JPH11186702A - Printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board having lands adaptable to different packages for one kind of electronic elements by placing lands for the smaller package inside lands for the larger package and connecting the same terminal function lands for the electronic components by a pattern. SOLUTION: Lands 1-1 for QEP-80 are placed inside of lands 1-2 for PLCC-84, and the lands having the same terminal function are connected, corresponding to two types of packages. If electronic components of either package are mounted, the operation is the same. This eliminates the need for the package change of electronic elements or printed wiring board change for conforming with developing tools, thus reducing the development cost and production cost.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board on which electronic components are mounted, and more particularly to a printed wiring board capable of mounting both packages on an electronic component having the same function and two different packages.

[0002]

2. Description of the Related Art In a conventional printed wiring board, only one type of land is arranged for one electronic component, and components of the same function but different packages are not considered.

[0003]

In the above prior art, since the land of each electronic component corresponds to only one type of package, each time the package is changed for the convenience of the electronic component maker, the printed wiring board is printed. The design needs to be redone.

Further, since a matching tool such as a CPU is not prepared for each package, when shifting from development to mass production, it is necessary to change a printed wiring board in order to cope with a package type used in mass production. It can happen.

An object of the present invention is to provide a printed wiring board corresponding to different packages for one type of electronic component.

[0006]

A land corresponding to a small package is arranged inside a land having a large package size, and lands having the same terminal function in an electronic component are connected by a pattern, so that two types of packages, large and small, are provided. Can be arranged.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a QFP-80 and PLCC-8.
4 is an embodiment of sharing a land. 1-1 is QFP-
Land for 80. 1-2 is a land for PLCC-84. 1-3 are patterns for connecting terminals having the same function.

In FIG. 1, a land for QFP-80 is arranged inside a land for PLCC-84, which corresponds to two kinds of package types. The same terminal functions are connected by pattern wiring between the land for PLCC-84 and the land for QFP-80.

FIG. 2 shows a state where the QFP-80 is mounted. FIG. 3 shows a state in which the PLCC-84 is mounted. Since the same terminal functions are connected by pattern wiring, the operation is the same regardless of which package electronic component is mounted.

[0011]

According to the present invention, it is not necessary to change the package of the electronic component or the printed wiring board in accordance with the development tool, and it is possible to reduce the development cost and cost.

[Brief description of the drawings]

FIG. 1 is a diagram showing an embodiment of a land where a QFP-80 and a PLCC-84 are shared.

FIG. 2 is a diagram showing a state in which a QFP-80 is mounted.

FIG. 3 is a diagram showing a state in which PLCC-84 is mounted.

[Explanation of symbols]

1-1: Land for QFP-80 1-2: PLCC-8
4 land, 1-3 ... QFP-80 and PLCC-8
4 for connecting terminals having the same function among the four terminals, 2-1.
... QFP-80 type electronic parts. 2-2 ... QFP-8
0 and PLCC-84 common land, 3-1 PLC
Common land for C-84 type electronic parts, 3-2 ... QFP-80 and PLCC-84.

Claims (1)

[Claims] 1. A printed wiring board on which electronic components are mounted, wherein a given component has at least two types of land shapes corresponding to components of different packages with the same function.