JPH11193334A - Etchant for cured epoxy resin - Google Patents
Etchant for cured epoxy resinInfo
- Publication number
- JPH11193334A JPH11193334A JP29809698A JP29809698A JPH11193334A JP H11193334 A JPH11193334 A JP H11193334A JP 29809698 A JP29809698 A JP 29809698A JP 29809698 A JP29809698 A JP 29809698A JP H11193334 A JPH11193334 A JP H11193334A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- alkali metal
- etchant
- metal compound
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、絶縁材料、接着
剤、塗料などに用いられるエポキシ樹脂硬化物のエッチ
ング液に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin cured liquid etchant used for insulating materials, adhesives, paints and the like.
【０００２】[0002]
【従来の技術】エポキシ樹脂は、ポリイミド樹脂と同様
にその電気特性、接着性に優れているため、種々の分野
で利用されている。エポキシ樹脂及びポリイミド樹脂
は、用途が広がるにつれ、樹脂の一部を粗化や除去して
使用するような用途がでてきた。ポリイミド樹脂のエッ
チングに関しては、従来からよく行われており、ヒドラ
ジン等の塩基性溶液でエッチングする方法が、特開昭５
０−４５７７号公報、特開昭５１−２７４６４号公報、
及び特開昭５３−４９０６８号公報などにより知られて
いる。2. Description of the Related Art Epoxy resins, like polyimide resins, are used in various fields because of their excellent electrical properties and adhesiveness. Epoxy resins and polyimide resins have been used for roughening or removing a part of the resin as the applications have expanded. With respect to etching of a polyimide resin, a method of etching with a basic solution such as hydrazine has been widely used.
0-4577, JP-A-51-27464,
And JP-A-53-49068.
【０００３】また、エポキシ樹脂の粗化やエッチングに
関しては、プリント配線板に用いられるエポキシ樹脂硬
化物の表面粗化処理、デスミア処理、エッチバック処理
に用いられる濃硫酸、クロム酸、アルカリ過マンガン酸
塩などでエッチングする方法が、特開昭５４−１４４９
６８号公報や、特開昭６２−１０４１９７号公報によっ
て知られれている。また、エポキシ樹脂に、アルカリに
可溶なアクリル樹脂を添加して、エッチングする方法
が、特開平５−２１８６５１号公報によって知られてい
る。Further, regarding the roughening and etching of epoxy resin, concentrated sulfuric acid, chromic acid, and alkali permanganic acid used for surface roughening, desmearing, and etch-back of a cured epoxy resin used for a printed wiring board are used. Japanese Patent Laid-Open No. 54-1449 discloses a method of etching with a salt or the like.
No. 68 and Japanese Patent Application Laid-Open No. 62-104197. Further, a method of adding an acrylic resin which is soluble in an alkali to an epoxy resin and performing etching is known from Japanese Patent Application Laid-Open No. H5-221851.
【０００４】[0004]
【発明が解決しようとする課題】無変性のエポキシ樹脂
の硬化物を、粗化、エッチングするのは、濃硫酸、クロ
ム酸、アルカリ過マンガン酸塩を使用していたが、これ
らの液は労働安全衛生法の特定化学物質に該当する薬品
であり、安全上取扱いに十分な注意が必要であり、さら
に取扱い者には定期的に健康診断が義務付けられる。さ
らに濃硫酸は吸水性が強いために、十分な濃度管理が必
要であり、アルカリ過マンガン酸塩でエポキシ樹脂を完
全に除去するには、８０℃前後の高温と３０分以上の時
間が必要であった。また、エポキシ樹脂をエッチング可
能にするためにアクリル樹脂を添加した変性エポキシ樹
脂の場合、エポキシ樹脂の耐熱性、耐薬品性等の優れた
特性を低下させてしまう。The roughening and etching of a cured product of an unmodified epoxy resin uses concentrated sulfuric acid, chromic acid, and alkali permanganate. It is a chemical substance that falls under the specified chemical substance of the Health and Safety Law, requires careful handling for safety, and requires regular health examinations for the handler. Furthermore, concentrated sulfuric acid has a high water absorption, so it is necessary to control the concentration sufficiently. To completely remove the epoxy resin with an alkali permanganate, a high temperature of about 80 ° C. and a time of 30 minutes or more are required. there were. Further, in the case of a modified epoxy resin to which an acrylic resin is added so that the epoxy resin can be etched, excellent properties such as heat resistance and chemical resistance of the epoxy resin are deteriorated.
【０００５】本発明は、取り扱いが容易で、無変性のエ
ポキシ樹脂の除去を可能とするエッチング液を提供する
ことを目的とする。[0005] It is an object of the present invention to provide an etchant which is easy to handle and which enables removal of an unmodified epoxy resin.
【０００６】[0006]
【課題を解決するための手段】本発明のエポキシ樹脂硬
化物のエッチング液は、ハロゲン化エポキシ樹脂組成物
の硬化物をエッチングする溶液であって、アミド系溶媒
と、アルカリ金属化合物の水溶液からなることを特徴と
する。The etchant for a cured epoxy resin of the present invention is a solution for etching a cured product of a halogenated epoxy resin composition, and comprises an amide solvent and an aqueous solution of an alkali metal compound. It is characterized by the following.
【０００７】本発明者らは、鋭意検討の結果、エポキシ
重合体の分解反応について種々検討した結果、エポキシ
重合体が、アミド系溶媒中でアルカリ金属化合物により
分解することを見出し、本発明をなしたものである。As a result of intensive studies, the present inventors have conducted various studies on the decomposition reaction of an epoxy polymer, and have found that the epoxy polymer is decomposed by an alkali metal compound in an amide-based solvent. It was done.
【０００８】[0008]
【発明の実施の形態】本発明のエッチング液は、アミド
系溶媒、アルカリ金属化合物の水溶液を配合、混合して
調製することができる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The etching solution of the present invention can be prepared by mixing and mixing an amide solvent and an aqueous solution of an alkali metal compound.
【０００９】本発明のエッチング液構成成分であるアミ
ド系溶媒は、どのようなものでもよく、例えば、ホルム
アミド、Ｎ−メチルホルムアミド、Ｎ，Ｎ−ジメチルホ
ルムアミド、アセトアミド、Ｎ−メチルアセトアミド、
Ｎ，Ｎ−ジメチルアセトアミド、Ｎ，Ｎ，Ｎ’，Ｎ’−
テトラメチル尿素、２−ピロリドン、Ｎ−メチル−２−
ピロリドン、カルバミド酸エステルなどがある。これら
のうち、Ｎ，Ｎ−ジメチルホルムアミド、Ｎ，Ｎ−ジメ
チルアセトアミド、Ｎ−メチル−２−ピロリドンがエポ
キシ樹脂硬化物を膨潤させる効果があり、分解物の溶解
性が良好なために特に好ましい。これらの溶媒は併用す
ることができる。また、ケトン系溶媒、エーテル系溶媒
などに代表されるその他の溶媒と併用しても構わない。The amide solvent which is a component of the etching solution of the present invention may be any solvent, for example, formamide, N-methylformamide, N, N-dimethylformamide, acetamide, N-methylacetamide,
N, N-dimethylacetamide, N, N, N ', N'-
Tetramethylurea, 2-pyrrolidone, N-methyl-2-
Examples include pyrrolidone and carbamic acid esters. Of these, N, N-dimethylformamide, N, N-dimethylacetamide, and N-methyl-2-pyrrolidone are particularly preferred because they have the effect of swelling the cured epoxy resin and have good solubility of the decomposition product. These solvents can be used in combination. Further, it may be used in combination with other solvents typified by ketone solvents, ether solvents and the like.
【００１０】ここで併用できるケトン系溶媒は、どのよ
うなものでもよく、例えば、アセトン、エチルエチルケ
トン、２−ペンタノン、３−ペンタノン、２−ヘキサノ
ン、メチルイソブチルケトン、２−ヘプタノン、４−ヘ
プタノン、ジイソブチルケトン、シクロヘキサノンなど
がある。The ketone solvent which can be used in combination here may be any solvent, for example, acetone, ethyl ethyl ketone, 2-pentanone, 3-pentanone, 2-hexanone, methyl isobutyl ketone, 2-heptanone, 4-heptanone. , Diisobutyl ketone and cyclohexanone.
【００１１】ここで併用できるエーテル系溶媒は、どの
ようなものでもよく、例えば、ジプロピルエーテル、ジ
イソプロピルエーテル、ジブチルエーテル、アニソー
ル、フェネトール、ジオキサン、テトラヒドロフラン、
エチレングリコールジメチルエーテル、エチレングリコ
ールジエチルエーテル、ジエチレングリコールジメチル
エーテル、ジエチレングリコールジエチルエーテルなど
がある。The ether solvent that can be used in combination here may be any solvent, for example, dipropyl ether, diisopropyl ether, dibutyl ether, anisole, phenetole, dioxane, tetrahydrofuran,
Examples include ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, and diethylene glycol diethyl ether.
【００１２】本発明のエッチング液構成成分であるアル
カリ金属化合物は、リチウム、ナトリウム、カリウム、
ルビジウム、セシウム等のアルカリ金属化合物で水に溶
解するものであればどのようなものでもよく、例えば、
リチウム、ナトリウム、カリウム、ルビジウム、セシウ
ム等の金属、水素化物、水酸化物、ホウ水素化物、アミ
ド、フッ化物、塩化物、臭化物、ヨウ化物、ホウ酸塩、
リン酸塩、炭酸塩、硫酸塩、硝酸塩、有機酸塩、フェノ
ール塩などが使用できる。これらのうち、アルカリ金属
水酸化物が好ましく、水酸化リチウム、水酸化ナトリウ
ム、水酸化カリウムが特に好ましい。The alkali metal compound which is a component of the etching solution of the present invention includes lithium, sodium, potassium,
Any kind of alkali metal compound such as rubidium and cesium that dissolves in water may be used.
Metals such as lithium, sodium, potassium, rubidium, cesium, hydrides, hydroxides, borohydrides, amides, fluorides, chlorides, bromides, iodides, borates,
Phosphate, carbonate, sulfate, nitrate, organic acid salts, phenol salts and the like can be used. Of these, alkali metal hydroxides are preferred, and lithium hydroxide, sodium hydroxide and potassium hydroxide are particularly preferred.
【００１３】本発明のエッチング液は、アミド系溶媒と
アルカリ金属化合物の水溶液からなり、アルカリ金属化
合物水溶液のアルカリ金属化合物濃度はどのような濃度
でも構わないが、０．５重量％から６０重量％の範囲が
好ましい。アルカリ金属化合物水溶液のアルカリ金属化
合物濃度が０．５重量％より低いとエポキシ樹脂硬化物
の分解速度が低下するため好ましくなく、６０重量％よ
り高いと水にアルカリ金属化合物が完全に溶解できない
ので好ましくない。The etching solution of the present invention comprises an amide solvent and an aqueous solution of an alkali metal compound. The alkali metal compound aqueous solution may have any alkali metal compound concentration, but is preferably 0.5% to 60% by weight. Is preferable. When the concentration of the alkali metal compound in the aqueous solution of the alkali metal compound is lower than 0.5% by weight, the decomposition rate of the cured epoxy resin is reduced, which is not preferable. When the concentration is higher than 60% by weight, the alkali metal compound cannot be completely dissolved in water. Absent.
【００１４】本発明のエッチング液は、アミド系溶媒
に、アルカリ金属化合物の水溶液を配合して調製する
が、どのような割合で配合しても相分離が起きてしま
う。しかしながら相分離しているために、エポキシ樹脂
の分解物が容易にアミド系溶媒相に溶解が可能である。
また、エッチングの際にエッチング液を９０℃前後まで
加熱して使用しても構わない。The etching solution of the present invention is prepared by mixing an aqueous solution of an alkali metal compound with an amide-based solvent, but phase separation occurs at any ratio. However, due to the phase separation, the decomposition product of the epoxy resin can be easily dissolved in the amide-based solvent phase.
Further, the etching solution may be heated to about 90 ° C. for use during etching.
【００１５】エッチング方法として、相分離したエッチ
ング液中に浸してもよいが、高速攪拌して均一に分散さ
せたエッチング液中に浸すのが好ましい。さらに気泡を
発生させたり、超音波により振動を与えたりしても構わ
ない。液中に浸さなくともスプレー等を使用しても構わ
ないし、さらに高圧をかけても構わない。As an etching method, it may be immersed in a phase-separated etching solution, but it is preferable to immerse it in an etching solution uniformly dispersed by stirring at high speed. Further, bubbles may be generated or vibration may be given by ultrasonic waves. A spray or the like may be used without immersion in the liquid, and a higher pressure may be applied.
【００１６】[0016]
【実施例】実施例１ 臭素化高分子量エポキシ重合体、フェノール樹脂マスク
化ジイソシアネート、クレゾールノボラック型エポキシ
樹脂からなる、フィルムの厚さが５０μｍの熱硬化性エ
ポキシ接着フィルムＡＳ−３０００Ｅ（日立化成工業株
式会社製、商品名）を、１７０℃、３０分加熱して、エ
ポキシ樹脂組成物の硬化フィルムを作製した。この硬化
フィルムは、強靱であり、引っ張っても折っても割れた
り切れたりしなかった。エッチング液として、Ｎ，Ｎ−
ジメチルホルムアミド８０重量％、水酸化ナトリウムの
水溶液（水酸化ナトリウム濃度：５０重量％）２０重量
％の混合溶液を調製した。硬化フィルムを６０℃のエッ
チング液に浸し、軽く振とうしたところ、硬化フィルム
は１５分で完全に溶解した。EXAMPLE 1 Thermosetting epoxy adhesive film AS-3000E (broken high molecular weight epoxy polymer, phenolic resin masked diisocyanate, cresol novolak type epoxy resin) having a thickness of 50 μm (Hitachi Chemical Industry Co., Ltd.) Was heated at 170 ° C. for 30 minutes to produce a cured film of the epoxy resin composition. The cured film was tough and did not crack or break when pulled or folded. N, N-
A mixed solution of 80% by weight of dimethylformamide and 20% by weight of an aqueous solution of sodium hydroxide (concentration of sodium hydroxide: 50% by weight) was prepared. When the cured film was immersed in an etching solution at 60 ° C. and shaken lightly, the cured film was completely dissolved in 15 minutes.
【００１７】実施例２ エッチング液として、Ｎ，Ｎ−ジメチルホルムアミド８
０重量％、水酸化カリウムの水溶液（水酸化カリウム濃
度：５０重量％）２０重量の混合溶液を調製した。実施
例１で作製した硬化フィルムを６０℃のエッチング液に
浸し、軽く振とうしたところ、硬化フィルムは１５分で
完全に溶解した。Example 2 N, N-dimethylformamide 8 was used as an etching solution.
A mixed solution of 0% by weight and 20% by weight of an aqueous solution of potassium hydroxide (concentration of potassium hydroxide: 50% by weight) was prepared. When the cured film prepared in Example 1 was immersed in an etching solution at 60 ° C. and shaken gently, the cured film was completely dissolved in 15 minutes.
【００１８】実施例３ エッチング液として、Ｎ，Ｎ−ジメチルホルムアミド８
０重量％、水酸化リチウムの水溶液（水酸化リチウム濃
度：１０重量％）２０重量％の混合溶液を調製した。実
施例１で作製した硬化フィルムを６０℃のエッチング液
に浸し、軽く振とうしたところ、硬化フィルムは４５分
で完全に溶解した。Example 3 N, N-dimethylformamide 8 was used as an etching solution.
A mixed solution of 0% by weight and 20% by weight of an aqueous solution of lithium hydroxide (lithium hydroxide concentration: 10% by weight) was prepared. When the cured film produced in Example 1 was immersed in an etching solution at 60 ° C. and shaken gently, the cured film was completely dissolved in 45 minutes.
【００１９】実施例４ エッチング液として、Ｎ，Ｎ−ジメチルホルムアミド８
０重量％、水酸化ナトリウムの水溶液（水酸化ナトリウ
ム濃度：１０重量％）２０重量％の混合溶液を調製し
た。実施例１で作製した硬化フィルムを６０℃のエッチ
ング液に浸し、軽く振とうしたところ、硬化フィルムは
２５分で完全に溶解した。Example 4 N, N-dimethylformamide 8 was used as an etching solution.
A mixed solution of 0% by weight and 20% by weight of an aqueous solution of sodium hydroxide (concentration of sodium hydroxide: 10% by weight) was prepared. When the cured film prepared in Example 1 was immersed in an etching solution at 60 ° C. and shaken lightly, the cured film was completely dissolved in 25 minutes.
【００２０】実施例５ エッチング液として、Ｎ，Ｎ−ジメチルアセトアミド８
０重量％、水酸化ナトリウムの水溶液（水酸化ナトリウ
ム濃度：２０重量％）２０重量％の混合溶液を調製し
た。実施例１で作製した硬化フィルムを６０℃のエッチ
ング液に浸し、軽く振とうしたところ、硬化フィルムは
２０分で完全に溶解した。Example 5 N, N-dimethylacetamide 8 was used as an etching solution.
A mixed solution of 0% by weight and 20% by weight of an aqueous solution of sodium hydroxide (concentration of sodium hydroxide: 20% by weight) was prepared. When the cured film prepared in Example 1 was immersed in an etching solution at 60 ° C. and shaken lightly, the cured film was completely dissolved in 20 minutes.
【００２１】実施例６ エッチング液として、Ｎ−メチル−２−ピロリドン８０
重量％、水酸化ナトリウムの水溶液（水酸化ナトリウム
濃度：２０重量％）２０重量％の混合溶液を調製した。
実施例１で作製した硬化フィルムを６０℃のエッチング
液に浸し、軽く振とうしたところ、硬化フィルムは２５
分で完全に溶解した。Example 6 N-methyl-2-pyrrolidone 80 was used as an etching solution.
A mixed solution of 20% by weight of an aqueous solution of sodium hydroxide (concentration of sodium hydroxide: 20% by weight) was prepared.
The cured film prepared in Example 1 was immersed in an etching solution at 60 ° C. and shaken gently.
Dissolved completely in minutes.
【００２２】比較例１ 実施例１で作製した硬化フィルムを６０℃のＮ，Ｎ−ジ
メチルホルムアミドに浸し、軽く振とうしたところ、２
４時間後でもフィルムは原形をとどめていた。Comparative Example 1 The cured film prepared in Example 1 was immersed in N, N-dimethylformamide at 60 ° C. and shaken lightly.
After four hours, the film remained in its original form.
【００２３】比較例２ 実施例１で作製した硬化フィルムを６０℃の２０重量％
水酸化ナトリウムの水溶液に浸し、軽く振とうしたとこ
ろ、２４時間後でもフィルムは原形をとどめていた。Comparative Example 2 20% by weight of the cured film prepared in Example 1 at 60 ° C.
When immersed in an aqueous solution of sodium hydroxide and shaken gently, the film remained in its original form even after 24 hours.
【００２４】比較例３ 実施例１で作製した硬化フィルムを６０℃の５重量％水
酸化ナトリウム、５重量％過マンガン酸カリウムの混合
水溶液に浸し、軽く振とうしたところ、６０分後でもフ
ィルムは表面が粗化されただけだった。Comparative Example 3 The cured film prepared in Example 1 was immersed in a mixed aqueous solution of 5% by weight of sodium hydroxide and 5% by weight of potassium permanganate at 60 ° C. and shaken gently. The surface was only roughened.
【００２５】[0025]
【発明の効果】以上に説明したように、本発明によっ
て、アミド系溶媒、アルカリ金属化合物の水溶液からな
る相分離したエッチング液により、ハロゲン化エポキシ
樹脂組成物の硬化物をエッチングすることができ、か
つ、濃硫酸、クロム酸、アルカリ過マンガン酸塩等の取
り扱いに注意を要する薬品を用いずにエッチングできる
溶液を提供することができる。As described above, according to the present invention, a cured product of a halogenated epoxy resin composition can be etched by a phase-separated etching solution composed of an amide solvent and an aqueous solution of an alkali metal compound. In addition, it is possible to provide a solution that can be etched without using a chemical such as concentrated sulfuric acid, chromic acid, or alkali permanganate that requires care in handling.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 中祖 昭士 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor: Shoji Nakaso 1500 Ogawa, Oaza, Shimodate City, Ibaraki Pref.Hitachi Chemical Industry Co., Ltd.
Claims (4)
エッチングする溶液であって、アミド系溶媒と、アルカ
リ金属化合物の水溶液からなることを特徴とするエポキ
シ樹脂硬化物のエッチング液。1. A solution for etching a cured product of a halogenated epoxy resin composition, comprising: an amide-based solvent and an aqueous solution of an alkali metal compound.
アミド、Ｎ，Ｎ−ジメチルアセトアミド、Ｎ−メチル−
２−ピロリドンのいずれかであることを特徴とする請求
項１に記載のエポキシ樹脂硬化物のエッチング液。2. The method according to claim 1, wherein the amide solvent is N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-amide.
The etchant for a cured epoxy resin according to claim 1, wherein the etchant is one of 2-pyrrolidone.
化物であることを特徴とする請求項１または２に記載の
エポキシ樹脂硬化物のエッチング液。3. The epoxy resin cured product etching solution according to claim 1, wherein the alkali metal compound is an alkali metal hydroxide.
水酸化ナトリウム、水酸化カリウムのいずれかであるこ
とを特徴とする請求項３に記載のエポキシ樹脂硬化物の
エッチング液。4. The method according to claim 1, wherein the alkali metal compound is lithium hydroxide,
The etchant for a cured epoxy resin according to claim 3, wherein the etchant is one of sodium hydroxide and potassium hydroxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29809698A JPH11193334A (en) | 1995-06-01 | 1998-10-20 | Etchant for cured epoxy resin |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13509095A JP3286116B2 (en) | 1995-06-01 | 1995-06-01 | Epoxy resin cured product etchant |
| JP29809698A JPH11193334A (en) | 1995-06-01 | 1998-10-20 | Etchant for cured epoxy resin |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13509095A Division JP3286116B2 (en) | 1995-06-01 | 1995-06-01 | Epoxy resin cured product etchant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11193334A true JPH11193334A (en) | 1999-07-21 |
Family
ID=15143608
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13509095A Expired - Fee Related JP3286116B2 (en) | 1995-06-01 | 1995-06-01 | Epoxy resin cured product etchant |
| JP29809698A Pending JPH11193334A (en) | 1995-06-01 | 1998-10-20 | Etchant for cured epoxy resin |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13509095A Expired - Fee Related JP3286116B2 (en) | 1995-06-01 | 1995-06-01 | Epoxy resin cured product etchant |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP3286116B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4051873B2 (en) * | 1999-10-07 | 2008-02-27 | 日立化成工業株式会社 | Recycling method of composite material of inorganic and cured epoxy resin |
| JP4967885B2 (en) * | 1999-10-07 | 2012-07-04 | 日立化成工業株式会社 | Recycling method for cured epoxy resin |
| ES2239038T3 (en) * | 1999-10-07 | 2005-09-16 | Hitachi Chemical Co., Ltd. | METHOD OF TREATMENT OF CURED PRODUCT WITH EPOXY RESIN. |
| JP4765202B2 (en) * | 2001-06-12 | 2011-09-07 | 日立化成工業株式会社 | Treatment solution for cured epoxy resin, treatment method and treatment product using the same |
| JP4539130B2 (en) * | 2004-03-12 | 2010-09-08 | 日立化成工業株式会社 | Treatment liquid for cured epoxy resin and treatment method using the same |
-
1995
- 1995-06-01 JP JP13509095A patent/JP3286116B2/en not_active Expired - Fee Related
-
1998
- 1998-10-20 JP JP29809698A patent/JPH11193334A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08325437A (en) | 1996-12-10 |
| JP3286116B2 (en) | 2002-05-27 |
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