JPH11204915A - Substrate dividing device - Google Patents

Substrate dividing device

Info

Publication number
JPH11204915A
JPH11204915A JP1341198A JP1341198A JPH11204915A JP H11204915 A JPH11204915 A JP H11204915A JP 1341198 A JP1341198 A JP 1341198A JP 1341198 A JP1341198 A JP 1341198A JP H11204915 A JPH11204915 A JP H11204915A
Authority
JP
Japan
Prior art keywords
shearing
blades
cutting
cutting blades
original plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1341198A
Other languages
Japanese (ja)
Inventor
Hirotsugu Maekawa
裕嗣 前川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Priority to JP1341198A priority Critical patent/JPH11204915A/en
Publication of JPH11204915A publication Critical patent/JPH11204915A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To attempt miniaturization and improvement of durability of a driving device which is provided with upper cutting blades projecting downwards and lower ones having holes which can fix with the cutting blades, by dividing into substrate units by differentiating the cutting blade heights and into each cutting blade height having more difference than the thickness of the original substrate. SOLUTION: Each required number of first cutting blades 16 and second cutting blades, for example seven each, having longitudinal prism shapes are so provided as projecting toward the lower perpendicular direction on the lower surface of an upper disc 3. A difference h1 -h2 between the higher height h1 of the first cutting blades 16 and the height h2 of the second cutting blades 17 is set as a bigger predetermined value than the thickness of an original substrate 8. Additionally each first and second cutting blade 16 and 17 is so arranged as to pressurize the original substrate in a proper balance. The maximum cutting power while cutting a bridge between each unit substrate can be reduced and a required pressure of a driving device can be reduced.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子機器に用いら
れるプリント基板を駆動装置の加圧力により多面付け状
態から単体に分割する基板分割装置に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board dividing apparatus for dividing a printed circuit board used in an electronic apparatus from a multi-faced state into a single body by a pressing force of a driving device.

【0002】[0002]

【従来の技術】プリント基板は1枚の原板に複数の同一
パターンの回路を形成させ多面付け状態とした後、単体
基板に分割される。斯かる分割を行う装置の一つに基板
分割装置がある。
2. Description of the Related Art A printed circuit board is divided into single substrates after a plurality of circuits having the same pattern are formed on a single original plate to form a multi-faced state. One of the devices for performing such division is a substrate dividing device.

【0003】以下図5〜図8に於いて、従来の基板分割
装置を説明する。
A conventional substrate dividing apparatus will be described below with reference to FIGS.

【0004】基板分割装置は上型1と下型2を有してい
る。前記上型1は偏平な直方体形状の上盤3と、該上盤
3の上面中央部に固着された円柱形状の支持部4と、前
記上盤3の下面に所要数突設された剪断刃5で構成さ
れ、図示しない駆動装置により昇降可能となっている。
該剪断刃5は縦長角柱形状で、該各剪断刃5の高さはそ
れぞれ等しくなっている。
The substrate dividing apparatus has an upper mold 1 and a lower mold 2. The upper die 1 has a flat rectangular parallelepiped upper plate 3, a columnar support 4 fixed to the center of the upper surface of the upper plate 3, and a required number of shearing blades provided on the lower surface of the upper plate 3. 5, and can be moved up and down by a driving device (not shown).
The shearing blades 5 have a vertically long prismatic shape, and the heights of the respective shearing blades 5 are equal.

【0005】前記下型2には前記剪断刃5が嵌合可能な
角孔6が所要数(図示では9個)穿設され、前記上盤3
は前記下型2と重合可能となっている。又、前記下型2
の所要位置には実装部品との干渉を避ける為の逃げ孔7
が各単体基板毎に穿設されている。
The lower die 2 is provided with a required number (9 in the figure) of square holes 6 into which the shearing blades 5 can be fitted.
Is polymerizable with the lower mold 2. Also, the lower mold 2
Escape holes 7 to avoid interference with mounted parts
Are provided for each single substrate.

【0006】原板8には同一パターンの回路が形成され
た複数(図示では2個)の単体基板9が多面付けされて
おり、該単体基板9の周囲にはスリット孔が穿設されて
いると共に複数(図示では9個)のブリッジ10が残置
され、前記単体基板9は前記原板8と一体化されてい
る。
The original plate 8 is provided with a plurality of (two in the figure) single substrates 9 on which a circuit of the same pattern is formed, and a slit hole is formed around the single substrate 9. A plurality of (9 in the figure) bridges 10 are left, and the single substrate 9 is integrated with the original plate 8.

【0007】前記原板8を前記下型2に載置し位置決め
する。位置決めされた状態では前記ブリッジ10は前記
角孔6に合致している。前記駆動装置(図示せず)を駆
動し、前記上型1を降下させる。前記各剪断刃5は同時
に前記原板8に当接し、前記各ブリッジ10を剪断し、
剪断後前記角孔6に嵌合する。前記各ブリッジ10は前
記原板8から打抜かれ、該原板8より複数(図示では2
個)の前記単体基板9に分割される。
[0007] The original plate 8 is placed on the lower die 2 and positioned. When positioned, the bridge 10 is aligned with the square hole 6. The driving device (not shown) is driven to lower the upper die 1. The respective shearing blades 5 simultaneously contact the original plate 8 to shear the respective bridges 10,
After shearing, it is fitted into the square hole 6. Each of the bridges 10 is punched from the original plate 8 and a plurality of the bridges 10 (two
) Are divided into the single substrates 9.

【0008】この時、前記ブリッジ10をn個設け、該
各ブリッジ10を剪断する為に必要な力をそれぞれP
1 ,P2 ,…,Pn とすると、前記駆動装置(図示せ
ず)の必要加圧力Wは数式1を満たす様決定される。
At this time, n bridges 10 are provided, and the force required to shear each bridge 10 is P
Assuming that 1 , P 2 ,..., P n , the required pressure W of the driving device (not shown) is determined so as to satisfy Equation 1.

【0009】[0009]

【数式1】W≧S×(P1 +P2 +…+Pn ) S:安全率[Formula 1] W ≧ S × (P 1 + P 2 +... + P n ) S: safety factor

【発明が解決しようとする課題】上記した従来の基板分
割装置では、前記ブリッジ10の数の増加に伴い、前記
駆動装置(図示せず)の加圧力を増大させる必要がある
為、装置全体が大規模化する虞れがあった。
In the above-described conventional substrate dividing apparatus, it is necessary to increase the pressing force of the driving device (not shown) as the number of the bridges 10 increases. There was a possibility that the scale would increase.

【0010】又、全ての前記剪断刃5で同時に前記各ブ
リッジ10の剪断を開始すると、前記原板8を介して前
記下型2に作用する押圧力が増大し、図9に示す様に前
記角孔6と逃げ孔7との間等強度の弱い部分11にクラ
ック12が発生する虞れがあった。
When the shearing of each of the bridges 10 is started simultaneously by all of the shearing blades 5, the pressing force acting on the lower mold 2 via the original plate 8 increases, and as shown in FIG. There is a possibility that a crack 12 may occur in a portion 11 having low strength between the hole 6 and the escape hole 7.

【0011】本発明は斯かる実情に鑑み、駆動装置の小
型化を図ると共に前記下型2の耐久性の向上を図るもの
である。
The present invention has been made in view of the above circumstances and aims at reducing the size of the driving device and improving the durability of the lower die 2.

【0012】[0012]

【課題を解決するための手段】本発明は、複数の剪断刃
が下方に突設された上型と、前記剪断刃が嵌合可能な孔
を有する下型とを有し、前記剪断刃の高さを違えた基板
分割装置に係り、又、前記各剪断刃の高さの差が分割さ
れる原板の厚さ以上である基板分割装置に係り、更に、
高さの異なる剪断刃を均等に配置した基板分割装置に係
り、高さの高い剪断刃から順次孔に嵌合し、原板から単
体基板を分割する。
According to the present invention, there is provided an upper mold having a plurality of shearing blades projecting downward, and a lower mold having a hole into which the shearing blades can be fitted. The present invention relates to a substrate dividing device having a different height, and also relates to a substrate dividing device in which a difference in height between the respective shearing blades is equal to or larger than a thickness of an original plate to be divided.
The present invention relates to a substrate dividing apparatus in which shear blades having different heights are uniformly arranged, and the shear blades having higher heights are sequentially fitted into holes to divide a single substrate from an original plate.

【0013】[0013]

【発明の実施の形態】以下、図1〜図4を参照しつつ本
発明の実施の形態を説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

【0014】上盤3の下面には縦長角柱形状の第1剪断
刃16及び第2剪断刃17がそれぞれ所要数(図示では
7個ずつ)下方鉛直方向に突設されている。前記第1剪
断刃16の高さは前記第2剪断刃17の高さより高く、
仮に前記第1剪断刃16の高さをh1 、前記第2剪断刃
17の高さをh2 とすると、前記第1剪断刃16と第2
剪断刃17との高さの差h1 −h2 は原板8の厚さより
所定値だけ大きくなる様設定されている。又、前記第1
剪断刃16、第2剪断刃17はそれぞれ原板8に対しバ
ランス良く加圧できる様均等に配置する。例えば図2中
の各単体基板9間のブリッジ10を結ぶ中心線18に対
して上下対称になる様、或は第1剪断刃16の総合加圧
力の力の作用中心、第2剪断刃17の総合加圧力の力の
作用中心がそれぞれ前記原板8の重心と一致し、或は前
記各力の作用中心が前記上型1を支持する軸の軸心と一
致し、原板8に大きな偏心荷重が掛からない様に、又上
型1に曲げモーメントが作用しない様に配置されてい
る。
On the lower surface of the upper platen 3, first and second shearing blades 16 each having a vertically long rectangular column shape are provided in a required vertical direction (seven in the figure) in the downward vertical direction. The height of the first shear blade 16 is higher than the height of the second shear blade 17,
Assuming that the height of the first shearing blade 16 is h 1 and the height of the second shearing blade 17 is h 2 , the first shearing blade 16 and the second
The height difference h 1 -h 2 from the shearing blade 17 is set to be larger than the thickness of the original plate 8 by a predetermined value. In addition, the first
The shearing blades 16 and the second shearing blades 17 are arranged evenly so that they can be pressed against the original plate 8 with good balance. For example, it is vertically symmetrical with respect to the center line 18 connecting the bridges 10 between the individual substrates 9 in FIG. 2, or the center of action of the force of the total pressing force of the first shearing blade 16 and the second shearing blade 17 The center of action of the force of the total pressing force coincides with the center of gravity of the original plate 8, or the center of action of each force coincides with the axis of the shaft supporting the upper die 1, so that a large eccentric load is applied to the original plate 8. The upper mold 1 is arranged so as not to be hung and no bending moment acts on the upper mold 1.

【0015】以下作用を説明する。The operation will be described below.

【0016】前記原板8を前記下型2に載置し位置決め
する。位置決めされた状態では前記ブリッジ10は前記
角孔6に合致している。駆動装置(図示せず)により上
型1を降下させると、前記各第1剪断刃16の先端が同
時に該各第1剪断刃16に対応する前記ブリッジ10に
当接し、該ブリッジ10の剪断が開始される(図3
(a)参照)。該ブリッジ10の剪断中に該ブリッジ1
0に作用する剪断力は図4に示す様に最大値Aに達す
る。前記第1剪断刃16の先端が前記原板8の下面に至
ると、前記第1剪断刃16に対応する前記ブリッジ10
は前記原板8から打抜かれ、剪断力はゼロになる(図3
(b)参照)。
The original plate 8 is placed on the lower die 2 and positioned. When positioned, the bridge 10 is aligned with the square hole 6. When the upper die 1 is lowered by a driving device (not shown), the tips of the first shearing blades 16 simultaneously contact the bridges 10 corresponding to the respective first shearing blades 16, and the shearing of the bridges 10 is stopped. Started (Figure 3
(A)). During the shearing of the bridge 10, the bridge 1
The shear force acting on zero reaches a maximum value A as shown in FIG. When the tip of the first shear blade 16 reaches the lower surface of the original plate 8, the bridge 10 corresponding to the first shear blade 16
Is punched from the original plate 8 and the shearing force becomes zero (see FIG. 3).
(B)).

【0017】更に、前記上型1を降下させると、前記各
第2剪断刃17の先端が同時に該各第2剪断刃17に対
応する前記ブリッジ10に当接し、該ブリッジ10の剪
断が開始される(図3(c)参照)。該ブリッジ10を
剪断する際の剪断力は図4に示す様に再び最大値Aに達
する。前記第2剪断刃17の先端が前記原板8の下面に
至ると、前記第2剪断刃17に対応する前記ブリッジ1
0は前記原板8から打抜かれ、剪断力はゼロになり(図
3(d)参照)、前記単体基板9は前記原板8から分割
される。
Further, when the upper die 1 is lowered, the tip of each of the second shearing blades 17 simultaneously comes into contact with the bridge 10 corresponding to each of the second shearing blades 17, and shearing of the bridge 10 is started. (See FIG. 3C). The shearing force when shearing the bridge 10 reaches the maximum value A again as shown in FIG. When the tip of the second shear blade 17 reaches the lower surface of the original plate 8, the bridge 1 corresponding to the second shear blade 17
0 is punched from the original plate 8, the shearing force becomes zero (see FIG. 3D), and the single substrate 9 is separated from the original plate 8.

【0018】前述した様に、前記駆動装置(図示せず)
の必要加圧力は前記ブリッジ10を剪断する際の剪断力
の最大値に基づいて算出され決定される。又、前記ブリ
ッジ10を剪断する際の剪断力の最大値Aは、図4に示
す様に全ての剪断刃が同時に全ての前記ブリッジ10を
剪断する際の剪断力の最大値Bの半分となる。而して、
前記駆動装置に必要な加圧力は全ての剪断刃が同時に全
ての前記ブリッジ10を剪断する場合と比較して半分で
済む。
As described above, the driving device (not shown)
Is calculated and determined based on the maximum value of the shearing force when the bridge 10 is sheared. Further, the maximum value A of the shearing force when shearing the bridge 10 is half the maximum value B of the shearing force when all the shearing blades simultaneously shear all the bridges 10 as shown in FIG. . Thus,
The pressure required for the drive is half that required when all shear blades shear all the bridges 10 at the same time.

【0019】尚、上記実施の形態に於いては、高さの違
う2種類の第1剪断刃16と第2剪断刃17を設けてい
るが、3種類以上としてもよく、その場合、前記ブリッ
ジ10を剪断する剪断力の最大値を更に低減させること
ができることは言う迄もない。
In the above embodiment, two types of first shearing blades 16 and second shearing blades 17 having different heights are provided, but three or more types may be provided. It goes without saying that the maximum value of the shearing force for shearing 10 can be further reduced.

【0020】又、前記第1剪断刃16と第2剪断刃17
との高さの差は前記原板8の厚さより所定値だけ大きく
なる様設定されているが、前記原板8の厚さに等しくな
る様設定されていてもよい。
The first shearing blade 16 and the second shearing blade 17
Is set to be larger than the thickness of the original plate 8 by a predetermined value, but may be set to be equal to the thickness of the original plate 8.

【0021】[0021]

【発明の効果】以上述べた如く本発明によれば、ブリッ
ジを剪断する際の剪断力の最大値を低減させることがで
きる為、駆動装置の必要加圧力を低減させることがで
き、装置全体の小型化を図ることが可能となる。
As described above, according to the present invention, since the maximum value of the shearing force when shearing the bridge can be reduced, the required pressure of the driving device can be reduced, and the entire device can be reduced. It is possible to reduce the size.

【0022】又、原板を介して下型に作用する押圧力を
低減させることができると共に高さの違う剪断刃が剪断
時の剪断力が分散する様均等に配置されているので、下
型にクラック等が発生する虞れが少なくなり、下型の耐
久性の向上が図れる等種々の優れた効果を発揮する。
Further, the pressing force acting on the lower mold via the original plate can be reduced, and the shearing blades having different heights are uniformly arranged so that the shearing force at the time of shearing is dispersed. There is less possibility that cracks or the like are generated, and various excellent effects such as improvement in durability of the lower mold can be achieved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態に於ける上型の側面図であ
る。
FIG. 1 is a side view of an upper die according to an embodiment of the present invention.

【図2】該実施の形態に於ける上型の下面図である。FIG. 2 is a bottom view of the upper die according to the embodiment.

【図3】(a)、(b)、(c)、(d)はそれぞれ該
実施の形態に於ける上型の作動状態を示す側断面図であ
る。
FIGS. 3 (a), (b), (c), and (d) are side cross-sectional views each showing an operation state of the upper die according to the embodiment.

【図4】該実施の形態に於ける剪断刃の下降ストローク
と原板に作用する剪断力との関係を示す図である。
FIG. 4 is a diagram showing a relationship between a descending stroke of a shearing blade and a shearing force acting on an original plate in the embodiment.

【図5】従来例を示す斜視図である。FIG. 5 is a perspective view showing a conventional example.

【図6】従来例を示す側面部分断面図である。FIG. 6 is a partial side sectional view showing a conventional example.

【図7】従来例の作動を示す斜視図である。FIG. 7 is a perspective view showing the operation of the conventional example.

【図8】従来例を示す側面図である。FIG. 8 is a side view showing a conventional example.

【図9】従来例に於いて、下型にクラックが発生した場
合を示す斜視図である。
FIG. 9 is a perspective view showing a case where a crack occurs in a lower mold in a conventional example.

【符号の説明】[Explanation of symbols]

1 上型 2 下型 6 角孔 8 原板 9 単体基板 10 ブリッジ 16 第1剪断刃 17 第2剪断刃 DESCRIPTION OF SYMBOLS 1 Upper die 2 Lower die 6 Square hole 8 Original plate 9 Single substrate 10 Bridge 16 First shear blade 17 Second shear blade

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 複数の剪断刃が下方に突設された上型
と、前記剪断刃が嵌合可能な孔を有する下型とを有し、
前記剪断刃の高さを違えたことを特徴とする基板分割装
置。
1. An upper mold having a plurality of shearing blades projecting downward, and a lower mold having a hole into which the shearing blades can be fitted,
A substrate dividing device, wherein the height of the shearing blade is different.
【請求項2】 前記各剪断刃の高さの差が分割される原
板の厚さ以上である請求項1の基板分割装置。
2. The substrate dividing apparatus according to claim 1, wherein a difference between the heights of the respective shearing blades is equal to or greater than a thickness of the original plate to be divided.
【請求項3】 高さの異なる剪断刃を均等に配置した請
求項1又は請求項2の基板分割装置。
3. The substrate dividing apparatus according to claim 1, wherein shear blades having different heights are evenly arranged.
JP1341198A 1998-01-07 1998-01-07 Substrate dividing device Pending JPH11204915A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1341198A JPH11204915A (en) 1998-01-07 1998-01-07 Substrate dividing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1341198A JPH11204915A (en) 1998-01-07 1998-01-07 Substrate dividing device

Publications (1)

Publication Number Publication Date
JPH11204915A true JPH11204915A (en) 1999-07-30

Family

ID=11832402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1341198A Pending JPH11204915A (en) 1998-01-07 1998-01-07 Substrate dividing device

Country Status (1)

Country Link
JP (1) JPH11204915A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008034575A (en) * 2006-07-28 2008-02-14 Colcoat Kk Substrate dividing device
CN103994348A (en) * 2014-04-26 2014-08-20 王定锋 Slitting injection molding LED identification module and method
CN104214563A (en) * 2014-04-26 2014-12-17 王定锋 Light-emitting diode (LED) identification module manufactured by sticking glue plate on whole board connecting piece of circuit board, and slitting method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008034575A (en) * 2006-07-28 2008-02-14 Colcoat Kk Substrate dividing device
CN103994348A (en) * 2014-04-26 2014-08-20 王定锋 Slitting injection molding LED identification module and method
CN104214563A (en) * 2014-04-26 2014-12-17 王定锋 Light-emitting diode (LED) identification module manufactured by sticking glue plate on whole board connecting piece of circuit board, and slitting method thereof

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