CN204122414U - A kind of microscope base adhering machine and dedusting tool thereof - Google Patents
A kind of microscope base adhering machine and dedusting tool thereof Download PDFInfo
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- CN204122414U CN204122414U CN201420333262.5U CN201420333262U CN204122414U CN 204122414 U CN204122414 U CN 204122414U CN 201420333262 U CN201420333262 U CN 201420333262U CN 204122414 U CN204122414 U CN 204122414U
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Abstract
A kind of microscope base adhering machine and dedusting tool thereof, it is suitable for carrying out dust removal operation to the chip that will encapsulate, and described dedusting tool comprises: an air jet system, and described air jet system comprises an air injection unit and at least one air nozzle; And a getter device, described getter device comprises a suction unit and at least one vacuum noz(zle), wherein dedusting gas is discharged by described air nozzle under the effect of described air injection unit, to blow away the grit of described chip surface, and siphoned away by described vacuum noz(zle) under the effect of air pressure that produces at described suction unit of the dedusting gas being loaded with described dirt material and discharge described dedusting tool.
Description
Technical field
The utility model relates to a kind of microscope base adhering machine and dedusting tool thereof, more particularly, at the charging aperture of microscope base adhering machine, dedusting tool is set, to remove the micro dust particle on chip, effective control bad point fraction defective and improved fraction defective, not only can reduce production cost, can also product competition be strengthened.
Background technology
COB (Chip on Board) is a kind of mode of integrated antenna package, two kinds of method for making that itself and CSP (Chip Scale Package) encapsulate for cell phone camera module.CSP encapsulation is the compact package of a kind of package casing size closest to seed core (die) size, there is multiple packing forms, and module factory can directly buy packaged upstream materials, encapsulate together with other spare parts again, its advantage is that encapsulation section is completed by FEOL, process apparatus cost is lower, processing time is short, and facing challenges is that light penetration rate is not good, price is more expensive, highly higher, backlight penetrates ghost phenomenon, in order to change the shortcoming of upper CSP, therefore occurred that COB encapsulates such mode, COB encapsulation then directly chip package within module, mainly through chip body and I/O terminal are put above crystal, when welding by circuit boards bonding for this bare chip conduction/heat-conducting glue, after solidifying, again by wire through effect that is ultrasonic or hot pressing, be connected on the I/O terminal welding zone of the chip pad corresponding with circuit board, after eventually passing test passes, seal up resin glue again, and COB encapsulation is because accurate spare part is without protection, therefore must be carry out operation at dust free room, and the investment of its relevant device procurement value is also high.If but the yield of encapsulation is controlled proper, compared to conventional packaging techniques, COB encapsulation not only can reduced volume, can also effectively control cost simultaneously.
But along with now science and technology development and the basic demand of modern to mobile phone camera more and more higher, therefore the demand of high pixel camera is increasing, but the higher mobile module of pixel is in manufacturing process, the particulate that dust is such is required also relatively higher, as long as attach some particulates, just must carry out reprocessing or scrapping, and the higher mobile module of pixel is also relatively higher for the requirement of particle.But in current processing procedure, encapsulation process still causes product to reprocess or to scrap than being easier to be subject to attaching of dust, and therefore yield does not reach desirable effect, causes first-pass yield low always.On long terms, such problem continues occurring again always, if do not manage to solve, after the rate of gross profit of encapsulation factory starts to decline, for manufacturer's integral benefit, can produce very serious impact.
Summary of the invention
Main purpose of the present utility model is to provide a kind of microscope base adhering machine and dedusting tool thereof, arranges dedusting tool at the charging aperture of microscope base adhering machine, to remove the micro dust particle on chip.
Another object of the present utility model is to provide a kind of microscope base adhering machine and dedusting tool thereof, described dedusting tool comprises an air jet system and a getter device, effectively can reduce particle in processing procedure to drop and be built-up in the possibility of chip, improving product yield and first-pass yield.
Another object of the present utility model is to provide a kind of microscope base adhering machine and dedusting tool thereof, the dust particle attached on chip can be removed through described air jet system, makes chip surface keep clean, improving product first-pass yield.
Another object of the present utility model is to provide a kind of microscope base adhering machine and dedusting tool thereof, can be outside by directly being drawn by the particle blown afloat to board through described getter device, particle can not be dropped again, avoid secondary pollution.
Another object of the present utility model is to provide a kind of microscope base adhering machine and dedusting tool thereof, and described air jet system and described getter device must carry out action simultaneously, guarantee chip before picture glue can not on attaching any powder dust particle, reduce product repair rate.
Another object of the present utility model is to provide a kind of microscope base adhering machine and dedusting tool thereof, and described air jet system is the appearance design of a kind of whole row's formula, really can aim at the edge of each chip, reaches the effect of really removing dedusting.
Another object of the present utility model is to provide a kind of microscope base adhering machine and dedusting tool thereof, through the angle allowed folded by described dedusting tool and described chip in fixed angle, can guarantee that gas can blow to whole chip, to reach best dust removing effects.
Another object of the present utility model is to provide a kind of microscope base adhering machine and dedusting tool thereof, the height distance of described dedusting tool and described chip is in preset range, in order to guarantee that powder dust particle indispensability blows afloat and is sucked away simultaneously, guarantee to reach best dust removing effects.
Another object of the present utility model is to provide a kind of microscope base adhering machine and dedusting tool thereof, each nozzle gap size apart of described whole row's formula air jet system, can replace according to described die size difference, make the effect that dedusting action all can remain best on the chip of different size.
Another object of the present utility model is to provide a kind of microscope base adhering machine and dedusting tool thereof, described dedusting tool is when carrying out sucking action through described getter device, air can be discharged toward board device external, guarantee that micro dust particle can not drop again in described chip, realize really clean dedusting.
For achieving the above object, the utility model provides a kind of dedusting tool for chip on board encapsulation (COB), and to carry out dust removal operation to the chip that will encapsulate, it comprises:
One air jet system, described air jet system comprises an air injection unit and at least one air nozzle; And
One getter device, described getter device comprises a suction unit and at least one vacuum noz(zle), wherein dedusting gas is discharged by described air nozzle under the effect of described air injection unit, to blow away the grit of described chip surface, and siphoned away by described vacuum noz(zle) under the effect of air pressure that produces at described suction unit of the dedusting gas being loaded with described grit.
Preferably, described air jet system and described getter device are installed on a chip on board encapsulation board.
Preferably, described air jet system comprises multiple described air nozzle, the arrangement of multiple described air nozzle parallel to each other and compartment of terrain, and be joined together to form whole row's air nozzle unit, described whole row's air nozzle unit is removably installed in described air injection unit, changes according to the arrangement mode of described chip to facilitate.
Preferably, the described air nozzle of described air jet system is arranged towards the direction of described chip edge.
Preferably, the described air nozzle of described air jet system is arranged relative to described chip place planar tilt.
Preferably, the described air nozzle of described air jet system has angle relative to described chip place planar shaped, and the scope of described angle is between 30 ° ~ 60 °.
Preferably, described dedusting gas is filtered air or nitrogen.
Preferably, described air nozzle and described vacuum noz(zle) are made up of antistatic material.
According to another aspect of the present utility model, the utility model also provides a kind of microscope base adhering machine, and it comprises:
One machine table main body, described machine table main body has a charging aperture; And
One dedusting tool, described dedusting tool is arranged on the position of contiguous described charging aperture, to carry out dust removal operation to the chip will sending into described machine table main body inside, preferably, in above-mentioned microscope base adhering machine, described dedusting tool comprises an air jet system, described air jet system comprises an air injection unit and at least one air nozzle, wherein dedusting gas is sent to described air nozzle under the effect of described air injection unit, to blow away the grit of described chip surface, preferably, in above-mentioned microscope base adhering machine, described dedusting tool comprises a getter device, described getter device comprises a suction unit and at least one vacuum noz(zle), the gas that wherein will enter near the inner described chip carrying out attachment process of described machine table main body is siphoned away by described vacuum noz(zle) in the effect of described suction unit.
Preferably, in above-mentioned microscope base adhering machine, described machine table main body also comprises a film advance mechanism, to transmit described chip to described charging aperture, described vacuum noz(zle) and described air nozzle are positioned at the top of described film advance mechanism, and described vacuum noz(zle) is farther from described charging aperture relative to described air nozzle.
Preferably, in above-mentioned microscope base adhering machine, the multiple described air nozzle of described air jet system packaging, the arrangement of multiple described air nozzle parallel to each other and compartment of terrain, and be joined together to form whole row's air nozzle unit, described whole row's air nozzle unit is removably installed in described air injection unit, changes according to the arrangement mode of described chip to facilitate.
Preferably, in above-mentioned microscope base adhering machine, described air nozzle and described chip place planar shaped have angle, and the scope of described angle is between 30 ° ~ 60 °.
Preferably, in above-mentioned microscope base adhering machine, described dedusting gas is filtered air or nitrogen.
Preferably, in above-mentioned microscope base adhering machine, the distance between described air nozzle and described film advance mechanism is between 1cm ~ 4cm, and the distance between described vacuum noz(zle) and described film advance mechanism is between 2cm ~ 10cm.
Described dedusting tool not only greatly improves the problem that in mobile phone module encapsulation process, yield is on the low side, also reduce the ratio that micro dust particle remains in described chip surface, the control bad to bad point has good effect, more obviously can reduce the drift particle of processing procedure to the impact of yield, strengthen the competitiveness of product.
Accompanying drawing explanation
Fig. 1 is the perspective view of the dedusting tool according to preferred embodiment of the present utility model.
Fig. 2 is the nozzle correspondence position schematic diagram of the dedusting tool according to preferred embodiment of the present utility model.
Fig. 3 is the side schematic view when applying of the dedusting tool according to preferred embodiment of the present utility model.
Fig. 4 is the schematic perspective view of dedusting tool when applying according to preferred embodiment of the present utility model.
Fig. 5 is the structural representation of the microscope base adhering machine according to preferred embodiment of the present utility model.
Detailed description of the invention
Below describe and realize the utility model for disclosing the utility model to enable those skilled in the art.Preferred embodiment in below describing only as an example, it may occur to persons skilled in the art that other apparent modification.The general principle of the present utility model defined in the following description can be applied to other embodiments, deformation program, improvement project, equivalent and not deviate from the other technologies scheme of spirit and scope of the present utility model.
The perspective view of microscope base adhering machine 100 according to preferred embodiment of the present utility model and dedusting tool 1 thereof as shown in Figures 1 to 5, it is worth mentioning that, described dedusting tool 1 of the present utility model is applicable to being integrated in other chip on boards encapsulation (COB) board, provides dust removing effects to give the chip in packaging technology.That is, described dedusting tool of the present utility model is not limited for described microscope base adhering machine 100, but may be used for the chip dedusting of other COB chip mounters.
In preferred embodiment in the utility model, described microscope base adhering machine 100 comprises machine table main body 101, described machine table main body 101 has comprised the necessary parts of attachment process, and there is charging aperture 102, described dedusting tool 1 is arranged at the position being adjacent to described charging aperture 102, thus carries out dedusting to the chip entering described machine table main body 101.
That is, the whole processing technology of traditional microscope base adhering machine 100 comprises board and send sheet, and board draws glue, lid camera lens, then the step such as slice.And in the utility model, described microscope base adhering machine 100 adds described dedusting tool 1, thus send sheet and board to draw between glue step at above-mentioned board, adds dust removal step, remain in the unilateral dust particle of chip to reduce, thus improve the yield in module process of assembling.
More specifically, described microscope base adhering machine 100 also comprises film advance mechanism 103, chip 104 is sent to described charging aperture 102 by it, described dedusting tool 1 carries out dedusting in the position of contiguous described charging aperture 102 to described chip 104, thus it is clean and tidy to guarantee to enter described chip 104 surface clean completing the operations such as paster in described microscope base adhering machine 100.
Described dedusting tool 1 is be made up of an air jet system 10 and a getter device 20, and described air jet system 10 comprises an air injection unit 11 and at least one air nozzle 12.Described air injection unit 11 for transmitting gas to described air nozzle 12, such as, can be embodied as air blast, described air nozzle 12 by chip described in gas channeling 104, to remove the dust and solid particle etc. on described chip 104 surface.
Described air nozzle 12 fixedly forms for multiple nozzle is arranged in parallel, each injector spacing can be corresponding with described chip 104 location gap on described film advance mechanism 103, and described air nozzle 12 can be a kind of arrangement outward appearance of whole row's formula nozzle, it is removably installed on described microscope base adhering machine 100, whole row's formula design department is in order to coordinate the stepwise operation of described microscope base adhering machine 100, be convenient to carry out switching promoting the circulation of qi body ejection of going forward side by side fast, to realize the object of dedusting.
That is, described air jet system 10 comprises multiple described air nozzle 12, the arrangement of multiple described air nozzle 12 parallel to each other and compartment of terrain, and link together to form whole row's air nozzle unit, described whole row's air nozzle unit is replaceable, thus changes for the arrangement mode of the described chip 104 on described film advance mechanism 103.
More specifically, such as, when the increasing number of the described chip 104 on described film advance mechanism 103, and when interval diminishes, corresponding described whole row's air nozzle unit also corresponding being replaced by has more described air nozzle 12, and the pitch smaller between adjacent described air nozzle 12, with to the quantity of the described chip 104 on described film advance mechanism 103 with arrange corresponding.Thus, for needing the arrangement mode of the described chip 104 of dedusting to arrange the described air nozzle 12 of multiple correspondence, substantially increase efficiency of dust collection.
It is worth mentioning that, described air nozzle 12, as shown in FIG., may be embodied as tubular structure, and its quantity and internal diameter can be determined according to actual needs, mainly meets the dust that can effectively remove on corresponding described chip 104 and solid particle.
Described getter device 20 comprises a suction unit 21 and at least one vacuum noz(zle) 22, described suction unit 21 may be embodied as air exhauster, be used for producing air pressure, thus by described vacuum noz(zle) 22 suction gas, to take away dust and the solid particle on described chip 104 surface.
It is worth mentioning that, described vacuum noz(zle) 22 is positioned at described air nozzle 12 front and compared with described air nozzle 12, position away from described charging aperture 102, described chip 104 on described like this film advance mechanism 103 first reaches the below of described vacuum noz(zle) 22, and then continues the below arriving forward described air nozzle 12.Like this, the dust blown afloat by described air jet system 10 and solid particle can be siphoned away by described vacuum noz(zle) 22, prevent secondary pollution.
That is, described dedusting tool 1 creates air circulation system, the described air injection unit 11 of described air jet system 10 sprays gas, gas sprays from described air nozzle 12 dust and the solid particle that blow away described chip 104 surface, then the gas being loaded with dust and solid particle enters described vacuum noz(zle) 22 further, discharges further under the gas pressure that described suction unit 21 produces.Such as in actual applications, the gas being loaded with dust and solid particle can be discharged outside described dedusting tool 1 by exhaust passage, also can by filter by dust and solid particulate filters, and only discharging gas, dust and solid particle be unified process again after being collected by described filter.
As shown in Figures 3 and 4, described vacuum noz(zle) 22 may be embodied as tubular structure, forms air intake passage therein.Described vacuum noz(zle) 22 is positioned at the front of described air nozzle 12, and can be positioned at directly over described film advance mechanism 103.When stick to the micro dust particle on described chip 104 blow afloat by described air jet system 10 while, described getter device 20 can start simultaneously extracts micro dust particle out described microscope base adhering machine 100, makes described chip 104 can not be subject to micro dust particle secondary pollution.The gas-circulating system that described air jet system 10 and described getter device 20 are formed, continue and repetition carry out action always, the situation that attaches of micro dust particle is improved.
It is worth mentioning that, the gas being used for carrying out dedusting ejection is N
2(nitrogen), or filtered air.These two kinds of gases are the gas than being easier to obtain in practical application, therefore preferably among these two kinds, get one, and N
2effect when carrying out dedusting is better than filtered air, therefore last just selected N
2as the gas adopted in described dedusting tool 1.Certainly, it will be appreciated by persons skilled in the art that and also can adopt other dedusting gases according to actual needs.
As shown in Figure 3, described air jet system 11 not aims at described chip 104 as the crow flies, but aim at described chip 104 edge in certain oblique angle mode, the described air nozzle 12 of described air jet system 10 has angle with the planar shaped at described chip 104 place, that is, described air nozzle 12 is arranged obliquely relative to described chip 104.
In this preferred embodiment of the present utility model, described angular range is preferably between 30 degree to 60 degree.It is worth mentioning that, according to the size of described chip 104, described angle also can correspondingly adjust, to obtain better dust removing effects.Particularly, described chip 104 area is larger, and angle can tend to 30 degree, and namely angle can be less, otherwise when described chip 104 area is less, described angle then can tend to 60 degree, and that is angle can become large.Its reason is, when gas sprays, described angle is larger, and direct contact surface is long-pending less, otherwise folded angle is less, more area can be had directly to contact, and blowing force can be larger.So, when described chip 104 area is less, angle can be inclined to 60 degree, because the area that needs carry out cleaning is less, so folded angle does not need too urine can clean described chip surface completely, and when described chip 104 area is larger, then must be more a little bit smaller relative to the angle of described chip 104 place plane by the air nozzle 12 of described air jet system 10, gas just likely can be allowed to blow over described chip 104 surface completely and to carry out dust removal operation.
Except the described air nozzle 12 of described air jet system 10 and the angle of described chip 104 limit to some extent, highly also the needing of described dedusting tool 1 and described chip 104 and described film advance mechanism 103 distance controls in preset range.Such as, described in the extended distance of described air nozzle 12, the distance of film advance mechanism 103 is at more than 1cm, can guarantee when sticking to the micro dust particle on described chip 104 and being blown afloat, the described vacuum noz(zle) 22 being positioned at the described getter device 20 of top can be siphoned away effectively, directly be discharged to described microscope base adhering machine 100 outside, micro dust particle because of not drawn by described getter device 20, and then can not be dropped on described chip 104 again, causing secondary pollution.Preferably, the distance between described air nozzle 12 and described film advance mechanism 103 is between 1cm ~ 4cm, and the distance between described vacuum noz(zle) 22 and described film advance mechanism 103 is between 2cm ~ 10cm.
As shown in Figure 4, for the described chip 104 on the described film advance mechanism 103 of described microscope base adhering machine, before and after it, between left and right apart from being all a fixing size, add that the described film advance mechanism 103 of described microscope base adhering machine 100 can operate by step-wise fashion, therefore when the every stepping of described film advance mechanism 103 one time of described microscope base adhering machine 100, described dedusting tool 1 also can carry out one-time dedusting action simultaneously, also it is significant to note that, described air jet system 10 is be designed to carry out action with described getter device 20 simultaneously, it is not the mode of order action, that is, when the described film advance mechanism 103 of described microscope base adhering machine 100 carries out step-by-step operation, while described chip 104 arrives the position of contiguous described charging aperture 102, described air jet system 10 can spray gas through described air nozzle 12 immediately, meanwhile, described getter device 20 also carries out twitch together with the time and does, the gas of inside and micro dust particle are all extracted into described microscope base adhering machine 100 outside, through the design operated so simultaneously, more can guarantee described chip 104 complete dedusting clean after, the situation of secondary pollution is not easily had to occur again, therefore product repair rate can reduce.
Therefore, described dedusting tool 1 can be considered as an inner loop system because of its function mode, the effect of a suction is blown through one, significantly reduce the ratio that micro dust particle remains in new film surface, and described air jet system 10 and described getter device 20 are again with the angle of described chip 104 with highly also limit all to some extent, this can guarantee that micro dust particle also can be sucked away while being blown afloat, except its secondary pollution must not be subject to the described chip carrying out dustproof function, also can determine not cause repeated contamination to other non-drifting dust regions.Therefore described dedusting tool 1 control bad to bad point can produce excellent effect, fraction defective simultaneously for the mobile micro dust particle in processing procedure also obviously reduces, be not only promote yield to bring good benefit with reduction repair rate to manufacturing cost, in the competitiveness of product, also bring the impact of forward simultaneously.
One skilled in the art will understand that the embodiment of the present utility model shown in foregoing description and accompanying drawing only limits the utility model as an example and not.The purpose of this utility model is complete and effectively realize.Function of the present utility model and structural principle are shown in an embodiment and are illustrated, do not deviating under described principle, embodiment of the present utility model can have any distortion or amendment.
Claims (14)
1., for a dedusting tool for chip on board encapsulation, to carry out dust removal operation to the chip that will encapsulate, it is characterized in that, comprising:
One air jet system, described air jet system comprises an air injection unit and at least one air nozzle; And
One getter device, described getter device comprises a suction unit and at least one vacuum noz(zle), wherein dedusting gas is discharged by described air nozzle under the effect of described air injection unit, to blow away the grit of described chip surface, and siphoned away by described vacuum noz(zle) under the effect of air pressure that produces at described suction unit of the dedusting gas being loaded with described grit.
2. as claimed in claim 1 for the dedusting tool of chip on board encapsulation, it is characterized in that, described air jet system and described getter device are installed on a chip on board encapsulation board.
3. as claimed in claim 1 for the dedusting tool of chip on board encapsulation, it is characterized in that, described air jet system comprises multiple described air nozzle, the arrangement of multiple described air nozzle parallel to each other and compartment of terrain, and be joined together to form whole row's air nozzle unit, described whole row's air nozzle unit is removably installed in described air injection unit, changes according to the arrangement mode of described chip to facilitate.
4., as claimed in claim 1 for the dedusting tool of chip on board encapsulation, it is characterized in that, the described air nozzle of described air jet system is arranged towards the direction of described chip edge.
5., as claimed in claim 1 for the dedusting tool of chip on board encapsulation, it is characterized in that, the described air nozzle of described air jet system is arranged relative to described chip place planar tilt.
6., as the dedusting tool for chip on board encapsulation as described in arbitrary in claim 1 to 5, it is characterized in that, the described air nozzle of described air jet system has angle relative to described chip place planar shaped, and the scope of described angle is between 30 ° ~ 60 °.
7., as the dedusting tool for chip on board encapsulation as described in arbitrary in claim 1 to 5, it is characterized in that, described dedusting gas is filtered air or nitrogen.
8., as the dedusting tool for chip on board encapsulation as described in arbitrary in claim 1 to 5, it is characterized in that, described air nozzle and described vacuum noz(zle) are made up of antistatic material.
9. a microscope base adhering machine, is characterized in that, comprising:
One machine table main body, described machine table main body has a charging aperture; And
One dedusting tool, described dedusting tool is arranged on the position of contiguous described charging aperture, to carry out dust removal operation to the chip will sending into described machine table main body inside, wherein said dedusting tool comprises an air jet system, described air jet system comprises an air injection unit and at least one air nozzle, wherein dedusting gas is sent to described air nozzle under the effect of described air injection unit, to blow away the grit of described chip surface, and described dedusting tool comprises a getter device, described getter device comprises a suction unit and at least one vacuum noz(zle), the gas that wherein will enter near the inner described chip carrying out attachment process of described machine table main body is siphoned away by described vacuum noz(zle) in the effect of described suction unit.
10. microscope base adhering machine as claimed in claim 9, it is characterized in that, described machine table main body also comprises a film advance mechanism, to transmit described chip to described charging aperture, described vacuum noz(zle) and described air nozzle are positioned at the top of described film advance mechanism, and described vacuum noz(zle) is farther from described charging aperture relative to described air nozzle.
11. as the microscope base adhering machine as described in arbitrary in claim 9 to 10, it is characterized in that, the multiple described air nozzle of described air jet system packaging, the arrangement of multiple described air nozzle parallel to each other and compartment of terrain, and be joined together to form whole row's air nozzle unit, described whole row's air nozzle unit is removably installed in described air injection unit, changes according to the arrangement mode of described chip to facilitate.
12. microscope base adhering machines as claimed in claim 11, is characterized in that, described air nozzle and described chip place planar shaped have angle, and the scope of described angle is between 30 ° ~ 60 °.
13. as the microscope base adhering machine as described in arbitrary in claim 9 to 10, and it is characterized in that, described dedusting gas is filtered air or nitrogen.
14. microscope base adhering machines as claimed in claim 10, it is characterized in that, the distance between described air nozzle and described film advance mechanism is between 1cm ~ 4cm, and the distance between described vacuum noz(zle) and described film advance mechanism is between 2cm ~ 10cm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420333262.5U CN204122414U (en) | 2014-06-20 | 2014-06-20 | A kind of microscope base adhering machine and dedusting tool thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420333262.5U CN204122414U (en) | 2014-06-20 | 2014-06-20 | A kind of microscope base adhering machine and dedusting tool thereof |
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| CN204122414U true CN204122414U (en) | 2015-01-28 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107931248A (en) * | 2017-11-30 | 2018-04-20 | 浙江舜宇光学有限公司 | Eyeglass dust-extraction unit |
| CN108273752A (en) * | 2018-03-13 | 2018-07-13 | 顺丰科技有限公司 | Dust-extraction unit and automatic sorting apparatus for automatic sorting apparatus |
| CN109719084A (en) * | 2018-12-26 | 2019-05-07 | 歌尔股份有限公司 | Air blowing dedusting tooling and MEMS chip dust removal method |
-
2014
- 2014-06-20 CN CN201420333262.5U patent/CN204122414U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107931248A (en) * | 2017-11-30 | 2018-04-20 | 浙江舜宇光学有限公司 | Eyeglass dust-extraction unit |
| CN107931248B (en) * | 2017-11-30 | 2024-01-26 | 浙江舜宇光学有限公司 | Lens dust removing device |
| CN108273752A (en) * | 2018-03-13 | 2018-07-13 | 顺丰科技有限公司 | Dust-extraction unit and automatic sorting apparatus for automatic sorting apparatus |
| CN109719084A (en) * | 2018-12-26 | 2019-05-07 | 歌尔股份有限公司 | Air blowing dedusting tooling and MEMS chip dust removal method |
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