method of sealing a flip-chip mounted body with a resin for sealing a space therebetween.

[0002]

2. Description of the Related Art In recent years, semiconductor mounting technology has been moving toward higher densities. In order to cope with a reduction in mounting area and an increase in the number of electrodes of a semiconductor element (hereinafter referred to as a chip), flip-chip mounting (bare chip) Is said to be the most advantageous. In the flip chip mounting, a metal bump electrode on a device forming surface of a bare chip is pressed against an electrode pad formed on one main surface of a wiring substrate to perform connection (flip chip bonding).

However, in this state, a stress due to thermal expansion of the substrate is applied to a connection portion between the substrate and the chip, which causes a problem that connection reliability is impaired.

To improve the flip chip mounting, a method has been proposed in which a resin is interposed between a bare chip and a substrate to mechanically fix the substrate and the chip to each other.

[0005]

FIG. 11 is a sectional view showing this conventional resin sealing method. A bump 2 (for example, gold) is formed on the chip 1, and the chip 1 is bonded to the substrate 3 (for example, high thermal expansion glass ceramic) by face-down by thermocompression bonding to form a flip chip mounted body.

[0006] The flip chip mounted body is fixed to the stage 4 with the substrate 3 facing down by vacuum suction or the like, and the underfill resin 6 in the dispenser 5 is applied to the periphery of the substrate via the needle 7. By heating the stage 4, the underfill resin 6 whose viscosity has been reduced fills the gap between the chip 1 and the substrate 3 by its own weight and capillary action. Complete.

[0007]

However, in the package having the above structure, further miniaturization is required, and after the chip is flip-chip bonded to a substrate having a size close to the chip size, the chip is connected to each of the peripheral portions of the substrate. Although it is required that the clearance 8 with the substrate be, for example, 0.5 mm or less, the method of sealing a resin from the periphery of the substrate as described above has a problem that it is difficult to meet the above requirements and is difficult. Was.

In addition, voids (bubbles) tend to remain in the gap between the chip and the substrate, and this void reduces the reliability of connection between the chip and the substrate.

[0009]

In order to solve the above-mentioned problems, the present invention provides a flip chip by preparing a substrate provided with an opening for supplying an underfill resin at the center, and bonding the chip to the substrate. Construct the mounting body, fix the flip chip mounting body on the rotatable stage, inject the underfill resin from the opening while rotating the flip chip mounting body around the opening, and between the chip and the substrate. The underfill resin is filled and sealed with resin.

[0010]

FIG. 1 is a sectional view showing a first embodiment of the present invention, and FIG. 2 is a plan view thereof.

In FIG. 1, an opening 2 serving as a through hole for supplying an underfill resin 16 in advance is formed in a substrate 13.
0 is provided. Since this opening 20 becomes the center of rotation, it is desirable to be provided at the center of the substrate 13.

The chip 11 and the substrate 13 are connected to the bumps 12 formed on the chip 11 by face-down,
3 are bonded by thermocompression bonding to an electrode pad (not shown) to form a flip chip mounted body.

Next, the flip chip mounted body is turned upside down, and is fixed to the stage 14 with the chip 11 facing down by a method such as vacuum suction. At this time, the back surface of the chip 11 and the top surface of the stage 14 come into contact.

The stage 14 is connected to rotating means such as a motor (not shown), and is configured to be horizontally rotatable.

Since the flip-chip mounted body is rotated by the rotation of the stage 14, the flip-chip mounting body is aligned so that the center of the opening 20 provided in the substrate 13 as the center of rotation coincides with the center of rotation of the stage 14.

The rotation speed of the stage 14 varies depending on the type of the underfill resin 16 and the size of the package, but a speed of 100 to 1000 rotations per minute is appropriate.

By rotating the stage 14, the underfill resin 16 in the dispenser 15 is passed through the opening 20 from the tip of the needle 17 while rotating the flip-chip mounted body around the opening 20. The injection is performed so as to close the gap between the substrate 11 and the substrate 13.

The underfill resin 16 injected from the opening 20 is subjected to a capillary action and centrifugal force due to rotation.
It spreads quickly and uniformly and is filled between the chip 11 and the substrate 13.

After that, the chip 11 and the substrate 13 are subjected to a heat treatment.
The underfill resin 16 filled in between is cured and resin-sealed to form a package.

As described above, according to the first embodiment,
An opening 20 for supplying underfill is provided at the center of the substrate 13.
The underfill resin 16 is injected and sealed with the resin through the opening 20 while the stage 14 is horizontally rotated around the opening 20, so that a centrifugal force is applied to the underfill resin 16 and the underfill resin 16 is quickly and Not only can the underfill resin 16 be uniformly spread and voids can be eliminated, but also the underfill resin 16 can be filled in a short time.

Therefore, it is possible to prevent a decrease in connection reliability between the chip 11 and the substrate 13 and to contribute to a reduction in manufacturing time.

Since the underfill resin 16 is injected from the opening 20 at the center of the substrate 13, the clearance between the chip 11 and the substrate 13 can be reduced.

The underfill resin 16 is used for the chip 1
If the rotation of the stage 14 is stopped before reaching the first end, and the capillary phenomenon is used thereafter, the amount of the underfill resin 16 that has protruded can be reduced.

FIG. 3 is a sectional view showing a second embodiment of the present invention, and FIG. 4 is a plan view thereof.

The second embodiment is the same as the first embodiment except that a frame 21 is provided on a stage 14.

The frame 21 is made of, for example, metal aluminum, and is fixed to the stage 14 by an adhesive or the like.

The frame 21 is a rectangular frame as shown in FIG. 4 and is formed so that the peripheral edge of the substrate 13 is in contact with the frame 21.
Firmly secure the flip-chip mount during rotation.

As described above, according to the second embodiment,
In addition to the effects of the first embodiment, it is possible to prevent the underfill resin 16 protruding from the peripheral portion of the chip 11 from scattering to the stage 14, eliminating the need for cleaning and replacement of the stage 14, and shortening the manufacturing time. Becomes possible.

FIG. 5 is a sectional view showing a third embodiment of the present invention, and FIG. 6 is a plan view thereof.

The second embodiment is the same as the first embodiment except that the counterbore portion 23 is provided on the stage 22.

The counterbore portion 23 has its wall surface 24
And the bottom is in contact with the back surface of the chip 11, and the flip chip mounting body is provided on the stage 22 so as to be accommodated in the recess.

As described above, the counterbore part 23 is mounted on the stage 22.
To provide the frame 21 of the second embodiment.
Can perform the same function as.

As described above, according to the third embodiment,
In addition to the effects of the second embodiment, a reduction in cost due to the elimination of the frame 21 can be expected.

FIG. 7 is a sectional view showing a fourth embodiment of the present invention, and FIG. 8 is a plan view thereof.

In the fourth embodiment, similarly to the third embodiment, the counterbore portion 26 is provided on the stage 25. However, only the configuration of the counterbore portion 26 is different, and the other portions are the same.

The counterbore portion 25 is formed in a step shape so as to form a first wall surface 27 and a second wall surface 28.

The peripheral portion of the substrate 13 contacts the first wall surface 27, the peripheral portion of the chip 11 contacts the second wall surface 28, and the back surface of the chip 11 contacts the bottom of the counterbore portion 26.

As described above, according to the fourth embodiment,
In addition to the effect of the third embodiment, since the peripheral edge of the chip 11 contacts the second wall surface 28, the underfill resin 16
Can be prevented from adhering to the peripheral portion and the back surface of the chip 11.

FIG. 9 is a sectional view showing a fifth embodiment of the present invention, and FIG. 10 is a plan view thereof.

The fifth embodiment is different from the fourth embodiment in that the size of the opening 30 provided in the substrate 29 is different, and the underfill resin is inserted into the opening 30 with the needle 17 inserted. 16 is injected, but the others are the same.

The size of the opening 30 is set so as to be in contact with the outer diameter of the needle 17 into which the underfill resin 16 is injected.
It is formed in substantially the same size.

When injecting the underfill resin 16, the needle 17 is inserted into the opening 30 of the substrate 29, and the underfill resin 16 is injected while the tip of the needle 17 is inserted into the substrate 29. 29 and chip 1
Fill between 1

As described above, according to the fifth embodiment,
In addition to the effects of the fourth embodiment, the underfill resin 1
Since the needle 17 is inserted into the opening 30 of the substrate 29 at the time of the injection of 6, the underfill resin 16 can be prevented from adhering to the back surface of the substrate 29, in the figure, the upper surface, and the yield can be reduced without defects. Can be raised.

In the above description, the fourth embodiment is used as a base. However, if the size of the opening is made substantially equal to the outer diameter of the needle, the needle is connected to the opening of the substrate. Injecting the underfill resin in the state of being inserted in the first embodiment can also be applied to the first to third embodiments.

[0045]

As described above, according to the present invention, the underfill resin is injected from the opening provided in the center of the substrate while rotating the flip chip mounting body, so that voids are eliminated and the underfill resin is injected in a short time. It can be filled, and the clearance between the chip and the substrate can be reduced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of the present invention.

FIG. 2 is a plan view showing the first embodiment.

FIG. 3 is a sectional view showing a second embodiment.

FIG. 4 is a plan view showing a second embodiment.

FIG. 5 is a sectional view showing a third embodiment.

FIG. 6 is a plan view showing a third embodiment.

FIG. 7 is a cross-sectional view showing a fourth embodiment.

FIG. 8 is a plan view showing a fourth embodiment.

FIG. 9 is a sectional view showing a fifth embodiment.

FIG. 10 is a plan view showing a fifth embodiment.

FIG. 11 is a sectional view showing a conventional method.

[Explanation of symbols]

 11 Chip 13, 29 Substrate 14, 22, 25 Stage 15 Dispenser 16 Underfill Resin 17 Needle 20, 30 Opening 21 Frame 23, 26 Counterbore 24 Wall 27 First Wall 28 Second Wall

──────────────────────────────────────────────────の Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/56

Claims (5)

(57) [Claims] A step of preparing a substrate having an opening for supplying an underfill resin at a central portion; a step of preparing a flip chip mounted body in which a semiconductor element is bonded to the substrate; Fixing the flip-chip mounted body to the stage, and injecting the underfill resin from the opening while rotating the stage to rotate the flip-chip mounted body around the opening. And a step of filling the underfill resin between the semiconductor element and the substrate and sealing the resin with the underfill resin. 2. The method of manufacturing a semiconductor device according to claim 1, further comprising a step of preparing a stage provided with a frame such that a peripheral portion of said substrate is in contact with said substrate. 3. The method of manufacturing a semiconductor device according to claim 1, further comprising a step of preparing a stage provided with a counterbored portion such that a peripheral portion of the substrate contacts a wall surface. 4. A peripheral portion of the substrate contacts a first wall surface,
So that the peripheral portion of the semiconductor element contacts the second wall surface,
2. The method for manufacturing a semiconductor device according to claim 1, further comprising a step of preparing a stage provided with a counterbore portion in a stepwise manner. 5. The size of the opening is formed to be in contact with the outer diameter of a needle into which the underfill resin is injected, and the underfill resin is filled with the needle inserted into the opening. 5. The method for manufacturing a semiconductor device according to claim 1, further comprising a step of implanting.