KR20010055681A - Device for combine bga substrates in pcb - Google Patents
Device for combine bga substrates in pcb Download PDFInfo
- Publication number
- KR20010055681A KR20010055681A KR1019990056944A KR19990056944A KR20010055681A KR 20010055681 A KR20010055681 A KR 20010055681A KR 1019990056944 A KR1019990056944 A KR 1019990056944A KR 19990056944 A KR19990056944 A KR 19990056944A KR 20010055681 A KR20010055681 A KR 20010055681A
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- South Korea
- Prior art keywords
- pcb
- bga
- bga substrate
- substrate
- board
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims description 85
- 229910000679 solder Inorganic materials 0.000 claims abstract description 31
- ARXHIJMGSIYYRZ-UHFFFAOYSA-N 1,2,4-trichloro-3-(3,4-dichlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=C(Cl)C=CC(Cl)=C1Cl ARXHIJMGSIYYRZ-UHFFFAOYSA-N 0.000 claims description 18
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 239000004020 conductor Substances 0.000 abstract description 13
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 5
- 230000035515 penetration Effects 0.000 abstract 1
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 6
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- ZLGYJAIAVPVCNF-UHFFFAOYSA-N 1,2,4-trichloro-5-(3,5-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(C=2C(=CC(Cl)=C(Cl)C=2)Cl)=C1 ZLGYJAIAVPVCNF-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
- F16B5/02—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of fastening members using screw-thread
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
본 발명은 반도체 칩(Chip)이 장착되는 비 지 에이(Ball Grid Array)기판(이하 "BGA 기판" 이라함)을 인쇄회로기판(이하 "PCB" 라함) 내부에 가열에 의한 솔더링 결합없이 손쉽고, 용이하게 결합하여 고정시킬 수 있는 PCB의 BGA 기판 결합장치에 관한 것으로 이는 특히, BGA 기판의 저부에 형성되는 다수의 솔더볼(Solder Ball)이 PCB의 BGA 장착부에 인쇄되는 패드 상측으로 위치되며, 상기 BGA 기판 각 모서리부에 관통홀이 천설되어, PCB와 볼트로서 결합하여 BGA 기판을 고정토록 함으로 인하여, PCB상에 BGA 기판의 결합시 상기 BGA 기판을 볼트로서 결합하는 간단한 동작에 의해 BGA 기판의 솔더볼이 PCB의 패드에 일정한 압력으로 결합되어 고정될 수 있도록 하며, 이에따라 BGA 기판의 결합을 위한 솔더볼을 가열할 필요없이 PCB 기판상에 손쉽고, 용이하게 결합하여 고정하고, BGA 기판의 분해가 용이하게 이루어질 수 있도록한 PCB의 BGA 기판 결합장치에 관한 것이다.The present invention is easy without a soldering bond by heating a ball grid array substrate (hereinafter referred to as "BGA substrate") on which a semiconductor chip (Chip) is mounted inside a printed circuit board (hereinafter referred to as "PCB"), The BGA substrate bonding device of the PCB that can be easily bonded and fixed, which is particularly, a plurality of solder balls (Solder Ball) formed on the bottom of the BGA substrate is located above the pad printed on the BGA mounting portion of the PCB, the BGA Through-holes are formed at each corner of the substrate to bond the PCB to the bolts to fix the BGA substrate. When the BGA substrate is bonded to the PCB, the solder balls of the BGA substrate are easily connected by the bolts. It can be combined and fixed to the pad of the PCB at a constant pressure, and thus, it is easy and easy to bond and fix on the PCB substrate without the need to heat the solder balls for bonding the BGA substrate. The present invention relates to a BGA substrate bonding apparatus of a PCB that enables easy disassembly of a substrate.
일반적으로 알려져있는 BGA 기판은, 기판 표면으로 반도체의 칩이 실장되고, 상기 반도체 칩 실장부위의 저부에는 다수의 솔더볼이 형성되어 PCB상에 인쇄된 패드와 가열에 의해 솔더링 결합토록 되는 것이다.In general known BGA substrates, a semiconductor chip is mounted on the substrate surface, and a plurality of solder balls are formed at the bottom of the semiconductor chip mounting portion to be soldered and bonded by heating with a pad printed on the PCB.
이와같은 기술과 관련된 종래의 BGA 기판의 결합구조에 있어서는 도 1에 도시한 바와같이, PCB(10)상에 BGA 기판(20)이 내삽되는 BGA 장착부(30)가 형성되고,상기 BGA 장착부(30)에는 도체 패드(40)가 인쇄되어, 이에 장착되는 BGA 기판(20)의 저부에 다수개 설치되는 솔더볼(50)과 각각 접촉토록 설치되고, 상기 PCB(10) 상에 설치되는 BGA 기판(20)은 가열에 의해 그 저부의 솔더볼(50)이 도체 패드(40)와 솔더링 결합토록 되는 구성으로 이루어진다.In the conventional BGA substrate coupling structure related to such a technique, as shown in FIG. 1, a BGA mounting portion 30 into which the BGA substrate 20 is inserted is formed on the PCB 10, and the BGA mounting portion 30 is formed. ) Is printed on the conductive pad 40, the plurality of solder ball 50 is installed in contact with the bottom of the BGA substrate 20 to be mounted thereon, respectively, the BGA substrate 20 is installed on the PCB (10) ) Is configured to allow the solder ball 50 at its bottom to be soldered to the conductor pad 40 by heating.
상기와 같은 결합구조를 갖는 종래의 BGA 기판은 도 2에서와 같이, PCB(10)에 형성되는 BGA 장착부(30)에 BGA 기판(20)을 결합시, 상기 BGA 기판(20) 저부에 격자형태를 이룬 솔더볼(50)이 PCB(10)의 도체 패드(40)와 접촉되는 상태에서, 상기 솔더볼(50)이 가열에 의해 도체 패드(40)와 솔더링 결합토록 됨으로써, PCB(10)상에 BGA 기판(20)을 장착하게 되는 것이다.In the conventional BGA substrate having a coupling structure as described above, as shown in FIG. 2, when the BGA substrate 20 is coupled to the BGA mounting portion 30 formed on the PCB 10, a lattice shape is formed at the bottom of the BGA substrate 20. The solder ball 50 is in contact with the conductor pad 40 of the PCB 10, the solder ball 50 is to be soldered and bonded to the conductor pad 40 by heating, thereby BGA on the PCB 10 The substrate 20 is to be mounted.
그러나, 상기 PCB(10)의 BGA 장착부(30)에 BGA 기판(20)을 올려놓고, 그 저부의 솔더볼(50)을 도체 패드(40)와 솔더링하는 과정에서 오정렬이 빈번하게 발생되며, 특히 상기 솔더볼(50)의 솔더링을 위한 고열에 의해 PCB(10) 및 BGA 기판(20)에 열적 변형이 발생하여 제품의 불량이 발생하게 됨은 물론, 상기와같이 반도체 칩(미도시)이 실장된 고가의 BGA 기판(20)은 재사용이 불가능하게 되는등 많은 문제점이 있었던 것이다.However, misalignment occurs frequently in the process of placing the BGA substrate 20 on the BGA mounting portion 30 of the PCB 10 and soldering the bottom solder ball 50 with the conductor pad 40. Thermal deformation occurs on the PCB 10 and the BGA substrate 20 due to the high temperature for soldering the solder ball 50, resulting in a defect in the product, as well as an expensive semiconductor chip (not shown) mounted as described above. The BGA substrate 20 had many problems such as being impossible to reuse.
본 발명은 상기한 바와같은 종래의 여러 문제점들을 개선하기 위한 것으로서 그 목적은, PCB상에 BGA 기판의 결합시 상기 BGA 기판을 볼트로서 결합하는 간단한 동작에 의해 BGA 기판의 솔더볼이 PCB의 패드에 일정한 압력으로 결합되어 고정될 수 있도록 하며, 이에따라 BGA 기판의 결합을 위한 솔더볼을 가열할 필요없이 PCB 기판상에 손쉽고, 용이하게 결합하여 고정하고, PCB 및 BGA 기판의 열적 변형을 미연에 방지함은 물론, 상기 BGA 기판의 분해가 용이하게 이루어져 재사용할 수 있는 PCB의 BGA 기판 결합장치를 제공하는데 있다.SUMMARY OF THE INVENTION The present invention has been made to solve various problems in the related art as described above, and an object thereof is that solder balls of a BGA substrate are fixed to pads of a PCB by a simple operation of coupling the BGA substrate as bolts when the BGA substrate is bonded onto the PCB. It can be combined and fixed by pressure, thus easily and easily joining and fixing on the PCB substrate without the need to heat the solder balls for bonding the BGA substrate, and also prevent thermal deformation of the PCB and BGA substrate in advance. In addition, the BGA substrate is easily disassembled to provide a BGA substrate bonding apparatus of the PCB can be reused.
도 1은 일반적인 PCB의 BGA 기판 결합구조를 설명하기 위한 결합상태 개략 사시도.1 is a schematic perspective view of a bonded state for explaining the BGA substrate bonding structure of a typical PCB.
도 2는 종래의 BGA 기판이 PCB상에 결합된 상태의 요부 측단면 구조도.Figure 2 is a side sectional structural view of the main portion of a conventional BGA substrate bonded to the PCB.
도 3은 본 발명에 따른 PCB의 BGA 기판 결합구조를 설명하기 위한 결합상태 개략 사시도.Figure 3 is a schematic perspective view of the bonding state for explaining the BGA substrate bonding structure of the PCB according to the present invention.
도 4는 본 발명인 BGA 기판이 PCB상에 결합된 상태의 요부 측단면 구조도.Figure 4 is a side cross-sectional structural view showing the main portion of the BGA substrate of the present invention coupled to the PCB.
도 5는 본 발명의 다른 실시예에 의한 PCB와 BGA 기판의 결합구조를 도시한 요부 단면 구조도.5 is a cross-sectional view showing a main part showing a coupling structure of a PCB and a BGA substrate according to another embodiment of the present invention.
* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
110...PCB 120...BGA 기판110 ... PCB 120 ... BGA Board
130...BGA 장착부 140...도체 패드130 ... BGA mounting 140 ... Conductor pad
150...솔더볼 160...관통홀150 ... Solder Ball 160 ... Through Hole
170...볼트 180...너트170 ... Bolt 180 ... Nut
190...구형 홈190.Spherical groove
상기 목적을 달성하기 위한 기술적인 구성으로서 본 발명은, BGA 기판의 저부에 형성되는 다수의 솔더볼이 PCB의 BGA 장착부에 인쇄되는 각각의 도체 패드 상측으로 위치되며, 상기 BGA 기판 각 모서리부에는 관통홀이 천설되어, PCB와 볼트로서 결합하여 BGA 기판을 고정토록 하는 구성으로 이루어진 것을 특징으로 하는 PCB의 BGA 기판 결합장치를 마련함에 의한다.As a technical configuration for achieving the above object, the present invention, a plurality of solder balls formed on the bottom of the BGA substrate is positioned above each of the conductive pads printed on the BGA mounting portion of the PCB, each corner portion of the BGA substrate through holes The installation of the BGA substrate bonding device of the PCB, characterized in that the configuration consisting of a fixed to combine the PCB and the bolt to fix the BGA substrate.
이하, 첨부된 도면에 의거하여 본 발명의 실시예를 상세하게 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 3은 본 발명에 따른 PCB의 BGA 기판 결합구조를 설명하기 위한 결합상태 개략 사시도이고, 도 4는 본 발명인 BGA 기판이 PCB상에 결합된 상태의 요부 측단면 구조도로서, PCB(110)상에 BGA 기판(120)이 설치되는 BGA 장착부(130)가 형성되고, 상기 BGA 장착부(130)에는 도체 패드(140)가 인쇄되어, 이에 장착되는 BGA 기판(120)의 저부에 다수개 설치되는 솔더볼(150)과 각각 접촉토록 설치된다.3 is a schematic perspective view illustrating a bonded state of the BGA substrate bonding structure of the PCB according to the present invention, Figure 4 is a side cross-sectional structural view of the main portion of the BGA substrate of the present invention coupled to the PCB, on the PCB 110 A BGA mounting unit 130 on which the BGA substrate 120 is installed is formed, and the conductive pad 140 is printed on the BGA mounting unit 130, and a plurality of solder balls are installed on the bottom of the BGA substrate 120 mounted thereon. 150) to be in contact with each other.
또한, 상기 BGA 기판(120)의 저부에 형성되는 다수의 솔더볼(150)이PCB(110)의 BGA 장착부(130)에 인쇄되는 각각의 도체 패드(140) 상측으로 위치되며, 상기 BGA 기판(120)의 각 모서리부에는 관통홀(160)이 천설되어, PCB(110)와 볼트(170)로서 결합하여 BGA 기판(120)을 고정토록 한다.In addition, a plurality of solder balls 150 formed on the bottom of the BGA substrate 120 is positioned above each of the conductive pads 140 printed on the BGA mounting portion 130 of the PCB 110, and the BGA substrate 120 Through holes 160 are installed in each corner portion of the c), and are coupled to the PCB 110 and the bolt 170 to fix the BGA substrate 120.
또한, 상기 BGA 기판(120)과 결합볼트(170)로서 결합되는 PCB(110)는, 그 저부에 너트(180)가 위치되어 상기 볼트(170)의 하단부와 체결토록 되며, 상기 PCB(110)의 BGA 장착부(130)에 인쇄되는 각각의 도체 패드(140)는 구형 홈(190) 내부에 인쇄되어, 상기 BGA 기판(120)의 솔더볼(150)이 구형 홈(190) 내부에 삽입되는 구성으로 이루어진다.In addition, the PCB 110 coupled to the BGA substrate 120 as the coupling bolt 170, the nut 180 is located at the bottom thereof to be fastened to the lower end of the bolt 170, the PCB 110 Each of the conductive pads 140 printed on the BGA mounting portion 130 is printed in the spherical groove 190, and the solder balls 150 of the BGA substrate 120 are inserted into the spherical groove 190. Is done.
이와같은 구성으로 이루어진 본 발명의 작용 및 효과를 설명하면 다음과 같다.Referring to the operation and effect of the present invention made of such a configuration as follows.
도3 및 도 4에 도시한 바와같이, 부품이 실장되는 PCB(110)상에 BGA 기판(120)이 설치되는 BGA 장착부(130)가 마련되는 상태에서, 상기 BGA 장착부(130)에는 도체 패드(140)가 인쇄되어, 이에 BGA 기판(120)의 저부에 격자 형상으로 형성되는 솔더볼(150)이 상기 도체 패드(140)와 각각 접촉되면서 BGA 기판(120)이 장착된다.As shown in FIGS. 3 and 4, in a state in which a BGA mounting unit 130 on which a BGA substrate 120 is installed is provided on a PCB 110 on which components are mounted, the BGA mounting unit 130 includes a conductor pad ( 140 is printed, so that the solder ball 150 formed in a lattice shape at the bottom of the BGA substrate 120 is in contact with the conductor pad 140, thereby mounting the BGA substrate 120.
이때, 상기 BGA 기판(120)의 저부에 형성되는 다수의 솔더볼(150)은, 상기 PCB(110)의 BGA 장착부(130)에 인쇄된 각각의 도체 패드(140) 상측으로 위치되는 상태에서, 상기 BGA 기판(120)의 각 모서리부에는 관통홀(160)을 천설시킨 후, 상기 PCB(110)와 볼트(170)로서 결합토록 함으로써, 상기 BGA 기판(120)이 PCB(110)와 결합토록 되고, 이때 상기 BGA 기판(120) 저부의 솔더볼(150)은 가열에 의한 솔더링이 필요없이 도체 패드(140)와 일정한 압력으로 접촉되어 PCB 및 BGA 기판(120)의 열적 변형을 방지하게 된다.In this case, the plurality of solder balls 150 formed on the bottom of the BGA substrate 120, the state is located above the respective conductive pads 140 printed on the BGA mounting portion 130 of the PCB 110, Through holes 160 are formed in each corner of the BGA substrate 120, and the PCB 110 and the bolt 170 are coupled to each other so that the BGA substrate 120 is coupled to the PCB 110. In this case, the solder ball 150 of the bottom of the BGA substrate 120 is in contact with the conductor pad 140 at a constant pressure without the need for soldering by heating to prevent thermal deformation of the PCB and the BGA substrate 120.
한편, 상기 BGA 기판(120)과 결합볼트(170)로서 결합되는 PCB(110)는, 그 저부에 너트(180)가 위치되는 상태에서, 상기 BGA 기판(120)을 결합하는 볼트(170)의 하단부와 체결토록 함으로써, 상기 PCB(110)에서 BGA 기판(120)이 이탈되는 것을 방지하게 되며, 또한 상기 볼트(170) 및 너트(180)를 풀어주는 동작에 의해 PCB(110)에서 BGA 기판(120)을 손쉽고, 용이하게 분리시킬 수 있게 되어 BGA 기판의 재활용이 가능토록 된다.On the other hand, the PCB 110 coupled to the BGA substrate 120 as the coupling bolt 170 of the bolt 170 for coupling the BGA substrate 120 in a state where the nut 180 is located at the bottom thereof By fastening with the lower end, the BGA substrate 120 is prevented from being separated from the PCB 110, and the BGA substrate (from the PCB 110) is released by releasing the bolt 170 and the nut 180. 120 can be easily and easily separated so that the BGA substrate can be recycled.
도 5는 본 발명의 다른 실시예에 의한 PCB와 BGA 기판의 결합구조를 도시한 요부 단면 구조도로서, 상기 PCB(110)의 BGA 장착부(130)에 인쇄되는 각각의 도체 패드(140)는 구형 홈(190) 내부에 인쇄되어, 상기 BGA 기판(120)의 솔더볼(150)이 구형 홈(190) 내부에 삽입토록 됨으로써, 격자 형상으로 형성되는 솔더볼(150)이 도체 패드(140)의 정확한 위치에서 결합될 수 있는 것이다.FIG. 5 is a cross-sectional view of a main part showing a coupling structure of a PCB and a BGA substrate according to another embodiment of the present invention, wherein each conductive pad 140 printed on the BGA mounting portion 130 of the PCB 110 has a spherical groove. Printed inside 190, the solder ball 150 of the BGA substrate 120 is inserted into the spherical groove 190 so that the solder ball 150, which is formed in a grid shape, is formed at the correct position of the conductor pad 140. It can be combined.
이상과 같이 본 발명에 따른 PCB의 BGA 기판 결합장치에 의하면, PCB상에 BGA 기판의 결합시 상기 BGA 기판을 볼트로서 결합하는 간단한 동작에 의해 BGA 기판의 솔더볼이 PCB의 패드에 일정한 압력으로 결합되어 고정될 수 있게 되며, 이에따라 BGA 기판의 결합을 위한 솔더볼을 가열할 필요없이 PCB 기판상에 손쉽고, 용이하게 결합하여 고정하고, PCB 및 BGA 기판의 열적 변형을 미연에 방지함은 물론, 상기 BGA 기판의 분해가 용이하게 이루어져 재사용할 수 있는 우수한 효과가 있다.According to the BGA substrate bonding apparatus of the PCB according to the present invention as described above, the solder ball of the BGA substrate is coupled to the pad of the PCB at a constant pressure by a simple operation of coupling the BGA substrate as a bolt when the BGA substrate is bonded to the PCB It can be fixed, thereby easily and easily combined and fixed on the PCB substrate without the need to heat the solder ball for bonding the BGA substrate, as well as prevent thermal deformation of the PCB and BGA substrate, as well as the BGA substrate There is an excellent effect that can be easily decomposed and reused.
본 발명은 특정한 실시예에 관련하여 도시하고 설명하였지만, 이하의 특허 청구범위에 의해 마련되는 본 발명의 정신이나 분야를 벗어나지 않는 한도내에서 본 발명이 다양하게 개조 및 변화될 수 있다는 것을 당업계에서 통상의 지식을 가진자는 용이하게 알수 있음을 밝혀 두고자 한다.While the invention has been shown and described with respect to specific embodiments thereof, it will be appreciated that the invention can be varied and modified without departing from the spirit or scope of the invention as set forth in the claims below. It will be clear to those skilled in the art that it can be easily understood.
Claims (3)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990056944A KR20010055681A (en) | 1999-12-11 | 1999-12-11 | Device for combine bga substrates in pcb |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990056944A KR20010055681A (en) | 1999-12-11 | 1999-12-11 | Device for combine bga substrates in pcb |
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| Publication Number | Publication Date |
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| KR20010055681A true KR20010055681A (en) | 2001-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1019990056944A KR20010055681A (en) | 1999-12-11 | 1999-12-11 | Device for combine bga substrates in pcb |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07312242A (en) * | 1994-05-18 | 1995-11-28 | Shinano Polymer Kk | Connecting method and connecting structure between circuit board and surface mounting type lsi |
| JPH08203644A (en) * | 1995-01-20 | 1996-08-09 | Nhk Spring Co Ltd | Socket for lsi package |
| JPH10209212A (en) * | 1997-01-21 | 1998-08-07 | Sumitomo Kinzoku Electro Device:Kk | Semiconductor device and its production |
| JPH11163043A (en) * | 1997-11-21 | 1999-06-18 | Nec Corp | Structure for mounting ball grid array |
| JPH11204173A (en) * | 1997-12-19 | 1999-07-30 | Molex Inc | Connector for bga |
-
1999
- 1999-12-11 KR KR1019990056944A patent/KR20010055681A/en not_active Application Discontinuation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07312242A (en) * | 1994-05-18 | 1995-11-28 | Shinano Polymer Kk | Connecting method and connecting structure between circuit board and surface mounting type lsi |
| JPH08203644A (en) * | 1995-01-20 | 1996-08-09 | Nhk Spring Co Ltd | Socket for lsi package |
| JPH10209212A (en) * | 1997-01-21 | 1998-08-07 | Sumitomo Kinzoku Electro Device:Kk | Semiconductor device and its production |
| JPH11163043A (en) * | 1997-11-21 | 1999-06-18 | Nec Corp | Structure for mounting ball grid array |
| JPH11204173A (en) * | 1997-12-19 | 1999-07-30 | Molex Inc | Connector for bga |
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