CN201120512Y

CN201120512Y - Apparatus for dissembling and piling packaging device

Info

Publication number: CN201120512Y
Application number: CNU200720193093XU
Authority: CN
Inventors: 付红志; 刘哲; 樊融融; 贾忠中
Original assignee: ZTE Corp
Current assignee: ZTE Corp
Priority date: 2007-11-14
Filing date: 2007-11-14
Publication date: 2008-09-24
Anticipated expiration: 2017-11-14

Abstract

The utility model provides an apparatus for demounting a stacked package device, which consists of an outer shell and an inner cover which are connected with each other partially, the structure of the inner cover is an annular box with an open bottom surface and a rectangular section, and the shape of the top of the box is a frustoconic structure or a platform-shaped structure. The hot blast can reach the welded part of the stacked package device through the gap between the two parts. The apparatus avoids the breakage to the device caused by the direct blowing of hot blast on the device body, and realizes the overall demounting to the stacked package device, thereby solving the problems of device splitting and total breakdown caused by utilizing the prior art and saving the maintenance cost.

Description

A kind of device of dismantling stack packaged device

Technical field

The utility model relates to PCBA (printed circuit board assembling) circuit assembly and makes the field, relates in particular to the device of stack packaged device being reprocessed the aspect.

Background technology

The appearance of novel stack packaged device has realized the PCBA circuit assembly from the development of two dimension to three-dimensional mounting direction, and this has promoted integrated level, function and the speed of service of device significantly, simultaneously also device in the assembling process is reprocessed the very big challenge of formation.

At present, common encapsulation BGA (BGA) is to carry out on the BGA reclamation work platform that is equipped with rectangle column casing air guide structure hot-blast spray nozzle as the dismounting of PBGA (plastic ball grid array), TBGA (tape ball grid array), CBGA (ceramic ball grid array) etc., and the schematic diagram of this hot-blast spray nozzle structure as shown in Figure 1.In rework process, the hot-blast spray nozzle of rectangle column casing air guide structure mainly is will directly deliver on the packaging body on BGA top from the hot blast of reprocessing platform by inner chamber, and the soldered ball that heat is delivered to the BGA bottom makes its fusing from top to bottom, thereby reaches the purpose of dismounting.But to novel stack packaged device, if adopting the hot-blast spray nozzle of said structure to reprocess on the platform at BGA dismantles, top which floor soldered ball of stack packaged device will reach molten condition prior to the bottom soldered ball, very easily cause falling apart or scrapping of device during dismounting, this has increased the maintenance cost of veneer greatly, has become current problem demanding prompt solution so seek a kind of suitable dismounting scheme of reprocessing.

Summary of the invention

The purpose of this utility model provides a kind of device of dismantling stack packaged device, to overcome the problem of scrapping that adopts prior art to dismantle the stack packaged device that is caused.

The device of dismounting stack packaged device described in the utility model is formed by connecting through the part by shell and inner cover two parts, and hot blast can be by the welding portion of the stack packaged device of gap arrival between the two; Suitably greater than inner cover bottom opening size, inner cover bottom opening size is measure-alike with stack packaged device for shell sizes.

Further, described inner cover is that bottom opening, cross section are the lid of rectangle, and the top profile of lid is frustum structure or platform-like structure; Described shell is the cuboid of hollow; Upper and lower four angles of described inner cover and described shell weld together; Cover on described housings in described, its opening is consistent with the direction of described shell under shed, and the certain distance that contracts in the under shed end face of opening with respect to described shell; Four sides of described inner cover all and the gap between the described shell keep evenly.

Further, described shell upper end projection is used for reprocessing with BGA the installation connection of platform.

The beneficial effects of the utility model are, adopt this device, hot blast transfer route when having changed the dismounting of existing nozzle makes hot blast directly blow on the tin ball of device bottom by the space between inner cover and the shell, has avoided directly blowing to the destruction of on the device body device being caused because of hot blast.In the unloading process, the temperature of tin ball is higher than device body all the time, guarantees that the tin ball takes the lead in arriving fusion temperature, thereby realizes the integral demounting to stack packaged device.From actual use the of the present utility model, the success rate of piling up the device integral demounting is reached 100%, overcome the device that utilizes prior art to cause and fallen apart and scrap problem, saved maintenance cost.

Description of drawings

Fig. 1 is the structural representation of existing hot-blast spray nozzle.

Fig. 2 is the structural representation that the bottom of existing hot-blast spray nozzle makes progress.

Fig. 3 is STRUCTURE DECOMPOSITION figure of the present utility model.

Fig. 4 is that structure of the present utility model is in conjunction with figure.

Fig. 5 is a vertical view of the present utility model.

Fig. 6 is the vertical view of platform-like embodiment of the present utility model

The specific embodiment

Below in conjunction with accompanying drawing 3 to Fig. 6 description detailed in addition to the utility model.

Fig. 3 is STRUCTURE DECOMPOSITION figure of the present utility model, and this utility model is to be formed by connecting through solder joint 302 parts by shell 301 and inner cover 303 two parts;

Fig. 4 is that structure of the present utility model is in conjunction with figure;

Fig. 5 is the utility model vertical view, between shell 301 and inner cover 303 two parts a fixed gap 501 is arranged.

Shell 301 tops are rectangular panel of hollow, and the lower end is the straight tube of the rectangle of the certain wall thickness of tool, and the hollow space of rectangular panel is identical with the internal diameter of the straight tube of rectangle, and shell can or directly be processed by a compact material by rectangular panel and the straight tube welding of rectangle.

Inner cover 303 is that bottom surface opening, cross section are the lid of rectangular ring, and the top profile of lid can be the frustum structure, also can be the platform-like structure.The inner cover of frustum structure is less to the resistance of hot blast, helps hot blast transmission from top to bottom, improves the efficiency of heating surface; Also can adopt the top structure of platform-like, as shown in Figure 6, its advantage is to realize with a compact material integral body processing of hot-blast spray nozzle, also promptly needn't process respectively and weld the inner cover and the shell of nozzle, thereby the high accuracy that can guarantee 301 on inner cover 303 and shell cooperates.

In the unloading process, at first the rectangular panel of hot-blast spray nozzle device being installed to BGA reprocesses on the hot blast interface of platform, the decline hot-blast spray nozzle, adjust the vertical range of nozzle with respect to stack packaged device on the pcb board, just entangle device package with the inner cover of guaranteeing nozzle, and leave certain slit between the lower port of assurance shell 301 and pcb board, this moment, the opening of inner cover 303 was in the below of piling up device orlop substrate substantially, then, start and to reprocess heating schedule that platform configured and dismantle and get final product.

In sum, the utility model hot-blast spray nozzle device has been realized the integral demounting to stack packaged device, has overcome the device that utilizes prior art to cause and has fallen apart and scrap problem, has saved maintenance cost, has improved operating efficiency.

More than be in order to make those of ordinary skills understand the utility model; and to detailed description that the utility model carried out; but can expect; in the scope that does not break away from claim of the present utility model and contained, can also make other variation and modification, these variations and revising all in protection domain of the present utility model.

Claims

1, a kind of device of dismantling stack packaged device is characterized in that, is formed by connecting through the part by shell and inner cover two parts, and hot blast can be by the welding portion of the stack packaged device of gap arrival between the two; Shell sizes is greater than inner cover bottom opening size, and inner cover bottom opening size is measure-alike with stack packaged device.

2, device according to claim 1 is characterized in that, described inner cover is that bottom opening, cross section are the lid of rectangle, and the top profile of lid is frustum structure or platform-like structure; Described shell is the cuboid of hollow; Upper and lower four angles of described inner cover and described shell weld together; Cover on described housings in described, its opening is consistent with the direction of described shell under shed, and the certain distance that contracts in the under shed end face of opening with respect to described shell; Four sides of described inner cover all and the gap between the described shell keep evenly.

3, device according to claim 2 is characterized in that described shell upper end projection is used for reprocessing with BGA the installation connection of platform.