JPH11205012A - High frequency circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify the attachment of a substrate in a high frequency circuit, to improve workability, to improve design accuracy and to attain stabilization of electrical characteristics by making a ground surface, where the high frequency return currents of first and second dielectric circuit parts are propagated, making then common to conductor chassises. SOLUTION: A dielectric substrate 4 provided with a microstrip conductor 3 on one side is fixed to a conductor chassis 1 by a dielectric adhesive agent 15, and the dielectric circuit part is formed. All the ground surface of first, second and third dielectric circuit parts consisting of the high frequency circuit are made common at the conductor chassis 1. Even if distortions occur on the conductor chassis due to temperature change, an atmospheric pressure change or the change of environment conditions such as vibration/impulses, the ground surface can always be kept at the same potential. In this case, since an impedance will not change, the electrical characteristics of the high frequency circuit are stabilized. The thickness of a dielectric layer 16 is set to be thin, if propagation frequency is increased.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency circuit in which a signal propagation line is constituted by a microstrip line.

[0002]

2. Description of the Related Art FIG. 9A is a mounting view showing a conventional high-frequency circuit, FIG. 9B is a plan view, and FIG.
FIG. 10B is a sectional view taken along line A91-A91, and FIG.
It is an electromagnetic field distribution figure in A92-A92 section of (b). In these figures, 1 is a conductor chassis, 2 is a conductor carrier, 3 is a microstrip conductor, 4 is a dielectric substrate, 5 is a conductor wire or a ribbon, 6 is a ground conductor,
7 is a solder or conductive adhesive, 8 is a screw, 9 is a first high-frequency circuit module, 10 is a second high-frequency circuit module, and 11 is a third high-frequency circuit module.

Next, the operation will be described. A high-frequency signal in a high-frequency circuit using the microstrip conductor 3 constituting the line is converted into an electric field through a dielectric substrate having a dielectric constant ε between the microstrip conductor 3 and the ground conductor 6 as shown in FIG. TEM (Trans
(Vertical Electromagnetic) mode propagation. The microstrip conductor 3 of the second high-frequency circuit module 10 is connected to the microstrip conductor 3 of the first high-frequency circuit module 9 and the microstrip conductor 3 of the third high-frequency circuit module 11 by a conductor wire or a conductor ribbon 5. Thus, a high-frequency signal current propagates on the microstrip conductor 3 and the conductor wire or the conductor ribbon 5. On the other hand, the ground conductor 6 of the second high-frequency circuit module 10 is connected to the ground conductor 6 of the high-frequency circuit module 9 via the solder or conductive adhesive 7, the conductor carrier 2, and the conductor chassis 1 serving as a common ground plane for the high-frequency circuit. It is connected to the ground conductor 6 of the third high-frequency circuit module 11, and a high-frequency signal return current propagates through this ground conductor 6.

[0004]

In a conventional high-frequency circuit, a high-frequency circuit module whose signal input / output terminal is a microstrip line is manufactured, each module is screwed to a conductor chassis, and the modules are connected to each other. A high frequency circuit was configured. In this case, between the conductor chassis 1 which is a common ground plane of the high-frequency circuit and the microstrip line 3 through which the high-frequency signal current propagates,
The ground conductor 6 and the conductor carrier 2 which are the conductor surfaces are present, and the ground conductor 6 and the conductor chassis 1 are maintained at the same potential by bonding with solder or a conductive adhesive and crimping with screws. As described above, in the configuration in which the ground conductor 6 of each high-frequency module is kept at the same potential as the conductor chassis 1 serving as a common ground plane of the high-frequency circuit, the back surface of the conductor carrier 2 of the module constituting the circuit and the carrier mounting portion Since the surface accuracy of the surface of the conductor chassis 1 has a limit, the conductor carrier 2 or the conductor chassis 1 is distorted due to a change in environmental conditions such as a temperature change, a pressure change, and vibration / shock, and a grounding area is changed. A potential difference is temporarily generated between the ground conductor 6 and the conductor chassis 1 serving as a common ground plane of the high-frequency circuit. In this case, since the impedance changes, phenomena such as output power fluctuation and output frequency fluctuation occur as the performance of the high frequency circuit, and the required performance may not be satisfied. In addition, due to resonance in a gap formed between the grounded conductor 6 metallized on the back surface of the substrate and the conductor carrier 2 due to poor soldering, there may be a case where characteristic deterioration such as an increase in loss that cannot be expected at the time of design is caused.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and simplifies the mounting of a board in a high-frequency circuit, improves workability, improves design accuracy, and stabilizes the electrical characteristics of the high-frequency circuit. The purpose is to make it.

[0006]

According to a first aspect of the present invention, there is provided a high-frequency circuit comprising: a conductor chassis; a first dielectric substrate; and a microstructure forming a line provided on one surface of the first dielectric substrate. A strip conductor, a second dielectric substrate, a microstrip conductor forming a line provided on one surface of the second dielectric substrate, and a dielectric layer together with the first and second dielectric substrates. A dielectric adhesive for forming and bonding the first and second dielectric substrates to the conductor chassis;
The first dielectric substrate, the microstrip conductor,
A first member comprising the dielectric adhesive and the conductor chassis;
And a second dielectric circuit portion including the second dielectric substrate, the microstrip conductor, the dielectric adhesive, and the conductor chassis, and the first and second dielectric circuit portions. The ground plane through which the high-frequency signal return current of the dielectric circuit portion propagates is shared by the conductor chassis.

Further, the high frequency circuit according to the second invention comprises:
A conductor chassis, a first dielectric substrate, a microstrip conductor constituting a line provided on one surface of the first dielectric substrate, a second dielectric substrate, and the second dielectric substrate Forming a dielectric layer together with the microstrip conductor constituting the line provided on one surface of the first and second dielectric substrates, and bonding the first and second dielectric substrates to the conductor chassis; A dielectric adhesive, a support provided at a location where the first and second dielectric substrates are attached to the conductor chassis, the first dielectric substrate, the microstrip conductor, the dielectric adhesive, A first dielectric circuit portion including the conductor chassis; and a second dielectric circuit portion including the second dielectric substrate, the microstrip conductor, the dielectric adhesive, and the conductor chassis. , In which the ground plane the first and the high-frequency signal return current of the second dielectric circuit portion propagates made common with the conductor chassis.

[0008] The high-frequency circuit according to the third invention comprises:
A conductor chassis, a first dielectric substrate, a microstrip conductor constituting a line provided on one surface of the first dielectric substrate, a second dielectric substrate, and the second dielectric substrate A microstrip conductor constituting a line provided on one surface of the microstrip conductor; a dielectric adhesive for bonding the first and second dielectric substrates to the conductor chassis; An air layer formed by avoiding a portion directly below, a dielectric layer formed by the first and second dielectric substrates and the air layer, the first dielectric substrate, the microstrip conductor, and the air A first dielectric circuit portion including a layer and the conductor chassis; and a second dielectric circuit portion including the second dielectric substrate, the microstrip conductor, the air layer, and the conductor chassis. Comprising a ground plane in which the first and the high-frequency signal return current of the second dielectric circuit portion is propagated is obtained by common with the conductor chassis.

A high-frequency circuit according to a fourth aspect of the present invention comprises:
A conductor chassis, a first dielectric film, a microstrip conductor constituting a line provided on one surface of the first dielectric film, a second dielectric film, and the second dielectric film Forming a dielectric layer together with the microstrip conductor constituting the line provided on one side of the first and second dielectric films, and bonding the first and second dielectric films to the conductor chassis; A first dielectric circuit portion including a dielectric adhesive, the first dielectric film, the microstrip conductor, the dielectric adhesive and the conductor chassis, a second dielectric film, and the microstrip A second dielectric circuit portion comprising a conductor, the dielectric adhesive, and the conductor chassis; The ground plane current propagates is obtained by common with the conductor chassis.

A high-frequency circuit according to a fifth aspect of the present invention comprises:
A conductor chassis, a first dielectric film, a microstrip conductor constituting a line provided on one surface of the first dielectric film, a second dielectric film, and the second dielectric film Forming a dielectric layer together with the microstrip conductor constituting the line provided on one side of the first and second dielectric films, and bonding the first and second dielectric films to the conductor chassis; A dielectric adhesive, a support provided at a location where the first and second dielectric films are attached to the conductor chassis, the first dielectric film, the microstrip conductor, the dielectric adhesive, A first dielectric circuit portion including the conductor chassis, the second dielectric film, the microstrip conductor, the dielectric adhesive, and the conductor shear; And a second dielectric circuit portion consisting of a ground plane in which the first and the high-frequency signal return current of the second dielectric circuit portion is propagated is obtained by common with the conductor chassis.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a plan view showing a high-frequency circuit according to Embodiment 1 of the present invention.
2A is a cross-sectional view taken along line A11-A11 of FIG. 1, and FIG. 2B is an electromagnetic field distribution diagram taken along line A12-A12 of FIG.
In these figures, 1 is a conductor chassis, 3 is a microstrip conductor, 4 is a dielectric substrate, 5 is a conductor wire or a ribbon, 12 is a first dielectric circuit section, 13 is a second dielectric circuit section, 14 Is a third dielectric circuit, 15 is an epoxy-based dielectric adhesive such as ABLEBOND 84-3, and 16 is a dielectric layer. Here, the first dielectric circuit unit 12, the second dielectric circuit unit 13, and the third dielectric circuit unit 14 are each a dielectric layer formed from the dielectric substrate 4 and the dielectric adhesive 15. 16, the microstrip conductor 3, and the conductor chassis 1.

The high-frequency circuit according to the present invention comprises a dielectric circuit portion formed by fixing a dielectric substrate 4 having a microstrip conductor 3 provided on one surface to a conductor chassis 1 with a dielectric adhesive 15. . In this case, only the dielectric substrate 4 and the dielectric layer 16 formed from the dielectric adhesive 15 are provided between the conductor chassis 1 serving as the ground plane of the high-frequency circuit and the microstrip conductor 3 through which the high-frequency signal current propagates. In terms of structure, there is no conductive surface. At this time, the electromagnetic field distribution in the dielectric circuit portion is as shown in FIG. 2B, and the dielectric substrate having a dielectric constant of ε1 between the microstrip conductor 3 and the conductor chassis 1 and the dielectric substrate having a dielectric constant of ε2 are provided. A high-frequency signal propagates in the TEM mode in a dielectric layer 16 having a dielectric constant ε3 formed by the adhesive 15. Therefore, the ground planes of the first dielectric circuit section 12, the second dielectric circuit section 13, and the third dielectric circuit section 14 that constitute the high-frequency circuit are all common to the conductor chassis 1, and the temperature change and the atmospheric pressure change Even if the conductor chassis 1 is distorted due to changes in environmental conditions such as vibration and shock, the ground plane can always maintain the same potential, and the impedance does not change, so that the electrical characteristics of the high-frequency circuit are stabilized. The thickness of the dielectric layer 16 is set so as to decrease as the propagation frequency increases in order to prevent coupling to higher-order modes. A high-permittivity dielectric substrate or an adhesive may be used. In addition, it is possible to prevent characteristic deterioration such as loss increase such as loss increase that cannot be expected at the time of design due to resonance in the gap between the ground conductor 6 and the conductor carrier 2 due to poor soldering.

Embodiment 2 FIG. FIG. 3 shows a support 1 between the conductor chassis 1 and the dielectric substrate 4 in the first embodiment.
7 is a diagram showing Embodiment 2 in the case of adding 7 and FIG.
3A is a plan view showing a high-frequency circuit, and FIG.
It is A31-A31 cross section of (a). In the figure, 17
Is a support base made of the same material as the chassis, for example.

Also in this case, the high-frequency circuit comprises a dielectric circuit portion formed by fixing a dielectric substrate 4 having a microstrip conductor 3 provided on one surface to a conductor chassis 1 with a dielectric adhesive 15. Is done. In this case, the dielectric layer 1 formed from the dielectric substrate 4 and the dielectric adhesive 15 is provided between the conductor chassis 1 serving as the ground plane of the high-frequency circuit and the microstrip conductor 3 through which the high-frequency signal current propagates.
6 only, and there is no conductor surface in structure. At this time,
The electromagnetic field distribution in the dielectric circuit portion is as shown in FIG. 2B. The dielectric substrate having a dielectric constant of ε1 and the dielectric adhesive 15 having a dielectric constant of ε2 are located between the microstrip conductor 3 and the conductor chassis 1. And a dielectric layer 16 having a dielectric constant of ε3
A high frequency signal propagates in the TEM mode. Therefore,
The ground planes of the first dielectric circuit section 12, the second dielectric circuit section 13, and the third dielectric circuit section 14 that constitute the high-frequency circuit are all common to the conductor chassis 1, and the temperature change, atmospheric pressure change, vibration Even if distortion occurs in the conductor chassis 1 due to a change in environmental conditions such as impact, the ground plane can always maintain the same potential, and the impedance does not change, so that the electrical characteristics of the high-frequency circuit are stable. The thickness of the dielectric layer 16 is set so as to decrease as the propagation frequency increases in order to prevent coupling to higher-order modes. A high-permittivity dielectric substrate or an adhesive may be used. In addition, it is possible to prevent characteristic deterioration such as loss increase such as loss increase that cannot be expected at the time of design due to resonance in the gap between the ground conductor 6 and the conductor carrier 2 due to poor soldering.

Further, as compared with the first embodiment,
7, the thickness of the dielectric adhesive layer can be made constant, and a change in impedance due to a variation in the dielectric adhesive layer can be eliminated. Furthermore, if the dielectric constant ε2 of the dielectric adhesive 15 and the height of the support 17 are selected in advance, the equivalent dielectric constant of the dielectric layer composed of the dielectric substrate 4 and the dielectric adhesive 15 is changed. The impedance can be changed, and the design can be performed with high accuracy.

Embodiment 3 FIG. 4 is a diagram showing a third embodiment in which the dielectric adhesive 15 is applied so as to avoid a portion directly below the microstrip conductor 3 in the first embodiment. FIG. 4 is a plan view showing a high-frequency circuit, and FIG. (A) is FIG.
5A is a cross section taken along line A41-A41 of FIG.
It is an electromagnetic field distribution figure in 42 cross sections. In the figure, 1
8 is an air layer.

Also in this case, the high-frequency circuit comprises a dielectric circuit section formed by fixing a dielectric substrate 4 having a microstrip conductor 3 provided on one surface to a conductor chassis 1 with a dielectric adhesive 15. Is done. In this case, the dielectric layer 1 formed from the dielectric substrate 4 and the dielectric adhesive 15 is provided between the conductor chassis 1 serving as the ground plane of the high-frequency circuit and the microstrip conductor 3 through which the high-frequency signal current propagates.
6 only, and there is no conductor surface in structure. At this time,
The electromagnetic field distribution in the dielectric circuit portion is as shown in FIG. 5B. The dielectric substrate having a dielectric constant of ε1 between the microstrip conductor 3 and the conductor chassis 1 and the air layer 18 having a dielectric constant of ε4. A high-frequency signal propagates in the TEM mode in the formed dielectric layer 16 having a dielectric constant of ε5. Therefore, the ground planes of the first dielectric circuit section 12, the second dielectric circuit section 13, and the third dielectric circuit section 14 that constitute the high-frequency circuit are all common to the conductor chassis 1, and the temperature change and the atmospheric pressure change Even if the conductor chassis 1 is distorted due to changes in environmental conditions such as vibration and shock, the ground plane can always maintain the same potential, and the impedance does not change, so that the electrical characteristics of the high-frequency circuit are stabilized.

In comparison with the first embodiment, the adhesive layer immediately below the microstrip line 3 where the electric field concentrates when a high-frequency signal propagates is formed by the air layer 1 having a relative dielectric constant of 1.0.
By setting it to 8, the dielectric loss caused by the dielectric adhesive layer 15 is reduced.

Embodiment 4 FIG. 6 is a diagram showing a fourth embodiment in which a dielectric film 19 is used instead of the dielectric substrate 4 in the first embodiment, FIG. 6 is a plan view showing a high-frequency circuit, and FIG. FIG. 7B is a cross-sectional view of the electromagnetic field in the A61-A61 section, and FIG. 7B is an A62-A62 section of FIG. In the figure, reference numeral 19 denotes a dielectric film such as a polyimide film.

In this case, the high-frequency circuit includes the conductor chassis 1
And a dielectric circuit portion formed by fixing a dielectric film 19 provided with a microstrip conductor 3 on one surface with a dielectric adhesive 15. In this case, only a dielectric layer 16 formed from the dielectric film 19 and the dielectric adhesive 15 is provided between the conductor chassis 1 serving as the ground plane of the high-frequency circuit and the microstrip conductor 3 through which the high-frequency signal current propagates. In terms of structure, there is no conductive surface.
At this time, the electromagnetic field distribution in the dielectric circuit portion is as shown in FIG.
(B), the dielectric constant ε formed by the dielectric film having the dielectric constant ε6 between the microstrip conductor 3 and the conductor chassis 1 and the dielectric adhesive 15 having the dielectric constant ε2.
The high-frequency signal propagates through the dielectric layer 16 in the TEM mode. Therefore, the ground planes of the first dielectric circuit section 12 and the second dielectric circuit section 13 constituting the high-frequency circuit are all common to the conductor chassis 1, and the temperature change, the atmospheric pressure change, the vibration and
Even if the conductor chassis 1 is distorted due to a change in environmental conditions such as impact, the ground plane can always maintain the same potential, and the impedance does not change, so that the electrical characteristics of the high-frequency circuit are stable. In addition, it is possible to prevent characteristic deterioration such as loss increase such as loss increase that cannot be expected at the time of design due to resonance in the gap between the ground conductor 6 and the conductor carrier 2 due to poor soldering.

Further, as compared with the first embodiment, by using the dielectric film 19 instead of the dielectric substrate 4,
It is no longer necessary to consider the size of the substrate, which had been limited in size by the coefficient of thermal expansion of the substrate, and the size of the film was increased to produce multiple dielectric circuits on the same film and reduce the number of components As a result, assembling can be further simplified, workability can be improved, and costs for mass production can be significantly reduced.

Embodiment 5 FIG. 8 is a diagram showing a fifth embodiment in which a dielectric film 19 is used instead of the dielectric substrate 4 in the second embodiment. FIG. 8A is a plan view showing a high-frequency circuit, and FIG. b) is A8 in FIG.
It is 1-A81 cross section. In the figure, 19 is a dielectric film.

In this case, the high-frequency circuit includes the conductor chassis 1
And a dielectric circuit portion formed by fixing a dielectric film 19 provided with a microstrip conductor 3 on one surface with a dielectric adhesive 15. In this case, only a dielectric layer 16 formed from the dielectric film 19 and the dielectric adhesive 15 is provided between the conductor chassis 1 serving as the ground plane of the high-frequency circuit and the microstrip conductor 3 through which the high-frequency signal current propagates. In terms of structure, there is no conductive surface.
At this time, the electromagnetic field distribution in the dielectric circuit portion is as shown in FIG.
(B), the dielectric constant ε formed by the dielectric film having the dielectric constant ε6 between the microstrip conductor 3 and the conductor chassis 1 and the dielectric adhesive 15 having the dielectric constant ε2.
The high-frequency signal propagates through the dielectric layer 16 in the TEM mode. Therefore, the ground planes of the first dielectric circuit section 12 and the second dielectric circuit section 13 constituting the high-frequency circuit are all common to the conductor chassis 1, and the temperature change, the atmospheric pressure change, the vibration and
Even if the conductor chassis 1 is distorted due to a change in environmental conditions such as impact, the ground plane can always maintain the same potential, and the impedance does not change, so that the electrical characteristics of the high-frequency circuit are stable. In addition, it is possible to prevent characteristic deterioration such as loss increase such as loss increase that cannot be expected at the time of design due to resonance in the gap between the ground conductor 6 and the conductor carrier 2 due to poor soldering.

Further, as compared with the fourth embodiment, the support table 1
7, the thickness of the dielectric adhesive layer can be made constant, and a change in impedance due to a variation in the dielectric adhesive layer can be eliminated. Further, if the dielectric film 15 is selected in advance in consideration of the dielectric constant ε2 of the dielectric adhesive 15 and the height of the support base 17, the dielectric film 19 and the dielectric adhesive 1
The impedance can be changed by changing the equivalent permittivity of the dielectric layer 16 made of 5 and the design can be performed with high accuracy.

Furthermore, by using the dielectric film 19 instead of the dielectric substrate 4 as compared with the second embodiment, the size of the substrate, which is limited in size by the thermal expansion coefficient of the substrate, is taken into consideration. This eliminates the need to increase the size of the film, making multiple high-frequency integrated circuits on the same film, and reducing the number of components.
Further, assembling workability is improved, which leads to a significant reduction in cost during mass production.

[0026]

As described above, according to the first aspect of the invention, a dielectric substrate having a microstrip conductor on one surface and no ground conductor on the back surface is attached to a conductor chassis with a dielectric adhesive, By forming a dielectric circuit part using a dielectric layer formed by a body substrate and a dielectric adhesive as a layer in which a high-frequency signal propagates in a TEM mode, the ground plane of the high-frequency circuit is made a common conductor chassis. Therefore, it is possible to eliminate the impedance fluctuation caused by the fluctuation of the ground area and to stabilize the electric characteristics.

According to the second aspect of the present invention, by providing the support, the thickness of the adhesive layer can be made constant, and the change in impedance due to the variation in the adhesive layer can be eliminated. Furthermore, if the dielectric constant of the adhesive and the height of the support base are selected in advance, the impedance of the microstrip conductor constituting the line can be changed, and the design can be performed with high accuracy.

According to the third aspect of the present invention, the dielectric adhesive is applied so as to secure an air layer immediately below the microstrip conductor of the dielectric substrate, thereby reducing the dielectric loss caused by the dielectric adhesive layer. Can be reduced.

According to the fourth aspect of the present invention, since the dielectric substrate is made of a dielectric film and the high-frequency circuit is made into a film, the mounting operation can be simplified and the cost for mass production can be greatly reduced. It was done.

According to the fifth aspect of the present invention, the height of the support table provided is selected to control the thickness of the dielectric adhesive, so that a more accurate design can be achieved. By forming the high-frequency circuit into a film by using the substrate as a dielectric film, the mounting operation is further simplified, and the cost for mass production can be greatly reduced.

[Brief description of the drawings]

FIG. 1 is a diagram showing Embodiment 1 of a high-frequency circuit according to the present invention.

FIG. 2 is a diagram showing Embodiment 1 of a high-frequency circuit according to the present invention.

FIG. 3 is a diagram showing a high-frequency circuit according to a second embodiment of the present invention;

FIG. 4 is a diagram showing a third embodiment of the high-frequency circuit according to the present invention.

FIG. 5 is a diagram showing a third embodiment of the high-frequency circuit according to the present invention.

FIG. 6 is a diagram showing a fourth embodiment of the high-frequency circuit according to the present invention.

FIG. 7 is a diagram showing a fourth embodiment of the high-frequency circuit according to the present invention.

FIG. 8 is a diagram showing a fifth embodiment of the high-frequency circuit according to the present invention.

FIG. 9 is a diagram of a conventional high-frequency circuit.

FIG. 10 is a diagram of a conventional high-frequency circuit.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 conductor chassis, 2 conductor carrier, 3 microstrip conductor, 4 dielectric substrate, 5 conductor wire or conductor ribbon, 6 ground conductor, 7 solder or conductive adhesive, 8 screw, 9 first high-frequency circuit module, 10
2nd high frequency circuit module, 11 3rd high frequency circuit module, 12 1st dielectric circuit section, 13 2nd
14 dielectric circuit portion, 15 third dielectric circuit portion, 15 dielectric adhesive, 16 dielectric layer, 17 support base, 18 air layer, 19 dielectric film.

Claims (5)

[Claims] 1. A conductor chassis, a first dielectric substrate,
A microstrip conductor forming a line provided on one surface of the first dielectric substrate; a second dielectric substrate; and a microstrip forming a line provided on one surface of the second dielectric substrate. A strip conductor, a dielectric adhesive for forming a dielectric layer together with the first and second dielectric substrates and adhering the first and second dielectric substrates to the conductor chassis, and the first dielectric A first dielectric circuit portion including a substrate, the microstrip conductor, the dielectric adhesive, and the conductor chassis; and a second dielectric substrate, the microstrip conductor, the dielectric adhesive, and the conductor chassis. And a ground plane through which the high-frequency signal return current of the first and second dielectric circuit sections propagates is shared by the conductor chassis. Frequency circuit. 2. A conductor chassis, a first dielectric substrate,
A microstrip conductor forming a line provided on one surface of the first dielectric substrate; a second dielectric substrate; and a microstrip forming a line provided on one surface of the second dielectric substrate. A strip conductor, a dielectric adhesive for forming a dielectric layer together with the first and second dielectric substrates, and bonding the first and second dielectric substrates to the conductor chassis; and the first and second dielectric substrates. A support provided at a position where the dielectric substrate is attached to the conductor chassis, and a first dielectric circuit portion including the first dielectric substrate, the microstrip conductor, the dielectric adhesive, and the conductor chassis And a second dielectric circuit section comprising the second dielectric substrate, the microstrip conductor, the dielectric adhesive, and the conductor chassis, wherein the first and second dielectric circuit sections are provided. High frequency circuit, characterized in that the ground surface is shared by the conductor chassis high frequency signal return current propagates. 3. A conductor chassis, a first dielectric substrate,
A microstrip conductor forming a line provided on one surface of the first dielectric substrate; a second dielectric substrate; and a microstrip forming a line provided on one surface of the second dielectric substrate. A strip conductor, a dielectric adhesive for bonding the first and second dielectric substrates to the conductor chassis,
An air layer formed by applying the dielectric adhesive so as to avoid right under the microstrip conductor; a dielectric layer formed by the first and second dielectric substrates and the air layer; A first dielectric circuit portion including the dielectric substrate, the microstrip conductor, the air layer, and the conductor chassis; and a second dielectric substrate including the second dielectric substrate, the microstrip conductor, the air layer, and the conductor chassis. And a second dielectric circuit unit.
And a ground plane through which the high frequency signal return current of the second dielectric circuit portion propagates is shared by the conductor chassis. 4. A conductor chassis, a first dielectric film, a microstrip conductor constituting a line provided on one surface of the first dielectric film, a second dielectric film, and a second dielectric film. A microstrip conductor constituting a line provided on one surface of the dielectric film of the second aspect,
A dielectric adhesive for forming a dielectric layer together with the second dielectric film and bonding the first and second dielectric films to the conductor chassis; the first dielectric film; the microstrip conductor; A first dielectric circuit portion including the dielectric adhesive and the conductor chassis;
A second dielectric film section comprising the second dielectric film, the microstrip conductor, the dielectric adhesive, and the conductor chassis; and a high-frequency signal of the first and second dielectric circuit sections. A high-frequency circuit wherein a ground plane through which a return current propagates is shared by the conductor chassis. 5. A conductor chassis, a first dielectric film, a microstrip conductor constituting a line provided on one surface of the first dielectric film, a second dielectric film, and the second dielectric film. A microstrip conductor constituting a line provided on one surface of the dielectric film of the second aspect,
And a dielectric adhesive for forming a dielectric layer together with the second dielectric film and adhering the first and second dielectric films to the conductor chassis; and applying the first and second dielectric films to the conductor chassis. A support provided at a location to be attached to a chassis; a first dielectric circuit portion including the first dielectric film, the microstrip conductor, the dielectric adhesive, and the conductor chassis; A second dielectric circuit portion comprising a body film, the microstrip conductor, the dielectric adhesive, and the conductor chassis, and a high-frequency signal return current of the first and second dielectric circuit portions propagates. A high-frequency circuit wherein a ground plane is shared by the conductor chassis.