CN108834304A - A kind of printed circuit board and its method for maintaining - Google Patents
A kind of printed circuit board and its method for maintaining Download PDFInfo
- Publication number
- CN108834304A CN108834304A CN201810780549.5A CN201810780549A CN108834304A CN 108834304 A CN108834304 A CN 108834304A CN 201810780549 A CN201810780549 A CN 201810780549A CN 108834304 A CN108834304 A CN 108834304A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- chip
- circuit board
- hole
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of printed circuit boards, it includes substrate and the chip by multiple ball bonds on the substrate, multiple through-holes and the multiple and one-to-one looping pit of the through-hole are offered on the substrate, each looping pit is located at the outside of corresponding through-hole and surrounds the through-hole, the projection of the multiple through-hole and the multiple soldered ball on the chip is set in distance, and the multiple through-hole is for sending hot wind to melt the soldered ball.Which also discloses a kind of method for maintaining of above-mentioned printed circuit board, including step：S1, an above-mentioned printed circuit board is provided；S2, melt the soldered ball by the logical hot wind of multiple through-holes, separate substrate with chip；S3, the substrate of damage or the chip are repaired.It can be such that the junction heat transfer rate of substrate and chip accelerates, and easily make chip and substrate quick separating.
Description
Technical field
The present invention relates to circuit board package technique field more particularly to a kind of printed circuit boards and its method for maintaining.
Background technique
Welded ball array encapsulation chip is provided on some printed circuit boards, and welded ball array encapsulation chip is due to its encapsulation knot
The particularity of structure, pin are all disposed within the bottom of entire packaging body, so that all depositing in welding and subsequent rework process
Much bothering.When reprocessing, conventional method is to its surface blowing hot-air, when heat passes through entire welded ball array encapsulation chip
When shell, weld is passed to, and melts weld, welded ball array encapsulation chip is then removed from printed circuit board and is tieed up
It repairs.
The method for maintaining heat transfer rate of conventional printed circuit boards is slow, and be not easy to make the welded ball array encapsulation chip with it is described
Printed circuit board separation.
Summary of the invention
For overcome the deficiencies in the prior art, one of the objects of the present invention is to provide a kind of printed circuit boards, can make
The junction heat transfer rate of substrate and chip is accelerated, and easily makes chip and substrate quick separating；
The second object of the present invention is to provide the method for maintaining of above-mentioned printed circuit board.
An object of the present invention is implemented with the following technical solutions：
A kind of printed circuit board comprising substrate and the chip by multiple ball bonds on the substrate, the base
Multiple through-holes and the multiple and one-to-one looping pit of the through-hole are offered on plate, each looping pit is located at corresponding lead to
The outside in hole simultaneously surrounds the through-hole, and the projection of the multiple through-hole and the multiple soldered ball on the chip is set in interval
It sets, the multiple through-hole is for sending hot wind to melt the soldered ball.
Preferably, the chip is that welded ball array encapsulates chip.
Preferably, the substrate-parallel is in the chip.
Preferably, the printed circuit board further includes pin, and the pin is fixed on the both ends of the chip.
Preferably, the pin is arranged with the substrate-parallel in parallel, and the pin protrudes the chip.
The second object of the present invention is implemented with the following technical solutions：
A kind of method for maintaining of above-mentioned printed circuit board, including step：
S1, an above-mentioned printed circuit board is provided；
S2, melt the soldered ball by the logical hot wind of centre bore of multiple through-holes, separate substrate with chip；
S3, the substrate of damage or the chip are repaired.
Further, in the step S2, hot wind is led to multiple through-holes by blowing device.
Further, the step S2 further includes when leading to hot wind by multiple through-holes, helping wind apparatus logical by being arranged one
Hot wind helps wind apparatus blowing hot-air described in blowing device alignment.
Further, described to help wind apparatus include air inlet and multiple air outlets, and the air outlet is provided projectingly on close
On the surface of the substrate side, in the step S2, the multiple air outlet is directed at the through-hole blowing hot-air.
Further, the bore of the air outlet is less than the aperture of the through-hole, in the step S2, by the outlet air
Mouth is placed in the through-hole and is directed at the through-hole blowing hot-air.
Compared with prior art, the beneficial effects of the present invention are：
Its projection of the multiple through-hole and the multiple soldered ball on the chip is set in distance, in maintenance, to
The through hole blowing hot-air, hot wind can directly blow to the chip and the substrate welding soldered ball at, and make the soldered ball by
Heat is accelerated, so as to make the chip and the substrate quick separating, so that it is easy to repair.
Detailed description of the invention
Fig. 1 is the top view of printed circuit board of the present invention；
Fig. 2 is the cross-sectional view of printed circuit board of the present invention；
Fig. 3 is the enlarged structure schematic diagram in Fig. 2 at A；
Fig. 4 is the usage state diagram of printed circuit board method for maintaining of the present invention；
Fig. 5 is the cross-sectional view that the present invention helps wind apparatus.
In figure：1, printed circuit board；10, substrate；11, through-hole；12, looping pit；20, chip；21, pin；22, soldered ball；
30, wind apparatus is helped；31, air-inlet cavity；32, air outlet；33, air inlet.
Specific embodiment
In the following, being described further in conjunction with attached drawing and specific embodiment to the present invention：
As shown in Figure 1-3, a kind of printed circuit board (PCB) 1 disclosed by the invention comprising substrate 10 and pass through multiple welderings
Ball 22 is welded on the chip 20 on the substrate 10, and multiple through-holes 11 and the multiple and through-hole 11 are offered on the substrate 10
One-to-one looping pit 12, each looping pit 12 are located at the outside of corresponding through-hole 11 and surround the through-hole 11, institute
It states the projection of multiple through-holes 11 and the multiple soldered ball 22 on the chip 20 to be set in distance, the multiple through-hole 11 is used for
Hot wind is sent to melt the soldered ball 22.
In the above-described embodiment, the projection of the multiple through-hole 11 and the multiple soldered ball 22 on the chip 20
It is set in distance, when dismantling the chip 20, as long as being blown into hot wind to multiple through-hole 11, hot wind runs past the through-hole
11, and the soldered ball 22 that the chip 20 is connect with the substrate 10 can be blowed to, and make the heated quickening of the soldered ball 22, so as to
Make the chip 20 and 10 quick separating of substrate.The through-hole 11 is mainly used for logical hot wind, because surrounding the through-hole 11
The looping pit 12 can separate through-hole 11 and the substrate 10 of logical hot wind, be thus avoided that the substrate 10 is heated and accelerate
And damage, it is transmitted on the soldered ball 22 so as to be more concentrated at heat.If do not dismantle the chip 20, the annular
Hole 12 can be used for arranging route, and in order to keep the route of arrangement more stable, the solderable closing of the upper and lower side of the looping pit 12 is described
Through-hole 11 and the looping pit 12 also can increase the radiating efficiency of the chip 20.In addition, quantity and the position of the through-hole 11
Can according on the substrate 10 wiring congestion degree and wiring direction do a little adjustment, in order to make heat transfer accelerate, do not influencing
When the substrate 10 is routed, some more through-holes 11 and looping pit 12 are designed as far as possible.
Wherein, the chip 20 is connect by multiple soldered balls 22 with the substrate 10, which can disperse the chip 20
To the pressure of the substrate 10, and it is more firm, and multiple through-holes 11 and multiple 22 uniform intervals of soldered ball are arranged, which can make more
Average distance between a soldered ball 22 and multiple through-holes 11 is closer, and can make the energy heated fast fusing of multiple soldered balls 22, thus
The chip 20 is set rapidly to separate with the substrate 10.The multiple soldered ball 22 is the soldering ball easily melted.
Preferably, in order to reduce the volume of the printed circuit board 1, the chip 20 is that welded ball array encapsulates chip
(BGA)。
Preferably, in order to make this printed circuit board be easier ventilation and heat, the substrate 10 is parallel with the chip 20 to be set
It sets.
Wherein, the printed circuit board 1 further includes pin 21, and the pin 21 is fixed on the both ends of the chip 20, institute
It states pin 21 to be arranged in parallel with the substrate 10, and the pin 21 protrudes the chip 20, which is convenient for the chip 20
It is electrically connected with external devices, and the chip 20 can also be installed or removed by plugging the pin 21, facilitated
Installation and removal.
In another embodiment, if the circuit being arranged on the substrate 10 is irregular, the substrate 10 and the core
Multiple soldered balls 22 between piece 20 will be arranged according to circuit it is irregular, at this time in order to make the soldered ball 22 be easier to be melt
Change, the dead zone setting of the circuit through-hole 11 can be not provided on 22 surrounding of soldered ball the and described substrate 10, at this time through-hole
11 substantially surround the soldered ball 22, can quickly melt the soldered ball 22 in the case where logical hot wind；Do not leading to hot wind
In the case where, the through-hole 11 also can quickly radiate to this printed circuit board 1.In this embodiment, other component is same as above
State embodiment.
As shown in figure 4, the invention also discloses a kind of method for maintaining of above-mentioned printed circuit board 1, including step：
S1, an above-mentioned printed circuit board is provided；
S2, melt the soldered ball by the logical hot wind 40 of multiple through-holes, separate substrate with chip；
S3, the substrate of damage or the chip are repaired.
In the above-described embodiment, when to blowing hot-air 40 at multiple through-holes 11, hot wind 40 can directly blow to the core
At the soldered ball 22 of piece 20 and the substrate 10, and make the heating of the soldered ball 22 faster, and makes 22 rapid melting of soldered ball, from
And the chip 20 can be made quickly to separate with the substrate 10, and then facilitate maintenance, and its method for maintaining is simple and convenient.
Preferably, in the step S2, hot wind 40 is led to multiple through-holes 11 by blowing device (not shown).In order to save
Cost-saving, the blowing device can be hair dryer.
Further, so that hot wind is blowed to the through-hole 11 to be more concentrated at and melt the soldered ball 22, the step S2
It further include when leading to hot wind 40 by multiple through-holes, helping wind apparatus 30 to lead to hot wind 40, the blowing device alignment by being arranged one
It is described to help 30 blowing hot-air of wind apparatus.
Preferably, described that wind apparatus 30 is helped to include air inlet 33 and multiple air outlets 32, the air outlet 32 is provided projectingly
In on the surface of 10 side of substrate, in the step S2, the multiple air outlet 32 is directed at the through-hole 11 and blows
Hot wind 40.
Further, in order to preferably connect it is described help wind apparatus 30, the bore of the air outlet 32 is less than described logical
The air outlet 32 is placed in the through-hole 11 in the step S2 and is directed at the through-hole 11 and blows heat by the aperture in hole 11
Wind 40.
As shown in figure 4, specifically, it is described that wind apparatus 30 is helped to include air-inlet cavity 31,31 upper end of air-inlet cavity is set
Air outlet 32, the air inlet 33 that 31 lower end of air-inlet cavity is arranged in, the air outlet 32 are connected to the through-hole 11.
Wherein, the air-inlet cavity 31 can be such that hot wind 40 is more concentrated at into the through-hole 11, without to outer scattered, again
In order not to allow the printed circuit board 1 Damage by Short Circuit due to electrostatic, the optimal material of the air-inlet cavity 31 is insulating materials, described
The shape of air-inlet cavity 31 can be "convex" shaped or rectangle, and the diameter of the air inlet 33 is greater than the blowing device air outlet
Diameter.In addition, the air outlet 32 can be connected through a screw thread with the through-hole 11.
Summary, the projection of multiple through-holes 11 and the multiple soldered ball 22 of the present invention on the chip 20 is in interval
Setting, and the through-hole 11 lower end it is settable it is described help wind apparatus 30 to carry out blowing hot-air 40, and the multiple soldered ball 22 can be improved
Burn-off rate, repaired so as to rapidly dismantle the chip 20, and method for maintaining is simple and easy.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and only illustrating for the description in above embodiments and description is of the invention
Principle, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these change and change
Into all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent
It defines.
Claims (10)
1. a kind of printed circuit board, it is characterised in that：It includes substrate and the core by multiple ball bonds on the substrate
Piece offers multiple through-holes on the substrate and multiple with the one-to-one looping pit of the through-hole, each looping pit be located at
The outside of its corresponding through-hole simultaneously surrounds the through-hole, the projection of the multiple through-hole and the multiple soldered ball on the chip
It is set in distance, the multiple through-hole is for sending hot wind to melt the soldered ball.
2. printed circuit board according to claim 1, it is characterised in that：The chip is that welded ball array encapsulates chip.
3. printed circuit board according to claim 1, it is characterised in that：The substrate is arranged in parallel with the chip.
4. printed circuit board according to claim 1, it is characterised in that：The printed circuit board further includes pin, described
Pin is fixed on the both ends of the chip.
5. printed circuit board according to claim 1, it is characterised in that：The pin is parallel to the substrate, and described
Pin protrudes the chip.
6. a kind of method for maintaining of above-mentioned printed circuit board, which is characterized in that including step：
S1, an above-mentioned printed circuit board is provided；
S2, melt the soldered ball by the logical hot wind of multiple through-holes, separate substrate with chip；
S3, the substrate of damage or the chip are repaired.
7. the method for maintaining of printed circuit board according to claim 6, it is characterised in that：In the step S2, by blowing
Wind apparatus leads to hot wind to multiple through-holes.
8. the method for maintaining of printed circuit board according to claim 7, it is characterised in that：The step S2 further includes passing through
When multiple through-holes lead to hot wind, helps wind apparatus to lead to hot wind by being arranged one, help wind apparatus to blow heat described in the blowing device alignment
Wind.
9. the method for maintaining of printed circuit board according to claim 8, it is characterised in that：It is described that help wind apparatus include air inlet
And multiple air outlets, the air outlet is provided projectingly on the surface of the substrate side, described in the step S2
Multiple air outlets are directed at the through-hole blowing hot-air.
10. the method for maintaining of printed circuit board according to claim 9, it is characterised in that：The bore of the air outlet is less than
The air outlet is placed in the through-hole in the step S2 and is directed at the through-hole blowing hot-air by the aperture of the through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810780549.5A CN108834304A (en) | 2018-07-17 | 2018-07-17 | A kind of printed circuit board and its method for maintaining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810780549.5A CN108834304A (en) | 2018-07-17 | 2018-07-17 | A kind of printed circuit board and its method for maintaining |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108834304A true CN108834304A (en) | 2018-11-16 |
Family
ID=64140620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810780549.5A Pending CN108834304A (en) | 2018-07-17 | 2018-07-17 | A kind of printed circuit board and its method for maintaining |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108834304A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113658923A (en) * | 2020-05-12 | 2021-11-16 | 宇瞻科技股份有限公司 | Packaging structure |
| CN114054885A (en) * | 2021-11-16 | 2022-02-18 | 深圳市铨天科技有限公司 | Integrated circuit BGA encapsulation protection support |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1093151A (en) * | 1993-04-02 | 1994-10-05 | 郑金安 | Double-layer insulating plastic pipe pipe (road) |
| JPH09181404A (en) * | 1995-12-26 | 1997-07-11 | Nec Corp | Printed board and method for repairing mounted component |
| JPH09246713A (en) * | 1996-03-12 | 1997-09-19 | Toshiba Corp | Printed circuit board |
| JPH10223798A (en) * | 1997-02-12 | 1998-08-21 | Oki Electric Ind Co Ltd | Ball grid array package structure and method of mounting it on printed circuit board |
| CN1252894A (en) * | 1997-12-19 | 2000-05-10 | 莫勒克斯有限公司 | BGA connector with heat activated connection and disconnection means |
-
2018
- 2018-07-17 CN CN201810780549.5A patent/CN108834304A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1093151A (en) * | 1993-04-02 | 1994-10-05 | 郑金安 | Double-layer insulating plastic pipe pipe (road) |
| JPH09181404A (en) * | 1995-12-26 | 1997-07-11 | Nec Corp | Printed board and method for repairing mounted component |
| JPH09246713A (en) * | 1996-03-12 | 1997-09-19 | Toshiba Corp | Printed circuit board |
| JPH10223798A (en) * | 1997-02-12 | 1998-08-21 | Oki Electric Ind Co Ltd | Ball grid array package structure and method of mounting it on printed circuit board |
| CN1252894A (en) * | 1997-12-19 | 2000-05-10 | 莫勒克斯有限公司 | BGA connector with heat activated connection and disconnection means |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113658923A (en) * | 2020-05-12 | 2021-11-16 | 宇瞻科技股份有限公司 | Packaging structure |
| CN114054885A (en) * | 2021-11-16 | 2022-02-18 | 深圳市铨天科技有限公司 | Integrated circuit BGA encapsulation protection support |
| CN114054885B (en) * | 2021-11-16 | 2023-03-14 | 深圳市铨天科技有限公司 | Integrated circuit BGA encapsulation protection support |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181116 |
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| RJ01 | Rejection of invention patent application after publication |