JPH11204173A - Connector for bga - Google Patents

Connector for bga

Info

Publication number
JPH11204173A
JPH11204173A JP9365125A JP36512597A JPH11204173A JP H11204173 A JPH11204173 A JP H11204173A JP 9365125 A JP9365125 A JP 9365125A JP 36512597 A JP36512597 A JP 36512597A JP H11204173 A JPH11204173 A JP H11204173A
Authority
JP
Japan
Prior art keywords
bga
connector
resistance heating
conductive pads
connector base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9365125A
Other languages
Japanese (ja)
Inventor
Atsuto Noda
野田敦人
Hiroyuki Fujii
藤井宏之
Masahito Okano
岡野雅人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Molex LLC
Original Assignee
Molex LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex LLC filed Critical Molex LLC
Priority to JP9365125A priority Critical patent/JPH11204173A/en
Priority to CN98804211A priority patent/CN1252894A/en
Priority to EP98964132A priority patent/EP0970522A1/en
Priority to PCT/US1998/027066 priority patent/WO1999033109A1/en
Publication of JPH11204173A publication Critical patent/JPH11204173A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a connector for BGA which does not damage the solder balls of a BGA package, eliminates a pressing mechanism to the BGA package, and is capable of making the height as small as possible. SOLUTION: A connector for BGA has a connector base 2 formed by arranging many conductive pads 3a, 3b on the surface 2a and the back 2b, and electrically connecting the conductive pads on the surface and the back with a via hole 4, a solder ball 5 formed in each conductive pad on the back 2b, and a high resistance heater 7 formed so as to thread a space through the conductive pads on the surface 2a. Solder balls 11 of a BGA package 10 are brought into contact with the conductive pads on the surface 2a, heat is generated with the high resistance heater 7 to solder the corresponding conductive pad and the solder ball of the BGA package 10, and the soldered ball 11 is made detachable from the conductive pad by heating with the high resistance heater 7.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明は、半田ボールが格子状に
設けられているＢＧＡパッケージと回路基板の接続に使
用するＢＧＡ用コネクタに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a BGA connector used for connecting a BGA package provided with solder balls in a lattice pattern to a circuit board.

【０００２】[0002]

【従来の技術】従来、半田ボールが格子状に設けられて
いるＢＧＡパッケージと回路基板の接続に使用できるよ
うにしたＢＧＡ用コネクタは、例えば、特開平８−３３
０００５号公報に開示された「ＢＧＡ用コンタクト」の
ように、絶縁性の基板（コネクタベース）にＢＧＡパッ
ケージの半田ボールと１対１で対応させて、金属スプリ
ング構造のコンタクトを設けて構成していた。コンタク
トとＢＧＡパッケージの半田ボールを対向させると共
に、ＢＧＡパッケージをコンタクト側に押圧状態で保持
することによって、半田ボールとコンタクトを電気的に
係合させて、ＢＧＡパッケージの着脱を可能にしてい
た。2. Description of the Related Art Conventionally, a BGA connector which can be used to connect a circuit board to a BGA package in which solder balls are provided in a grid pattern is disclosed in, for example, Japanese Patent Application Laid-Open No. 8-33.
As in the "BGA contact" disclosed in Japanese Patent Publication No. 0005, a metal spring structure contact is provided on an insulating substrate (connector base) in one-to-one correspondence with a BGA package solder ball. Was. By making the contact and the solder ball of the BGA package face each other, and holding the BGA package on the contact side in a pressed state, the solder ball and the contact are electrically engaged, and the BGA package can be attached and detached.

【０００３】[0003]

【発明が解決しようとする課題】前記のような従来のＢ
ＧＡ用コネクタでは、ＢＧＡパッケージの半田ボールに
対してＢＧＡ用コネクタのコンタクトが圧接することに
なるので、半田ボールの表面に傷を付けたり、半田ボー
ルを変形させたりし、半田ボールにダメージを与える問
題点があった。また、半田ボールとコンタクトの間で、
確実な電気的係合を形成するために、係合部に比較的高
い接触圧力が必要であり、このためのＢＧＡパッケージ
に対する押圧機構をコネクタに備える必要があり、構造
が複雑化する問題点があった。更に、コネクタを構成す
るコンタクトにばね性能を保有させるために、コンタク
トにはある程度の長さが必要であり、コネクタの高さが
高くなり、また、コンタクトの長さに比例してインダク
タンスが大きくなるなどの問題点があった。The conventional B as described above
In the GA connector, the contact of the BGA connector is pressed against the solder ball of the BGA package, so that the surface of the solder ball is scratched, the solder ball is deformed, and the solder ball is damaged. There was a problem. Also, between the solder ball and the contact,
In order to form a reliable electrical engagement, a relatively high contact pressure is required at the engagement portion, and it is necessary to provide the connector with a pressing mechanism for the BGA package, which complicates the structure. there were. Furthermore, in order for the contacts constituting the connector to have spring performance, the contacts need to have a certain length, the height of the connector increases, and the inductance increases in proportion to the length of the contacts. There were problems such as.

【０００４】本発明は斯かる問題点に鑑みてなされたも
ので、ＢＧＡパッケージの半田ボールにダメージを与え
ないようにし、ＢＧＡパッケージに対する押圧機構を不
要とし、かつ、高さを可及的に小さくできるＢＧＡ用コ
ネクタを提供することを目的としている。[0004] The present invention has been made in view of the above problems, and does not damage solder balls of a BGA package, eliminates the need for a pressing mechanism for the BGA package, and makes the height as small as possible. It is an object of the present invention to provide a BGA connector that can be used.

【０００５】[0005]

【課題を解決するための手段】前記の目的のもとになさ
れた本発明は、ＢＧＡパッケージの半田ボールを溶融す
るための高抵抗発熱体を、半田ボールと対向する導電パ
ッドに近接して設けたものである。SUMMARY OF THE INVENTION The present invention, which has been made with the above object, provides a high resistance heating element for melting a solder ball of a BGA package in proximity to a conductive pad facing the solder ball. It is a thing.

【０００６】即ち本発明は、表面及び裏面に、それぞ
れ、多数の導電パッドが設けられ、表裏面の導電パッド
相互がバイアホールによって１対１の関係で互いに電気
的に導通している板状のコネクタベースと、コネクタベ
ースの一方の面の各導電パッドに設けられた金属ボール
と、コネクタベースの他方の面の導電パッド間を縫うよ
うに設けられた高抵抗発熱体と、を備えていることを特
徴とするＢＧＡ用コネクタである。That is, according to the present invention, a large number of conductive pads are provided on the front and back surfaces, respectively, and the conductive pads on the front and back surfaces are electrically connected to each other by via holes in a one-to-one relationship. A connector base, a metal ball provided on each conductive pad on one surface of the connector base, and a high resistance heating element provided so as to sew between conductive pads on the other surface of the connector base. This is a BGA connector characterized by the following.

【０００７】また、表面及び裏面に、それぞれ、多数の
導電パッドが設けられ、表裏面の導電パッド相互がバイ
アホールによって１対１の関係で互いに電気的に導通し
ている板状のコネクタベースと、コネクタベースの一方
の面の各導電パッドに設けられた金属ボールと、コネク
タベースの他方の面の導電パッド間を縫うように設けら
れた高抵抗発熱体と、を備えて成り、コネクタベースの
他方の面の導電パッドに、ＢＧＡパッケージの半田ボー
ルを当接させると共に、高抵抗発熱体に電力を供給して
発熱させることで、ＢＧＡパッケージの半田ボールを溶
融させて対応導電パッドと半田付けが可能であり、か
つ、導電パッドに半田付けされた半田ボールが、高抵抗
発熱体に電力を供給して発熱させることで、半田ボール
を溶融させて半田付けされた導電パッドより離脱可能と
したことを特徴とするＢＧＡ用コネクタである。Also, a plurality of conductive pads are provided on the front surface and the rear surface, respectively, and the conductive pads on the front and rear surfaces are electrically connected to each other by via holes in a one-to-one relationship. A metal ball provided on each conductive pad on one surface of the connector base, and a high-resistance heating element provided so as to sew between the conductive pads on the other surface of the connector base. The solder balls of the BGA package are brought into contact with the conductive pads on the other surface, and power is supplied to the high-resistance heating element to generate heat, thereby melting the solder balls of the BGA package and soldering to the corresponding conductive pads. It is possible, and the solder ball soldered to the conductive pad supplies power to the high resistance heating element to generate heat, so that the solder ball is melted and soldered It is a BGA connector, characterized in that the detachable from conductive pads.

【０００８】前記において、高抵抗発熱体は、コネクタ
ベースの他方の面に近接させて張設した１本乃至複数本
の、ニクロム線などの高抵抗発熱線で構成することがで
き、或は、コネクタベースの他方の面に付着させた１乃
至複数の、ニクロムその他の高抵抗発熱材の薄膜で構成
することができる。この薄膜は、蒸着やスパッタリング
などの真空薄膜形成技術で形成できるほか、フォトリソ
グラフィーや印刷の技術によって形成することもでき
る。In the above, the high-resistance heating element may be constituted by one or more high-resistance heating wires such as nichrome wires stretched close to the other surface of the connector base. It can be composed of one or more thin films of nichrome or other high resistance heating material attached to the other surface of the connector base. This thin film can be formed by a vacuum thin film forming technique such as vapor deposition or sputtering, or can be formed by a photolithography or printing technique.

【０００９】コネクタベースの他方の面に設けられる金
属ボールは、半田ボールが主として採用されるが、銅ボ
ールなど、半田付けが可能なその他の金属ボールであっ
ても良い。As the metal balls provided on the other surface of the connector base, solder balls are mainly used, but other metal balls that can be soldered, such as copper balls, may be used.

【００１０】板状のコネクタベースは、セラミックス、
ＢＴレジンその他の合成樹脂、ガラス繊維入り複合樹脂
などの絶縁性の板材を使用する。[0010] The plate-shaped connector base is made of ceramics,
An insulating plate material such as BT resin or other synthetic resin, or a composite resin containing glass fiber is used.

【００１１】[0011]

【作用】本発明のＢＧＡ用コネクタによれば、ＢＧＡパ
ッケージの半田ボールを高抵抗発熱体の発熱を介して溶
融させて導電パッドと着脱するようにできるので、半田
ボールに対するダメージを無くすることができる。しか
も、ＢＧＡパッケージの半田ボールと導電パッドは、両
者を半田付けすることで導電を図るので、ＢＧＡパッケ
ージを押圧するための機構を不要にすることができる。
また、ＢＧＡパッケージと回路基板の間は、コネクタベ
ースの厚さだけが介在する構成にできるので、コネクタ
としての高さが低くでき、また、この間のインダクタン
スを極めて小さくすることができる。According to the BGA connector of the present invention, the solder balls of the BGA package can be melted through the heat generated by the high-resistance heating element and can be attached to and detached from the conductive pads, thereby eliminating damage to the solder balls. it can. In addition, since the solder balls and the conductive pads of the BGA package are electrically conductive by soldering them, a mechanism for pressing the BGA package can be eliminated.
Further, since only the thickness of the connector base is interposed between the BGA package and the circuit board, the height of the connector can be reduced, and the inductance therebetween can be extremely reduced.

【００１２】[0012]

【実施例】以下、本発明の実施例を添付の図を参照して
説明する。図１は実施例のＢＧＡ用コネクタ１の一部拡
大断面図であり、図２は同じく実施例のＢＧＡ用コネク
タ１の一部を破切して示した模式図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a partially enlarged cross-sectional view of the BGA connector 1 of the embodiment, and FIG. 2 is a schematic diagram showing a part of the BGA connector 1 of the embodiment in a cut-away manner.

【００１３】このＢＧＡ用コネクタ１は、絶縁性の板状
部材で成るコネクタベース２の表面２ａと裏面２ｂに、
それぞれ、多数の導電パッド３ａ、３ｂが格子状に設け
られ、表面２ａの導電パッド３ａと裏面２ｂの導電パッ
ド３ｂが、コネクタベース２を貫通して設けられている
バイアホール４によって、１対１の関係で電気的に導通
している。The BGA connector 1 has a front surface 2a and a rear surface 2b of a connector base 2 made of an insulating plate member.
A large number of conductive pads 3a, 3b are provided in a grid pattern, and the conductive pad 3a on the front surface 2a and the conductive pad 3b on the back surface 2b are formed one-to-one by via holes 4 provided through the connector base 2. Electrically conductive in the relationship of

【００１４】コネクタベース２の裏面２ｂに設けられた
導電パッド３ｂには、更に、半田ボール５が設けられて
いる。また、コネクタベース２の表面２ａには、格子状
に設けられた導電パッド３ａの間を縫うようにして表面
２ａに近接させて１本のニクロム線６が張設してあり高
抵抗発熱体７を構成してある。この高抵抗発熱体７のニ
クロム線６を通して電力を供給することによって、高抵
抗発熱体７が発熱し、コネクタベース２の表面２ａ近傍
を加熱できるようにしてある。The conductive pads 3b provided on the back surface 2b of the connector base 2 are further provided with solder balls 5. On the surface 2a of the connector base 2, one nichrome wire 6 is stretched close to the surface 2a so as to sew between the conductive pads 3a provided in a grid pattern. Is configured. By supplying power through the nichrome wire 6 of the high-resistance heating element 7, the high-resistance heating element 7 generates heat, so that the vicinity of the surface 2a of the connector base 2 can be heated.

【００１５】上記実施例のＢＧＡ用コネクタ１は、図１
に示したように、回路基板８上に設置して使用する。回
路基板８には、コネクタベース２の裏面２ｂに設けた半
田ボール５と１対１で対向する導電パッド９が設けてあ
り、この導電パッド９と半田ボール５を半田付けして使
用する。ＢＧＡパッケージ１０は、コネクタベース２の
表面２ａ側から、その半田ボール１１をコネクタベース
２の表面２ａに設けた導電パッド３ａと１対１で対向、
当接させ、この状態で高抵抗発熱体７に電力を供給す
る。高抵抗発熱体７に電力を供給すると、コネクタベー
ス２の表面２ａ近傍が加熱されることから、ＢＧＡパッ
ケージ１０の半田ボール１１が溶融して、表面２ａの導
電パッド３ａに半田付けされ、ＢＧＡパッケージ１０と
回路基板８が接続された状態にすることができる。The BGA connector 1 of the above embodiment is shown in FIG.
As shown in (1), it is installed on the circuit board 8 and used. The circuit board 8 is provided with a conductive pad 9 which faces the solder ball 5 provided on the back surface 2b of the connector base 2 on a one-to-one basis. The conductive pad 9 and the solder ball 5 are used by soldering. In the BGA package 10, the solder balls 11 face the conductive pads 3 a provided on the front surface 2 a of the connector base 2 on a one-to-one basis from the front surface 2 a side of the connector base 2.
The power is supplied to the high-resistance heating element 7 in this state. When power is supplied to the high-resistance heating element 7, the vicinity of the surface 2a of the connector base 2 is heated, so that the solder balls 11 of the BGA package 10 are melted and soldered to the conductive pads 3a on the surface 2a. 10 and the circuit board 8 can be connected.

【００１６】また、上記のようにして接続された状態に
あるＢＧＡパッケージ１０を脱着する際は、高抵抗発熱
体７を構成しているニクロム線６を通して電力を供給し
て、コネクタベース２の表面２ａ近傍を加熱するように
する。高抵抗発熱体７の発熱によって、ＢＧＡパッケー
ジ１０の半田ボール１１が溶融するので、ＢＧＡ用コネ
クタ１上のＢＧＡパッケージ１０を脱着することができ
る。When the BGA package 10 connected as described above is attached or detached, electric power is supplied through the nichrome wire 6 constituting the high-resistance heating element 7 and the surface of the connector base 2 is supplied. The vicinity of 2a is heated. Since the solder balls 11 of the BGA package 10 are melted by the heat generated by the high resistance heating element 7, the BGA package 10 on the BGA connector 1 can be detached.

【００１７】上記実施例においては、高抵抗発熱体７を
ニクロム線６で構成したが、タンタル線その他の高抵抗
金属線で構成することもできる。また、金属線に代え
て、高抵抗発熱材の薄膜を、蒸着やスパッタリングなど
の真空薄膜形成技術によって、コネクタベース２の表面
２ａ上に直接設けることもできる。更には、コネクタベ
ース２の表面２ａに薄膜を直接形成できる、露光、レジ
スト除去などの工程で成るフォトリソグラフィーや印刷
技術を採用することもできる。薄膜を表面２ａに直接形
成する場合には、表面２ａの導電パッド３ａの設置と同
時に行うことができる。In the above embodiment, the high-resistance heating element 7 is made of the nichrome wire 6, but may be made of a tantalum wire or another high-resistance metal wire. In place of the metal wire, a thin film of a high-resistance heating material may be provided directly on the surface 2a of the connector base 2 by a vacuum thin film forming technique such as vapor deposition or sputtering. Furthermore, a photolithography or printing technique that can form a thin film directly on the surface 2a of the connector base 2 and that includes processes such as exposure and resist removal can also be adopted. When a thin film is formed directly on the surface 2a, it can be formed simultaneously with the installation of the conductive pads 3a on the surface 2a.

【００１８】コネクタベース２の裏面２ｂ側に設けた半
田ボール５は、銅ボールなどとすることもできる。裏面
２ｂの導電パッド３ｂ及び回路基板８上の導電パッド９
と半田付けが可能な金属（合金を含む）であれば、いか
なる材質のものでも採用することができる。The solder balls 5 provided on the back surface 2b of the connector base 2 may be copper balls or the like. Conductive pad 3b on back surface 2b and conductive pad 9 on circuit board 8
Any material can be used as long as it is a metal (including an alloy) that can be soldered.

【００１９】コネクタベース２の材質は、薄くて強靭な
絶縁性材料とする。アルミナ、ガラスなどのセラミック
スや、プラスチックＢＧＡの分野で採用されているＢＴ
レジンや、プリント回路基板の分野で採用されているガ
ラス繊維入り複合樹脂などが代表的である。ＢＴレジン
やガラス繊維入り複合樹脂によるコネクタベース２で
は、コネクタベース２内部に、信号層、グランド層、Ｖ
ｃｃ層、配線層などを多重構造で設けた構造とすること
ができる。The material of the connector base 2 is a thin and tough insulating material. BT used in ceramics such as alumina and glass, and plastic BGA
Typical examples are resins and composite resins containing glass fibers used in the field of printed circuit boards. In the connector base 2 made of BT resin or a composite resin containing glass fiber, a signal layer, a ground layer, a V
A structure in which a cc layer, a wiring layer, and the like are provided in a multiplex structure can be employed.

【００２０】コネクタベース２の表面２ａ及び裏面２ｂ
に、それぞれ、格子状に設けた導電パッド３ａ、３ｂ
は、同心円状や放射状のパターンで設けるようにしても
良い。Front surface 2a and back surface 2b of connector base 2
Conductive pads 3a, 3b provided in a grid
May be provided in a concentric or radial pattern.

【００２１】[0021]

【発明の効果】以上に説明の通り、本発明によれば、コ
ネクタベースの表面（他方の面）に高抵抗発熱体を設け
て、ＢＧＡパッケージの半田ボールを溶融させて、半田
付け及び脱着ができるようにしたので、ＢＧＡパッケー
ジの半田ボールにダメージを与えないようにできると共
に、ＢＧＡパッケージに対する押圧機構を不要とし、か
つ、高さを可及的に小さくできるＢＧＡ用コネクタを構
成することができる。As described above, according to the present invention, a high resistance heating element is provided on the surface (the other surface) of the connector base to melt the solder balls of the BGA package so that soldering and detachment can be performed. Since it is possible to do so, it is possible to prevent the solder balls of the BGA package from being damaged, to eliminate the need for a pressing mechanism for the BGA package, and to configure a BGA connector capable of minimizing the height. .

【図面の簡単な説明】[Brief description of the drawings]

【図１】 本発明の実施例のＢＧＡ用コネクタの一部拡
大断面図である。FIG. 1 is a partially enlarged sectional view of a BGA connector according to an embodiment of the present invention.

【図２】 同じく実施例のＢＧＡ用コネクタの一部を破
切して示した模式図である。FIG. 2 is a schematic view showing a part of the BGA connector of the embodiment in a cut-away manner.

【符号の説明】[Explanation of symbols]

１ ＢＧＡ用コネクタ ２ コネクタベース ２ａ コネクタベースの表面（他方の面） ２ｂ コネクタベースの裏面（一方の面） ３ａ、３ｂ 導電パッド ４ バイアホール ５ 半田ボール ６ ニクロム線 ７ 高抵抗発熱体 ８ 回路基板 ９ 回路基板上の導電パッド １０ ＢＧＡパッケージ １１ ＢＧＡパッケージの半田ボール Reference Signs List 1 connector for BGA 2 connector base 2a surface of connector base (other surface) 2b back surface of connector base (one surface) 3a, 3b conductive pad 4 via hole 5 solder ball 6 nichrome wire 7 high resistance heating element 8 circuit board 9 Conductive pads on circuit board 10 BGA package 11 BGA package solder balls

─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成１０年１月１９日[Submission date] January 19, 1998

【手続補正１】[Procedure amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】００１６[Correction target item name] 0016

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【００１６】また、上記のようにして接続された状態に
あるＢＧＡパッケージ１０を離脱する際は、高抵抗発熱
体７を構成しているニクロム線６を通して電力を供給し
て、コネクタベース２の表面２ａ近傍を加熱するように
する。高抵抗発熱体７の発熱によって、ＢＧＡパッケー
ジ１０の半田ボール１１が溶融するので、ＢＧＡ用コネ
クタ１上のＢＧＡパッケージ１０を離脱することができ
る。When the BGA package 10 connected as described above is detached, power is supplied through the nichrome wire 6 constituting the high-resistance heating element 7 so that the surface of the connector base 2 can be removed. The vicinity of 2a is heated. Since the solder balls 11 of the BGA package 10 are melted by the heat generated by the high resistance heating element 7, the BGA package 10 on the BGA connector 1 can be detached.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 岡野雅人 神奈川県大和市深見東１−５−４ 日本モ レックス株式会社 内 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Masato Okano 1-5-4 Fukamihigashi, Yamato-shi, Kanagawa Japan Nihon Molex Co., Ltd.

Claims (6)

【特許請求の範囲】[Claims] 【請求項１】 表面２ａ及び裏面２ｂに、それぞれ、
多数の導電パッド３ａ、３ｂが設けられ、表裏面２ａ、
２ｂの導電パッド３ａ、３ｂ相互がバイアホール４によ
って１対１の関係で互いに電気的に導通している板状の
コネクタベース２と、 コネクタベース２の一方の面２ｂの各導電パッド３ｂに
設けられた金属ボール５と、 コネクタベース２の他方の面２ａの導電パッド３ａ間を
縫うように設けられた高抵抗発熱体７と、を備えている
ことを特徴とするＢＧＡ用コネクタ。1. A front surface 2a and a back surface 2b, respectively,
A large number of conductive pads 3a, 3b are provided,
The conductive pads 3a and 3b are provided on the plate-shaped connector base 2 in which the vias 4 electrically connect the conductive pads 3a and 3b to each other in a one-to-one relationship, and provided on each of the conductive pads 3b on one surface 2b of the connector base 2. A BGA connector comprising: a metal ball 5 provided; and a high-resistance heating element 7 provided so as to sew between conductive pads 3a on the other surface 2a of the connector base 2. 【請求項２】 高抵抗発熱体７は、コネクタベース２
の他方の面２ａに近接させて張設した高抵抗発熱線６で
構成した請求項１に記載のＢＧＡ用コネクタ。2. The high resistance heating element 7 includes a connector base 2
2. The BGA connector according to claim 1, comprising a high-resistance heating wire 6 stretched close to the other surface 2a of the BGA. 【請求項３】 高抵抗発熱体７は、コネクタベース２
の他方の面２ａに付着させた高抵抗発熱材の薄膜で構成
した請求項１に記載のＢＧＡ用コネクタ。3. The high-resistance heating element 7 includes a connector base 2
2. The BGA connector according to claim 1, wherein the BGA connector is formed of a thin film of a high-resistance heating material attached to the other surface 2a of the BGA. 【請求項４】 表面２ａ及び裏面２ｂに、それぞれ、
多数の導電パッド３ａ、３ｂが設けられ、表裏面２ａ、
２ｂの導電パッド３ａ、３ｂ相互がバイアホール４によ
って１対１の関係で互いに電気的に導通している板状の
コネクタベース２と、 コネクタベース２の一方の面２ｂの各導電パッド３ｂに
設けられた金属ボール５と、 コネクタベース２の他方の面２ａの導電パッド３ａ間を
縫うように設けられた高抵抗発熱体７と、を備えて成
り、 コネクタベース２の他方の面２ａの導電パッド３ａに、
ＢＧＡパッケージ１０の半田ボール１１を当接させると
共に、高抵抗発熱体７に電力を供給して発熱させること
で、ＢＧＡパッケージ１０の半田ボール１１を溶融させ
て対応導電パッド３ａと半田付けが可能であり、かつ、
導電パッド３ａに半田付けされた半田ボール１１が、高
抵抗発熱体７に電力を供給して発熱させることで、半田
ボール１１を溶融させて半田付けされた導電パッド３ａ
より離脱可能としたことを特徴とするＢＧＡ用コネク
タ。4. On the front surface 2a and the back surface 2b,
A large number of conductive pads 3a, 3b are provided,
The conductive pads 3a and 3b are provided on the plate-shaped connector base 2 in which the vias 4 electrically connect the conductive pads 3a and 3b to each other in a one-to-one relationship, and provided on each of the conductive pads 3b on one surface 2b of the connector base 2. And a high-resistance heating element 7 provided so as to sew between the conductive pads 3a on the other surface 2a of the connector base 2 and a conductive pad on the other surface 2a of the connector base 2. In 3a,
The solder balls 11 of the BGA package 10 are brought into contact with each other, and the power is supplied to the high-resistance heating element 7 to generate heat. Yes, and
The solder ball 11 soldered to the conductive pad 3a supplies power to the high-resistance heating element 7 to generate heat, thereby melting the solder ball 11 and soldering the conductive pad 3a.
BGA connector characterized by being more detachable. 【請求項５】 高抵抗発熱体７は、コネクタベース２
の他方の面２ａに近接させて張設した高抵抗発熱線６で
構成した請求項４に記載のＢＧＡ用コネクタ。5. The high resistance heating element 7 includes a connector base 2
5. The BGA connector according to claim 4, comprising a high resistance heating wire 6 stretched close to the other surface 2a of the BGA. 【請求項６】 高抵抗発熱体７は、コネクタベース２
の他方の面２ａに付着させた高抵抗発熱材の薄膜で構成
した請求項４に記載のＢＧＡ用コネクタ。6. The high resistance heating element 7 includes a connector base 2
5. The BGA connector according to claim 4, wherein the BGA connector is formed of a thin film of a high-resistance heating material attached to the other surface 2a of the BGA.
JP9365125A 1997-12-19 1997-12-19 Connector for bga Pending JPH11204173A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP9365125A JPH11204173A (en) 1997-12-19 1997-12-19 Connector for bga
CN98804211A CN1252894A (en) 1997-12-19 1998-12-18 BGA connector with heat activated connection and disconnection means
EP98964132A EP0970522A1 (en) 1997-12-19 1998-12-18 Bga connector with heat activated connection and disconnection means
PCT/US1998/027066 WO1999033109A1 (en) 1997-12-19 1998-12-18 Bga connector with heat activated connection and disconnection means

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9365125A JPH11204173A (en) 1997-12-19 1997-12-19 Connector for bga

Publications (1)

Publication Number Publication Date
JPH11204173A true JPH11204173A (en) 1999-07-30

Family

ID=18483492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9365125A Pending JPH11204173A (en) 1997-12-19 1997-12-19 Connector for bga

Country Status (4)

Country Link
EP (1) EP0970522A1 (en)
JP (1) JPH11204173A (en)
CN (1) CN1252894A (en)
WO (1) WO1999033109A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010055681A (en) * 1999-12-11 2001-07-04 이형도 Device for combine bga substrates in pcb
US7696617B2 (en) 2003-05-30 2010-04-13 Shinko Electric Industries Co., Ltd. Package for semiconductor devices
CN102707219A (en) * 2012-06-21 2012-10-03 上海华岭集成电路技术股份有限公司 Testing device for semiconductor device test

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2796497B1 (en) * 1999-07-13 2001-09-07 Thomson Csf Detexis PERFECTED INTERCONNECTION BETWEEN AN ELECTRONIC COMPONENT AND A CARD
US6816385B1 (en) * 2000-11-16 2004-11-09 International Business Machines Corporation Compliant laminate connector
CN102621466B (en) * 2012-03-22 2015-02-11 上海华力微电子有限公司 Aging test board and method for manufacturing same
CN107732488A (en) * 2016-08-10 2018-02-23 泰科电子(上海)有限公司 Connector
CN108834304A (en) * 2018-07-17 2018-11-16 盛世瑶兰（深圳）科技有限公司 A kind of printed circuit board and its method for maintaining

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Publication number Priority date Publication date Assignee Title
US4813128A (en) * 1988-01-13 1989-03-21 Cray Research, Inc. High density disposable printed circuit inter-board connector
US5093987A (en) * 1990-12-21 1992-03-10 Amp Incorporated Method of assembling a connector to a circuit element and soldering component for use therein
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5691041A (en) * 1995-09-29 1997-11-25 International Business Machines Corporation Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010055681A (en) * 1999-12-11 2001-07-04 이형도 Device for combine bga substrates in pcb
US7696617B2 (en) 2003-05-30 2010-04-13 Shinko Electric Industries Co., Ltd. Package for semiconductor devices
CN102707219A (en) * 2012-06-21 2012-10-03 上海华岭集成电路技术股份有限公司 Testing device for semiconductor device test

Also Published As

Publication number Publication date
WO1999033109A1 (en) 1999-07-01
CN1252894A (en) 2000-05-10
EP0970522A1 (en) 2000-01-12

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