JPH11216429A - Sorter of chip parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sorter of chip parts capable of sorting the chip parts at a high speed at a relatively low cost. SOLUTION: An assorting mechanism C for receiving the chip parts inspected by an inspection section mechanism B and assorting these chip parts is formed to an approximately columnar shape as a whole. The mechanism has a rotary vane section 500 of an approximately disk shape which has a plurality of projecting parts 550 regularly arranged on the outer marginal parts thereof, a drive section 600 which drives the rotary vane section 500, an approximately columnar pedestal section 700 which is internally fixed with the drive section 600 and supports the rotary vane section 500, a plurality of gas blow-off means 800 which are arranged on the exterior side of the rotary vane section 50 and blow of the chip parts turned on the pedestal 700 by the projection parts 550 of the rotary vane section 500 along the marginal parts of these projecting parts 550 toward the outside of the rotary vane section 500 and approximately cylindrical chip parts receiving sections 900 which make a pair with these gas blow off means 800 at the same number and are arranged on the outer periphery side of the pedestal section 700 in order to receive the blown off chip parts W.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component sorting apparatus for sorting chip components supplied from a parts feeder (device for aligning and supplying components).

[0002]

2. Description of the Related Art A conventional chip component sorting apparatus is generally arranged in the form of a substantially rectangular parallelepiped chip component which is continuously pressed and supplied in a row from a parts feeder. Of one or more of the chip components arranged in a predetermined direction, and taking out and transferring them from the row, and electrical characteristics and optics provided at the transfer destination of the handling device An inspection device for measuring mechanical characteristics, other performance, and / or shape, etc., and a component sorting area after inspection provided in a place different from the inspection device.

[0003] The transfer of chip components from the inspection device to the post-inspection component sorting area is performed by the above-mentioned handling device (hereinafter referred to as a first handling device) and by another handling device (hereinafter referred to as a second handling device). (Referred to as a device). Further, when the chip components are taken out from the parts feeder by the first handling device, the first components may be small because the chip components are small or / and the rows of the chip components may be densely arranged.
When it is difficult to take out chip components with the above-mentioned handling device, an escapement mechanism for securing a space between chip components that is easy to handle for transfer is provided at the end of the parts feeder.

[0004] The post-inspection parts sorting area is an area in which the number of chip component receiving units (for example, trays) desired to be sorted based on the inspection result are arranged. However, this area is often a sorting / transporting mechanism having a belt conveyor and a path changing mechanism using a scraper provided on the way of transporting chip components on the belt conveyor.

[0005]

In recent years, in particular, in addition to simply selecting chip components within the rated value (within the specified value) or out of the rated value (out of the specified value), in particular, the rating within the so-called ranking value is not considered. Multi-section sorting is increasingly required.

[0006] Therefore, the time required for sorting chip components is longer than before, but on the other hand, as the cost of chip components decreases and competition among companies intensifies, the cost required for multi-class sorting within the rated value is increased. There is a strong demand for reduction.

[0007] For this reason, higher speed sorting than before and lower cost of the chip component sorting apparatus are required. However, since the handling apparatus and the like are mechanically operated, if the sequence time is to be shortened, each part is required. Is required to be controlled at a very high speed, with a high response and with a high precision. However, since the operation is a mechanical operation, there is a limit in shortening the sequence time due to its inertia characteristics and the like.

[0008] In addition, durability of the chip component sorting apparatus is also an essential condition. Therefore, even though the chip components to be sorted are lightweight products, expensive components and devices with high power performance of the device drive unit and excellent control ability must be used in the chip component selection device. In addition, the cost of the entire apparatus is increased.

Incidentally, as a countermeasure against high-speed sorting, it is not surprising that a configuration in which a handling device and an inspection device are integrated, that is, an inspection is also performed during transfer by the handling device. In such a case, a contact for inspection is approached to the electrode portion of the chip component from a direction other than the bottom surface (where the electrode portion is usually provided) of the chip component being transferred by the handling device. It will be.

However, such an approach to a variety of chip components is restricted, which is irrational in manufacturing the device. In addition, the movement amount of the contact is affected by the shape of the chip component, which is disadvantageous for shortening the operation time.

A main object of the present invention is to provide a chip component sorting apparatus which is relatively inexpensive and capable of high-speed sorting.

[0012]

In order to solve the above-mentioned problems, a chip component sorting apparatus according to the present invention comprises an inspection area provided on an extension of a chip component supply device from a chip component supply direction in a conveying direction. And inspection means for inspecting the chip component positioned in the inspection area, and judgment means for judging the selection of the chip component based on a signal from the inspection means.

Therefore, in the case of the chip component sorting apparatus according to the present invention, the chip component is not moved to another place at the time of inspection / judgment. There is no time loss due to relocation. Note that the chip component supply device here is, for example, a parts feeder (having a linear feeder unit) which is an external peripheral device of the sorting device.

More specifically, for example, an apparatus for sorting chip components according to the present invention comprises a transport path body having a chip component transport path penetrating the interior in a substantially horizontal direction, and a starting end side of the transport path body. A substantially horizontal gas blowing means for transporting chip components provided at the end, an inspection area for chip components provided at the end side of the transport path body, and a chip component provided at a lower side of the inspection area to substantially remove the chip components. A substantially perpendicular gas suction / blowout means capable of adsorbing and floating in a perpendicular direction, a chip component positioning portion provided at an end side of the inspection area, an inspection means provided at an upper side of the inspection area, Determining means for determining the selection of chip components based on a signal from the means.

Therefore, in the case of the chip component sorting apparatus according to the present invention, the aligned chip components that are continuously pushed and supplied in a row from a parts feeder which is an external peripheral device of the sorting apparatus are provided. And is sent to the chip component transport path in the transport path body. Chip components on the chip component transport path are pushed forward by subsequent chip components that are continuously fed from the parts feeder, but the chip components in the front row are located in the chip component positioning section provided at the end of the inspection area. When it reaches, its advance stops. In this forward movement, a substantially horizontal gas blowing means is also used to increase the speed. In this inspection area,
The chip components in the front row are sucked downward by the substantially perpendicular gas suction / blowout means and temporarily fixed.

At this stage, the inspection is carried out by the inspection means provided on the upper side of the inspection area, and the judgment is made by the judging means. The force of the gas blowing of at least the substantially horizontal gas blowing means and the substantially perpendicular gas suction / blowing means is applied to the frontmost row of chip components that have been inspected by the inspection means, and the frontmost row of chip components is In the combined vector direction, the light is emitted outside the inspection area beyond the chip component positioning section. At this time, the chip component that has been sent subsequent to the chip component in the front row becomes a new chip component in the front row, and the above operation is repeated. The chip components discharged to the outside of the inspection area are transferred to a sorting mechanism of a chip component sorting apparatus according to the present invention described later or a conventional general sorting mechanism to be sorted.

The chip component sorting apparatus according to the present invention is preferably provided with an electric supply unit for supplying electricity to the chip component when inspecting the chip component by the inspection unit, below the inspection area. . Therefore, in the case of the chip component sorting apparatus according to the present invention, by providing the electricity supply means, the electrical characteristics and the optical characteristics can be inspected.

In the chip component sorting apparatus according to the present invention, the electric supply means includes electrodes respectively corresponding to the electrodes of the chip component, and a gap for electrically separating the electrodes is provided between the electrodes. It is preferable that the gap portion also functions as the gas suction / blow-out port of the gas suction / blow-out means in the substantially perpendicular direction. Therefore, in the case of the chip component sorting apparatus according to the present invention, a mechanism for separating the electrodes from the gas suction / blow-out port is provided in a limited area below the small chip component.

In the chip component sorting apparatus according to the present invention, when the chip component is a bipolar component such as an LED, a positive electrode, a negative electrode, and both electrodes are supplied to the electricity supply means. Means for electrically opposing electricity, and a gap between the plus side electrode and the minus side electrode for electrically separating the two electrodes, wherein the gap is substantially perpendicular to the gas. Gas suction and suction
It is preferable to also serve as an outlet.

Therefore, in the case of the chip component sorting apparatus according to the present invention, since there is provided means for electrically reversing the electric power applied to both electrodes, all the chip components are aligned in the correct electrode direction. Even if not supplied, for example,
Performs a forward / reverse judgment test (a test to determine whether the chip component is in the forward or reverse direction by applying a voltage lower than the main test voltage to the chip component in advance before the main inspection) If a predetermined level of current is flowing through the chip component, the determining means determines that the chip component has the correct electrode direction, and immediately performs the main test by applying the main test voltage. If a current equal to or higher than the predetermined level does not flow, the determination means determines that the chip component is in the opposite direction to the correct electrode, and immediately reverses and applies the main test voltage (to both electrodes). It is also possible to use a method of electrically opposing electricity. It is to be noted that the plus side electrode or the minus side electrode naturally includes a case where the voltage becomes zero volt.

As another means, a chip component sorting apparatus according to the present invention is provided at a transport path body portion having a transport path for chip components in a substantially horizontal direction, and provided at an end side of the transport path body portion. A chip component inspection area, pressing means provided on the upper side of the inspection area and pressing the upper surface side of the chip component, and provided on a transport path below the pressing means, wherein the pressing means presses the chip component. Then, a deformed conveyance path portion that is elastically deformed, a plurality of probe portions projecting from the through holes of the deformed conveyance path portion and contacting the electrode portion of the chip component when the deformed conveyance path portion is elastically deformed, and an electrode of the chip component. A chip component positioning portion for positioning the chip component so as to face the through hole, an inspection device for inspecting the chip component contacted by the probe portion, and a judging device for judging the selection of the chip component based on a signal from the inspection device. The may be characterized by comprising.

Therefore, in the case of the chip component sorting apparatus according to the present invention, the aligned chip components that are continuously pressed and supplied from the parts feeder in a row form the chip components of the transport path body. It is sent to the transport path. Chip components on the chip component transport path are pushed forward by subsequent chip components continuously fed from the parts feeder. When the front row of chip components reaches the chip component positioning section, its advance stops.

The electrode portion of the frontmost chip component is positioned in the inspection area so as to face the through hole at the upper end of the probe portion. Therefore, when the pressing means presses the frontmost row of chip components from above, the deformed conveyance path portion is pressed by the chip components and elastically deforms downward. This allows
The electrode portion of the chip component and the probe portion come into electrical contact. Electricity necessary for inspecting the chip component by the inspection means is supplied to the probe section. Therefore, the chip components in the front row are inspected by the inspection means, and are determined by the determination means in connection with sorting. Thereafter, the chip component in the front row is moved from this position by some moving means (for example, a moving path of the chip component cut out on the side and a pushing means to the side). Become.

The chip part sorting apparatus according to the present invention is used in combination with the above-described chip part sorting apparatus according to the present invention (specifically, the inspection part mechanism of the chip part sorting apparatus). It is preferable to provide a sorting mechanism of a chip component sorting device having the following configuration. The sorting mechanism includes a rotating blade having a plurality of projections regularly provided on an outer edge, a driving unit for driving the rotating blade, a driving unit fixed to the inside, and the rotating blade being A pedestal portion supporting the portion, and a chip component provided on the outer side of the rotating blade portion and rotated on the pedestal portion by the convex portion of the rotating blade portion, along the edge of the convex portion, A plurality of gas blowing means for blowing off in the direction of the outside of the portion, and a chip component receiving portion provided in the same number as the gas blowing means and provided on the outer peripheral side of the pedestal portion for receiving the blown chip components. It is characterized by that.

Therefore, in the case of the chip component sorting apparatus according to the present invention, the chip part discharged to the outside of the inspection area by the inspection unit mechanism is located on the pedestal portion, and The protrusion is received between two adjacent protrusions of the plurality of protrusions provided regularly on the outer edge. The next chip component released to the outside of the inspection area is rotated to receive between the downstream convex portion of the two convex portions and the further downstream convex portion adjacent to the downstream convex portion. The blade is being rotated.

With this repetition, chip components are successively sent to the outer edge of the rotary blade. The chip signal is sent to the outer edge of the rotary blade by the selection signal of the determination means of the inspection mechanism. The current position information of each chip component is linked. Thereby, each chip component is rotated to the vicinity of the predetermined chip component receiving portion [that is, a predetermined time after the chip component released to the outside of the inspection area is released (this predetermined time is determined by the inspection time). When a different time elapses according to the result), the gas is blown out by the gas blowing means along the edge of the convex portion on the downstream side toward the outside of the rotating blade portion, and collected at a predetermined chip component receiving portion. . While the rotating blades make one rotation, each chip component is collected in a predetermined chip component receiving unit based on the inspection result.

This sorting mechanism is a general inspection device other than the inspection unit mechanism [however, this sorting mechanism is
A chip component is supplied at the same timing as described above, and a signal for selecting the chip component is transmitted].

In the chip component sorting apparatus according to the present invention, the rotary blade is provided so as to partially overlap an inner body fitted into a shaft of the drive unit and an outer peripheral side of the inner body. The outer body part has an outer body part and the inner body part and the outer body part overlap with each other, but the connection is disconnected when a predetermined force or more is applied to the outer body part. A cancellation type coupling mechanism may be provided.

Therefore, in the case of the chip component sorting apparatus according to the present invention, even if a trouble that the chip component is caught between the pedestal portion and the rotary blade portion occurs, the connection at the time of overload sensitivity occurs. The connection between the inner body part and the outer body part of the rotating blade part is disconnected by the releasable connection mechanism, the inner body part idles, the outer body part does not rotate, and the sorting operation is interrupted.

The overload-responsive connection-releasing type coupling mechanism includes, for example, a coupling hole formed in the inner body or the outer body, and a coupling hole formed in the outer body or the inner body. A coupling body hole formed at a position engageable with the portion,
It can be composed of a connecting member provided inside the connecting main body hole and an elastic body that acts to press the connecting member against the connecting hole.

A chip component sorting apparatus according to the present invention as a sorting mechanism includes a chip component temporary receiver having a plurality of chip component temporary receivers arranged in a substantially circular shape, and a chip component temporary receiver. A driving unit for rotating, a plurality of gas blowing means fixedly provided to face an opening for receiving a chip component provided on an upper side of the chip component temporary receiving portion, and the same number of the gas blowing means. A collecting unit that collects the chip components moved by the operation of the gas blowing means, and the chip component temporary receiving unit is provided with a chip in the middle of a chip component passage leading downward from the opening. It has a middle part for temporarily securing the parts, and the chip parts are collected by the operation of the gas blowing means from the middle part through the end opening of the chip part passage to the collection part. It may be.

In the case of the chip part sorting apparatus according to the present invention, the chip part discharged to the outside of the inspection area is received by the chip part temporary receiving part by the inspection part mechanism. The chip component is moved from the opening of the temporary chip component receiving portion to a middle portion provided in the middle of the chip component passage in the temporary chip component receiving portion and temporarily stops there. Similarly, the next chip component is also received by the rotating chip component temporary receiving portion on the downstream side.

In this repetition, the chip components are successively received by the chip component temporary receiving section on the further downstream side, and the signals for selection by the judging means of the inspection section mechanism and the position of each chip component temporary receiving section are provided. The linked current position information of each chip component is linked. Thereby, each chip component is rotated to the vicinity of a predetermined collection part (that is, the chip component discharged to the outside of the inspection area is
After a predetermined time (e.g., the predetermined time varies depending on the inspection result) after the release, the gas is blown out by a gas blowing means in a direction outside the distal end opening of the chip component passage, and is collected by a predetermined collection unit. Is done. While the chip component temporary receiving body makes one rotation, each chip component is collected by a predetermined collection unit based on the inspection result.

[0034]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a chip component sorting device for an LED as a chip component sorting device according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic perspective view showing a chip component sorting apparatus according to a first embodiment of the present invention and a parts feeder as an external peripheral device thereof, and FIG. 2 is a view showing the first embodiment of the present invention. FIG. 3 is a schematic cross-sectional view illustrating an inspection unit mechanism of the chip component selection device, FIG. 3 is a schematic partially cutaway perspective view illustrating the inspection unit mechanism of the chip component selection device according to the first embodiment of the present invention,
FIG. 4 is a schematic plan view showing a chip component sorting apparatus according to the first embodiment of the present invention and a parts feeder as an external peripheral device thereof (gas blowing means is not shown), and FIG. 5 is FIG. FIG. 6 is a schematic cross-sectional view for explaining an overload-sensitive connection-disconnection type coupling mechanism of a sorting mechanism of the chip component sorting apparatus according to the first embodiment of the present invention. FIGS. 7 and 8 are schematic perspective views for explaining a sorting mechanism of the chip component sorting apparatus according to the first embodiment of the present invention.

The chip component sorting apparatus A according to the first embodiment of the present invention comprises an inspection mechanism B and an inspection mechanism B.
And a sorting mechanism C for receiving and sorting the chip components W blown from the inspection unit mechanism B, and a table base 1000 for supporting them.

As shown in FIGS. 2 and 3, the inspection section mechanism B is formed in a substantially square shape, and has a chip component transfer path 100c that penetrates the inside thereof in a substantially horizontal direction.
00 and the transport path body portion 100 (the chip component transport path 10
0c), a substantially horizontal gas blowing means 200 for transporting chip components provided on the starting end side 100a, and the transport path body 1
The inspection area 150 of the chip component W provided on the terminal side 100b of the "00", and the substantially vertical direction gas suction / blowing means provided on the lower side of the inspection area 150 and capable of adsorbing and floating the chip component W in the substantially vertical direction. 300, a chip component positioning section 155 provided on the end side of the inspection area 150, an inspection means 400 provided on the upper side of the inspection area 150, and a chip component W based on a signal from the inspection means 400. A judgment means (not shown) for judging the selection is provided, an inspection mechanism support portion 470 which supports the transport path body portion 100 and has at least an insulating surface, and a cover 450 which covers substantially the entirety thereof. ing.

The sorting mechanism C is formed in a substantially cylindrical shape, and has a substantially disk-shaped rotary blade 500 having a plurality of convex portions 550 regularly provided on the outer edge thereof. A driving unit 600 for driving the rotary blade 500; a substantially cylindrical pedestal portion 700 in which the driving unit 600 is fixed and supporting the rotary blade portion 500; and a rotary blade provided on the outside of the rotary blade portion 500; A plurality of chip components W that are rotated on the pedestal portion 700 by the protrusions 550 of the portion 500 are blown off along the edge 551 (see FIG. 7) of the protrusion 550 toward the outside of the rotary blade portion 500. A pair of gas blowing means 800 and the same number of the gas blowing means 800, and a substantially cylindrical chip component receiving portion 900 provided on the outer peripheral side of the pedestal portion 700 to receive the blown chip components W , A control unit for controlling in sorting mechanism C and a (not shown).

The inspection mechanism B is located near the outer periphery of the upper part of the pedestal 700 of the sorting mechanism C, and
0 is installed at a position where it does not touch.

FIG. 2 and FIG.
As shown in FIG. 2, the LED chip component has a substantially rectangular parallelepiped shape. The chip component W has two electrode portions 10 and 10 because it is an LED. These two electrode parts 10, 1
Of the 0s, one is an anode terminal and the other is a cathode terminal. The chip component W has an electrode 1
It has a recess 11 that electrically and physically separates 0 and 10 from each other. The direction connecting the electrode parts 10 and 10 is the longitudinal direction of the chip component W.

As shown in FIGS. 1 and 4, the chip component W is inspected by the parts feeder 2000, which is an external peripheral device of the chip component selection device A, from the parts feeder 2000 side. Continuously toward the transport path body 100 (starting side 100a of the chip component transport path 100c) of the section mechanism B, a line-aligned state (that is, there is no chip component W having the opposite front and back, and the chip (In a state of being aligned in the longitudinal direction of the component W).

The parts feeder 2000 has a bowl portion 2100 and a straight feeder portion 2200. The bowl portion 2100 is a mechanism for feeding the chip components W to the straight-ahead feeder portion 2200 in an aligned state in which the chip components W are aligned such that the front and back of the chip components W are not opposite, and are aligned in the longitudinal direction of the chip components W. Straight feeder section 220
Numeral 0 is a mechanism for gradually moving the row of chip components W in an aligned state at a predetermined speed by high-frequency fine vibration.

The linear feeder unit 2200 is provided with a chip component W
Has a straight passage groove 2210 serving as a passage. In order to be able to transfer the chip component W between the front end side of the rectilinear feeder unit 2200 and the start end side 100a of the chip component conveyance path 100c of the conveyance path body unit 100 of the inspection unit mechanism B, the passage groove 2210 And the horizontal position of the bottom on the starting end side 100a of the chip component transport path 100c of the transport path body 100. Further, in order to prevent the influence of the high-frequency fine vibration of the rectilinear feeder unit 2200 from being transmitted to the inspection unit mechanism B, a gap corresponding to a minute distance in which the rectilinear feeder unit 2200 moves back and forth is inspected with the distal end side of the rectilinear feeder unit 2200. Conveyance path body 1 of the mechanism B
The linear feeder unit 2200 is fixed to the table base unit 1000 between the starter side 100a of the chip component transport path 100c and the table base unit 1000. The length of the gap for the minute distance is extremely smaller than the length of the electrode portion 10 of the chip component W in the longitudinal direction. Therefore, this chip component W
Pass through the gap for the minute distance without falling into the gap for the minute distance.

The chip component transport path 10 of the transport path body 100
0c indicates that the chip component W having a cross-sectional shape orthogonal to the longitudinal direction over substantially the entire length thereof is conveyed inside the conveyance path body 100 (that is, on the chip component conveyance path 100c).
(Of a cross section orthogonal to the longitudinal direction).

The substantially horizontal gas blowing means 200 is an auxiliary means for transporting chip components provided at the starting end 100a of the transporting path body 100, and has a gas blowing through-hole 201 at the leading end thereof.
And a gas supply source section (not shown) such as an air compressor for supplying purified oil-free dry air connected to the outer end side of the gas blowing through-hole section 201 via a pipe (not shown). And a solenoid valve (not shown) which is a high-speed opening / closing means provided at an outlet of the gas supply source (not shown).

The gas blowing through-hole portion 201 has its tip end exposed on the upper side of the chip component transporting path 100c of the transporting path body 100, and its longitudinal direction is formed in an oblique direction which is almost horizontal. I have. The horizontal direction of the gas blowing through-hole portion 201 in the longitudinal direction is the same as the longitudinal direction of the chip component transport path 100c of the transport path body 100. The advancing direction of the gas (air) sent from the gas supply source unit (not shown) and blown out from the gas blowing through-hole unit 201 is from the starting end 100a of the chip component transfer path 100c of the transfer path unit 100. This is the direction toward the terminal side 100b.

The chip component inspection area 150 is located at the terminal side 100 of the chip component transport path 100c of the transport path body 100.
b, the vertical dimension thereof (that is, the distance between the lower end of the inspection means 400 provided on the upper side of the inspection area 150 and the bottom of the chip component transport path 100c) is larger than the height dimension of the chip component W. It is formed large enough.

The substantially perpendicular gas suction / blowout means 300
As shown in FIG. 2 and FIG.
0, a gas suction / blow-out hole 110 provided on the lower side
And an insulating tube (not shown) connected to a lower side of the gas suction / blow-out hole 110 via a hole (not shown) of the inspection unit mechanism support 470; And a solenoid valve (not shown) provided at the outlet of the gas suction and supply source (not shown).

The gas suction / blow-out hole 110 is provided at the chip component positioning portion 1 provided at the end of the inspection area 150.
The lower part of one chip component W positioned in the front row by 55 forms a substantially cross shape in a horizontal view. The vertical through-hole portion 111 (see FIG. 3) of the gas suction / blow-out through-hole portion 110 having a substantially cross shape in a horizontal view is parallel to the longitudinal direction of the one chip component W positioned in the frontmost row. In addition, in the direction of the center line of the chip component W, the one chip component W is formed so as to extend over substantially the entire length.

On the other hand, the horizontal through-hole 112 (see FIG. 3) of the gas suction / blow-out through-hole 110, which is substantially cruciform in a horizontal view, is the terminal side 100b of the transport path body 100 and
Chip component positioning portion 155 provided on the terminal side of 50
It is formed as a gap so as to be completely (electrically and physically) separated from the tip block 102 having good conductivity on the side and the main block 101 of the transport path body 100. However, the width dimension of the horizontal through hole 112 is formed smaller than the dimension of the electrode portion 10 in the longitudinal direction of the chip component W, and the chip component W is
Try not to be depressed. This lateral hole 11
2 is formed at a position where the electrode portion 10 on the front (in the traveling direction) side of one chip component W positioned in the front row is barely placed on the chip component positioning portion 155 side. .

The main body block portion 101 has an upper main body block portion 101a and a lower main body block portion 101b having good conductivity, and can be vertically separated from each other. The front end block portion 102 has an inclined portion 102a (see FIG. 2) on the front side.

The gas suction / supply unit (not shown)
For example, it has a gas supply source (not shown) such as an air compressor, and a gas suction source (not shown) such as an ejector (a device that generates a negative pressure when compressed air is supplied). Note that a vacuum pump or the like may be used instead of the ejector.

In the inspection area 150, an electric supply means for supplying electricity at the time of electric inspection (inspection of luminance, etc.) of the chip component W is provided on the tip block portion 102 side and the lower main body block portion 101b side. 120 are provided. The electric supply means 120 is electrically formed on the surface of the front end block 102 with which the lower part of the electrode section 10 on the front (in the traveling direction) side of the one chip component W positioned in the front row contacts. The supply-side electrode section 121 and the electrode section 1
The lower main body block portion 10 in which the lower portion of the electrode portion 10 on the rear side (opposite to the traveling direction) of the chip component W paired with 0 contacts.
1b, a supply-side electrode portion 122 electrically formed on the surface
A power supply unit (not shown) for supplying electricity so that one of the two supply-side electrode units 121 and 122 is used as a positive electrode and the other is used as a negative electrode; Means (not shown) for reversing the
From the power supply unit (not shown), the lower surface side of the front end block unit 102 and substantially directly below the supply-side electrode unit 121 and the lower surface side of the lower body block unit 101b and substantially directly below the supply-side electrode unit 122 And a wiring (not shown) connected to the

It should be noted that the electrically formed supply side electrode portions 121 and 122 here are not physically formed electrodes but portions that function as actual electrodes only when an electrical conduction route is formed. Point to. This is because the wiring and the power supply unit allow the tip block unit 1 having good conductivity to be formed.
02 and the lower body block 1 having good conductivity
At first glance, it seems that each of the components 01b serves as an electrode. However, in practice, in the first embodiment of the present invention, the chip component W must be positioned in the front row. In this case, since the electrical conduction route is not formed, the chip component W positioned in the front row is
This is because only the portions where the lower portions of the electrode portions 10 and 10 contact each other, that is, only the supply-side electrode portions 121 and 122 serve as actual electrodes.

When the chip component W is changed to be longer in the longitudinal direction, the position of the supply-side electrode portion 122 is changed to the position of the chip component W positioned in the front row.
Of the electrode part 10 on the opposite side to the traveling direction of the chip component W
Electrically moves to the position where the lower part of the touches. Therefore,
Even when the chip component W is changed to be longer in the longitudinal direction, it is possible to cope with it. Further, since the lower part of the chip component W subsequent to the chip component W positioned in the front row has the same potential, no current flows.

The means (not shown) for electrically reversing the electric power applied to both electrodes is, for example, a D / A for bipolar operation.
Consists of a converter. The output terminals of the D / A converter are electrically connected to the supply-side electrode units 121 and 122 via the above-mentioned wiring and the like, respectively. Also,
The D / A converter is supplied with a predetermined plus voltage and a minus voltage. The input of the D / A converter is connected to the determination means (not shown). Instruction (digital data) from the determination means (not shown)
Is changed, the supply-side electrode portions 121 and 122
Can be set to a positive voltage and a negative voltage, respectively, or the electric power applied to both electrodes can be electrically reversed so as to be a negative voltage and a positive voltage, respectively.
Further, by changing the instruction (digital data), the magnitude of the voltage generated in the supply-side electrode units 121 and 122 can be freely changed.

The chip component positioning portion 155 is formed at the upper end portion of the front end block portion 102 and
This is for positioning the chip component W, which has advanced to the forefront part c, at a position where it comes into contact with the supply-side electrode parts 121 and 122. In addition, the chip component positioning unit 155
The chip component W is formed to have a sufficient height so that the chip component W can jump over the chip component positioning portion 155 by the substantially perpendicular gas suction and blow means 300 and the substantially horizontal gas blow means 200.

The inspection means 400 is an upper part of the inspection area 150 and is a means for performing various inspections detachably provided on the upper main body block portion 101a. Circuit. This light receiving element is arranged at a position behind the inspection means 400 so as to be hardly affected by disturbance light. The inspection means 400 can be provided with an image capturing means such as a camera (and its signal processing circuit) in place of a circuit such as the light receiving element, for example, when performing a shape inspection other than the luminance.

The judging means (not shown) is an electronic circuit part capable of judging, storing and controlling, such as a microcomputer. The determination means (not shown) includes a substantially horizontal gas blowing means 200 and a substantially vertical gas suction / blowing means 300.
, An electric supply unit 120, an inspection unit 400, and a control unit (not shown) on the sorting mechanism C side.

The cover body 450 is provided on the upper side of the inspection means 400 so as to substantially cover the inspection means 400 and the transport path body part 100, and mainly disturbs disturbance light when measuring luminance characteristics. It is made difficult for the light receiving element provided at a position deep in the inspection means 400 to go around. The determination means (not shown) may be installed inside the cover body 450 or may be installed outside.

A notch 452 (see FIG. 1) is provided below the cover body 450 in front of the front end block portion 102. The notch 452 is an outlet for discharging the inspected chip component W outside the inspection unit mechanism B. Therefore, the size of the notch 452 is determined by the substantially perpendicular gas suction / blowing means 300 and the substantially horizontal gas blowing means 200 so that the chip component W jumps over the chip component positioning portion 155 and the front end block 1
It is formed so that it is not hindered from being discharged outside the inspection section mechanism B while being transported in the air or sliding down the inclined section 102a of the tip block section 102 on the upper side of the inclined section 102a of No. 02.

Next, details of the sorting mechanism C will be described. The rotating blade portion 500 is formed in a substantially disk shape and has a plurality of convex portions 550 regularly provided on the outer edge thereof. The number of the convex portions 550 is as shown in FIG. , For example. This number does not necessarily need to match the number of chip component receiving units 900, and is determined by the inspection capability of the inspection unit mechanism B or the like.

As shown in FIG.
It is formed in a substantially parabolic shape when viewed horizontally. Convex part 550
As shown in FIG. 5 and FIG. 7, the convex portion 550 has a perpendicular wedge-shaped cross-section in the direction from the start end to the end. This wedge-shaped shape is formed at a position where a pedestal portion 700 and a convex portion 550 described later face each other.
The shape conforms to the shape of the upper surface of the pedestal 700.

Further, the rotating blade section 500 includes a driving section 600.
And an outer body 530 provided so as to partially overlap the outer peripheral side of the inner body 510. The protrusion 550 is provided on the outer edge of the outer body 530. The part where the inner body part 510 and the outer body part 530 overlap is connected to each other, but the connection is released when an overload force is applied to the outer body part 530. (See FIG. 6).

As shown in FIG. 6, the inner body portion 510 is formed in a substantially cylindrical shape, and the substantially cylindrical shaft side portion 51 is formed.
1 and a substantially flat ring-shaped flange 515 extending outward from near the center of the side surface of the shaft side portion 511.

In the center of the shaft side portion 511 (inner body portion 510), the through hole 5 into which the shaft portion 601 of the driving portion 600 is fitted.
11a is provided. The flange-shaped portion 515 is provided with a coupling hole 515a formed of two through-holes forming a part of the overload-responsive connection-releasing type connection mechanism 570. The size of the coupling hole 515a is determined by a coupling member 531 described later.
It is formed smaller than a. One coupling hole 51
As shown in FIG. 4, the coupling hole 5a and the other coupling hole 515a are provided at point-symmetric positions with respect to the shaft 601 of the driving unit 600.

The outer body 530 is formed in a substantially flat ring shape. A through hole 530a for rotatably fitting the inner body 510 in the center of the outer body 530.
Is provided. The inner diameter of the through-hole portion 530a is the axial side portion 511 of the inner body portion 510, and the flange portion 515
Is formed substantially in the same manner as the outer diameter of the lower side of the.

The height of the outer body 530 on the side of the through-hole 530 a is the shaft side 511 of the inner body 510, and the height between the lower part of the flange 515 and the lower part of the shaft side 511. It is formed substantially in the same manner as the length dimension.

The outer body portion 530 and the engaging through-hole portion 53
In the vicinity of 0a, the main body hole 53 for coupling, which is a through-hole forming a part of the overload-sensitive connection-disconnection type coupling mechanism 570, is provided at a position where it can be engaged with the two coupling holes 515a.
1 is provided. Inside the connection main body hole 531, a connection member 531 a, which is the remaining portion of the connection mechanism 570 for canceling connection at the time of overload response, is provided.
1a (the connecting member 531a is inserted into the connecting hole 5).
Elastic body portion 53 acting to press against the lower side of 15a)
1b and a fixing member 531c for fixing the bottom side of the elastic body portion 531b to the bottom side of the coupling body hole 531.

The connecting member 531a is formed in a substantially spherical body. The material of the connecting member 531a is preferably a hard material such as a metal. The elastic body portion 531b is a spring.
The fixing member 531c is a fastening component such as a screw. The connecting member 531a is pushed up by the elastic body portion 531b so as to bite into the lower side of the connecting hole 515a. However, when a predetermined force or more is applied to the connecting member 531a, the connecting body 531a is pressed. It is configured to be pushed down to the position above the hole 531.

Further, in the middle from the center of the outer body portion 530 to each of the convex portions 550 regularly provided on the outer edge portion,
At positions on the concentric circles from the center of the outer body portion 530, position detection through holes 590 are provided.

The pedestal 700 is formed in a substantially columnar table. The upper surface of the pedestal portion 700 is
It is formed in a shape conforming to the shape of the bottom side of 00.
That is, the pedestal 700 has a dug portion 710 formed on the upper surface thereof in a substantially trapezoidal shape (a trapezoid whose upper side is longer than the lower side) in a horizontal cross section. Since the outer peripheral side of the dug portion 710 has an inclination toward the center side, the chip component W released from the inspection section mechanism B slides down to the center side, and When the component W is rotated by the rotary blade 500, the component W does not jump out due to centrifugal force.

At the center of the pedestal 700, a driving unit 600
A through-hole portion 701 for exposing the shaft portion 601 is formed. On the upper surface side of the pedestal portion 700, at a position on the lower side of a route through which the position detection through-hole portion 590 of the rotating blade portion 500 passes when the rotating blade portion 500 is rotating,
A position detection sensor (not shown) is provided. This position detection sensor is a sorting mechanism C that controls the driving unit 600.
Are connected to a control unit (not shown) of the rotary blade unit 5.
00 is used for the rotary servo and the rotary blade 5
It is used to detect the presence or absence of rotation of 00 or a rotation delay. still,
The control unit (not shown) of the sorting mechanism C is mutually connected to the determination means (not shown) of the inspection unit mechanism B.

The driving section 600 is a motor. The driving section 600 is configured to move the upper side of the shaft section 601 to the pedestal section 700.
And is fixed inside the center of the pedestal 700.

As shown in FIG. 4, for example, eight chip component receiving portions 900 are provided on the outer peripheral side of the pedestal portion 700 at a predetermined interval. The upper side of the chip component receiving section 900 is disposed above the upper section of the pedestal section 700. The chip component receiving portion 900 includes a notch 901 for receiving chip components (see FIG. 5 and the like) in a portion above the position of the pedestal portion 700 and a portion where the outer edge portion of the pedestal portion 700 intersects with the chip component receiving portion 900. ) Is formed.

The lower side of the chip component receiving portion 900 is fixed to a chip component receiving portion through-hole portion 1001 formed in the table base portion 1000. Chip part receiving section 9
The inside of the lower part of 00 is formed so as to make the outlet narrow.

Note that immediately below the chip component receiving section 900,
A chip component receiving tray (not shown) is provided. Also,
In FIG. 1, the through-hole portion 1001 for the chip component receiving portion is not visible as a shadow of the chip component receiving portion 900, but is extra so that 16 chip component receiving portions 900 are provided instead of eight. A spare through-hole 1002 for a chip component receiving part formed in the same shape as the through-hole 1001 for a chip part receiving part which has the same shape as the through-hole 1001 for a chip part receiving part
(Provided at the midpoint between 001 and 001).

The gas blowing means 800 includes a nozzle 801
A gas supply source such as an air compressor (not shown) connected to the nozzle 801; and a solenoid valve (not shown) provided at an outlet of the gas supply source (not shown). . The gas blowing means 800 is controlled by a control unit (not shown) of the sorting mechanism C. As shown in FIG. 7, the gas blowing means 800 is provided in a one-to-one relationship with the chip component receiving portion 900, in the vicinity of the chip component receiving portion 900, and on the side of the rotating blade portion 500 on the rotation direction side (downstream side). Installed on the side.

Next, the operation of the chip component sorting apparatus A formed as described above will be described in the following sections.

Initial setting before inspection in the inspection section mechanism B. The chip component W is aligned from the parts feeder 2000 such that the front and back of the chip component W are not reversed, and the conveying path body portion of the inspection unit mechanism B is aligned in the longitudinal direction of the chip component W in an aligned state. 100 is fed to the starting end 100a. The sent chip components W are pushed forward by the subsequent chip components W in the direction of the terminal side 100b of the transport path body 100 while forming a line. This chip component W
Is performed in addition to the gas blowing output from the substantially horizontal gas blowing means 200.

In FIG. 2, for convenience of illustration, a plurality of chip components W in the transport path body portion 100 are shown to advance at a certain interval from each other.
The chip component W moves forward with little space.

The chip component W in the front row is in the inspection area 150
, The chip component positioning portion 155 stops the advance. The certain period up to the above is the initial setting period before the inspection. The determination means (not shown) of the inspection unit mechanism B also performs the gas blowing operation from the substantially horizontal gas blowing means 200, thereby shortening the initial setting period.

The inspection operation in the inspection section mechanism B will be described. In the inspection area 150, the chip components W in the front row are inspected by the substantially perpendicular gas suction / blow-out means 300 instructed by the judging means (not shown) of the inspection section mechanism B in the inspection area 150.
It is sucked to the lower side of 0 and temporarily fixed. In this state,
The electrode units 10 and 10 of the chip component W in the front row are electrically connected to the supply-side electrode units 121 and 122 that are located therebelow.

At this time, for example, first, a preliminary normal / reverse determination test, that is, a voltage lower than the inspection voltage is applied to the chip component W in advance before the main inspection to determine whether the chip component W is in the forward direction or the reverse direction. Perform a test to determine For example, the power supply unit (the power supply unit of the electric supply unit 120 receiving the instruction of the determination unit (not shown) of the inspection unit mechanism B so that the supply side electrode unit 121 becomes the plus side electrode and the supply side electrode unit 122 becomes the minus side electrode). (Not shown), a predetermined preliminary forward / reverse determination test voltage is applied.

As a result, if a predetermined level of current is flowing through the chip component W, the determination means (not shown) determines that the chip component W has the correct electrode direction, and immediately thereafter, the supply-side electrode portion. A power supply unit (not shown) is instructed so that the voltage applied to 121 and 122 becomes the luminance inspection voltage which is the main inspection voltage. Immediately thereafter, the inspection means 400 measures the luminance, and sends the result data to the judgment means (not shown). The judging means (not shown) judges the value within a certain range of the predetermined luminance rank, and stores the rank data.

On the other hand, if a predetermined level of current does not flow through the chip component W as a result of applying the predetermined preliminary forward / reverse determination test voltage, the determination means (not shown) determines that the chip component W has a correct electrode. The power supply unit (not shown) determines that the direction is opposite, and immediately applies the luminance test voltage, which is the main test voltage, by reversing the voltage (electricity applied to both electrodes is electrically reversed). Instruct the means (not shown) to electrically reverse the electricity applied to both electrodes. That is, the supply-side electrode portion 121 becomes a minus-side electrode, the supply-side electrode portion 122 becomes a plus-side electrode, and the supply-side electrode portion 1
The potential difference between 21 and 122 becomes the luminance test voltage.

Immediately thereafter, the inspection means 400 measures the luminance and sends the result data to the judgment means (not shown). Judgment means (not shown) if some luminance is measured
Determines the value of the predetermined luminance rank within a predetermined range, and stores the rank data.

In this case, the luminance may not be measured (the luminance is zero). In this case,
It is determined that the chip is defective due to disconnection or the like in the chip, and the determination means (not shown) stores the data as a rank outside the rank.

The above-mentioned rank data is sent to the control unit (not shown) of the sorting mechanism C.

The operation of transporting the chip component W after inspection in the inspection section mechanism B will be described. After the inspection, the chip components W in the front row are substantially vertically suctioned by gas instructed by the judgment means (not shown) of the inspection unit mechanism B.
The gas is blown up from the lower side of the conveying path body 100 in the direction of the vector a (substantially vertical direction) in FIG. 2 by the blowing output of the gas from the blowing means 300, and immediately thereafter, the chip components W in the front row are arranged in the following direction. The vector b direction is determined by the combined force of the force pushed in the forward direction by the chip component W and the gas blowing output from the substantially horizontal gas blowing means 200 instructed by the judging means (not shown) of the inspection unit mechanism B. (Substantially horizontal direction).

As a result, the chip component W in the front row after the inspection is
Jumps over the chip component positioning section 155 in the direction of the composite vector c of the vector a and the vector b, and conveys air or slides down the inclined section 102a of the tip block section 102 above the inclined section 102a of the tip block section 102. It is released outside the inspection section mechanism B while being inspected. At this time, gas is excessively released by the opening of the horizontal through-hole portion 112, and the front side of the chip component W is blown up extra, so that the chip component W can easily jump over the chip component positioning portion 155.

In the inspection section mechanism B, the chip component W next to the frontmost row of chip components W (that is, the second position) is the new frontmost chip component W, and the above is repeated. Done. The repetition time of the above-mentioned is because the solenoid valve (not shown) of the substantially horizontal gas blowing means 200 and the substantially vertical gas suction / blowing means 300 can be opened and closed at a high speed. , Within 0.3 seconds.

The receiving operation of the chip component W after the inspection in the sorting mechanism C will be described. As described above, the chip component W (hereinafter, abbreviated as “chip component W conveyed in the air”) discharged from the inspection unit mechanism B so as to be conveyed in the air or slid down from the two convex portions adjacent to the rotating blade portion 500. The drive unit 600 for driving the rotary blade unit 500 is controlled to rotate in a predetermined direction at a predetermined rotation speed by a control unit (not shown) of the sorting mechanism C so as to be received at substantially the center between 550 and 550. ing.

The chip component W conveyed in the air subsequent to the chip component W has two adjacent projections 550 and 55 adjacent to each other.
0, and between the downstream convex portion 550 and the further downstream convex portion 550 adjacent to the downstream convex portion 550. Hereinafter, the chip component W further conveyed in the air is also received between the convex portions 550 and 550 on the further downstream side in this way.

The sorting operation of the chip components W after inspection in the sorting mechanism C will be described. The rank data relating to the chip component W sent from the determination means (not shown) of the inspection unit mechanism B to the control unit (not shown) of the sorting mechanism C is sent to the control unit (not shown) of the sorting mechanism C. ) Is stored. In the sorting mechanism C, since the number of the convex portions 550 of the rotary blade section 500 is 10, a total of ten rank data is stored in the control section (not shown) of the sorting mechanism C.

The data of the rank is assigned and stored in the control unit (not shown) of the sorting mechanism C for each data in a delay time set in advance for each rank. The operation of subtracting the elapsed time from is repeated until the value becomes zero.

The preset delay time includes the time obtained by the rotation speed of the rotary blade 500, the position of the chip component receiving unit 900 for each rank, the direction of the nozzle unit 801 and the nozzle unit 801. The time is determined in consideration of the time determined by the amount of air blown from the air.

For the rank data, the control unit (not shown) of the sorting mechanism C subtracts the delay time in addition to the delay time for one data to make the time zero. At this time, gas blowout means designation data indicating which one of the gas blowout means 800 corresponding to the chip component receiving section 900 is to be operated is also distributed.

Therefore, as shown in FIG. 7, when the delay time is subtracted and the time becomes zero, the gas choreographed to the data whose delay time is subtracted and the time becomes zero is obtained. The gas blowing means 800 is selectively operated based on the blowing means designation data, and gas is blown from the nozzle unit 801 of the gas blowing means 800.

The gas from the nozzle portion 801 causes
The chip component W reaching the front of the nozzle portion 801
Along the edge 551 of the projection 550,
It is blown off in the direction outside 0. Note that, at this time, the chip component W is rotated because the convex portion 550 rotates.
Is blown off substantially in the middle of the chip component receiving notch 901 of the predetermined chip component receiving section 900 while receiving the inertial force due to the force in the direction in which the is pressed.

As described above, any one of the delay times assigned to the ten data is subtracted during the rotation of the rotary blade 500 by one rotation, and the time becomes zero. Each time, the blowing operation is performed. Will be After all, rotating blade part 5
While 00 is making one rotation, all the ten blowing operations are completed. That is, when the rotating blade 500 makes one rotation, ten chip components W around the rotating blade 500 are rotated.
Have been sorted into predetermined chip component receiving units 900. Such an operation is also performed after the second rotation.

The operation of the overload-sensitive connection disconnection type connection mechanism 570 in the sorting mechanism C will be described. In the sorting mechanism C, if the overload-responsive connection-releasing type connection mechanism 570 is not attached, the chip component W may be somehow located between the convex portion 550 of the rotary blade 500 and the upper surface of the pedestal 700. If it fits in due to the cause, at least the rotation speed of the rotary blade portion 500 changes, and the sorting operation of the chip components W is not normally performed, and the wrong sorting is performed. In some cases, the rotating blades 5
00 is damaged, or the motor protection circuit normally provided in the drive section 600 operates to stop the entire chip component sorting apparatus A. In order to avoid this, the overload-sensitive connection-disengaging connection mechanism 570 formed as described above is used.
Is provided, and operates as follows.

When the chip component W fits between the convex portion 550 of the rotary blade portion 500 and the upper surface of the pedestal portion 700, the inner body portion 510 of the rotary blade portion 500 rotates at a predetermined rotation speed. However, the outer body portion 530 rotates slower than the predetermined rotation speed because the chip component W is fitted therein. This state is a state in which a predetermined force or more is applied to the outer body portion 530. Therefore, the connecting member 531 a of the outer body 530 is pushed down by the lower part of the inner body 510. Therefore, the outer body part 530 and the inner body part 5
The connection with 10 is disconnected. This condition occurs substantially simultaneously in the two overload sensitive connection disconnection coupling mechanisms 570.

Therefore, at least rotation of the outer body portion 530 is stopped or substantially stopped until the inner body portion 510 rotates half a turn. The position detection sensor (not shown) on the upper surface of the pedestal 700 detects that the rotation of the outer body 530 is stopped or substantially stopped until the inner body 510 rotates half a turn. I do. Sorting mechanism C
The control unit (not shown) determines that the state is abnormal based on a signal from the position detection sensor (not shown).

The control section of the sorting mechanism C (not shown)
Sends an instruction to stop the driving unit 600 and the gas blowing unit 800, while instructing the determining unit (not shown) of the inspection unit mechanism B to stop the inspection unit mechanism B. Further, the control unit (not shown) of the sorting mechanism C activates an alarm device such as a buzzer (not shown) provided in the chip component sorting device A.

As a result, the operator rushes, and the chip component W fitted between the convex portion 550 of the rotary blade portion 500 and the upper surface of the pedestal portion 700 remains on the pedestal portion 700 without being sorted. The operation of removing the chip component W is performed. And the outer body part 5 of the rotating blade part 500
In order to reconnect the inner member 510 with the inner member 510, the outer member 530 is rotated while observing from above the connecting hole 515a until the connecting member 531a is fitted into the connecting hole 515a. After this operation is completed, the operator resets the chip component sorting apparatus A and resumes the operation.

In the chip component sorting apparatus A according to the first embodiment of the present invention, which is configured and operates as described above, the above configuration is merely an example, and for example, the following configuration is adopted. Can also. The inspection unit mechanism B includes an inclined surface 102a (see FIG.
) Of the pedestal part 700 via an insulator at a position where the pedestal part 700 becomes a part of the inclination of the dug part 710.
0 may be embedded and installed.

In such a case, the inspection unit mechanism B
A lower body block portion 101b of the conveying path body portion 100;
The distal end block portion 102 and the inspection portion mechanism support portion 470 can also be integrally formed as components of the pedestal portion 700, respectively. That is, in this case, FIG.
In this case, the insulator is unnecessary, and the tip block 102 is integrated as a part of the disc-shaped body F of the pedestal 700 located below the rotating blade 500, and The through-hole portion 112 is fused with a ring-shaped gap G located outside the disc-shaped body F, and the lower main body block portion 101b is joined with the ring-shaped body H located outside the gap G.
The inspection part mechanism support part 470 is integrated as a part of
May be integrated as a part of an insulating support (not shown) fixed to the lower side of the disc-shaped body F and the ring-shaped body H.

The pedestal 700 is attached to the lower body block 1
When the front block 01b and the front end block 102 are not integrally formed, the lower main block 101b and the upper main block 101a do not have to be separated from each other. However, it is preferable to be able to separate from the viewpoint of maintenance of the transport path body part 100.

The gas suction / blow-out hole 11 of the inspection unit mechanism B
The shape of the chip component W is not limited to a substantially cross shape when viewed horizontally.
Any shape can be used as long as it can be stably blown up so that it rises substantially directly above or slightly forward (for example, an X shape in horizontal view).

The electric supply means 120 of the inspection section mechanism B is also wired to the inspection means 400 side, and by adding necessary circuit parts, the LED part which is a chip component W other than the above-described optical characteristics such as luminance. Can be measured. Further, in this manner, it is possible to measure the electrical characteristics of any chip component W as long as it is a bipolar component (for example, a bipolar transistor).

When the chip component W is, for example, a transistor having three polarities, the supply-side electrodes corresponding to the emitter terminal, the collector terminal, and the base terminal are formed into, for example, a printed circuit board and embedded as the electric supply means 120 in the inspection area 150. It becomes possible if it is provided as follows. Similarly, when the chip component W is another multipolar component, it becomes possible to provide a supply-side electrode corresponding to each terminal as the electric supply means 120 of the inspection area 150. At this time, a means for reversing (switching) the polarity of each (supply-side) electrode is provided so as to cope with the case where the directions of the electrodes of the chip component W are not aligned.

When the supply-side electrode is formed into a printed circuit board, the size of the chip component W is small.
It is often difficult to manufacture a printed circuit board having the width of the current chip component transport path 100c in terms of manufacturing. Therefore, a printed circuit board having a width larger than the width of the chip component transport path 100c is manufactured, and the current chip component transport path 100c is manufactured.
The printed circuit board may be inserted into the transport path body portion 100 from the starting end 100a so that the position of the bottom surface of the printed circuit board becomes the position of the upper surface of the printed circuit board.

At this time, at least one through-hole corresponding to the vertical through-hole 111 is provided in a portion of the printed circuit board located above the vertical through-hole 111 of the gas suction / blow-out through-hole 110. . The portion of the printed circuit board located above the horizontal through hole 112 is formed as an insulating portion (that is, a portion without electrodes). With such a printed circuit board, the wiring for the printed circuit board can be connected to an arbitrary position on the printed circuit board. In addition, by using such a printed circuit board, various chip components W such as a chip component W having multiple electrodes with different electrode arrangements can be used.
Can be handled by replacing the printed circuit board.

Further, when such a printed circuit board is used for the inspection section mechanism B, the supply electrodes 121 and 122 are formed on the printed circuit board so as to be insulated from each other. For example, if the entire transport path body 100 is formed of an insulator, the horizontal through-hole portion 112 physically completely separates the two supply-side electrodes 121 and 122 from each other. It does not have to be formed so that Therefore, in this case, it is also possible to omit the inspection section mechanism support section 470. Further, even when such a printed board is not used for the inspection section mechanism B, for example, the inspection section mechanism support section 470 can be formed by fitting an insulating material into the lateral through-hole section 112 and adhesively fixing it.
Can be omitted.

The electric supply means 120 of the inspection unit mechanism B can be omitted when the chip component selection device A only selects the outer shape of the chip component W. In this case, as the inspection unit 400, an image capturing unit such as a camera and a signal processing circuit unit thereof are installed, and
Sorting of the outer shape, such as the size and shape of the chip component W, is performed.

Means for electrically reversing the electricity applied to both electrodes of the electricity supply means 120 of the inspection unit mechanism B (not shown)
Uses four relays, two of which are connected in the cross direction, and the other two are connected one by one in parallel, and a power supply may be connected to one end thereof. In other words, a relay connected in the cross direction
By switching the relays connected one by one with good timing, the electric power applied to both electrodes can be electrically reversed. However, it is slightly unfavorable in consideration of the response speed and the life of the relay.

Means for electrically reversing the electricity applied to both electrodes of the electricity supply means 120 of the inspection unit mechanism B (not shown)
Is omitted when the parts feeder 2000, which is an external peripheral device, has a function of supplying the chip components W in the same direction of the electrodes, and the power supply unit (not shown) of the electric supply means 120 is connected to a general power supply. can do.

The cover body 450 of the inspection section mechanism B may be omitted when the optical characteristics are not inspected.

In the above description, the chip component W is supplied to the inspection unit mechanism B from the parts feeder 2000 side in the longitudinal direction of the chip component W. It may be supplied in the same direction. In this case, the transport path body 100
The width dimension of the chip component transfer path 100c is
May be slightly larger than the length dimension in the longitudinal direction. Further, the lower structure of the inspection area is different from the above by 90 degrees. At this time, as described above, for example, the entire conveyance path body 100 may be formed of an insulator, or the supply-side electrodes may be formed on a printed circuit board.

The projection 5 of the rotary blade 500 of the sorting mechanism C
The number of fifty can be any suitable number other than ten. However, when the number of the protrusions 550 is significantly increased, the diameters of the rotary blade 500 and the pedestal 700 may be increased.

In the connection mechanism 570 for canceling connection at the time of overload of the rotary blade portion 500 of the sorting mechanism C, the shape of the connection member 531a may be not a substantially spherical body but any shape having a curved surface on the upper side. The elastic portion 531b is not a spring,
An elastic body such as silicone rubber may be used. Inner body 51
0, a connecting hole 515a formed on the outer body 530,
The coupling main body hole 531 formed in the above is not a through hole, but may be a hole whose one side which is not in contact with each other is closed.
In this case, the fixing member 531c is unnecessary, and the elastic body 531 is not required.
b is fixed to the bottom of the coupling body hole 531 with an adhesive or the like. Connecting hole 515 formed in inner body 510
When the outer body portion 530 and the inner body portion 510 of the rotary blade portion 500 are reconnected to each other when the upper side of the a is a closed hole, the connecting member 531a is surely connected to the connecting hole portion 5.
Although it is difficult to confirm whether the rotary blade portion 500 has been pushed up by 15a, the connection is normally completed when the rotary blade portion 500 is rotated half a turn.

Further, the main body hole 5 for coupling is formed in the inner body 510.
31 may be formed to accommodate the elastic body portion 531b and the like, while a coupling hole 515a may be formed in the outer body portion 530. Further, the flange 515 is provided below the inner body 510,
The flange portion 515 is provided on the outer body portion 530 on the side of the through-hole portion 530a.
May be provided with a flange portion of the outer body portion 530 overlapping the upper side.

The overload-sensitive connection canceling type connection mechanism 570 of the sorting mechanism C has a configuration in which the shape of the chip component W is
If there is no risk of fitting between the 0 convex portion 550 and the upper surface of the pedestal portion 700, it can be omitted.

The rotary blade section 500 of the sorting mechanism C is arranged as shown in FIG.
The disc-shaped body F of the pedestal 700 located at the lower side of the rotating blade 500 shown in the above may be integrated as a component of the rotating blade 500. In other words, the rotating blade portion 500 in this case is formed by the disk-shaped body F, the plurality of convex portions 550, and the outer edge portion of the rotating blade portion 500 between the base ends of the convex portions 550 on the upper peripheral side. It is also possible to have a plurality of pocket-like groove-like portions (entering roulette balls) provided on the upper peripheral portion of the center rotating plate of the toy roulette. still,
In this case as well, the overload-sensitive connection release type connection mechanism 570 is also provided.
Can be omitted.

The drive section 600 of the sorting mechanism C may be any drive apparatus having a rotating function other than a motor. However, a device that cannot rotate at a constant speed, for example, can perform only a step operation, is not appropriate because the chip component W may be blown off by inertial force.

Chip part receiving section 900 of sorting mechanism C
Can be any suitable number other than eight. In the first embodiment as well, the number can be set to 16. However, when the number of the chip component receiving portions 900 is greatly increased, the diameter of the pedestal portion 700 may be increased.

The control section (not shown) of the sorting mechanism C and the determination means (not shown) of the inspection section mechanism B may be integrated and provided in the sorting mechanism C or the inspection section mechanism B.

In the operation of the chip component selection device A described above, “Initial setting before inspection in the inspection section mechanism B.” The forward movement of the chip component W is based on the gas blowing output from the substantially horizontal gas blowing means 200. May not be used.

In the operation of the chip component selection apparatus A described above, “Inspection Operation in Inspection Unit Mechanism B”, the inspection of only the luminance of the chip component W is described. When other electrical and optical characteristics are measured, it is needless to say that a voltage for measuring electrical and optical characteristics is applied by the electric supply means 120 according to the measurement.

In the operation of the chip component sorting apparatus A described above, “Receiving operation of the chip component W after the inspection in the sorting mechanism C”, the chip component W conveyed from the inspection unit mechanism B in the air is supplied to the rotating blades. Instead of receiving in the substantially middle between two adjacent protrusions 550 and 550 of the part 500, any one of the protrusions 55 between the two protrusions 550 and 550 is such that the reception of the chip component W is not hindered.
You may make it receive in the position biased to 0.

The inspection mechanism B and the sorting mechanism C need not always be used in pairs. For example, inspection unit mechanism B
For example, a pair of a general conveyor such as a belt conveyor and a scraper can be used. The inspected chip components W are transported in the air to a general transport device such as a belt conveyor, and the scrapers sort the chip components W on the belt conveyor based on data from the inspection unit mechanism B. on the other hand,
The sorting mechanism C can be used as a pair with a general inspection unit mechanism. From the general inspection unit mechanism, the inspected chip component W is transferred to the two adjacent convex portions 55 of the rotating blade portion 500.
When the data is input at a timing that can be received between 0 and 550, and data on the same rank as the inspection unit mechanism B is received from a general inspection unit mechanism, the sorting mechanism C functions as described above.

Next, as another embodiment of an LED chip component sorting apparatus, a chip component sorting apparatus according to a second embodiment of the present invention will be described with reference to FIGS. . FIG. 8 shows a chip component sorting apparatus according to the second embodiment of the present invention (however, the inspection unit mechanism is not shown above the chip component positioning unit and the pressing unit),
FIG. 9 is a perspective view showing a tip side of a parts feeder which is an external peripheral device, FIG. 9 is a cross-sectional view showing a main part of an inspection unit mechanism of a chip component sorting device according to a second embodiment of the present invention,
FIG. 10 is a perspective view for explaining a deformed conveyance path of an inspection unit mechanism of a chip component sorting apparatus according to a second embodiment of the present invention, and FIG. 11 is related to a second embodiment of the present invention. It is a schematic sectional drawing which shows the chip component temporary receiving part of the sorting mechanism of a chip component selection apparatus.

In the chip component sorting apparatus S according to the second embodiment of the present invention, the first embodiment of the present invention is implemented by using the parts feeder 2000 (the leading end of which is a linear feeder section 2200). Inspection mechanism T for inspecting chip components W continuously supplied in the same manner as in the above embodiment, sorting mechanism U for receiving and sorting chip components W sent out from inspection mechanism T, and table base 1000 supporting them. '.

As shown in FIG. 9 and the like, the inspection section mechanism T is provided on a transport path body section 160 having a transport path 161 for chip components in a substantially horizontal direction, and provided at the end side of the transport path body section 160. A chip component inspection area 170, pressing means 180 provided on the upper side of the inspection area 170 and pressing the upper surface of the chip component W, and a pressing means 180 provided on the transport path 161 below the pressing means 180. When the means 180 presses the chip component W, the deformed conveying path portion 16 elastically deforms
And two probe portions 168, 168 that project from the through holes 162a, 162a of the deformed transport path portion 162 and contact the electrode portions 10, 10 of the chip component W when the deformed transport path portion 162 is elastically deformed. The electrode part 10 of the chip component W,
A chip component positioning section 165 for positioning the probe part 10 so as to face the through holes 162a, 162a;
Inspection means (not shown) for inspecting the chip component W contacted with the first and second components 168 and 168; determination means (not shown) for determining the selection of the chip component W based on a signal from the inspection means (not shown); A chip component ejection route 190 for ejecting the inspected chip component W abutting on the chip component positioning section 165 from the inspection area 170 (see FIG. 8).
Moving means 195 (see FIG. 8) for moving the contacting chip component W to the chip component discharge route 190 side.
And

As shown in FIG. 8, the sorting mechanism U
A chip component temporary receiver 580A having a substantially disk body 589 and a plurality of chip component temporary receivers 580 attached in a substantially circular shape around the substantially disk body 589, and a position near the center of the chip component temporary receiver 580A. 750A, a driving part (not shown) for rotating the temporary receiving part 580A, and a plurality of fixing parts provided so as to be able to face the opening 581a provided at the upper part of the temporary receiving part 580A. The inside of the gas blowing means 850, a collecting unit (not shown) for forming the same number of pairs as the gas blowing means 850 and collecting the chip components W moved by the gas blowing means 850, and the sorting mechanism U are controlled. And a control unit (not shown).

Note that the inspection unit mechanism T is
It is fixed on 0 '. The positional relationship between the leading end side of the linear feeder unit 2200 of the parts feeder 2000 and the start end side of the inspection unit mechanism T is basically the same as in the first embodiment of the present invention. Further, the sorting mechanism U is fixed on the table base 1000 'adjacent to the inspection unit mechanism T so that the chip components W can be delivered and received as described later.

The transport path body section 160 has a lower member 160a that is substantially rectangular in plan view, and an upper member (not shown) fixed to the upper surface of the lower member 160a. The upper member (not shown) is a member whose main purpose is to regulate both side surfaces of the chip component W which is pushed by the subsequent chip component W and advances on the transport path 161. A notch (not shown) capable of discharging the inspected chip component W is provided in the upper member on the side surface on the chip component discharge route 190 side on the chip component discharge route 190 side. Further, on the side surface of the upper member opposite to the chip component discharge route 190, the inspected chip component W is transferred by the moving means 195 to the chip component discharge route 19.
In order to discharge to the zero side, the moving means 19
An opening (not shown) for projecting the distal end side of 5 is provided. The lower member 160a is processed so that at least a portion of the deformed conveyance path portion 162 has an insulating property. For example, the portion of the deformed conveyance path section 162 is made of an insulating resin.

The deformed transport path section 162 is provided with a cavity 162d from the lower side in order to make it a thin plate having elasticity, and has a width smaller than the width dimension of the chip component W so as to be substantially adjacent to both sides of the transport path 161. Slit part 1 with sufficiently narrow width
62b and the like are provided. The slit part forming a pair with the slit part 162b is not seen as a shadow of the chip component W in FIG. 8, but is formed from the upstream side to the chip component discharge route 190.

In the vicinity of the center of the deformed conveyance path 162 in the conveyance direction, through holes 162a, 162a from which the tip ends of the probe parts 168, 168 can protrude are opened.

Note that an upper member (not shown) of the transport path body 160 is disposed on the slit 162b and the like, and the slit 162b and the like are closed.
On both sides of the slit portion 162b, through holes 162 for adjusting the atmospheric pressure in the cavity 162d and the space communicating therewith are provided.
c and 162c are provided. These through holes 162c, 1
The upper side of 62c communicates with a through hole (not shown) of an upper side member (not shown) of the transport path body section 160. Thereby, the vibration convergence after the deformed conveyance path portion 162 is pushed down via the chip component W by the pressing means 180 is accelerated, and the forward movement of the subsequent chip component W is not hindered. In the normal state, the deformed conveyance path 16
2 is hardly deformed in the vertical direction due to the difference in ambient temperature between the upper and lower sides.

The chip component positioning portion 165 is a rectangular plate portion in a side view, and positions the frontmost chip component W so as to come into contact with the probe portions 168 and 168. The chip component positioning section 165 is provided at least in the deformed conveyance path section 1.
Although it is not fixed to 62, it is fixed to the lower member 160a. Since the chip component positioning portion 165 is installed so as to cover the downstream portion of the deformed conveyance path portion 162, after the pressing means 180 pushes the deformed conveyance path portion 162 down via the chip component W, the chip component positioning portion 165 is lowered. Also contributes to quick convergence of vibration.

The pressing means 180 includes a contact portion 181 for pressing the upper surface side portion of the frontmost row of chip components W positioned by the chip component positioning portion 165, and a cylinder for slightly moving the contact portion 181 up and down. (The illustration is omitted. The structure is the same as that of the cylinder used as the moving means 195, except that the mounting direction is vertical instead of horizontal.) Contact part 18
1 is provided with a through hole 181a, in which an optical fiber (not shown) is fixed. The tip of this optical fiber is fixed near the lower end of the contact portion 181. The base end of the optical fiber is arranged before a light receiving element (not shown) (to the extent that it does not come into contact with the contact portion 181 by vertical movement). The periphery of the light receiving element is covered so that disturbance light does not enter. Since the optical fiber is fixed to the contact portion 181 as described above, the movable portion (not shown) on the tip end side of the cylinder portion is the contact portion 181 and is a portion formed long on the near side in FIG. It is connected to.

The probe portions 168 and 168 are electrode needles for supplying electricity at the time of an electrical inspection (inspection of luminance or the like) of the chip component W. A power supply unit (not shown) for supplying electricity so that one is a positive electrode and the other is a negative electrode is connected to each base end of the probe units 168 and 168 via a wiring (not shown). Note that the power supply unit is provided with the same means (not shown) for electrically inverting the electricity applied to both electrodes in the inspection unit mechanism B according to the first embodiment of the present invention.

The chip component discharge route 190 extends from the base end of the chip component positioning portion 165 to the near side of the chip component positioning portion 165 on the upper side of the transport path body portion 160 having a dimension slightly longer than the longitudinal dimension of the chip component W. It is composed of a slide-shaped inclined portion extending from a notch (not shown) of a member (not shown) to the sorting mechanism U side. This chip component discharge route 190
Is formed such that the chip component W sliding down here falls into the opening 581a of the chip component temporary receiving section 580 during the closest approach of the sorting mechanism U.

The moving means 195 is a means for pushing the side surface of the frontmost row of chip components W positioned by the chip component positioning section 165 and discharging the chip components to the chip component discharge route 190 side, as shown in FIG. , For example, a cylinder. Note that the movable part 195a of the moving means 195
Should be able to operate at high speed,
In particular, it is an air cylinder.

The inspection means (not shown) is the inspection means 400 in the inspection section mechanism B according to the first embodiment of the present invention.
And basically the same. When the image capturing means such as a camera is attached during the shape inspection, the pressing means 180 is obstructive, so that the pressing means 180 is removable.

The judgment means (not shown) is basically the same as the judgment means (not shown) in the inspection section mechanism B according to the first embodiment of the present invention, and can be judged, stored and controlled by a microcomputer or the like. Electronic circuit part. However, as the configuration is changed, this determining means (not shown) includes a power supply unit (not shown) connected to the probe unit 168, a pressing means 180, an inspection means 400, and a moving means 195. And a control unit (not shown) on the sorting mechanism U side
And connected to.

Next, details of the sorting mechanism U will be described. As shown in FIGS. 8 and 11, the chip component temporary receiving portion 580 has a chip component passage 58 inside a substantially rectangular cylinder.
1 is formed. The chip component passage 581 is
The upper opening 581a includes a portion that is wide and narrows downward, and a substantially tubular portion that is connected to the portion. This substantially tubular portion is formed slightly larger than the chip component W, and is meandered to the lower end of the substantially tubular portion so that the chip component W does not fall at a stroke. A middle portion 581b having a flat portion is provided.

The middle section 581b is used to temporarily secure the chip component W to the vicinity of a predetermined collecting section (not shown). Middle part 581b of chip component passage 581
The lower side further extends in a meandering manner to the lower end side of the chip component temporary receiving portion 580, and has a flat portion.
bL. An opening 581c is provided on the downstream side of the lower portion 581bL. This lower opening 5
Reference numeral 81c denotes an outlet for the chip component W from the chip component temporary receiving section 580 to the collection section (not shown).

The middle portion 581b is formed by the middle portion 581b.
The chip component W that has fallen to b
It has a flat portion so as not to drop to the side, and is formed as follows so as not to drop to the opening 581c side even under the influence of centrifugal force. Middle section 581
The position of the opening of the chip component passage 581 immediately above b is set in the direction in which the centrifugal force acts, that is, the rotation, so that the chip component W that has fallen below this opening is not blown off by the centrifugal force and drops to the opening 581c. Chip part temporary receiving part 58 to be moved
0, and the flat portion is formed such that its longitudinal direction is substantially along the direction in which centrifugal force acts. Therefore, the chip component W does not usually drop to the lower portion 581bL at a stretch. However, in consideration of a case where the lower part 581bL is dropped, the lower part 581bL is taken into consideration.
The length dimension of the flat portion of bL prevents the chip component W from sliding down to the opening 581c due to centrifugal force. By the way, since the internal shape of the chip component temporary receiving portion 580 is complicated as described above and it is usually difficult to integrally mold the chip component temporary receiving portion 580, the chip component temporary receiving portion 580 is formed by dividing into arbitrary plural members and combining them. .

Such a chip component temporary receiving section 580 includes:
It plays substantially the same role as the convex portion 550 of the rotary blade portion 500 of the sorting mechanism C in the first embodiment of the present invention. Therefore, description will be made assuming that the number of the chip component temporary receiving units 580 is, for example, ten. This number is not necessarily the same as the number of collection units (not shown), and is determined by the inspection capability of the inspection unit mechanism T or the like. In the case of the chip component temporary receiving section 580, the chip component W is placed between the convex section 550 and the pedestal section 700 as in the case of the sorting mechanism C.
Does not occur, so that there is no need for such a mechanism as the overload-sensitive connection canceling connection mechanism 570.

Around the substantially disk body 589, ten chip component temporary receiving portions 580 are attached. A drive unit (not shown) is connected to the center of the substantially disk 589. On the way from the center of the substantially disk-shaped body 589 to the portion where each chip component temporary receiving portion 580 is attached, the position detecting through-hole portion 590 '(separation mechanism) C position detection through hole 5
90 is provided. The difference between the shape of the position detection through-hole 590 ′ and the position detection through-hole 590 is merely a change for reducing the weight of the substantially disk body 589.

When the chip component temporary receiver 580A is rotating, the chip component temporary receiver 5
A position detection sensor (not shown) is provided at a position on the lower side of the route through which the position detection through-hole 590 'of the approximately disk body 589 of the 80A passes. This position detection sensor is connected to a control unit (not shown) of the sorting mechanism U for controlling a drive unit (not shown), and the chip component temporary receiver 580 is provided.
A is used for the rotation servo of A, and is used for detecting the presence or absence of rotation or rotation delay of the chip component temporary receiver 580A. Note that a control unit (not shown) of the sorting mechanism U is mutually connected to a determination unit (not shown) of the inspection unit mechanism T.

The driving section (not shown) is similar to the driving section 600 of the sorting mechanism C, and is, for example, a motor.

The gas blowing means 850 corresponds to the gas blowing means 800 of the sorting mechanism C with the tip end of the nozzle portion 801 positioned directly below, and the gas blowing means 850 of the rotating chip component temporary receiving section 580 is positioned directly below. What is necessary is just to let the upper opening 581a pass. Therefore, also in the gas blowing means 850, a gas supply source section (not shown) such as an air compressor connected to a nozzle section (not shown) and a solenoid valve (not shown) provided at an outlet of the gas supply source section (not shown). (Not shown). This gas blowing means 850
Is controlled by a control unit (not shown) of the sorting mechanism U.
The nozzle part of the gas blowing means 850 is a collecting part (not shown).
In a one-to-one relationship, the components are arranged at predetermined intervals in the vicinity of the upper side of the collection unit (not shown) and slightly in the counter-rotating direction (upstream side) of the temporary chip component receiver 580A. Regarding the installation in which the chip component W is slightly shifted in the anti-rotation direction side (upstream side), the chip component W located in the middle section 581b is blown out to the collection section (not shown) by the gas blowing from the gas blowing means 850. The time until collection (delay time) is taken into account.

The collecting unit (not shown) is for finally collecting the inspected chip component W via the chip component temporary receiving unit 580 of the chip component temporary receiving body 580A according to the inspection result. For example, a chip component receiving tray. The number of the collecting parts is equal to the number of the gas blowing means 850 and is the number of the chip components W classified.
In other words, it can be said that the collecting unit has a function similar to that of the chip component receiving unit 900 (and the chip component receiving plate installed immediately below) of the sorting mechanism C according to the first embodiment of the present invention. . Therefore, as in the case of the first embodiment of the present invention, the number is, for example, eight.

Next, the operation of the chip component sorting apparatus S formed as described above will be described in the following (1) to (5).

(1) Initial setting before inspection in inspection unit mechanism T. The chip component W is aligned from the parts feeder 2000 such that the front and back of the chip component W are not reversed, and the conveying path body of the inspection unit mechanism T is aligned in the longitudinal direction of the chip component W. The sheet is fed to the start end side of the conveyance path 161 of the cartridge 160. The sent chip components W are advanced by being pushed by the subsequent chip components W toward the end side of the transport path body portion 160 while forming a row.

The chip component W in the front row is in the inspection area 170
, The forward movement is stopped by the chip component positioning section 165. Thus, the chip component positioning unit 16
At the stage positioned by 5, the electrode units 10, 10 of the chip component W in the front row face the through holes 162 a, 162 a, but are not in contact with the tips of the probe units 168, 168. I have. The certain period up to the above is the initial setting period before the inspection. Note that, at this stage, the contact portion 181 of the pressing means 180 is stopped at its initial position such that the lower surface thereof is slightly above the upper end portion of the chip component W.

(2) Inspection Operation in Inspection Unit Mechanism T After the elapse of the initial setting period, the lower end of the contact portion 181 moves the chip component W in the front row in the inspection area 170 by the pressing operation of the pressing unit 180 receiving the instruction of the determining unit (not shown) of the inspection unit mechanism T. Push down a small distance from the top. Therefore, the deformed conveyance path portion 162 is slightly elastically deformed to the lower side by being pushed by the chip component W. As a result, the distal ends of the probe portions 168 and 168 slightly protrude from the through holes 162a and 162a of the deformed conveyance path portion 162. Therefore, the electrode parts 10 and 10 of the chip component W in the front row are electrically connected to the probe parts 168 and 168 that slightly protrude.

At this time, for example, first, a preliminary normal / reverse determination test, that is, a voltage lower than the inspection voltage is applied to the chip component W in advance before the main inspection to determine whether the chip component W is in the normal direction or the reverse direction. Perform a test to determine For example, the power supply unit (not shown) instructed by the judging means (not shown) of the inspection unit mechanism T so that the downstream probe unit 168 becomes a positive electrode and the upstream probe unit 168 becomes a negative electrode. ), A predetermined preliminary forward / reverse determination test voltage is applied.

As a result, if a predetermined level of current is flowing through the chip component W, the determination means (not shown) determines that the chip component W has the correct electrode direction, and immediately thereafter, the probe unit 168, The power supply unit (not shown) is instructed so that the voltage applied to 168 becomes the luminance inspection voltage which is the main inspection voltage. Immediately thereafter, inspection means (not shown)
Measures the luminance through an optical fiber (not shown),
The result data is sent to the judgment means (not shown). The judging means (not shown) judges the value within a certain range of the predetermined luminance rank, and stores the rank data.

On the other hand, if a predetermined level of current does not flow through the chip component W as a result of applying the predetermined preliminary forward / reverse determination test voltage, the determination means (not shown) determines that the chip component W has the correct electrode. The power supply unit (not shown) determines that the direction is opposite, and immediately applies the luminance test voltage, which is the main test voltage, by reversing the voltage (electricity applied to both electrodes is electrically reversed). Instruct the means (not shown) to electrically reverse the electricity applied to both electrodes. That is, the downstream probe 168 becomes a negative electrode, the upstream probe 168 becomes a positive electrode,
The potential difference between the probe units 168 becomes a voltage for luminance inspection.

Immediately thereafter, the inspection means (not shown) measures the luminance via an optical fiber (not shown) and sends the result data to the judgment means (not shown). If some luminance has been measured, the judging means (not shown) judges the value within a certain luminance range within a predetermined luminance rank, and stores the rank data.

In this case, the luminance may not be measured (the luminance is zero). In this case,
It is determined that the chip is defective due to disconnection or the like in the chip, and the determination means (not shown) stores the data as a rank outside the rank.

The above rank data is sent to the control unit (not shown) of the sorting mechanism U.

(3) Operation of transporting chip component W after inspection in inspection section mechanism T. After the inspection, the contact portion 181 of the pressing means 180 that has pressed down the front row of chip components W is returned to the initial position in response to an instruction from the determining means (not shown) of the inspection unit mechanism T.
Immediately thereafter, the movable part 195a of the moving means 195, which has been instructed by the judging means (not shown) of the inspection unit mechanism T, performs a push operation, so that the chip component W in the front row after the inspection is operated.
Is discharged to the chip component discharge route 190 side. Therefore, the chip component W is transferred to the chip component discharge route 190.
Is released outside the inspection unit mechanism T while sliding down.

In the inspection section mechanism T, the chip component W next to the chip component W in the front row (ie, at the second position) becomes a new chip component W in the front row, and the above-mentioned (1) (3) are repeated.

The contact portion 181 of the pressing means 180
Is set to be sufficiently smaller than the height from the bottom to the thinnest part of the chip component W. For this reason, at the time of this pressing, the chip component W in the front row and the subsequent chip component W are placed on the upper surface of the deformed transport path portion 162 that is finely curved downward and the transport path body portion 16.
There is no danger that it will be pinched between the lower surface of the upper member (not shown) and the lower member.

(4) The receiving operation of the chip component W after the inspection in the sorting mechanism U. As described above, the chip component W released so as to slide down from the inspection unit mechanism T (hereinafter, “the released chip component W”
Abbreviated. Is driven by the control unit (not shown) of the sorting mechanism U so that the chip component temporary receiver 580A is received by the chip component temporary receiving unit 580 that is approaching closest. The rotation is controlled in a fixed direction at a predetermined rotation speed.

The released chip component W subsequent to the chip component W is received by the adjacent chip component temporary receiving section 580 on the upstream side of the chip component temporary receiving section 580.
The following further released chip components W are also like this,
Further, it is received by the chip component temporary receiving section 580 on the upstream side. Note that the reception in the chip component temporary receiving section 580 means a state in which the chip component W is temporarily secured on the middle section 581b of the chip component temporary receiving section 580.

(5) Sorting operation of chip components W after inspection in sorting mechanism U. The rank data relating to the chip component W, which is sent from the determination unit (not shown) of the inspection unit mechanism T to the control unit (not shown) of the sorting mechanism U, is stored in the control unit (not shown) of the sorting mechanism U. ) Is stored. In this sorting mechanism U, since the number of the chip component temporary receiving portions 580 is ten, the data of the rank is ten in total, and the sorting mechanism U
(Not shown).

With respect to the data of the rank, a control unit (not shown) of the sorting mechanism U assigns and stores a delay time set in advance for each of the ranks for each data. The operation of subtracting the elapsed time from is repeated until the value becomes zero.

The preset delay time is determined by the time obtained by the rotational speed of the chip component temporary receiver 580A, the position of the collecting unit for each rank, the amount of air blown from the nozzle unit, and the like. It is set in consideration of time.

For the data of the rank, the control unit (not shown) of the sorting mechanism U subtracts the delay time in addition to the delay time for one data, and the time becomes zero. At this time, the gas blowing means designation data indicating which of the collecting sections should operate the gas blowing means 850 is also distributed.

Therefore, when the delay time is subtracted and the time becomes zero, the gas blow-out means is designated based on the gas blowing means designation data which is distributed to the data whose delay time is subtracted and the time becomes zero. The means 850 is selectively operated, and gas is blown from the nozzle portion of the gas blowing means 850.

With the gas from the nozzle portion, the chip component W temporarily secured on the middle portion 581b of the chip component temporary receiving portion 580 that has reached below the nozzle portion passes through the lower portion 581bL. It is blown off to the opening 581c side and collected by a predetermined collecting unit. At this time, if the chip component W is temporarily secured in the lower portion 581bL, the chip component W is opened from the lower portion 581bL by the gas from the nozzle portion.
It is blown off to the side 1c and collected by the predetermined collecting section. The blowing speed of the gas from the nozzle is
Since it is very fast, the time difference between when it is blown off from above the middle section 581b and when it is blown off from above the lower section 581bL is small, and there is no problem in collecting the chip component W to the collection section. Also, the size of the collecting section is formed so as not to cause any trouble.

As described above, any of the delay times choreographed to the ten pieces of data corresponds to the chip component temporary receiver 58.
During one rotation of OA, the time is always subtracted and the time becomes zero. Each time, the blowing operation is performed. After all, during the one rotation, all the ten blowing operations are completed. In other words, after one rotation, the ten chip components W secured in each chip component temporary receiving section 580 are:
Sorting has been completed in a predetermined collection section. Such an operation is also performed after the second rotation.

In the chip component selection apparatus S according to the second embodiment of the present invention, which is configured and operates as described above, the above configuration is merely an example, and for example, the following configuration is adopted. Can also.

In the inspection section mechanism T, the deformed transport path section 16
The upstream-side through hole 162a has a long hole in the longitudinal direction so that the size of the chip component W can be long in the longitudinal direction. It may be movable.

In the inspection section mechanism T, the probe section 16
The power supply units 8 and 168 are also wired to the inspection means side, and by adding necessary circuit components, measure various electrical characteristics of the LED as the chip component W in addition to the above-mentioned optical characteristics such as luminance. It is also possible. Further, in this manner, it is possible to measure the electrical characteristics of any chip component W as long as it is a bipolar component (for example, a bipolar transistor). Note that the inspection means is an inspection unit mechanism B, T
Is generally provided on the upper side of the inspection area 150 or 170. However, if the inspection unit mechanism is only for inspection items that do not need to be inspected from the upper side of the chip component W, the inspection unit mechanism other than the upper side may be used. Needless to say, it can be provided.

When the chip component W is, for example, a transistor having three polarities, a probe section 168 and a power supply section corresponding to the emitter terminal, the collector terminal, and the base terminal may be provided. The same applies to the case where the chip component W is another multipolar component.

The probe sections 168 and 168 of the inspection section mechanism T
And the power supply unit, the chip component selection device S is a chip component W
If only the outer shape is selected, it can be omitted. At this time, as the inspection means, an image capturing means such as a camera and a signal processing circuit unit thereof are installed, and the external processing such as the size and shape of the chip component W is selected by image processing.

The means (not shown) for electrically reversing the electric power applied to both electrodes of the inspection unit mechanism T has a function of supplying chip components W in the same direction as the electrodes to the parts feeder 2000 which is an external peripheral device. If there is, the power supply unit (not shown) can be used as a general power supply.

In the above description, the chip components W are supplied to the inspection unit mechanism T from the parts feeder 2000 side in the longitudinal direction of the chip components W. It may be supplied in the same direction.

The pressing means 180 and the moving means 195 of the inspection unit mechanism T may be a pressing means by gas blowing and a moving means by gas blowing, respectively. For example, the gas blowing means 80 of the sorting mechanism C according to the first embodiment of the present invention.
A mechanism similar to 0 is adopted as the mechanism. However, in this case, when the pressing unit 180 or the moving unit 195 is operated, there is a possibility that the chip component W succeeding the chip component W in the front row may be slightly pushed back to the rear side. In order to do so, the substantially horizontal gas blowing means 2 used in the inspection unit mechanism B according to the first embodiment of the present invention
00 is also provided in the inspection unit mechanism T. At the same time, when the substantially horizontal gas blowing means 200 is operated, in order to prevent the deformed conveyance path section 162 from being vibrated by the blown gas, the substantially horizontal gas blowing means 200 is kept at a fixed position after the operation. It is preferable to provide vibration preventing means for supporting the deformed conveyance path portion 162 from below only for a short time. It should be noted that the substantially horizontal gas blowing means 200 and the vibration preventing means are provided by pressing means 180.
Even when the moving means 195 and the moving means 195 are not used as the pressing means by gas blowing and the moving means by gas blowing, respectively, they may be provided in the inspection unit mechanism T to speed up the forward movement of the chip component W.

Chip part temporary receiving section 580 of sorting mechanism U
May be any suitable number other than ten.

The drive unit of the sorting mechanism U may be any drive device having a rotating function other than a motor. Further, the rotation may not be constant, for example, only the step operation may be performed.

The collecting unit (not shown) of the sorting mechanism U has 8
Any appropriate number other than the number may be used.

The control section (not shown) of the sorting mechanism U and the determination means (not shown) of the inspection section mechanism T may be integrated and provided in the sorting mechanism U or the inspection section mechanism T.

The inspection unit mechanism T and the sorting mechanism U do not necessarily need to be used in pairs, as in the case of the chip component sorting apparatus A according to the first embodiment of the present invention.

[0192]

As described above, the chip component sorting apparatus according to the present invention includes an inspection area provided on an extension of the chip component supply device from the chip component supply device in the transport direction, and an inspection area provided in the inspection area. It is characterized by comprising inspection means for inspecting the positioned chip component, and judgment means for judging the selection of the chip component based on a signal from the inspection means.

Therefore, in the case of the chip component sorting apparatus according to the present invention, the chip components are not moved to another place at the time of inspection / judgment. There is no time loss due to relocation. Therefore, speeding up is possible.

More specifically, for example, a chip component sorting apparatus according to the present invention includes a transport path body having a chip component transport path that penetrates the interior in a substantially horizontal direction, and a starting end of the transport path body. A substantially horizontal gas blowing means for transporting chip components provided on the side, a chip component inspection area provided on the end side of the transport path body portion, and a chip component provided at a lower side of the inspection area. A substantially perpendicular gas suction / blowout means capable of adsorbing and floating in a substantially perpendicular direction, a chip component positioning portion provided on the end side of the inspection area, and an inspection means provided on an upper side of the inspection area; And determining means for determining the selection of chip components based on a signal from the inspecting means.

Therefore, in the case of the chip component sorting apparatus according to the present invention, the aligned chip components that are continuously pushed and supplied in a row from the parts feeder, which is an external peripheral device of the sorting apparatus, are used. And is sent to the chip component transport path in the transport path body. Chip components on the chip component transport path are pushed forward by subsequent chip components that are continuously fed from the parts feeder, but the chip components in the front row are located in the chip component positioning section provided at the end of the inspection area. When it reaches, its advance stops. In this forward movement, a substantially horizontal gas blowing means is also used to increase the speed. In this inspection area,
The chip components in the front row are sucked downward by the substantially perpendicular gas suction / blowout means and temporarily fixed.

At this stage, the inspection is performed by the inspection means provided on the upper side of the inspection area, and the judgment is made by the judging means. The force of the gas blowing of at least the substantially horizontal gas blowing means and the substantially perpendicular gas suction / blowing means is applied to the frontmost row of chip components that have been inspected by the inspection means, and the frontmost row of chip components is In the combined vector direction, the light is emitted outside the inspection area beyond the chip component positioning section. At this time, the chip component that has been sent subsequent to the chip component in the front row becomes a new chip component in the front row, and the above operation is repeated.

As described above, the time required for the chip component to reach the inspection area can be shortened by the substantially horizontal gas blowing means.
The gas is discharged to the outside of the inspection area in a short time by the gas blowing force of the substantially horizontal gas blowing means and the substantially vertical gas suction / blowing means. This is because, for example, a solenoid valve can be used as the opening / closing means as the blowing means, so that the high speed of the solenoid valve can also be directly used. ].

Therefore, in the case of the chip component sorting apparatus according to the present invention, the time required for transportation before and after the inspection can be reduced, so that the speed of chip component sorting can be increased.
In the case of the chip component sorting device according to the present invention,
Since the mechatronics portion can be eliminated by using the substantially horizontal gas blowing means and the substantially perpendicular gas suction / blowing means, the durability and the continuous stability can be improved. Further, in the case of the chip component sorting apparatus according to the present invention, since relatively expensive components are not required,
The device for sorting chip components according to the present invention can be provided at a relatively low cost.

The chip component sorting apparatus according to the present invention is preferably provided with an electric supply means for supplying electricity to the chip component when inspecting the chip component by the inspection means, below the inspection area. . Therefore, in the case of the chip component sorting apparatus according to the present invention, by providing this electricity supply means, the electrical characteristics and the optical characteristics can be inspected, and the speed of the sorting of the characteristics can be increased. Further, since expensive components are not required for the electricity supply means, the chip component sorting apparatus according to the present invention can be provided at a relatively low cost.

[0200] In the chip component sorting apparatus according to the present invention, the electric supply means includes electrodes respectively corresponding to the electrodes of the chip component, and a gap for electrically separating the electrodes is provided between the electrodes. It is preferable that the gap portion also functions as the gas suction / blow-out port of the gas suction / blow-out means in the substantially perpendicular direction.

Therefore, in the case of the chip component sorting apparatus according to the present invention, a mechanism for separating the gas suction / blow-off port from each electrode is provided in a limited area below the small chip component. Can be Therefore, it becomes easy to manufacture the chip component sorting apparatus according to the present invention.

[0202] In the chip component sorting apparatus according to the present invention, when the chip component is a bipolar component such as an LED, the power supply means is supplied to the plus side electrode, the minus side electrode and both electrodes. Means for electrically opposing electricity, and a gap between the plus side electrode and the minus side electrode for electrically separating the two electrodes, wherein the gap is substantially perpendicular to the gas. Gas suction and suction
It is preferable to also serve as an outlet.

Therefore, the device for selecting chip components according to the present invention has a means for electrically reversing the electric power applied to both electrodes, so that all chip components are aligned in the correct electrode direction. Even if not supplied, for example,
Performs a forward / reverse judgment test (a test to determine whether the chip component is in the forward or reverse direction by applying a voltage lower than the main test voltage to the chip component in advance before the main inspection) If a predetermined level of current is flowing through the chip component, the determining means determines that the chip component has the correct electrode direction, and immediately performs the main test by applying the main test voltage. If a current equal to or higher than the predetermined level does not flow, the determination means determines that the chip component is in the opposite direction to the correct electrode, and immediately reverses and applies the main test voltage (to both electrodes). It is also possible to use a method of electrically opposing electricity. Means for electrically reversing the electricity to be applied to both electrodes can be achieved at low cost, and when a part feeder, which is an external device, is provided with a function of aligning the electrode directions of chip components (in this case, the present invention is not limited to this) It is necessary to provide an electric circuit (including means other than means for electrically reversing the electric power applied to both electrodes) in the device for selecting chip components in the parts feeder in duplicate, rather than the entire system (the present invention). And the cost of the chip component sorting apparatus and the external parts feeder) can be reduced.

Further, as another means, a chip component sorting apparatus according to the present invention is provided at a transport path body portion having a transport path for chip components in a substantially horizontal direction, and provided at an end side of the transport path body portion. A chip component inspection area, pressing means provided on the upper side of the inspection area and pressing the upper surface side of the chip component, and provided on a transport path below the pressing means, wherein the pressing means presses the chip component. Then, a deformed conveyance path portion that is elastically deformed, a plurality of probe portions projecting from the through holes of the deformed conveyance path portion and contacting the electrode portion of the chip component when the deformed conveyance path portion is elastically deformed, and an electrode of the chip component. A chip component positioning portion for positioning the chip component so as to face the through hole, an inspection device for inspecting the chip component contacted by the probe portion, and a judging device for judging the selection of the chip component based on a signal from the inspection device. The may be characterized by comprising.

Therefore, in the case of the chip component sorting apparatus according to the present invention, the aligned chip components that are continuously pressed and supplied from the parts feeder and are supplied in a row form the chip components in the transport path body. It is sent to the transport path. Chip components on the chip component transport path are pushed forward by subsequent chip components continuously fed from the parts feeder. When the front row of chip components reaches the chip component positioning section, its advance stops.

The electrode portion of the chip component in the front row is positioned in the inspection area so as to face the through hole on the upper end side of the probe portion. Therefore, when the pressing means presses the frontmost row of chip components from above, the deformed conveyance path portion is pressed by the chip components and elastically deforms downward. This allows
The electrode portion of the chip component and the probe portion come into electrical contact. Electricity necessary for inspecting the chip component by the inspection means is supplied to the probe section. Therefore, the chip components in the front row are inspected by the inspection means, and are determined by the determination means in connection with sorting. Thereafter, the chip component in the front row is moved from this position by some moving means (for example, a moving path of the chip component cut out on the side and a pushing means to the side). Become.

Therefore, in the case of the chip component sorting apparatus according to the present invention, although the pressing means and the moving means have the mechatronics portion, they do not require expensive components.
A low-cost chip component sorting apparatus can be provided.

The chip component sorting apparatus according to the present invention is used in combination with the above-described chip component sorting apparatus according to the present invention (specifically, an inspection unit mechanism of the chip component sorting apparatus). It is preferable to provide a sorting mechanism of a chip component sorting device having the following configuration.

This sorting mechanism comprises a rotating blade having a plurality of projections regularly provided on an outer edge, a driving unit for driving the rotating blade, and a driving unit fixed to the inside and A pedestal portion for supporting the rotating blade portion, and a chip component provided on the outer side of the rotating blade portion and rotated on the pedestal portion by the convex portion of the rotating blade portion along the edge of the convex portion. A plurality of gas blowing means for blowing off in the direction of the outside of the rotating blade portion, and a pair of the gas blowing means in the same number as the gas blowing means, provided at predetermined intervals on the outer peripheral side of the pedestal portion for receiving the blown chip components. And a chip component receiving section.

[0210] Therefore, in the case of the chip component sorting apparatus according to the present invention, the chip component discharged to the outside of the inspection area by the inspection section mechanism is placed on the pedestal portion and the rotary blade portion. The protrusion is received between two adjacent protrusions of the plurality of protrusions provided regularly on the outer edge. The next chip component released to the outside of the inspection area is rotated to receive between the downstream convex portion of the two convex portions and the further downstream convex portion adjacent to the downstream convex portion. The blade is being rotated.

In this repetition, chip components are successively sent to the outer edge of the rotary blade, but the signals for selection by the judging means of the inspection mechanism and the outer edge of the rotary blade are respectively located. The current position information of each chip component is linked. Thereby, each chip component is rotated to the vicinity of the predetermined chip component receiving portion [that is, a predetermined time after the chip component released to the outside of the inspection area is released (this predetermined time is determined by the inspection time). When a different time elapses according to the result), the gas is blown out by the gas blowing means along the edge of the convex portion on the downstream side toward the outside of the rotating blade portion, and collected at a predetermined chip component receiving portion. . While the rotating blades make one rotation, each chip component is collected in a predetermined chip component receiving unit based on the inspection result.

Therefore, in the case of the chip component sorting apparatus according to the present invention, in the sorting mechanism, the chip component receiving section is provided on the outer peripheral side of the pedestal section, for example, at predetermined intervals (that is, on the outer peripheral side of the pedestal section). Since a large number can be provided at predetermined angles (for each predetermined angle), it is possible to easily perform various types of sorting and also to reduce the size. In addition, since gas blowing means (for example, a solenoid valve) can be used, the mechatronics portion can be eliminated, and high-speed sorting can be achieved by the instantaneous action of gas blowing, as well as high durability (long life) and continuous stability. It can also be excellent in properties.

Further, in the case of the chip component sorting apparatus according to the present invention, since the sorting mechanism does not require relatively expensive components, the chip component sorting apparatus according to the present invention can be manufactured at a relatively low cost. Can be provided by Moreover,
The rotating blades can be reduced in weight, and the energy required to rotate the rotating blades by the driving unit is insignificant.On the other hand, the gas blowing means is also insignificant in energy. In the case of the sorting device of
The sorting mechanism can save energy.

[0214] In the chip component sorting apparatus according to the present invention, the rotary blade portion is provided so as to partially overlap the inner body portion fitted into the shaft portion of the driving portion and the outer peripheral side of the inner body portion. It has an outer body part, and the part where the inner body part and the outer body part overlap is connected to each other, but the connection is released when a predetermined force or more is applied to the outer body part. A mold coupling mechanism may be provided.

Therefore, in the case of the chip component sorting apparatus according to the present invention, even if a trouble such that the chip component is caught between the pedestal portion and the rotary blade portion occurs, the connection at the time of overload response is possible. The connection between the inner body part and the outer body part of the rotating blade part is disconnected by the releasable connection mechanism, the inner body part idles, the outer body part does not rotate, and the sorting operation is interrupted. Therefore, incorrect sorting (sorting) can be prevented.

The overload-responsive connection releasing type connection mechanism includes, for example, a connecting hole formed in the inner body portion or the outer body portion, and a connecting hole formed in the outer body portion or the inner body portion. A coupling body hole formed at a position engageable with the portion,
It can be composed of a connecting member provided inside the connecting main body hole and an elastic body that acts to press the connecting member against the connecting hole.

Therefore, in the case of the chip component sorting apparatus according to the present invention, it is possible to provide an overload sensitive connection canceling connection mechanism with a simple and low-cost configuration.

Further, in the chip component sorting apparatus according to the present invention, in the sorting mechanism, a chip component temporary receiver having a plurality of chip component temporary receivers arranged in a substantially circular shape; A driving unit for rotating, a plurality of gas blowing means fixedly provided to face an opening for receiving a chip component provided on an upper side of the chip component temporary receiving portion, and the same number of the gas blowing means. A collecting unit that collects the chip components moved by the operation of the gas blowing means, and the chip component temporary receiving unit is provided with a chip in the middle of a chip component passage leading downward from the opening. It has a middle portion for temporarily securing components, and the operation of the gas blowing means collects chip components from the middle portion via a terminal-side opening of a chip component passage to a collection portion. It may be.

In the case of the chip part sorting apparatus according to the present invention, the chip part discharged to the outside of the inspection area is received by the chip part temporary receiving part by the inspection part mechanism. The chip component is moved from the opening of the temporary chip component receiving portion to a middle portion provided in the middle of the chip component passage in the temporary chip component receiving portion and temporarily stops there. Similarly, the next chip component is also received by the rotating chip component temporary receiving portion on the downstream side.

In this repetition, chip components are successively received by the chip component temporary receiving section on the further downstream side. However, the signal for selection by the judging means of the inspection section mechanism and the position of each chip component temporary receiving section are provided. The linked current position information of each chip component is linked. Thereby, each chip component is rotated to the vicinity of a predetermined collection part (that is, the chip component discharged to the outside of the inspection area is
After a predetermined time (e.g., the predetermined time varies depending on the inspection result) after the release, the gas is blown out by a gas blowing means in a direction outside the distal end opening of the chip component passage, and is collected by a predetermined collection unit. Is done. While the chip component temporary receiving body makes one rotation, each chip component is collected by a predetermined collection unit based on the inspection result.

Therefore, also in the case of the chip component sorting apparatus according to the present invention, it is possible to easily perform various kinds of sorting and to reduce the size. In addition, since gas blowing means (for example, a solenoid valve or the like) can be used,
The mechatronics portion can be eliminated, the sorting can be performed at high speed by the instantaneous action of gas blowing, and the durability can be high (long life) and the continuous stability can be excellent.

Furthermore, in the case of the chip component sorting apparatus according to the present invention, since the sorting mechanism does not require relatively expensive components, the chip component sorting apparatus according to the present invention can be manufactured at a relatively low cost. Can be provided by In the case of the chip component sorting apparatus according to the present invention, there is no fear that the chip component is clogged, and no countermeasure is required.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a chip component sorting apparatus according to a first embodiment of the present invention and a parts feeder which is an external peripheral device thereof.

FIG. 2 is a schematic cross-sectional view illustrating an inspection unit mechanism of the chip component selection device according to the first embodiment of the present invention.

FIG. 3 is a schematic partially cutaway perspective view showing an inspection unit mechanism of the chip component selection device according to the first embodiment of the present invention.

FIG. 4 is a schematic plan view showing a chip component sorting device and a parts feeder as an external peripheral device according to the first embodiment of the present invention (gas blowing means is not shown).

FIG. 5 is a sectional view taken along the line EE in FIG. 4;

FIG. 6 is a schematic cross-sectional view for explaining an overload-sensitive connection-disconnection type coupling mechanism of a sorting mechanism of the chip component sorting apparatus according to the first embodiment of the present invention.

FIG. 7 is a schematic perspective view for explaining a sorting mechanism of the chip component sorting apparatus according to the first embodiment of the present invention.

FIG. 8 shows an apparatus for selecting chip components according to a second embodiment of the present invention (however, the inspection unit mechanism is not shown above the chip component positioning unit and the pressing means) and its peripheral devices. It is a perspective view showing the tip side of a certain parts feeder.

FIG. 9 is a cross-sectional view illustrating a main part of an inspection unit mechanism of a chip component sorting apparatus according to a second embodiment of the present invention.

FIG. 10 is a perspective view for explaining a deformed conveyance path of an inspection unit mechanism of a chip component selection device according to a second embodiment of the present invention.

FIG. 11 is a schematic cross-sectional view showing a chip component temporary receiving section of a sorting mechanism of a chip component sorting device according to a second embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List A Chip device sorting device B Inspection unit mechanism C Sorting mechanism 500 Rotating blade unit 550 Convex unit 600 Drive unit 700 Pedestal unit 800 Gas blowing unit 900 Chip component receiving unit

Claims (13)

[Claims] 1. An inspection area provided on an extension of a chip component supplied from a chip component supply device in a transport direction, inspection means for inspecting a chip component positioned in the inspection area, and inspection means provided by the inspection means. A chip component selecting device for determining a chip component based on a signal. 2. A transport path body portion having a chip component transport path penetrating the interior in a substantially horizontal direction, and a substantially horizontal gas blowing means for transporting chip components provided at a starting end of the transport path body portion. A chip component inspection area provided on the terminal side of the transport path body portion, and a chip component provided below the inspection area;
A substantially perpendicular gas suction / blowout means capable of adsorbing and floating chip components in a substantially perpendicular direction, a chip component positioning portion provided at the end side of the inspection area, and an inspection means provided at an upper side of the inspection area And a determining means for determining the selection of chip components based on a signal from the inspection means. 3. The semiconductor device according to claim 2, further comprising: an electric supply unit provided at a lower side of the inspection area for supplying electricity to the chip component when inspecting the chip component by the inspection unit. Chip parts sorting equipment. 4. The electric supply means includes electrodes respectively corresponding to the electrodes of the chip component, and has a gap between each of the electrodes to electrically separate the electrodes. 4. The device for sorting chip components according to claim 3, wherein the device also serves as a gas suction / blow-out port of the gas suction / blow-out means in a substantially perpendicular direction. 5. The chip component sorting apparatus according to claim 3, wherein the chip component is a bipolar component such as an LED, and the power supply means includes a plus side electrode, a minus side electrode, and both electrodes. Means for electrically reversing the electric power applied to the positive electrode and the negative electrode, and a gap is provided between the positive electrode and the negative electrode to electrically separate the two electrodes, and the gap is substantially perpendicular to the vertical line. A chip component sorting device, which also serves as a gas suction / blow-out port of a directional gas suction / blow-out means. 6. The chip component sorting apparatus according to claim 1, wherein at least the substantially horizontal gas blowing means and the substantially perpendicular direction are provided for the chip parts which have been inspected by the inspection means. Selecting a chip component by applying a force of gas blowing with a gas suction / blowing means to discharge the chip component in the direction of its combined vector beyond the chip component positioning portion to the outside of the inspection area. apparatus. 7. A transport path body section having a transport path for chip components in a substantially horizontal direction, a chip component inspection area provided at the end side of the transport path body section, and a chip component inspection area provided above the inspection area. Pressing means for pressing the upper surface side of the chip component, a deformed conveying path portion provided in a conveying path below the pressing means and elastically deformed when the pressing means presses the chip component; A plurality of probe portions that project from the through holes of the deformation conveyance path portion and contact the electrode portions of the chip component during elastic deformation, and a chip component positioning portion that positions the electrode portion of the chip component so as to face the through hole. A chip component inspection device for inspecting a chip component contacted by a probe portion, and a judgment device for judging the selection of the chip component based on a signal from the inspection device. 8. A rotating blade having a plurality of projections regularly provided on an outer edge, a driving unit for driving the rotating blade, and a driving unit fixed to the inside and including the rotating blade. A pedestal portion supporting the portion, and a chip component provided on the outer side of the rotating blade portion and rotated on the pedestal portion by the convex portion of the rotating blade portion, along the edge of the convex portion, A plurality of gas blowing means for blowing off in the direction of the outside of the portion, and a chip component receiving portion provided in the same number as the gas blowing means and provided on the outer peripheral side of the pedestal portion for receiving the blown chip components. A chip component sorting apparatus. 9. The rotary blade has an inner body fitted into a shaft of the drive unit, and an outer body provided to partially overlap the outer periphery of the inner body. In the part where the body part and the outer body part overlap, they are connected to each other,
9. The chip component sorting apparatus according to claim 8, further comprising an overload-responsive connection-disengaging connection mechanism that is disconnected when a predetermined force or more is applied to the outer body. 10. The overload-responsive connection-disengaging connection mechanism includes a coupling hole formed in an inner body portion or an outer body portion, and an outer body portion or an inner body portion, wherein the coupling hole portion includes: A main body hole for coupling formed at a position where it can be engaged, a coupling member provided inside the main body hole for coupling, and an elastic body that works to press the coupling member against the coupling hole. The chip component sorting apparatus according to claim 9, further comprising: 11. A chip component temporary receiver having a plurality of chip component temporary receivers arranged in a substantially circular shape, a driving unit for rotating the chip component temporary receiver, and an upper part of the chip component temporary receiver. A plurality of gas blowing means fixedly provided to face an opening for receiving a chip component provided on the side, and the same number of the gas blowing means are paired and moved by the operation of the gas blowing means. And a collecting unit for collecting chip components, wherein the chip component temporary receiving unit includes:
A middle step portion for temporarily securing the chip component in the middle of the chip component passage leading to the lower side from the opening, and by the operation of the gas blowing means, the chip component passes from the middle stage through the distal opening of the chip component passage; A chip component sorting apparatus, wherein the chip parts are collected by a collecting part. 12. The configuration according to claim 1, 2, 3, 4, 5, 6, or 7 is used as an inspection unit mechanism of a chip component selection device, and the configuration according to claim 8, 9, 10, or 11 is used as a chip component. A sorting mechanism of the sorting device of (1). 13. The chip component sorting apparatus according to claim 12, wherein the gas blowing means at a predetermined location is activated after a predetermined time elapses according to a signal from the determination means. apparatus.