JPH11207533A - Method and device for part assembling - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily and highly accurately hold a positional relationship during the adhering and fixing period of a part item or a part support to an intermediate holding member. SOLUTION: The holding posture of a head 2 is varied to detect the predesignated three points of the head 2 by a CCD camera while the head 2 is held on a head support to be freely adjusted for position by a head grasping means and a head position adjusting mechanism, position adjustment is performed for the assembling position of the head 2 to the head support. Also, each CCD camera is arranged such that the detection optical path of the CCD camera is inclined with respect to the head surface of the head 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for assembling a component, and more particularly, to a component and a component support to which the component is to be mounted, which is disposed between the component and the component support. The present invention relates to a method and an apparatus for assembling parts, which are bonded and fixed by an adhesive via an intermediate holding member.

[0002]

2. Description of the Related Art Conventionally, when a component and a component support to which the component is assembled are indirectly fixed using a bracket-like intermediate holding member disposed between the component and the component support. Generally, an assembly method is employed in which the component and the component support and the intermediate holding member are fixed by screws. However, in this assembling method by screwing, the torque at the time of tightening the screws is likely to cause a displacement in a mounting position of the component with respect to the component support, and it is difficult to accurately position the component. As an assembling method for eliminating the misalignment of the parts due to the tightening of the screws, the parts and the parts supporting body and the intermediate holding member are formed so as to be fitted to each other while maintaining a predetermined positional relationship in advance, Methods for improving the positioning accuracy of each component are known. However, in this assembling method, since the positional accuracy of the assembled components is uniquely determined by the individual finishing accuracy of each component, each component itself needs to be processed with high accuracy. Therefore, while this assembly method can be configured at low cost, there is a difficulty in directly using a plastic molded product or the like that tends to vary in component accuracy due to mold sinking as a component, and the material cost and processing cost of each component. There is a drawback that causes an increase.

[0003] Therefore, the component and the component support as described above can be separated from each other without being affected by the finishing accuracy.
In order to assemble inexpensively using the intermediate holding member so as to maintain an accurate positional relationship with each other, an assembling method of bonding and fixing the component and the component support and the intermediate holding member using an adhesive is adopted. Is preferred.

However, as described above, in the assembling method in which the component and the component support and the intermediate holding member are fixed to each other with an adhesive, there is no positional deviation between the component and the component support during bonding. However, the quality of the assembling position of the component with respect to the component support after bonding and fixing is determined. For this reason, the positional relationship between the component and the component support at the time of the bonding greatly affects the quality of a product using the component.

For example, when the above components are a print head of a printer, a line sensor of a scanner, a solid-state image pickup device of a CCD camera, etc., if an assembly error occurs in a component attached to the component support, this error occurs. Due to an assembly error of a part, an image printed by the part, an image read by the part, and the like are displaced, so that there is a problem that image quality is deteriorated.

In particular, when the above-mentioned component is an ink-jet head of an ink-jet printer (subordinate, simply referred to as "head"), the head surface of the head (printing ink is discharged) due to an assembly error of the head with respect to the component support. The distance between the surface on which the nozzle hole is formed and the printing surface of the recording paper varies, or the nozzle hole does not face an appropriate position with respect to a predetermined printing position on the recording paper. I do. For this reason, in the case of such a head, the ink drop ejected from each nozzle hole reaches a printing surface deviating from a predetermined printing portion due to an assembling error. Would.
In addition, inks of different colors (usually yellow ink,
In a color printer with multiple heads filled with magenta ink, cyan ink, and black ink), if an assembling error occurs in the assembling positions of the heads of each color, printing is performed due to variations in the printing positions of the ink drops of each color. Color shift and distortion occur in the image.

Therefore, in order to assemble a high-precision part by such an assembling method by bonding, when the above-mentioned part and the part support are bonded and fixed to the intermediate holding member, the part support and the intermediate holding member are fixed. It is necessary to maintain the positional relationship between the component and the component support with high precision in advance so that the component and the component face the correct assembly position. Incidentally, in the case of a color printer head as described above, it is necessary to keep the tolerance of the assembling position at the time of bonding to the component support within the range of the order of microns.

[0008]

As described above, in the method of assembling a component using an adhesive, the positional relationship between the component and the component support at the time of bonding is determined by associating the component with the component support. This is extremely important in assembling with high precision. Therefore, in this type of conventional component assembling method and apparatus, for example, in the head assembling method and apparatus, in a direction perpendicular to the head surface of the head, a nozzle hole formed in the head surface is formed by: CC with solid-state imaging device (CCD)
An image is taken with a D camera, the position of the center of gravity of the image of the nozzle hole is calculated by a calculation unit, the position of the head in the X-axis and Y-axis directions is measured, and an autofocus device built in the CCD camera is used. Based on the output data relating to the defocus amount in the Z-axis direction, the control / arithmetic unit calculates the position in the Z-axis direction. Based on the measurement result, the head surface of the head with respect to the component support and The position of the nozzle hole was adjusted.

However, in the conventional method and apparatus for assembling a head, when measuring the position of the nozzle hole, one nozzle hole on the head surface of the head is focused.
When the head is positioned, the position of the one nozzle hole in the X, Y, and Z-axis directions can be accurately positioned. It is not possible to accurately measure the misalignment of other nozzle holes due to surface tilting or rotation.

[0010] Therefore, in such a head assembling method and apparatus, the position deviation of another nozzle hole due to the surface inclination or rotation of the head surface based on the position of the one nozzle hole is corrected. Operation becomes extremely difficult. Therefore, when the position of the nozzle hole is measured by the measurement method as described above, the positioning of the head requires a lot of time, complicated arithmetic processing, and the like. It has been difficult to simplify the measuring means for measuring the position of the nozzle hole.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to maintain the positional relationship between a component and a component supporter at the time of adhesion and fixing to an intermediate holding member easily and with high precision. It is an object of the present invention to provide a method and apparatus for assembling parts.

[0012]

In order to achieve the above object, according to the first aspect of the present invention, a component and a component support to which the component is assembled are arranged between the component and the component support. A component assembling method of bonding and fixing with an adhesive via an intermediate holding member, wherein the component support is positioned and held at a predetermined assembly position, and the component is positioned relative to the component support. In a state in which the component is held in an adjustable manner, by changing the holding posture of the component and detecting three points specified in advance of the component, position adjustment of the mounting position of the component with respect to the component support is performed. Is what you do.

In this component assembling method, the component support positioned and held at a predetermined assembly position is
The above components are held so that their positions can be adjusted. As we all know,
By specifying the positional relationship of three points that are not on the same straight line for an object of any shape, the attitude of the object in space is determined. Therefore, as described above, three points of the part are specified in advance, and the three points are detected.
By changing the holding posture of the component, it is possible to adjust the position of mounting the component with respect to the component support very accurately.

According to a second aspect of the present invention, in the component assembling method of the first aspect, when assembling a plurality of identical components side by side under the same assembling conditions with respect to the component support, each of the components assembled immediately before the same is assembled. It is characterized in that position adjustment data at the time of position adjustment with respect to the component support is referred to as position adjustment data at the time of assembling a component to be assembled next.

In this component assembling method, when a plurality of identical components are juxtaposed and assembled to the component support under the same assembling conditions, the position of the component assembled immediately before is adjusted with respect to the component support at the time of position adjustment. The adjustment data is referred to as position adjustment data at the time of assembling a component to be assembled next. In this way, by referring to the position adjustment data at the time of adjusting the position of the component assembled immediately before with respect to the component support, by assembling the component to be assembled next, it is possible to adjust the position at the time of assembling the subsequent component. The time required is reduced.

According to a third aspect of the present invention, in the parts assembling method of the first or second aspect, the detection optical axes of three previously specified points on the same plane of the component are inclined with respect to the plane. The position of the mounting position of the component with respect to the component support is adjusted by performing detection using at least three optical detection means.

Here, when an arbitrary point on the part is detected by using an optical detection means (such as an optical sensor or a CCD camera), the conventional apparatus uses the same method as described above with respect to the plane where the point exists. The detection optical axis of the optical detection means is set vertically, and the defocus amount in the direction of the detection optical axis is detected using an autofocus device. The position of the point was measured by calculation. Therefore, in order to determine the position of the point, a complicated calculation and an expensive measuring device are required. On the other hand, in this part assembling method, at least three optical detecting means whose detection optical axes are inclined with respect to the plane of the part are defined by three points specified in advance on the same plane of the part. Is detected using As described above, by detecting each point of the component using the optical detection means having the detection optical axis inclined, the positions of the three points on the X, Y, and Z coordinates can be determined. Become. Therefore, in this component assembling method, it is not necessary to use the above-described autofocus device when positioning the component in the Z-axis direction. Further, as described above, when at least three optical detection means are used to detect three previously specified points on the same plane of the component, the detection of each detection means with respect to the plane is performed. When the optical axes are arranged vertically, the detection optical axes of the detection means are parallel to each other, so that the distance between the detection optical axes is automatically determined by the outer diameter of each detection means. You. Therefore, in such a method for detecting the position of a part, the part to be assembled is relatively small, and the maximum distance between any three points of the part is the minimum distance between the detection optical axes of the detection means. In the case where the distance is smaller than the above, the respective detection optical axes of the detecting means are located outside the three points of the component, so that the detecting means cannot detect the three points of the component. . On the other hand, in this component assembling method, the detection optical axes of at least three optical detection means for detecting three points of the component are inclined with respect to the detected plane of the component. In addition, it is possible to set the detection optical axes of the respective detection means in arbitrary directions different from each other.
Therefore, in this component assembling method, the minimum separation distance of any three points that can be detected by the detecting means is not automatically determined by the outer diameter of each detecting means. Even for a component having a size, any three points of the component can be detected and accurately positioned.

According to a fourth aspect of the present invention, in the component assembling method of the first, second or third aspect, the intermediate holding member coated with the adhesive is attached to the component and the component prior to adjusting the position of the component. It is characterized in that it is installed at a position that comes into contact with the component support.

In this component assembling method, prior to adjusting the position of the component, the intermediate holding member to which the adhesive has been applied is placed at a position in contact with the component and the component support. Therefore, according to this component assembling method, the adhesive applied to the intermediate holding member is moved along the applied surface by the relative operation between the component and the intermediate holding member at the time of adjusting the assembly position of the component. And the layer thickness of the adhesive is equalized.

According to a fifth aspect of the present invention, in the component assembling method of the first, second, third, or fourth aspect, a light-curing adhesive having a property of being solidified by light irradiation as an adhesive applied to the intermediate holding member. The method is characterized in that the adhesive is solidified by irradiating light to the adhesive after adjusting the position of assembling the parts using an agent.

In this component assembling method, a photocurable adhesive having a property of being solidified by light irradiation is used as the adhesive applied to the intermediate holding member. After the position of the component is adjusted, the adhesive is irradiated with light to solidify the adhesive. Therefore, according to this component assembling method, the adhesive does not solidify during the adjustment of the assembling position of the component,
The problem that the part is fixed with the assembly position adjustment being incomplete is avoided.

According to a sixth aspect of the present invention, in the component assembling method of the fifth aspect, the intermediate holding member is formed of a light transmitting material, and the adhesive is irradiated with light through the intermediate holding member to form the adhesive. It is characterized by solidifying the agent.

In this component assembling method, the intermediate holding member is formed of a light transmitting material, and the adhesive is irradiated with light through the intermediate holding member to solidify the adhesive. Thereby, the range of light irradiation on the adhesive is expanded, and the solidification time of the adhesive is reduced.

According to a seventh aspect of the present invention, a component and a component support to which the component is assembled are bonded and fixed with an adhesive via an intermediate holding member disposed between the component and the component support. A component supporter for positioning and holding the component support at a predetermined assembly position, and a component supporter held by the component supporter. Component holding means for holding the component in a position-adjustable manner; component position detecting means for detecting three predetermined points of the component held by the component holding means; And a component position adjusting means for adjusting the position of the component assembling position with respect to the component support held by the component support holding means based on the detected position of the point.

In this component assembling apparatus, the holding position of the component is adjusted by the component holding means so that the three specified points of the component are detected by the component position detecting means. Accordingly, the position of mounting the component with respect to the component support is adjusted very accurately based on the principle described in the first aspect of the present invention.

According to an eighth aspect of the present invention, in the component assembling apparatus of the seventh aspect, the component comprises an ink jet head, and the component position detecting means includes three nozzle holes formed in a head surface of the ink jet head. At least 3 individually detected from a direction inclined with respect to the head surface
A plurality of solid-state imaging devices.

In this component assembling apparatus, the three nozzle holes formed in the head surface of the head are arranged in a direction inclined with respect to the head surface by the component position detecting means comprising at least three solid-state imaging devices. Detected individually. Thus, as described in the third aspect of the present invention, the position of the nozzle hole can be easily and accurately detected. Further, in this component assembling apparatus, since the existing nozzle holes formed in the head surface of the head are used as a positioning reference at the time of head positioning adjustment, the position of the head is detected by the component position detecting means. There is no need to provide a detected mark or the like on the head.

In this part assembling apparatus, the part position detecting means for detecting the previously specified three points of the part and determining the mounting position of the part on the part support is used for the part support of the part. After the assembling is completed, three points of the part are detected again. This makes it possible to know from the detection result of the component position detecting means whether or not the component has been displaced before and after the assembly of the component. Therefore, the quality of the assembled component can be determined by comparing the detection results before and after the component assembly by the component position detection unit with the component quality determination unit. As described above, by using the component position detecting means for detecting the assembling position at the time of assembling the component, by detecting the component position after the completion of the assembly, a new inspection process independent of the assembly process of the component is provided. In addition, the quality of the part can be determined very easily and accurately during a series of assembly steps for the part.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A head unit assembling apparatus as a part assembling apparatus for assembling an ink jet head unit (hereinafter, simply referred to as "head unit") which is a printing unit of an ink jet printing type color printer will be described below. An embodiment applied to (1) will be described.

FIG. 1 shows the appearance of a head unit 1 assembled by the head unit assembling apparatus. The head unit 1 includes four heads 2 as components of a printing unit of the color printer, a head support 3 as a component support for supporting the head 2, a head support 3, and the head 2. And an intermediate holding member 4 for holding the four heads 2 on the head support 3 by being bonded and fixed so as to connect the two.

As shown in FIGS. 3 and 4, each of the heads 2 has a nozzle shape for supplying ink in an ink cartridge (not shown) mounted on the back of the head 2 into the head body. An ink supply unit 2a;
a number of nozzle holes 2b as ink discharge holes for discharging the ink supplied through a to recording paper or the like as minute ink droplets, and the head for controlling the timing of discharging the ink droplets from the nozzle holes 2b 2 has a flexible flat cable 2c for supplying a control signal and the like to a control board (not shown) incorporated in the back surface of the control board 2. The nozzle holes 2b of each head 2 are formed in two rows on the head surface 2d facing the recording paper so as to extend along the recording paper conveyance direction (sub-scanning direction).

On the other hand, as shown in FIG. 1, the head support 3 is interposed through the intermediate holding member 4 so that the head surface 2d of each head 2 is exposed from the back side to the front side. A substantially vertical head holding wall 3a for holding the head 2, and a collar for supporting the head support 3 in a reciprocating manner in a direction (main scanning direction) orthogonal to the recording paper conveyance direction. A slide bearing 3b slidably fitted to a head unit support shaft (not shown) provided on the printer main body side, and the ink cartridge is mounted on an ink supply nozzle 2a of each head 2. Thus, a cartridge holding bracket 3c for mounting and holding the ink cartridge on the back side of the head support 3 is formed.

Each head 2 of the head unit 1
Are configured to be adhesively fixed to each head holding wall 3a of the head support 3 via four intermediate holding members 4, respectively. As shown in FIG. 4, the intermediate holding member 4 has a substantially vertical first adhesive interface 4a formed parallel to the head holding wall 3a of the head support 3,
A head base 2 in which a control board of the head 2 is incorporated.
and e is an L-shaped member having a substantially horizontal second adhesive interface 4b formed in parallel with the upper surface of e. Further, the intermediate holding member 4 has 4a, 4a
It is formed of a transparent resin body having a property of transmitting ultraviolet light (UV light) for solidifying the UV adhesive applied to b.

FIG. 2 is a block diagram showing the overall configuration of a head unit assembling apparatus for assembling the head unit 1 configured as described above. FIG. 3 shows an example of a specific configuration of the head unit assembling apparatus. As shown in FIGS. 2 and 3, this head unit assembling apparatus is a component mounting jig for mounting components of the head unit 1 including the head 2, the head support 3, and the intermediate holding member 4. 100, the component mounting jig 100 positioned at the component setting portions A and B of the component setting stage 201 is reciprocated between the component setting portions A and B and the jig elevating portion C of the component setting stage 201. Jig transfer mechanism 202 for moving the jig up and down between the jig elevating portion C and the component set stage 201 and the component assembly stage 301 above the component set stage 201. A jig transferring unit 200 as a jig transferring means including a component mounting jig elevating mechanism 203 for performing a component mounting jig raised above the component assembling stage 301. A component mounting jig gripping mechanism 302 for gripping the component mounting jig 100 and a component mounting jig gripping mechanism 302 gripping the component mounting jig 100 are connected to a jig elevating portion D and a component assembling portion E of the component assembling stage 301 (see FIG. 8)
, A component mounting jig position adjusting mechanism 303 for adjusting the stop position of the component mounting jig 100 on the component assembling stage 301, and a component mounting jig position adjusting mechanism 303. Mounting jig 1 reciprocated by
A component mounting jig positioning unit 3 including a component mounting jig position measuring means 304 for measuring the movement position of the 00
In a state where the component mounting jig 100 is positioned at the component assembly site, the intermediate holding member 4 set on the component mounting jig 100 is held, and the intermediate holding member 4 is moved to a predetermined adhesive application position. The intermediate holding member holding mechanism 401 is moved to a predetermined mounting position between the head 2 and the head support 3 set on the component mounting jig 100, and the intermediate holding member holding mechanism 401 for facing the The intermediate holding member position adjusting mechanism 40 for adjusting the mounting position of the intermediate holding member 4 held by the intermediate holding member holding mechanism 401
2, an adhesive applying means 403 for applying a UV adhesive to the intermediate holding member 4 held by the intermediate holding member holding mechanism 401, and the intermediate holding member 4 by the adhesive applying means 403. The intermediate holding member mounting unit 400 including the adhesive application amount adjusting means 404 for adjusting the application amount of the UV adhesive applied to the component mounting jig 100 in a state where the component mounting jig 100 is positioned at the component assembly site. A head gripper 501 for gripping the head 2 set on the component mounting jig 100, an X axis parallel to the moving direction of the component mounting jig gripping mechanism 302, and a Y axis orthogonal to the X axis , Z axis, and α, β, and γ rotation directions about the X, Y, and Z axes as rotation centers. And the head gripper A head position adjusting unit 500 including a head position adjusting mechanism 502 for adjusting the position of the head 2 gripped by 501, and a CCD camera 601 as a component position detecting means for detecting the nozzle hole 2b of the head 2 have been detected. Nozzle hole position measuring means 60 for measuring the position of a predetermined nozzle hole 2b based on image data
2, a nozzle hole illumination light source 604 for illuminating a nozzle hole 2b to be detected by the CCD camera 601 via a halogen light guide 603, and a predetermined mounting position via a UV light guide 605. Intermediate holding member 4
Nozzle hole position measurement and head fixing unit 600 including a UV light source 606 for irradiating UV light to the
Host controller (sequencer) for controlling the operation of units mainly driven by air cylinders
And a sub-controller (personal computer) for controlling the operation of a unit driven by a motor as a drive source, performing image processing of image data obtained by each measuring means, and performing arithmetic processing of measured data. 700 and the like.

Next, the component assembling operation of the head unit assembling apparatus will be described. 5 and 6 show an example of an operation flow of the head unit assembling apparatus. The operation program of this operation flow is based on the control / arithmetic device 70.
0 is written in advance in a ROM or the like, and is started by turning on a main switch (not shown) of the head unit assembling apparatus.

When the operation program starts, an initial setting operation is executed (step S1). By this initial setting operation, each unit described above returns to the home position and stands by. Next, the component setting stage 201 shown in FIG.
An operator performs an operation of setting each component of the head unit 1 on the component mounting jig 100 positioned at the component setting sites A and B (step S2).

The component mounting jig 100 positions and holds the head support 3 so that the head support 3 maintains the posture at the time of assembling, and opens an assembly site for the head 2 and the intermediate holding member 4. A head support holding portion, a head support portion for supporting the head 2 so as to secure a position adjustment region of the head 2 with respect to the head support positioned at the head support holding portion, and a head support holding portion And an intermediate holding member supporting portion for supporting the intermediate holding member 4 in a position in which the intermediate holding member 4 can be transferred to the head support 3 positioned at the portion.

As shown in FIGS. 3, 4, and 8, the head support holding portion includes a fixed short axis 102 fixed to the back side plate 101 of the component mounting jig 100, and a fixed short axis 10
The movable short shaft 104 is provided so as to be able to advance and retreat with respect to the side plate 103 on the front side of the component mounting jig 100 so as to face the component mounting jig 100.
A pressing member 106 attached to a pair of brackets 105 fixed inside the upper right hand of each of the side plates 101 and 103; and a component mounting jig 100 for pushing up the head support 3 in a set state. And three push-up members 107 arranged on the bottom plate 113. Here, the outer diameters of the fixed short axis 102 and the movable short axis 104 are fitted to the sliding bearing 3b of the head support 3 to support the head support 3 reciprocally. It is formed to have the same diameter as the outer diameter of a head unit support shaft (not shown) provided on the side. Further, the pressing member 106 has a protrusion 1 formed on the lower surface at a substantially central portion thereof.
06a is opposed to a cartridge holding bracket 3c for mounting and holding the above-described ink cartridge formed on the side of the head support 3 opposite to the sliding bearing 3b on the back side of the head support 3. Is configured.

The movable short axis 104 penetrates the side plate 103, and the bracket 10 is disposed outside the side plate 103.
8 is fixed. The bracket 108 is attached to the side plate 1.
The movable short shaft 104 is slidably pivoted in a direction parallel to the axial direction of the movable short shaft 104 by a support shaft 110 that is supported between the other bracket 109 fixed to the outside of the movable shaft 03 and the outer plate 03. I have. Also, the support shaft 110 is attached to the bracket 108.
The extension behavior of the extensible coil spring 111 wound around the side plate 103 imparts a displacement behavior in a direction approaching the side plate 103. Further, the bracket 108 is provided with an operation lever 112 penetrating through a key-shaped guide hole 109a formed in another bracket 109.

The head support 3 is set in the head support holding section constructed as described above as follows. First, prior to the setting of the head support 3, the operation lever 112 is moved by the coil spring 111.
Of the bracket 109
Is locked at the key of the guide hole 109a. Thereby, the movable short shaft 104 is
Is displaced outward of the side plate 103. This movable short axis 104
, The distance between the opposing surfaces of the movable short axis 104 and the fixed short axis 102 is changed by the sliding bearing 3 b of the head support 3.
Is greater than the maximum width of In this state, the sliding bearing 3b on the back side of the head support 3 is fitted to the fixed short shaft 102, and the guide hole 109a of the operation lever 112 is provided.
Is released from the lock, and the movable short shaft 104 is fitted to the sliding bearing 3b on the front side of the head support 3.
Next, the three push-up members 107 disposed on the bottom plate 113 are set to a predetermined height by operating the same manner as in the case of the movable short shaft 104, and the pair of brackets 1 are set.
05, the pressing member 106 is attached.
The cartridge holding bracket 3c of the head support 3 is pressed by the projection 106a of No. 06.

Thus, the head support 3 is positioned and set at a predetermined portion of the component mounting jig 100 by the head support holder. Here, as described above, the head support holding unit includes the fixed short axis 102 and the movable short axis 104, similarly to the head unit support axis for reciprocating the head 2 in the main scanning direction. The slide bearing 3b of the head support 3 is fitted and supported. Therefore, the fixed short axis 102 and the movable short axis 1
04 as a reference axis at the time of assembling the head 2 to the head support 3, the head support 3
The head 2 can be positioned with high accuracy. The back surface of the head support 3 is supported by three push-up members 107 arranged on the bottom plate 113 of the component mounting jig 100. This allows
The horizontality of the surface of the head support 3 is ensured.

On the other hand, the head support portion is constituted by a head support member 115 which is clamped and fixed to a substantially central portion of the pair of side plates 101 and 103. The head support member 115 is provided at a position where a position adjustment region of the head 2 can be secured with respect to the head support 3 positioned at the head support holder. As shown in FIGS. 3, 4, and 7, the head support member 115 has
Four head installation surfaces 115a on which the head bases 2e of the four heads 2 are installed, and the ink supply unit 2 of the heads 2 in a state where the heads 2 are installed on the head installation surfaces 115a.
A fitting hole 115b into which a is fitted and a cable pocket 115c for accommodating the flexible flat cable 2c of the head 2 are formed. The head support member 115 has the heads 2 mounted on the head mounting surface 115a, and each head 2 is positioned below the head assembly portion sandwiched between the head holding walls 3a of the head support 3 above. It is formed so as to face (see FIG. 3).

As described above, the head support is inserted into the fitting hole 115b of the head support member 115.
The head 2 is configured to be positioned on the head installation surface 115a by fitting the ink supply unit 2a of the head 2 with the ink supply unit 2a, so that the head 2 can be positioned without using any special positioning means. it can. The head support portion is configured such that the flexible flat cable 2c of the head 2 is housed in the cable pocket 115c of the head support member 115 in a state where the head 2 is installed on the head installation surface 115a. So
When the head 2 is gripped by the head gripper 501 described later, the flexible flat cable 2c does not hinder the gripping operation of the head gripper 501.

Similar to the head support member 115, the intermediate support member support portion is a plate-like intermediate support member support member 116 substantially parallel to the bottom plate 113 clamped and fixed to the upper left portion of the pair of side plates 101 and 103. It is composed of As shown in FIGS. 3, 4 and 7, the intermediate holding member support member 116 is formed with two parallel fitting grooves 116a orthogonal to the side plates 101 and 103. In addition, each fitting groove 11
In the 6a, five positioning pins 116b are implanted at equal intervals. As a result, each of the intermediate holding members 4 has its first bonding interface 4
a is set on the intermediate holding member support member 116 such that a is in contact with the positioning pin 116b and the second adhesive interface 4b is in contact with the bottom of the fitting groove 116a. Here, the interval and the groove width of each of the fitting grooves 116a and the interval of each of the positioning pins 116b are determined in a state where each of the intermediate holding members 4 is set on the intermediate holding member supporting member 116. The arrangement of the intermediate holding members 4 is set so as to be substantially the same as the mounting position of each intermediate holding member 4 with respect to the head support 3 and the head 2. Accordingly, each of the intermediate holding members 4 by the intermediate holding member holding mechanism 401 and the intermediate holding member position adjusting mechanism 402 described later.
Is simplified, and the configuration and control of the intermediate holding member holding mechanism 401 and the intermediate holding member position adjusting mechanism 402 are simplified.

The component mounting jig 100 includes two stays 114 and a bottom plate 113, as shown in FIGS.
The component mounting jig 100 has a configuration in which the upper part is opened.
These components can be assembled from above the component mounting jig 100, respectively. This makes it possible to speed up the operation of setting the components and the operation of detaching the assembled head unit 1 and improve the degree of freedom in the layout of the nozzle hole position measurement / fixing unit 600. Further, the bottom plate 113 of the component mounting jig 100 is provided with the head support member 11.
An opening 113a is formed in the lower part of the head support 5 so that the head holding means 501 described later can enter the inside of the back side of the head support 3 (see FIG. 3). As described above, by gripping the head 2 from the back side of the head support 3 by the head gripping means 501, the nozzle hole position measuring / fixing unit 600 disposed above the head support 3 is held. The degree of freedom in layout can be further improved, and the size and strength of the head unit 1 can be reduced. That is, when the head 2 is assembled to the head support 3 from above the head support 3, the head mounting opening 3d of the head support 3 (see FIG. 4).
Must be larger than the size of the head base 2e of the head 2. Therefore, in this case, the span of the head holding wall 3a of the head support 3 becomes large,
As the size of the head support 3 increases, the holding strength of the head holding wall 3a of the head 2 decreases.

As described above, the component mounting jig 10
After setting each component of the head unit 1 to 0, step S3 in FIG. 5 is executed, and two start switches SW1 and SW2 for starting the transfer of the component mounting jig 100 by the operator are substantially simultaneously operated. It is determined whether the switch has been turned on. These two start switches SW1,
SW2 is ON unless the operator operates with both hands
As shown in FIG. 3, the components are set in the vicinity of the component setting parts A and B at both ends of the component setting stage 201 at an appropriate distance. Thereby, when the component mounting jig 100 starts the transfer operation, the danger of the operator's hand being accidentally entangled in the movable part thereof is avoided.

When any one of the two start switches SW1 and SW2 of each of the component setting parts A and B is turned on substantially simultaneously, the component mounting jig transfer mechanism for transferring the component mounting jig 100 is performed. Of the two jig transfer cylinders 204a and 204b of 202, the jig transfer cylinder 204a of the corresponding part set part (here, for convenience of explanation, the part set part A on the left side of FIG. 3) is turned on. (Step S4).

Each of the above jig transfer cylinders 204a, 204
Reference numerals 4b denote air cylinders, respectively, and are disposed on the cylinder guide shaft 205 shown in FIGS. The cylinder guide shaft 20
5 is a pair of support brackets 206 attached to the lower part of both sides of the component set stage 201,
It is supported in parallel with the component setting stage 201.
Also, the jig transfer cylinders 204a, 204b
The above-mentioned parts mounting jig 1
Each jig mounting table 207a for positioning and mounting 00,
Each is fixed to the lower part of 207b via a cylinder bracket 208.

Here, the jig mounting tables 207a, 2
Reference numeral 07b is configured to place the component mounting jig 100 having the same configuration. Here, for convenience of explanation, only the jig mounting table 207a located on the left side of the component setting site A in FIG. 3 will be described. As shown in FIGS. 3 and 7, four sides of the bottom plate 113 of the component mounting jig 100 can be mounted on the upper surface of the jig mounting table 207a at a substantially central portion of the upper surface of the jig mounting table 207a. In addition, a jig elevator 209 of a component mounting jig elevator mechanism 203 described later.
A relatively large opening 207c through which a hole 207 penetrates is formed. A jig mounting plate 210 made of an acrylic plate is attached around the opening 207c. Thus, the mounting surface of the component mounting jig 100 is configured to be slightly higher than the upper surface of the jig mounting table 207a. Also, five jig positioning members formed in a crank shape for positioning the component mounting jig 100 are provided on the three front, rear, and left sides of the jig mounting plate 210 in FIG. 211 is the bottom plate 11 of the component mounting jig 100.
3 are fixed to the upper surface of the jig mounting table 207a so as to be in contact with the three side surfaces. Further, two jig mounting guide rails 21 laid on the component setting stage 201 are provided at four corners on the lower surface of the jig mounting base 207a.
Rail guides 213 that are slidably fitted to 2 are provided respectively. The two jig placing table guide rails 212 are arranged in parallel with the cylinder guide shaft 205. Further, a jig pressing member 214 for preventing blind movement due to inertia of the component mounting jig 100 when the jig mounting table 207a moves and stops is provided on the right side of the jig mounting table 207a. Have been.

By the component mounting jig transfer mechanism 202 configured as described above, the O of the jig transfer cylinder 204a is
N (step S4), the jig mounting table 207a
Is moved from the component setting part A to the jig elevating part C in FIG. Then, a cylinder bracket 208 of the jig transfer cylinder 204a is connected to a cylinder stop member 215 provided at a substantially central portion of the component set stage 201.
The jig transfer cylinder 204a
Is stopped. The movement stop position of the jig transfer cylinder 204a is set at substantially the center of the opening 207c of the jig mounting table 207a when the jig transfer cylinder 204a is stopped. The elevating platform 209 is set to face.

Thus, the component mounting jig 100
Is transferred to the jig elevating and lowering portion C substantially at the center of the component setting stage 201 and is stopped. First, the pressing of the component mounting jig 100 by the jig pressing member 214 driven by the air cylinder is released. Is done. Next, the jig elevating cylinder 216 for elevating the jig elevating table 209 of the component mounting jig elevating mechanism 203 is turned on (step S5), and the jig elevating table 209 is raised. The jig elevating cylinder 216 is formed of an air cylinder.
It is configured to move up and down the elevating table support 217 which is a support of the system 09. As shown in FIGS. 3 and 7, the jig elevating cylinder 216
1 is disposed on a cylinder support plate 218 attached via a cylinder stay 218 to a lower surface of the cylinder support plate 218.

When the jig lift cylinder 216 is turned on and the jig lift 209 is raised, the jig lift 209 is moved upward.
The jig positioning pin 220 provided on the upper surface of the jig fits into the elevating positioning hole 221 formed in the bottom plate 113 of the component mounting jig 100, and the component mounting jig 100 is mounted on the jig elevating table 209. Positioned. Then, as the jig elevating table 209 is further raised, the jig elevating portion C of the component setting stage 201 is mounted on the jig mounting table 207a.
The component mounting jig 100 transferred to the jig elevator 20
9 and is lifted to the jig elevating portion D of the component assembly stage 301 provided above the component set stage 201, as shown in FIG.

As shown in FIG. 3 and FIG. 8, the component mounting jig 10
0 and a length from a jig elevating part D where the component mounting jig 100 is raised and lowered to a component assembling part E where each component of the head unit 1 is assembled. A relatively large opening 301a is formed. In addition, the component mounting jig 100 is provided on both sides in the longitudinal direction of the opening 301a on the upper surface of the component assembling stage 301 in a direction orthogonal to the direction in which the component mounting jig 100 is transferred on the component set stage 201. Two parallel jig positioning guide rails 305 for guiding the jig positioning unit 300 are laid.

Each jig positioning guide rail 305
The component mounting jig gripping mechanism 3 for gripping the component mounting jig 100 raised on the component assembly stage 301 is described below.
The jig gripping base 306 on which the No. 02 is assembled is mounted on the rail guide 3 attached to the four corners on the lower surface of the jig gripping base 306.
07, it is mounted so as to be able to reciprocate freely. The jig holding table 306 is formed in a channel shape surrounding the elevating path of the component mounting jig 100. Also,
The component mounting jig holding mechanism 302 assembled to the jig holding base 306 is provided with a fixed jig holding member 308 fixed to the inner side of the jig holding base 306 and a front side of the jig holding base 306. And a movable jig holding member 308 provided.

The fixed gripping member 308 is fitted into two gripping holes 118a (see FIG. 7) provided in the gripping member 118 attached to the back side plate 101 of the component mounting jig 100. Two jig holding pins 310 to be combined
Has been planted. In addition, the movable jig holding member 309
Is provided with one jig gripping pin 311 that fits into one gripped hole 119a provided in the gripped member 119 attached to the side plate 103 on the front side of the component mounting jig 100. ing. In addition, the movable jig holding member 309
Is configured to move in a direction to advance and retreat with respect to the fixing jig holding member 308 by a jig holding cylinder 312 formed of an air cylinder. Here, the movable jig holding member 309 is in a flat position, and is retracted to the front side of the jig holding table 306 so that the jig holding pin 311 does not protrude into the elevating path of the component mounting jig 100. Are waiting for you. Further, in a state where the movable jig holding member 309 is in a standby position at the retracted position, each jig holding pin 310 of the fixed jig holding member 308 and the jig holding pin 311 of the movable jig holding member 309 are An opening 306a of the jig holding table 306 is formed so as to reach a position retracted from the elevation path of the component mounting jig 100, respectively.

Then, as described above, step S in FIG.
5 is executed, and the jig lifting cylinder 216 is turned on, the jig lifting table 209 causes the predetermined jig elevating portion D on the component assembling stage 301, that is, each of the above components of the component mounting jig 100. Holes 118a and 119a to be gripped
On the other hand, the component mounting jig 100 is lifted to a position where the jig gripping pins 310 and 311 face each other and stopped. In this way, when the component mounting jig 100 rises to the predetermined jig elevating portion D on the component assembling stage 301 and stops, step S6 in FIG. 5 is executed, and the jig holding cylinder 312 is turned on. Is done.

When the jig holding cylinder 312 is turned on, the movable jig holding member 309 is moved in a direction approaching the fixed jig holding member 308. Thereby, each of the gripped holes 118a of the component mounting jig 100,
The jig gripping pins 310 and 311 of the movable jig gripping member 309 and the fixed jig gripping member 308 are fitted to 119a, and the component mounting jig 100 is moved to the jig gripping base 30.
6. In this way, the jig holding table 306
When the gripping of the component mounting jig 100 is completed, the step S7 of FIG. The jig gripper drive motor 313 of the position adjusting mechanism 303 is turned on.

The jig gripper drive motor 313 is configured to rotate the ball screw 314 forward and reverse via a reduction gear (not shown) (see FIG. 8). The ball screw 314 is screwed with a ball nut 315 having a built-in steel ball fitted into the screw groove. The ball nut 315 is fixed on the jig holder 306 via a channel-shaped holder bracket 316. The jig gripper drive motor 313 and the ball screw 314 are, as shown in FIG. 3 and FIG. Supporting member 317 (the front side is not shown)
And bearing members 319 fixed to the front and back ends of a support plate 318 fixed between the upper surfaces of the support members 317, respectively.

Thus, as described above, step S7 of FIG. 5 is executed, and the jig gripper driving motor 313 is turned off.
N, when the ball screw 314 is rotated forward, the jig holding table 306 is moved to the jig positioning guide rail 30.
5 is moved to the inner side of the component assembly stage 301. Then, by the movement of the jig holding table 306,
The component mounting jig 100 held by the jig holding table 306
Is moved from the jig elevating portion D of the component assembling stage 301 to the component assembling portion E. The movement position of the jig holding table 306 is determined by the amount of movement of the linear scale 320 fixed on the jig holding table 306.
The scale is measured by the scale measuring unit 321 fixed above, and based on the measured value of the scale measuring unit 321, the jig gripper driving motor 313 is turned on / off by the control / arithmetic device 700 to be extremely accurate. Is managed.

In this manner, as shown in step S8 of FIG. 5, it is determined whether or not the jig holding table 306 has been moved to a predetermined component assembly site E.
Is moved to the predetermined component assembly site E, the jig gripper drive motor 313 is turned off (step S9).
As a result, the component mounting jig 100 held by the jig holding table 306 is fixed to a predetermined component assembly site E. Then, when the head 2, the head support 3, and the intermediate holding member 4 supported by the component mounting jig 100 reach respective predetermined assembly start sites, first, step S1 in FIG.
0, the Z-axis movement position adjustment motor ZM of the head position adjustment mechanism 502 is turned on.

This Z-axis movement position adjusting motor ZM is provided in FIG.
As shown in FIG.
The Z-axis moving table 510 is configured to move up and down along the axial direction. The Z-axis moving position adjusting motor ZM moves the Y-axis moving position along the X-axis direction parallel to the moving direction of the jig holding table 306 and the Y-axis direction orthogonal to the Z-axis direction. It is fixed to a Y-axis moving base 511 that is moved by the adjustment motor YM. Further, the Y-axis moving position adjusting motor YM
It is fixed to an X-axis moving base 512 which is moved by an axis moving position adjusting motor XM. The X-axis movement position adjustment motor XM is rotated in the γ direction by the Z-axis rotation position adjustment motor ZRM about the Z axis as a rotation center.
It is fixed to the shaft turntable 513. Further, an X-axis rotation position adjustment motor XRM for rotating the X-axis rotation table 514 in the α direction about the X-axis as a rotation center is fixed to the Z-axis movement table 510. The X-axis rotation table 514 rotated in the α direction by the X-axis rotation position adjustment motor XRM has a Y-axis rotation position for rotating the Y-axis rotation table 515 in the β direction around the Y axis. The adjustment motor YRM is fixed.

Further, the Y-axis rotation position adjusting motor YRM
The gripping arm support 50 as the head gripping means 501 is provided on the Y-axis turntable 514 which is rotated in the β direction.
3 and two head holding cylinders 504 and 505 are provided side by side. Each head holding cylinder 504, 505
As shown in FIG. 9, each of the head gripping arms 507, 508 fixed to the upper surface is formed by an air cylinder, and each of the head gripping arms 507, 508 is moved in the Y-axis orthogonal to the moving direction of the jig gripping base 306. It is comprised so that it may each reciprocate along a direction. Each of the above-described head gripping arms 507,
508 so as to face each other.
6 is fixed.

As a result, when step S10 in FIG. 5 is executed and the Z-axis moving position adjusting motor ZM of the head position adjusting mechanism 502 is turned on, the Z-axis moving table 510 is set.
Is raised. Then, it is determined in step S11 in FIG. 5 whether or not each of the head gripping arms 506, 507, and 508 of the head gripping means 501 has risen to a predetermined head gripping position due to the elevation of the Z-axis moving table 510. . Then, each head gripping arm 506, 507, 50
8 reaches a predetermined head gripping position, the Z-axis moving position adjusting motor ZM is turned off, and the Z-axis moving table 5 is turned off.
10 is stopped (step S12). Here, the head gripping position is, as shown in FIGS. 9 and 10A, each head gripping arm 506, 507, 50.
8, head holding pins 506a, 507a, 508a planted facing each other are drilled on both sides of the head base 2e supported on the head supporting member 115 of the component mounting jig 100. Head holding hole 2f
(One is not shown).

As described above, each head grip arm 50
When 6, 507 and 508 reach a predetermined head gripping position and the Z-axis movement position adjustment motor ZM is turned off, first, the Y-axis movement position adjustment motor YM is turned on (step S13). Thereby, as shown in FIG. 10A, the head gripping arm 506 is moved in a direction approaching the head base 2e supported on the head support member 115 of the component mounting jig 100. Then, as shown in FIG. 10B, when the head gripping pin 506a of the head gripping arm 506 is fitted into the head gripping hole 2f of the head base 2e (step S14), the above Y
The axis movement position adjustment motor YM is turned off (step S
15). Next, step S16 in FIG. 5 is executed,
Each of the head holding cylinders 504 and 505 is turned on. As a result, as shown in FIG. 10B, the head gripping arms 507 and 508 are moved in a direction approaching the head base 2e, and as shown in FIG. 508 head holding pin 50
7a and 508a are fitted into the other head holding holes 2f of the head base 2e.

In this manner, the head holding pins 507a, 508a of the head holding arms 507, 508 described above are used.
As a result, the head support member 11 of the component mounting jig 100 is
When the head base 2e of the head 2 supported on the head 5 is gripped, the step S17 in FIG. 5 is executed, and the Z-axis movement position adjusting motor ZM is turned on again. When the Z-axis movement position adjusting motor ZM is turned on, the head gripping arms 506, 507, and 508 of the head gripping means 501 are raised together with the Z-axis movement table 510 to a predetermined head assembly position (see FIG. 3). . Then, in step S18 of FIG.
07 and 508 are determined to have reached the predetermined head assembly position, the Z-axis movement position adjustment motor ZM is turned off.
F, the ascent of the Z-axis movable base 510 is stopped (step S19).

Next, step S20 in FIG. 6 is executed, and the nozzle hole position measuring means 602 is turned on. The nozzle hole position measuring means 602 is a nozzle hole (hereinafter, referred to as a “nozzle hole”) of a predetermined portion of the head 2.
2b) in the X-, Y-, and Z-axis directions, and measures the position of the head holding means 5 with respect to the head support 3 held by the head support holding portion of the component mounting jig 100.
In step 01, it is measured whether or not the head surface 2d of the head 2 raised to a predetermined head assembling position faces an accurate assembling position.

Here, the conventional nozzle hole position measuring means is:
The nozzle hole 2b formed in the head surface 2d is imaged from a direction perpendicular to the head surface 2d of the head 2 by a CCD camera equipped with a solid-state imaging device (CCD), and an image of the nozzle hole 2b is taken. The position of the center of gravity of the head 2 is calculated by the calculation unit, and the position of the head 2 in the X-axis and Y-axis directions is measured.
The control / arithmetic unit 700 calculates the position in the Z-axis direction based on output data on the amount of defocus in the Z-axis direction from an autofocus device built in the CCD camera, and measures the position in the Z-axis direction. Was.

However, in the conventional nozzle hole position measuring means, when the head 2 is positioned by focusing on one nozzle hole 2b on the head surface 2d of the head 2, the one nozzle The position of the hole 2b in the X, Y, and Z axis directions can be accurately positioned.
The head surface 2d starting from the position of the two nozzle holes 2b
It is not possible to accurately measure the displacement of the other nozzle hole 2b due to the surface tilting or rotation of the nozzle hole 2b.

For this reason, the conventional nozzle hole position measuring means corrects the positional deviation of the other nozzle hole 2b due to the tilting or rotation of the head surface 2d based on the position of the one nozzle hole 2b. Operation becomes extremely difficult. Therefore, in the conventional method for measuring the position of the nozzle hole 2b by the nozzle hole position measuring means, the positioning of the head 2 requires a lot of time and complicated arithmetic processing, so that the head assembly can be speeded up. Also, it has been difficult to simplify the measuring means for measuring the position of the nozzle hole.

Therefore, in the head unit assembling apparatus according to the present embodiment, as described above, the position of the head 2 can be adjusted with respect to the head support 3 by the head gripping means 501 and the head position adjusting mechanism 502. In this state, the holding posture of the head 2 is changed, and three points specified in advance of the head 2 are detected by a CCD camera, so that the position of the mounting position of the head 2 with respect to the head support 3 is adjusted. I do. Further, in the head unit assembling apparatus according to the present embodiment, 3
Each CCD camera is arranged such that the detection optical axes of at least three CCD cameras for detecting points are respectively inclined with respect to the detected plane (head surface 2d) of the head 2.

That is, the nozzle hole position measuring means 602 of the head unit assembling apparatus according to the present embodiment
As shown in FIGS. 3 and 11, the head surface 2d of the head 2
1 of the two rows of nozzle holes 2b drilled in FIG.
1, the nozzle hole 2b located at the left end of the row on the near side
The CCD camera 601a for detecting the position of the nozzle hole 2b-1 from the vertical direction, the CCD camera 601b for detecting the position of the nozzle hole 2b-1 from the vertical direction, and the halogen light output by the nozzle hole illumination light source 604. The nozzle hole 2b
And a CCD camera 601c for detecting the position of the nozzle hole 2b-2 located at the right end of the front row in FIG. A CCD camera 601d for detecting the position of the nozzle hole 2b-2 from a vertical direction via a mirror 606a, and a halogen light guide 603b for guiding the halogen light to illuminate the nozzle hole 2b-2. 11, a CCD camera 601e for detecting the position of the nozzle hole 2b-3 located at the center of the back row from the tilt direction via the mirror 606b;
The halogen light is supplied to the nozzle hole 2b through a mirror 606c.
-3b for illuminating -3. As shown in FIG. 3, the nozzle hole position measuring means 602 having the above-described structure is connected to the component assembling stage 301 through a plurality of columns 330.
The top plate 331 is integrated with a support plate 610 attached so as to hang down through an opening 331a substantially at the center of the top plate 331.

As described above, each C with the detection optical axis tilted
By using the CD cameras 601a, 601b, and 601c to detect the nozzle holes 2b-1, 2b-2, and 2b-3 as three points specified in advance on the head surface 2d of the head 2, the nozzle holes 2b The position on each of the X, Y, and Z coordinates of -1, 2b-2, and 2b-3 can be determined. Therefore, the nozzle hole position measuring means 60
In No. 2, when the position of the head 2 is measured in the Z-axis direction, it is not necessary to use the above-described autofocus device.

Further, in the nozzle hole position measuring means 602, as described above, the nozzle hole 2b formed in the head surface 2d of the head 2 is used as a detected portion of each CCD camera. However, such a C
The position of an image receiving surface of a solid-state image pickup device, such as a component having no existing detected portion that can be used as a detected portion of a CD camera, is determined by the nozzle hole position measuring means 6.
For example, when measuring at 02, a detection mark as a detected portion of the CCD camera is formed on the component in advance.

As described above, at least three C
When three previously specified points on the head surface 2d of the head 2 are detected using a CD camera, when the detection optical axes of the respective CCD cameras are arranged perpendicular to the head surface 2d, Since the detection optical axes of the CCD cameras are parallel to each other, the distance between the detection optical axes of the CCD cameras is automatically determined by the outer diameter of each CCD camera. Therefore, in such a method for detecting the position of the head 2, the head 2 to be assembled is relatively small, and the maximum distance between the three points on the head surface 2d is smaller than the minimum distance between the respective detection optical axes of the CCD camera. When the distance is smaller than the separation distance, the respective detection optical axes of the CCD camera are located outside three points of the head surface 2d.
The D camera cannot detect three points on the head surface 2d. On the other hand, in the component assembling method according to the present embodiment, at least three CCD cameras 601a and 601 for detecting the three points on the head surface 2d.
b, 601c is the head surface 2d of the head 2
, The respective detection optical axes can be set in arbitrary directions different from each other. Therefore, in the component assembling method according to the present embodiment, the minimum separation distance of any three points that can be detected by each CCD camera is not automatically determined by the outer diameter of each CCD camera. Regardless of the size of the head 2, any three points on the head 2 can be detected and positioned accurately.

On the other hand, each of the above-mentioned CCD cameras 601a, 601
01b, 601c, 601d, and 601e, image data of the nozzle holes 2b-1, 2b-2, and 2b-3 are displayed on the CRT screen of a personal computer as a sub-controller by the control / arithmetic device 700. Output and monitored. Here, if the position and shape of the monitor image are different from the positions and shapes of the nozzle holes 2b set in advance, the position of the head surface 2d of the head 2 is correctly assembled in step S21 in FIG. It is determined that it is not at the position, and the head position adjusting mechanism 502 shown in FIG. 9 is turned on (step S2).
2). As a result, each motor of the head position adjusting mechanism 502 is driven, and the above-described X, Y, Z, α, γ, β
The head 2 is adjusted and moved in the axial direction. Then, as a result of the six-axis movement adjustment of the head 2, as shown in step S2 in FIG.
In 1, when it is determined that the position of the head surface 2 d of the head 2 faces the correct assembling position, the nozzle hole position measuring means 602 and the head position adjusting mechanism 502 are turned off (step S 23). .

In this way, the component mounting jig 100
When the head 2 is positioned at a predetermined assembly position with respect to the head support 3 held at a predetermined portion of FIG.
The intermediate holding member position adjusting mechanism 402 of the intermediate holding member mounting unit 400 shown in FIG.
The intermediate holding member holding mechanism 401 is driven. As shown in FIGS. 3 and 12, this intermediate holding member holding mechanism 401 simultaneously holds four intermediate holding members 4 necessary for bonding and fixing one head 2 to the head support 3 at the same time. Two air chucks 4 that can be held
05 and 406.

Each of these air chucks 405 and 406
In the home position, as shown in FIG. 3, the intermediate holding member support member 1 of the component mounting jig 100
The front end of the chuck arm 407 is positioned on the two fitting grooves 116a (see FIG. 4) for setting the four intermediate holding members 4 on the upper surface of the chuck arm 407 so as to face almost directly above. Respectively. As shown in FIG. 12, each of the air chucks 405 and 406 is provided with a respective positioning pin 116b implanted in the two fitting grooves 116a.
In order that the two intermediate holding members 4 positioned between them can be held while substantially maintaining their respective postures at the time of setting,
Each holding part (lower end) is formed in a rectangular shape. Air holes 405a and 406a for sucking and blowing air are provided on the lower surface and both side surfaces of the holding portions of the air chucks 405 and 406, respectively.

A rotary shaft 407a along the Y-axis direction is fixed to the base of the chuck arm 407.
The rotating shaft 407a is rotatably supported by a chuck bracket 408 arranged on the base side of the chuck arm 407 so as to be able to rotate substantially 180 degrees. The chuck bracket 408 is held by a chuck lifting / lowering cylinder 409 formed of an air cylinder so as to move up and down along the Z-axis direction. Further, as shown in FIG. 3, the chuck elevating cylinder 409 is provided with a fixing plate 410 fixed to the back side on the component assembling stage 301.
The robot 411 attached to the
It is configured to reciprocate along the axial direction. Also, the rotation shaft 4 at the base of the chuck arm 407
07a is configured to be rotationally driven by a chuck rotating cylinder 412 formed of a rotary air cylinder fixed to the chuck bracket 408.

As a result, step S24 is executed, and when the intermediate holding member position adjusting mechanism 402 is turned on,
First, the chuck lifting cylinder 409 is operated, and the chuck bracket 408 is lowered along the Z-axis direction. By the lowering of the chuck bracket 408,
As shown by an arrow a in FIG.
05, 406 is the intermediate holding member support member 1
Then, it is lowered to a position where it can hold each of the two intermediate holding members 4 set on 16. Each air chuck 40
The lower position of the chuck lifting cylinder 4
09 with respect to the lower stopper 409 a fixed to the lower part of the chuck bracket 408.
8a is determined by the contact position.

In this manner, each of the air chucks 4
When the holding portions 05 and 406 are lowered to a position where the intermediate holding member 4 can be held, the air holes 405 of the holding portions are lowered.
Air is sucked through the holes a and 406a. As a result, a negative pressure is generated around each of the holding portions of the air chucks 405 and 406, and each of the holding portions of each of the air chucks 405 and 406 has two intermediate holding members 4 (total of four).
Is held by suction.

Next, the chuck elevating cylinder 409
Of the chuck bracket 40 by the operation of
8 is raised by a predetermined amount, the chuck rotating cylinder 412 operates, and as shown by an arrow b in FIG.
The rotation shaft 407a is rotated by approximately 180 degrees. After this,
The chuck elevating cylinder 409 is further operated in the reverse direction, and the positioning piece 408 of the chuck bracket 408 is moved.
until a contacts the upper stopper 409b fixed to the upper part of the chuck lifting cylinder 409.
As shown by the arrow c in FIG. 12, the chuck bracket 408 is raised. As a result, the top and bottom sides of the holding portions of the air chucks 405 and 406 are inverted, and the top and bottom sides of the holding portions of the air chucks 405 and 406 are inverted. The bonding interfaces 4a, 4b of the intermediate holding members 4 described above
Faces.

On the other hand, the intermediate holding member position adjusting mechanism 40
Above the air chuck 405, the adhesive applying means 403 for applying the UV adhesive to the adhesive interfaces 4a and 4b of the intermediate holding members 4 described above.
Two syringes 431 each having a pair of application nozzles 430 are provided. Further, around the two syringes 431, the adhesive application amount adjusting means 404 is provided.
The heater 432 is provided so that the UV adhesive is maintained at a predetermined temperature (here, about 30 ° C.) at which the UV adhesive exhibits an optimum viscosity.

Each syringe 431 is fixed to a syringe bracket 436 by a syringe holder 435 as shown in FIG. Further, the syringe bracket 436 is slidably held in the Y-axis direction by a bracket holder 437 attached to the lower surface of the top plate 331. As a result, by holding the drawer lever 438 attached to the syringe bracket 406, each of the syringes 431 is moved to the position shown in FIG.
It can be pulled out to the left end side of the device body shown in
The operation of replenishing the syringe 431 with the UV adhesive is facilitated, and the risk of burns due to contact with the heater 432 during the replenishment operation is reduced.

With such a configuration, as described above, the top and bottom of each of the intermediate holding members 4 sucked and held by the respective holding portions of each of the air chucks 405 and 406 are inverted, and the respective air chucks 405 and 406 are turned over. When the bonding interfaces 4a and 4b of the intermediate holding members 4 described above reach the upper surface and both side surfaces of the holding unit, as shown in FIG. The two intermediate holding members 4 held by the holding portion of the air chuck 405 face the bonding interfaces 4a and 4b, respectively.

Thereafter, step S25 in FIG. 6 is executed, the adhesive application means 403 is turned on, and the pair of application nozzles 430 of the two syringes 431 are held by the holding section of the air chuck 405. A UV adhesive is applied to each of the bonding interfaces 4a and 4b of the two intermediate holding members 4 thus formed. And this air chuck 405
When the application of the UV adhesive to the bonding interfaces 4a and 4b of the two intermediate holding members 4 held by the holding portions is completed, the robot 411 causes the air chuck 406 located on the left side in FIG. Is moved to the position of the air touch 405 located on the right side. As a result, each of the bonding interfaces 4 of the intermediate holding members 4 sucked and held on the upper surface side and both side surfaces of the holding portion of the air chuck 406.
a and 4b face the pair of application nozzles 430 of the syringes 431, respectively. In this state, the adhesive application unit 403 is turned on again, and the pair of application nozzles 430 of the two syringes 431 are used to turn on each of the two intermediate holding members 4 held by the holding unit of the air chuck 406. A UV adhesive is applied to the bonding interfaces 4a and 4b.

When the application of the UV adhesive to the intermediate holding members 4 is completed as described above, the air chucks 405 and 406 are returned to the home positions, and the robot 411 is returned to the home position. As a result, the head is moved above a predetermined assembly site between the head 2 and the head support 3 positioned at a predetermined assembly position of the component mounting jig 100. In this way,
When the air chucks 405 and 406 reach above a predetermined assembly site, the chuck lifting cylinder 4
By the operation of 09, each of the air chucks 405 and 406 is respectively lowered. As a result, the four intermediate holding members 4 sucked and held by the holding portions of the air chucks 405 and 406 are moved between the head 2 and the head support 3 as shown in FIG. It faces a predetermined assembly position. Then, in this state, the air chuck 405,
Air is injected from the air holes 405a and 406a of the holding unit 406. As a result, as shown in FIG. 13B, the bonding interfaces 4a and 4b of the intermediate holding members 4 held by the holding portions of the air chucks 405 and 406, respectively.
Are adhered to the respective bonding portions of the head 2 and the head support 3. Then, the above air chucks 4
05, 406 are returned to the home position,
The operation of the intermediate holding member position adjusting mechanism 402 is stopped (Step S26).

In this way, each of the intermediate holding members 4 is transferred to a predetermined assembling position, and each of the bonding interfaces 4a, 4
When b is brought into close contact with the respective bonding portions of the head 2 and the head support 3, step S27 in FIG. 6 is executed, and the head fixing unit is turned on. By turning on the head fixing unit, the Y of each of the air chucks 405 and 406 is turned on.
The pair of UV light guides 605 that have been waiting outside the moving path to open the moving path in the axial direction,
As shown in FIG. 14, the operation of the UV light guide cylinder 620 including an air cylinder causes the head to approach the upper part of the head 2.

Then, as described above, each UV light guide 6
05 is protruding above the head 2 and the U
The V light source 606 is turned on, and the above-mentioned UV light guides 605 are set.
As a result, the UV light from the UV light source 6
06 UV light is applied. By irradiation of this UV light,
The UV adhesive is solidified, and the head 2 and the head support 3 are bonded and fixed to each other via the intermediate holding members 4. In addition, above each of the UV light guides 605,
A blower pipe 621 that discharges air (preferably cool air) toward each intermediate holding member 4 at the time of irradiation with the UV light is integrally attached by an attachment member 622.
The air discharged from the blower tube 621 causes the UV
Overheating deformation of each intermediate holding member 4 due to light irradiation is prevented, and displacement of the head 2 and the head support 3 due to thermal stress is prevented.

When the assembly of one head 2 to the head support 3 is completed, it is determined whether the next head 2 is to be assembled (step S28). here,
For example, if it is programmed to sequentially assemble the remaining heads 2, a head assembly routine previously set to execute a series of head unit assembling steps as described above is executed for a predetermined number of heads. It is repeatedly executed until the assembly is completed (step S29). In this head assembling routine, the position adjustment data at the time of adjusting the position of the head 2 assembled immediately before with respect to the head support 3 is set to be referred to as the position adjustment data at the time of assembling the head 2 to be assembled next. ing. When the above-described head assembling routine is executed a predetermined number of times and the assembling of the predetermined number of heads 2 onto the head support 3 is completed, it is concluded in step S28 in FIG. 6 that the next head 2 is not to be assembled. Then, the return operation of each unit described above is started (step S30).

At this time, in the head unit assembling apparatus according to the present embodiment, the nozzle hole position measuring means 602 is turned on again (Step S31) at the start of the return operation of each unit, and each of the assembled units is completed. The positions of the three nozzle holes on the head surface 2d of the head 2 are measured again. This makes it possible to know from the detection result of the nozzle hole position measuring means 602 whether or not each head 2 has been displaced before and after assembly of each head 2. Therefore, the results of detection by the nozzle hole position measuring means 602 before and after assembling the head 2 are compared by the control / arithmetic device 700, and the nozzle hole position measuring means 6 is compared.
02, that is, the result of the pass / fail judgment of the assembled head 2 is output to the CRT (step S32). Thereafter, an operation substantially opposite to the above-described assembling operation is performed, and when it is confirmed that each unit has returned to the home position (step S33), the program is stopped.

[0090]

According to the first to ninth aspects of the present invention, the holding posture of the component held in a position-adjustable manner with respect to the component supporter positioned and held at a predetermined assembly position can be varied. Since the previously specified three points of the part are detected, there is an excellent effect that the position of the part in space can be accurately detected and the position can be adjusted very accurately.

In particular, according to the second aspect of the present invention, when assembling a plurality of identical parts side by side under the same assembling conditions with respect to the part support, the position of the part assembled immediately before with respect to the part support. Since the position adjustment data at the time of adjustment is referred to as position adjustment data at the time of assembling a component to be assembled next, there is an excellent effect that the time required for the position adjustment at the time of assembling a subsequent component can be reduced.

According to the third aspect of the present invention, the detection optical axes of at least three optical detection means for detecting the three points of the component are respectively inclined with respect to the detected plane of the component. Therefore, the positions of the three points on the X, Y, and Z coordinates can be determined without using an autofocus device or the like. In addition, since the position of the detection optical axis of each of the detection means can be set freely, the minimum separation distance of any three points that can be detected by the detection means is:
It is not automatically determined by the outer diameter of each detecting means, and it is possible to detect any three points of the part and accurately position the part regardless of the size. There is an excellent effect that it can be done.

According to the fourth aspect of the present invention, prior to adjusting the position of the component, the intermediate holding member, to which the adhesive has been applied, may be attached to the part contacting the component and the component support. Since it is installed, the adhesive applied to the intermediate holding member can be diffused along the applied surface by a relative operation between the component and the intermediate holding member at the time of adjusting the assembly position of the component. And has an excellent effect that the layer thickness of the adhesive can be equalized.

According to the fifth aspect of the present invention, as the adhesive applied to the intermediate holding member, a photo-curable adhesive having a property of being solidified by light irradiation is used, and after the position of the assembling position of the component is adjusted. By irradiating the adhesive with light, the adhesive is solidified, so that the adhesive does not solidify during the adjustment of the assembly position of the component, and the assembly position adjustment is incomplete. There is an excellent effect that it is possible to avoid a problem that the part is fixed as it is.

According to the sixth aspect of the present invention, the intermediate holding member is formed of a light transmitting material, and the adhesive is irradiated with light through the intermediate holding member to solidify the adhesive. There is an excellent effect that the range of light irradiation on the adhesive can be expanded and the solidification time of the adhesive can be shortened.

According to the seventh aspect of the present invention, the component holding posture is varied by the component holding means so that the three points specified in advance of the component are detected by the component position detecting means. Accordingly, there is an excellent effect that it is possible to provide a component assembling apparatus capable of extremely accurately adjusting the position of assembling the component with respect to the component support.

According to the eighth aspect of the present invention, existing nozzle holes formed on the head surface of the ink jet head are
Since it is used as a positioning reference at the time of adjusting the positioning of the ink jet head, there is no need to provide a detected mark or the like for detecting the position of the ink jet head by the component position detecting means on the ink jet head. There is.

According to the ninth aspect of the present invention, the component position after the completion of assembly is detected by using the component position detecting means for detecting the assembling position at the time of assembling the component. There is an excellent effect that the quality of the part can be determined very easily and accurately during a series of assembly steps for the part without providing a new inspection step.

[Brief description of the drawings]

FIG. 1 is an exemplary perspective view showing the appearance of a head unit assembled by a head unit assembling apparatus according to an embodiment;

FIG. 2 is a block diagram showing an overall configuration of the head unit assembling apparatus.

FIG. 3 is a schematic front view showing the overall configuration of the head unit assembling apparatus.

FIG. 4 is a perspective view showing a schematic configuration of a component of the head unit and a component mounting jig for supporting the component at a predetermined assembly site.

FIG. 5 is a flowchart of the first half showing an example of an operation program of the head unit assembling apparatus.

FIG. 6 is a flowchart of a second half showing an example of an operation program of the head unit assembling apparatus.

FIG. 7 is a perspective view showing a schematic configuration in a state where the component mounting jig is positioned at a component setting portion of a component setting stage of the head unit assembling apparatus.

FIG. 8 is a perspective view showing a schematic configuration of a part component mounting jig positioning unit of a component assembling stage of the head unit assembling apparatus.

FIG. 9 is a perspective view showing a schematic configuration of a head position adjusting unit for adjusting a position of a head surface of the inkjet by gripping an inkjet head which is a component of the head unit.

FIGS. 10A, 10B, and 10C are schematic process diagrams illustrating a process of gripping an inkjet head by a head gripping unit of the head position adjustment unit.

FIG. 11 is a view showing a part 3 of the ink jet head specified in advance.
FIG. 3 is a perspective view showing a schematic configuration of a nozzle hole position measuring means for detecting the positions of individual nozzle holes.

FIG. 12 is a view showing a state in which an intermediate holding member as the above-mentioned component set in the above-mentioned component mounting jig is moved to a predetermined position between a head support as another component held by the above-mentioned component mounting jig and the above-mentioned ink jet head. FIG. 6 is a side view showing a schematic configuration of an intermediate holding member mounting unit for transferring the assembly to an assembly site and an adhesive applying unit for applying a UV adhesive to the intermediate holding member.

FIGS. 13A and 13B show the intermediate holding member when the intermediate holding member is transferred to a predetermined assembly site of the head support and the inkjet head by the intermediate holding member mounting unit. The principal part sectional drawing which shows the behavior of a member.

FIG. 14 is a view showing a state in which an intermediate holding member transferred to a predetermined assembly site between the head support and the ink jet head has a U-shape;
The principal part side view which shows schematic structure of the head fixing unit for irradiating V light and solidifying this UV adhesive.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Head unit 2 Ink jet head 2b Nozzle hole 2d Head surface 3 Head support 4 Intermediate holding member 400 Intermediate holding member attaching unit 403 Adhesive applying means 500 Head position adjusting unit 600 Nozzle hole position measuring / head fixing unit 601 CCD camera 602 Nozzle Hole position measuring means 603 Halogen light guide 604 Nozzle hole illumination light source 605 UV light guide 606 UV light source 700 Control / arithmetic unit

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shio Kanaya 1-3-6 Nakamagome, Ota-ku, Tokyo Inside Ricoh Co., Ltd. (72) Inventor Shunichi 1-3-6 Nakamagome, Ota-ku, Tokyo No. Inside Ricoh Company

Claims (9)

[Claims] A component assembling method for bonding and fixing a component and a component support to which the component is to be assembled with an adhesive via an intermediate holding member disposed between the component and the component support. Along with positioning and holding the component support at a predetermined assembly position, while holding the component in a position-adjustable manner relative to the component support, changing the holding posture of the component,
A method for assembling a part, comprising detecting three previously specified points of the part to adjust the position of the part with respect to the part support. 2. A component assembling method according to claim 1, wherein a plurality of identical components are juxtaposed and assembled to said component support under equal assembly conditions.
A component assembling method, wherein position adjustment data at the time of position adjustment of a component assembled immediately before with respect to the component support is referred to as position adjustment data at the time of assembly of a component to be assembled next. 3. The component assembling method according to claim 1, wherein three specified points existing on the same plane of the component are determined.
By detecting using at least three optical detection means in which the detection optical axis is inclined with respect to the plane,
A component assembling method, comprising: adjusting a mounting position of the component with respect to the component support. 4. The component assembling method according to claim 1, wherein the intermediate holding member coated with the adhesive is attached to the component and the component support before adjusting the position of the component. A component assembling method, wherein the components are installed so as to be in contact with each other. 5. The component assembling method according to claim 1, wherein a light-curable adhesive having a property of being solidified by light irradiation is used as the adhesive applied to the intermediate holding member,
A component assembling method, comprising: irradiating the adhesive with light after the position adjustment of the assembling position of the component to solidify the adhesive. 6. The component assembling method according to claim 5, wherein the intermediate holding member is formed of a light transmitting material, and the adhesive is irradiated with light through the intermediate holding member to solidify the adhesive. A part assembling method characterized by the above-mentioned. 7. A component assembling apparatus for bonding and fixing a component and a component support to which the component is assembled with an adhesive via an intermediate holding member disposed between the component and the component support. A component support holding means for positioning and holding the component support at a predetermined assembling position; and a component adjustably holding the component with respect to the component support held by the component support holding means. Component holding means, component position detection means for detecting three predetermined points of the component held by the component holding means, and the component based on the detected positions of the three points detected by the component position detection means A component assembling apparatus, comprising: component position adjusting means for adjusting a position of an assembly position of the component with respect to the component support held by the support holding means. 8. A component assembling apparatus according to claim 7, wherein said component comprises an ink jet head, and said component position detecting means comprises three nozzle holes for discharging printing ink formed on a head surface of said ink jet head. A component assembling device, comprising: at least three solid-state imaging devices that individually detect the solid-state imaging device from directions inclined with respect to the head surface. 9. The component assembling apparatus according to claim 7, wherein said component and a component support to which said component is attached are provided.
After adhesively fixing with an adhesive via an intermediate holding member arranged between the component and the component support, the component position detecting means is adhesively fixed to the component support via the intermediate holding member. A component assembling apparatus comprising: a component quality determining unit that detects the above three points of the assembled component again and determines the quality of the assembled component based on the detection result of the component position detecting unit.