CN218555977U - Paster electronic component positioner - Google Patents
Paster electronic component positioner Download PDFInfo
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- CN218555977U CN218555977U CN202222370025.3U CN202222370025U CN218555977U CN 218555977 U CN218555977 U CN 218555977U CN 202222370025 U CN202222370025 U CN 202222370025U CN 218555977 U CN218555977 U CN 218555977U
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- positioning
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Abstract
The utility model provides a paster electronic component positioning device, which comprises a bottom plate, a first base plate and a positioning matrix plate, wherein a positioning piece for positioning the positioning matrix plate is arranged on the bottom plate; the positioning matrix plate is concavely provided with an accommodating area, a plurality of square accommodating holes penetrating through the upper surface and the lower surface of the positioning matrix plate are arranged in the accommodating area, and the size of each square accommodating hole is larger than that of the patch electronic element; the first base plate is arranged between the bottom plate and the positioning matrix plate, is used for supporting the patch electronic element and is used for driving the patch electronic element in the square accommodating hole to move when moving. Compared with the prior art, the utility model discloses set up first backing plate and location matrix board, set up a plurality of square holding holes that are used for holding paster electronic component on the location matrix board, the big batch material loading and the location of the paster electronic component of being convenient for have improved the production efficiency that laser engraved letters.
Description
Technical Field
The utility model relates to an electronic component makes the field, especially relates to a paster electronic component positioner.
Background
After the production of chip electronic elements such as MLCC (Multi-layer Ceramic Capacitors), chip resistors and IC chips is completed, it is necessary to engrave characters or pattern marks on the surface of the chip resistors with laser so as to identify the types of the chip electronic elements. As shown in fig. 1, the conventional positioning device includes a bottom plate 10, a first positioning plate 14 and a second positioning plate 15, the bottom plate 10 is disposed on a worktable of a laser marking apparatus, the first positioning plate 14 and the second positioning plate 15 are disposed on the bottom plate 10, and the first positioning plate 14 and the second positioning plate 15 are perpendicular to each other to form a reference position for positioning a chip electronic component a. When the laser carving machine is used, the patch electronic element A needs to be placed on the bottom plate 10, one corner of the patch electronic element A is abutted to the reference position, so that the patch electronic element A is positioned, then laser carving equipment is started, and characters or patterns are carved on the surface of the patch electronic element A. The conventional positioning device can only position one patch electronic element A at a time, and an operator is required to place the patch electronic element A to a reference position formed between the first positioning plate 14 and the second positioning plate 15, so that the operation is inconvenient, and the production efficiency is low.
SUMMERY OF THE UTILITY MODEL
Based on this, the utility model aims at providing a can carry out the paster electronic component positioner who fixes a position to a plurality of paster electronic components simultaneously to improve the efficiency of carving characters on paster electronic component.
The utility model provides a paster electronic component positioning device, which comprises a bottom plate, a first base plate and a positioning matrix plate, wherein a positioning piece for positioning the positioning matrix plate is arranged on the bottom plate; the positioning matrix plate is concavely provided with an accommodating area, a plurality of square accommodating holes penetrating through the upper surface and the lower surface of the positioning matrix plate are arranged in the accommodating area, the length and width of each square accommodating hole are respectively 3/2-2 times of the length and width of the patch electronic element, the thickness of the positioning matrix plate is 1-3/2 times of the thickness of the patch electronic element, and the thickness of the accommodating area is equal to that of the patch electronic element; the first base plate is arranged between the bottom plate and the positioning matrix plate, is used for supporting the patch electronic element and is used for driving the patch electronic element in the square accommodating hole to move when moving.
Furthermore, the accommodating area is communicated with the edge of the positioning matrix plate through a through groove.
Furthermore, one surface of the first base plate, which faces the positioning matrix plate, is provided with an anti-slip surface.
Furthermore, one side of the first base plate facing the bottom plate is provided with a smooth surface.
Furthermore, a plurality of fixing holes are formed in the bottom plate, and the positioning piece is detachably mounted on the bottom plate through the fixing holes.
Furthermore, the fixing hole is internally provided with threads, and the positioning piece is installed on the fixing hole through a bolt.
Furthermore, the locating element includes location strip and reference column, location strip and reference column respectively with the adjacent both sides limit butt of location matrix board, the distribution direction of location strip is rather than the extending direction unanimous of the side of the location matrix board of butt.
Further, the adjacent accommodating holes are equal in spacing.
The patch electronic element support device comprises a square containing hole, and is characterized by further comprising a second base plate, wherein the second base plate is used for covering the positioning matrix plate before the positioning matrix plate is turned over, supporting the patch electronic element in the square containing hole when the positioning matrix plate is turned over, and driving the patch electronic element in the square containing hole to move after the positioning matrix plate is turned over.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the first base plate and the positioning matrix plate are arranged, and the positioning matrix plate is provided with a plurality of square accommodating holes for accommodating the chip electronic elements, so that the chip electronic elements can be conveniently fed and positioned in a large batch, and the production efficiency of laser lettering is improved;
2. the positioning piece is detachably arranged on the bottom plate through the fixing hole, so that the position of the positioning piece can be adjusted, the positioning piece can be suitable for positioning matrix plates with different sizes, and the application range of the positioning piece is enlarged;
3. the second backing plate is arranged, the patch electronic element can be turned over through the second backing plate, and double-side lettering of the patch electronic element is achieved.
Drawings
Fig. 1 is a schematic structural diagram of a positioning device for a patch electronic component in the prior art.
Fig. 2 is a schematic structural diagram of a patch electronic component positioning device in an embodiment of the present application.
Fig. 3 is a schematic structural view of a positioning matrix board of the patch electronic component positioning device in an embodiment of the present application.
Fig. 4 is a schematic structural diagram of a base plate of a patch electronic component positioning device in an embodiment of the present application.
In the figure: 10. a base plate; 11. a fixing hole; 12. a positioning bar; 13. a positioning column; 14. a first positioning plate; 15. a second positioning plate; 20. a first backing plate; 30. positioning a matrix plate; 31. an accommodating area; 32. a square containing hole; 33. a communicating groove; A. a patch electronic component.
Detailed Description
The following are specific embodiments of the present invention, and the technical solutions of the present invention will be further described with reference to the accompanying drawings, but the present invention is not limited to these embodiments.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
As shown in fig. 2, the utility model discloses a paster electronic component positioner includes by lower supreme bottom plate 10, first backing plate 20 and the location matrix board 30 that stacks in proper order, and bottom plate 10 sets up on the workstation of equipment of carving characters is carved to the laser, still is provided with the setting element that is used for advancing line location to location matrix board 30 on the bottom plate 10, adjacent both sides limit butt on setting element and the location matrix board 30, and two are the location limit with the side of setting element butt.
As shown in fig. 2 and 3, the positioning matrix board 30 is recessed with a receiving area 31, a plurality of square receiving holes 32 penetrating through the upper and lower surfaces of the positioning matrix board 30 are provided in the receiving area 31, the length and width of the square receiving holes 32 are respectively 3/2 to 2 times of the length and width of the chip electronic component a, the thickness of the positioning matrix board 30 is 1 to 3/2 times of the thickness of the chip electronic component a, and the thickness of the receiving area 31 is equal to the thickness of the chip electronic component a.
The first base plate 20 is arranged between the bottom plate 10 and the positioning matrix plate 30, and is used for supporting the chip electronic component a and driving the chip electronic component a located in the square containing hole 32 to move when moving; the square housing hole 32 has four right angles, one of the right angles is set as a reference position, the first pad 20 is moved to make the chip electronic component a abut against two sides of the reference position in the square housing hole 32, and the positioning of the chip electronic component a is completed. The reference position is set according to a laser engraving program of the laser engraving device, and the directions of the reference positions of the square housing holes 32 are the same.
In a preferred embodiment, the reference position is set to a right angle closest to the intersection of two positioning sides in the square-shaped receiving hole 32 to reduce the influence on the position of the positioning matrix plate 30 when the first pad 20 is moved, and improve the positioning accuracy of the patch electronic component. When the chip electronic component a is positioned, the moving direction of the first backing plate 20 is a direction toward the intersection of the two positioning edges, and the first backing plate 20 also applies a force toward the intersection of the two positioning edges to the positioning matrix plate 30 when moving, so that the two positioning edges of the positioning matrix plate 30 are kept in abutment with the positioning element, thereby improving the positioning accuracy of the chip electronic component.
The utility model discloses an operation flow as follows:
(1) Arranging the positioning matrix board 30 on the first backing board 20, and placing a plurality of chip electronic elements A in the accommodating area 31;
(2) Shaking the positioning matrix plate 30 and the first backing plate 20 to make the chip electronic component A fall into the square containing hole 32;
(3) Removing the redundant chip electronic element A in the accommodating area 31;
(4) Placing the positioning matrix plate 30 and the first base plate 20 on the base plate 10, and moving the positioning matrix plate 30 so that the positioning matrix plate 30 is positioned by the positioning member;
(5) Moving the first backing plate 20, and driving the chip electronic component a to move to a set reference position through the first backing plate 20;
(6) And starting the laser lettering equipment to carve characters and patterns on the surface-mounted electronic element A.
In order to facilitate the removal of the excess chip electronic components a in the containing area 31 after the square containing holes 32 contain the chip electronic components a, in a preferred embodiment, the containing area 31 is communicated with the edge of the positioning matrix plate 30 through a communicating groove 33, and the communicating groove 33 is used for discharging the excess chip electronic components a. When the patch electronic component a is accommodated in each of the accommodation holes 32, the first backing plate 20 and the positioning matrix plate 30 are tilted so that the communication groove 33 is positioned lower than the accommodation area 31, and the first backing plate 20 and the positioning matrix plate 30 are shaken, and the excess patch electronic component a slides down from the communication groove 33 and is discharged under the action of shaking and gravity.
The first backing plate 20 drives the patch electronic component a to move by friction, and in order to enable the patch electronic component a to move smoothly, in a preferred embodiment, a non-slip surface is provided on a side of the backing plate 20 facing the positioning matrix plate 30. Specifically, the anti-slip surface may be a rough surface formed by sand blasting or sanding on the backing plate 20, or may be an anti-slip material layer, such as a rubber layer, disposed on the surface of the backing plate 20.
The first pad 20 needs to bear the weight of the positioning matrix plate 30 and the chip electronic component a, and if the friction coefficient between the first pad 20 and the bottom plate 10 is large, a large force needs to be applied to the first pad 20 to move the first pad 20, which is inconvenient for the operation of moving the first pad 20; in order to allow the first pad 20 to move smoothly, in a preferred embodiment, a side of the first pad 20 facing the base plate 10 is provided with a smooth surface; specifically, the smooth surface may be a smooth surface formed by polishing on the pad 20, or may be a smooth material layer, such as a teflon layer, provided on the first pad 20. In other embodiments, a smooth surface may be provided on the base plate 10 to reduce the coefficient of friction between the base plate 10 and the first shim plate 20.
In order to allow the spacer to be matched to various sizes of the positioning matrix plates 30, in a preferred embodiment, a plurality of fixing holes 11 are provided on the base plate 10, and the spacer is detachably mounted on the base plate 10 through the fixing holes 11, so that the positioning matrix plates 30 of various sizes can be matched by adjusting the positions of the spacers. In a specific embodiment, the fixing hole 11 is internally provided with threads, and the positioning piece is arranged on the fixing hole 11 through a bolt; in other embodiments, the positioning hole 11 may be a smooth hole inside, and the positioning member is installed on the fixing hole 11 by a pin.
In a preferred embodiment, the positioning member includes a positioning strip 12 and a positioning column 13, the positioning strip 12 and the positioning column 13 respectively abut against two adjacent edges of the positioning matrix plate 30, and the distribution direction of the positioning strip 12 is consistent with the extending direction of the side edge of the positioning matrix plate 30 that it abuts against. In other embodiments, the positioning element may also be two positioning strips 12, or may also be more than three positioning posts 13.
In order to facilitate the positioning of the plurality of chip electronic components a, to make the position deviation of the characters and patterns on each chip electronic component a smaller, and to improve the consistency of each batch of chip electronic components a, in a preferred embodiment, the adjacent accommodating holes 31 are equally spaced.
In some cases, both sides of the patch electronic component a need to be engraved with characters or patterns, and therefore, in a preferred embodiment, in order to realize double-sided engraving of the patch electronic component a, the patch electronic component a further includes a second backing plate, which is used for covering the positioning matrix plate 30 above the positioning matrix plate 30 before the positioning matrix plate 30 is turned over, and is used for supporting the patch electronic component a in the square accommodating hole 32 when the positioning matrix plate 30 is turned over, so as to prevent the patch electronic component a from falling off, and is used for driving the patch electronic component a in the square accommodating hole 32 to move after the positioning matrix plate 30 is turned over, so as to realize positioning of the patch electronic component a. In a preferred embodiment, the second shim plate is identical to the first shim plate 20.
Therefore, the operation flow of the present invention can further include the following steps:
(7) After characters and patterns are engraved on one surface of the surface-mount electronic element A, covering a second base plate above the positioning matrix plate 30;
(8) After the first base plate 20, the positioning matrix plate 30 and the second base plate are turned over together, the base plate 10 is placed on the bottom plate, and the bottom plate 10, the second base plate, the positioning matrix plate 30 and the first base plate 20 are stacked in sequence from bottom to top;
(9) Removing the first backing plate 20 and moving the positioning matrix plate 30 to position the positioning matrix plate 30 by the positioning piece;
(10) Moving the second base plate to enable the second base plate to drive the patch electronic element A to move to a set reference position;
(11) And starting the laser lettering equipment again, and lettering and patterns on the other surface of the surface-mounted electronic element A.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the first base plate and the positioning matrix plate are arranged, and the positioning matrix plate is provided with a plurality of square accommodating holes for accommodating the chip electronic elements, so that the chip electronic elements can be conveniently fed and positioned in a large batch, and the production efficiency of laser lettering is improved;
2. the positioning piece is detachably arranged on the bottom plate through the fixing hole, so that the position of the positioning piece can be adjusted, the positioning piece can be suitable for positioning matrix plates with different sizes, and the application range of the positioning piece is enlarged;
3. the second backing plate is arranged, the patch electronic element can be turned over through the second backing plate, and double-side lettering of the patch electronic element is achieved.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the scope of the present invention.
Claims (9)
1. A paster electronic component positioner which characterized in that:
the positioning device comprises a bottom plate (10), a first base plate (20) and a positioning matrix plate (30), wherein a positioning piece for positioning the positioning matrix plate (30) is arranged on the bottom plate (10);
an accommodating area (31) is concavely arranged on the positioning matrix board (30), a plurality of square accommodating holes (32) penetrating through the upper surface and the lower surface of the positioning matrix board (30) are arranged in the accommodating area (31), the length and the width of each square accommodating hole (32) are respectively 3/2-2 times of the length and the width of the patch electronic element (A), the thickness of the positioning matrix board (30) is 1-3/2 times of the thickness of the patch electronic element (A), and the thickness of the accommodating area (31) is equivalent to that of the patch electronic element (A);
the first base plate (20) is placed between the bottom plate (10) and the positioning matrix plate (30) and used for supporting the patch electronic element (A) and driving the patch electronic element (A) in the square containing hole (32) to move when moving.
2. A patch electronic component positioning device as claimed in claim 1, wherein:
the accommodating area (31) is communicated with the edge of the positioning matrix plate (30) through a communicating groove (33).
3. A patch electronic component positioning device as claimed in claim 1, wherein:
and one surface of the first base plate (20) facing the positioning matrix plate (30) is provided with an anti-slip surface.
4. A patch electronic component positioning device as claimed in claim 1, wherein:
one surface of the first base plate (20) facing the bottom plate (10) is provided with a smooth surface.
5. A patch electronic component positioning device as claimed in claim 1, wherein:
the positioning piece is characterized in that a plurality of fixing holes (11) are formed in the bottom plate (10), and the positioning piece is detachably mounted on the bottom plate (10) through the fixing holes (11).
6. A patch electronic component positioning device as claimed in claim 5, wherein:
threads are arranged in the fixing hole (11), and the positioning piece is installed on the fixing hole (11) through a bolt.
7. A patch electronic component positioning device as claimed in any one of claims 1-6, wherein:
the setting element includes location strip (12) and reference column (13), location strip (12) and reference column (13) respectively with the adjacent both sides limit butt of location matrix board (30), the distribution direction of location strip (12) and its butt the extending direction of the side of location matrix board (30) is unanimous.
8. A patch electronic component positioning device as claimed in any one of claims 1-6, wherein:
the adjacent accommodating areas (31) have equal intervals.
9. A patch electronic component positioning device as claimed in any one of claims 1-6, wherein:
still include the second backing plate, the second backing plate is in the upset be used for the lid to establish before location matrix board (30) the top of location matrix board (30) to in the upset be used for right during location matrix board (30) in square holding hole (32) paster electron element (A) support, and in the upset be used for driving behind location matrix board (30) and be located paster electron element (A) in square holding hole (32) remove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222370025.3U CN218555977U (en) | 2022-09-06 | 2022-09-06 | Paster electronic component positioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222370025.3U CN218555977U (en) | 2022-09-06 | 2022-09-06 | Paster electronic component positioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218555977U true CN218555977U (en) | 2023-03-03 |
Family
ID=85310548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222370025.3U Active CN218555977U (en) | 2022-09-06 | 2022-09-06 | Paster electronic component positioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218555977U (en) |
-
2022
- 2022-09-06 CN CN202222370025.3U patent/CN218555977U/en active Active
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