JPH11185005A - Connecting terminal for ic card, production of ic card using the connection terminal and ic card using the connection terminal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connecting terminal for IC card with which an electric resistance value is low and further attachment to a circuit board is facilitated by forming a hoop member by connecting a lot of attachments equipped with plural cylindrical projections corresponding to through hole position on the surface. SOLUTION: The hoop member is formed by connecting a lot of attachments 2 equipped with plural cylindrical projections 1 on the surface. This hoop member is fold from a sprocket hole 3 for feeding the hoop member and a punched pot 4 for detaching the attachments 2 from the hoop member. The hoop member is formed from the metal of the same material as the electric circuit of the IC card. The cylindrical projection 1 is formed corresponding to the position of the through hole opened on a film when producing the IC card by attaching the attachment 2 to the film on which the electric circuit is printed. The cylindrical projection 1 is formed by forming a columnar projection on the surface by cold forging and passing a pin through the columnar projection.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card such as a telephone card and a highway card. More specifically, the present invention relates to a non-contact type IC card which has a low electric resistance value and can obtain stable conductivity. And a method of manufacturing an IC card using the connection terminal, and an IC card using the connection terminal.

[0002]

2. Description of the Related Art In a printed circuit board on which an electric circuit is printed on a print film, a method of connecting the electric circuit printed on the surface thereof includes a method of applying a conductive paste to a through hole formed in the substrate and a method of connecting a through-hole. A method of inserting a pin made of a conductive material into a hole (for example,
No. 6296, "Method for connecting double-sided circuit of printed wiring board", and JP-A-64-7694, "Method and apparatus for connecting double-sided printed circuit board"). However, any of these connection methods is not preferable for application to an IC card or the like which functions with a small amount of current because the electric resistance value at the connection portion becomes high. In light of this situation,
Insert a hollow rivet of the same material as the circuit into the through hole,
A method of suppressing the electric resistance value by connecting circuits by caulking on the substrate surface has also been developed.

[0003]

However, the above method has the following problems. That is, since the IC card such as a telephone card or a highway card which is required to be portable is formed to be thin, the IC card may be slightly curved when being carried or used. In some cases, the conductive film was peeled off from the circuit and the conductivity became unstable. In addition, since the hollow shaft of the rivet is bent and attached to the substrate circuit at the time of swaging, the end of the bent portion may cut the circuit on the back surface. Therefore, there has been a demand in the industry for the creation of a connection terminal of an IC card which has a low electric resistance value, can obtain stable conductivity, and can be easily mounted on a circuit board.

The present invention employs the following means in order to solve the above-mentioned problems of the prior art. According to the first aspect of the present invention, there is provided a connection terminal for electrically connecting a circuit in an IC card film in which an electric circuit is printed on one side and has a through hole for circuit connection at a required position. An IC card comprising a plurality of mounting members formed of metal of the same material as the circuit and having a plurality of cylindrical projections provided on the surface corresponding to the through-hole positions to form a hoop material. Connection terminal. According to a second aspect of the present invention, there is provided the connection terminal of the IC card according to the first aspect, wherein a plurality of protrusions are formed around the cylindrical projection. According to the third aspect of the present invention, there is provided a connection terminal for electrically connecting a circuit in an IC card film having an electric circuit printed on one side and having a through hole for connecting a circuit at a required position, A plurality of cutouts are formed at a position corresponding to the through hole formed of a metal of the same material as the circuit, and a plurality of fixtures formed by bending the cutouts to the surface side are connected to form a hoop material. The connection terminal of the featured IC card. According to a fourth aspect of the present invention, there is provided the connection terminal for an IC card according to the third aspect, wherein an adhesive is applied to a bent portion of the cut. In the invention according to claim 5, an adhesive film or an adhesive made of an insulating material is provided between the plurality of cylindrical projections or between the bent portions of the cuts. Connection terminal of the IC card.

According to the invention of claim 6, the film surface has an IC.
The electric circuit of the card is printed and this film is wound on a bobbin, and a hoop material having the same material as that of the electric circuit is formed with a mounting tool provided with a plurality of cylindrical projections, and the hoop material is transferred to another bobbin. Winding, then sending the film to the caulking section of the caulking machine, sending the hoop material toward the caulking section from another direction, cutting off one mounting tool in front of the film and sending it to the caulking section, A method for manufacturing an IC card is characterized in that the projection is inserted into a through hole provided in an electric circuit of the film, caulked, and then the film is cut into a predetermined length. In the invention of claim 7, an electric circuit of an IC card is printed on the surface of the film, and the film is wound around a bobbin. Forming a bent attachment, winding the hoop material onto another bobbin, then feeding the film to the caulking section of the caulking machine, sending the hoop material from another direction toward the caulking section, and Then, one of the attachments is cut off and sent to the caulking portion, and the bent portion of the cut is inserted into a through hole provided in an electric circuit of the film, folded back to the film surface and caulked, and then the film is cut into a predetermined length. A method of manufacturing an IC card.

According to the invention of claim 8, a film having an electric circuit printed on one side and having a through hole for circuit connection at a required portion, and a plurality of cylinders formed on the surface of the same material as the electric circuit and made of metal. And an attachment provided with a projection. The IC card is characterized in that the film and the attachment are integrated by inserting the cylindrical projection into the through hole and caulking. . According to the ninth aspect of the present invention, there is provided a film having an electric circuit printed on one side and having a through hole for circuit connection at a required portion, and a plurality of cuts formed on the surface of the same material as the electric circuit. An IC card comprising: a notch formed by bending the notch toward the front side; and a film and a mounting member being integrated by inserting the bent portion into a through hole and caulking. And

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A connection terminal of an IC card according to the present invention, a method of manufacturing an IC card using the connection terminal, and an IC card using the connection terminal will be described below with reference to the drawings. FIG. 1 is a perspective view showing a preferred embodiment of a connection terminal (hereinafter, sometimes simply referred to as a connection terminal) of an IC card according to the present invention. The connection terminal shown in FIG. 1 forms a hoop material by connecting a large number of fixtures (2) each having a plurality of cylindrical protrusions (1) on the surface. In FIG. 1, four attachments (2) are shown, of which the innermost attachment (2) has not been subjected to any processing, and 2
The second attachment (2) is the first stage of the process of forming the cylindrical projection (1), and the second attachment (2) from the front is the second stage of the process of forming the cylindrical projection (1). The first mounting fixture (2) shows a completed state in which the cylindrical projection (1) is formed. In addition, cylindrical projection (1)
Is formed by raising and plastically deforming a plate material constituting the fixture (2). Therefore, it is necessary to use a hoop material thicker than the thickness of the fixture (2) of the finished product. In the figure, (3) is a sprocket hole for feeding the hoop material, and (4) is a punched portion for removing the attachment (2) from the hoop material. The hoop material is formed of a metal having the same material as the electric circuit of the IC card, for example, aluminum when the circuit is aluminum, and copper when the circuit is copper.

FIG. 2 is a perspective view of the attachment (2) removed from the hoop material, and FIG. 3 is a sectional view taken along line AA of FIG. The cylindrical projection (1) is attached to a film on which an electric circuit is printed by attaching a fixture (2) as described later.
When manufacturing a C card, it is formed so as to correspond to the position of the through hole formed in the film. In the present invention, the number of the cylindrical projections (1) is not limited at all, and two,
The number is appropriately set to four, eight, or the like. The cylindrical projection (1) is formed by cold forging. Specifically, first, the center part (hatched part) of the attachment (2) is pressed from above to reduce the thickness of the center part and increase the thickness of both ends (parts other than the hatched part) (FIG. 5). The second attachment from the back (2)), and then the area around the portion where the cylindrical projection (1) is formed is pressed from above with a mold to raise the surface (third attachment from the back in FIG. 5). Tool (2)), and further press to form a columnar projection on the surface (see the second mounting fixture (2) from the front in FIG. 5), and finally pass the pin through the columnar projection. To form a cylindrical projection (1) (see the foremost attachment (2) in FIG. 5).

In the present invention, the method of forming the cylindrical projection (1) is not necessarily limited to the above method, and for example, the following method may be used. First, the lower surface of the fixture (2) is pushed up by a pin (not shown) to form a bulge on the surface (see the second fixture (2) from the back in FIG. 1), and the pin is further pushed up to make a circle on the surface. Form columnar projections (Fig. 1
(Refer to the second attachment from the front (2)), and finally, the pin is pierced from below to form a cylindrical projection (1) (the first attachment (2) in FIG. 1).
reference). According to the method described above, the hole (11) of the cylindrical projection (1) becomes a through hole as shown in FIG. 4, but in the present invention, the hole (11) of the cylindrical projection (1) is shown in FIG. As shown in FIG. In this case, after forming the columnar protrusion on the surface, a pin may be inserted from above the columnar protrusion to form the hole (11).

FIG. 6 is a perspective view showing a modification of the attachment (2). In the attachment (2) according to this example, a plurality of ridges (5) are formed around the cylindrical projection (1). The adhesive (13) is applied between the cylindrical projections (1). The type of the adhesive (13) is not particularly limited as long as it is insulating, and an epoxy resin, a silicone resin, or the like is preferably used. Further, instead of simply applying the adhesive, a configuration in which an insulating film having an insulating adhesive layer provided on both surfaces is attached can also be suitably adopted. FIG. 7 is a schematic sectional view showing a state where the attachment (2) shown in FIG. 6 is attached to an IC card film on which an electric circuit is printed.
In the figure, (81) is a film base layer, and (82) is a film print layer. As shown in FIG. 7, a plurality of bumps (5) formed around the cylindrical projection (1) bite into the surface of the film during the production of the IC card, so that the attachment (2) is securely attached to the film. In addition to the role of fixing, it also plays a role of breaking the metal oxide film attached to the printed circuit surface of the metal electrical circuit to ensure the grounding between the metals and to improve the electrical characteristics. The adhesive (13) applied between the cylindrical projections (1) plays a role in firmly and surely fixing the attachment (2) to the film. Thus, the surface of the fixture (2) having the plurality of cylindrical projections (1) has the plurality of bumps (5) and the adhesive (1).
The provision of 3) makes it difficult for the attachment (2) to move even when the film is bent, so that a larger number of grounding surfaces can be obtained as compared with the conventional case where one rivet is used for fixing.

In the present invention, as described above, it is preferable to perform both the formation of the plurality of protrusions (5) and the application of the adhesive (13), but only the plurality of protrusions (5) are provided as shown in FIG. FIG. 9 shows a configuration in which the adhesive (13) is not applied.
As shown in the above, a configuration in which only the adhesive (13) is applied and no bump (5) is provided is also included in the technical scope of the present invention.

FIG. 10 is a perspective view showing another embodiment of the connection terminal of the IC card according to the present invention. In the connection terminal shown in FIG. 10, a hoop material is formed by connecting a large number of attachments (2) each having a bent portion (7) in which a plurality of cuts (6) are bent toward the front side. still,
FIG. 10 shows four attachments (2),
Among them, the innermost mounting fixture (2) has not been processed at all, the second mounting fixture (2) from the back has a notch (6), the second mounting tool (1) and the first mounting tool (1) The attachment device (2) at the front is the completed one in which the bent portion (7) is formed. In the figure, (3) is a sprocket hole for feeding the hoop material, and (4) is a punched portion for removing the attachment (2) from the hoop material. The hoop material of this example is formed of the same material as the metal of the electric circuit of the IC card, similarly to the above-described example.

FIG. 11 is a perspective view of the attachment (2) removed from the hoop material of FIG. 10, and FIG. 12 is a plan view of the attachment (2) removed from the hoop material of FIG. The bent portion (7) is formed by attaching a fixture (2) to a film on which an electric circuit is printed as described later.
When the C card is manufactured, it is formed so as to correspond to the position of the through hole formed in the film. Also,
The bent corners (71) provided at the four corners play a role of holding down the four corners of the film when the attachment (2) is attached to the film to manufacture an IC card. The bent part (7) and the bent corner part (71) are formed by press molding, and an adhesive such as an epoxy resin or a silicone resin is applied to the surface side (the side that becomes the surface before bending) of both parts. . By applying the adhesive in this manner, it becomes possible to firmly and reliably fix the attachment (2) to the film during the production of the IC card,
Good conductivity can be obtained. However, those in which the adhesive is not applied to the bent portion (7) and the bent corner (71) are also included in the technical scope of the present invention.

FIG. 13 shows an insulative adhesive (13) between the bent portions (7) in the fixture (2) shown in FIG.
Is applied. By applying an insulating adhesive between the bent portions (7) in this manner, I
At the time of manufacturing the C card, the attachment (2) can be firmly and reliably fixed to the film. Also in this example, similarly to the above-described example, a configuration in which an adhesive film made of an insulating material is stuck instead of applying the adhesive can be suitably adopted.

Hereinafter, a method of manufacturing an IC card using the connection terminal (1) having the above configuration will be described. First, a method of manufacturing an IC card using the connection terminals having the structure shown in FIG. 1 will be described with reference to the schematic diagrams of FIGS. The electric circuit of the IC card is printed on the film surface, a through hole is formed at a required portion of the printed electric circuit, and the film (8) having the electric circuit and the through hole is wound around a bobbin (9). (Figure 1
4). In the figure, (81) is a film base layer, (82)
Is a film printing layer.

Further, as shown in FIG. 1, a mounting tool (2) provided with a plurality of cylindrical projections (1) is formed on a hoop material made of the same material as the electric circuit of the IC card. 10) is wound around another bobbin (14) (FIG. 1).
5). In forming the cylindrical projection (1), one of the two methods described above is used. In forming the hole (11), any one of the above methods may be selected depending on whether the hole is a blind hole or a through hole. Further, since the thickness of the fixture (2) decreases with the formation of the cylindrical projection (1), the hoop material used is made thicker than the thickness of the fixture (2) of the finished product.

Next, the film (8) is sent to a caulking section of a caulking machine, and at the same time, the hoop material (10) is viewed from another direction.
To the caulking section. Then, in front of the film (8), the foremost mounting tool (2) sent in
The film is cut into a predetermined length by cutting the film into a predetermined length after inserting the cylindrical projection (1) into the through hole (83) of the film (8) and caulking the film, and then feeding the same to the caulking portion.
The IC card (12) in which the attachment (2) is fixed to the film (8) as shown in FIG. 6 is completed.

Using a connection terminal having the structure shown in FIG.
When manufacturing a C card, first, an electric circuit of an IC card is printed on the film surface in the same manner as described above, and the film on which the electric circuit is printed is wound around a bobbin. A plurality of cuts (6) are provided in a hoop material made of the same material as the electric circuit of the IC card,
This cut is bent toward the front side to form a bent portion (7), and at the same time, the four corners are bent to form a bent corner (71).
The hoop material is formed on another bobbin by forming a fitting (2) shown in FIG. The notch (6) is formed by sandwiching between the upper and lower knife dies, and the bent portion (7) and the bent corner (71) are formed by press molding.

Next, the film is sent to a caulking section of a caulking machine, and at the same time, the hoop material is sent from another direction toward the caulking section. Then, in front of the film, the foremost attachment (2) sent is cut off and sent to the caulking portion, and the bent portion (7) of the cut (6) is inserted into a through hole provided in an electric circuit of the film. After being folded back on the film surface and caulking, the film is cut into a predetermined length to thereby obtain an IC card (1) in which the attachment (2) is fixed to the film (8) as shown in FIG.
2) is completed. At this time, the bending corners (71) formed at the four corners of the attachment (2) are folded back at the four corners of the film surface, thereby playing the role of firmly fixing the attachment (2) to the film.

[0019]

As described above, according to the first aspect of the present invention, there is provided an IC card film in which an electric circuit is printed on one side and has a through hole for connecting a circuit at a required position. A connection terminal for connection;
A plurality of fixtures formed of a metal of the same material as the electric circuit and having a plurality of cylindrical protrusions provided on the surface corresponding to the positions of the through holes are connected to form a hoop material. Since the connection terminal is an IC card connection terminal, the following effects are obtained. That is, since the circuits are connected by a metal of the same material and are connected by a plurality of cylindrical projections, it is possible to obtain an IC card having stable electric conductivity, low electric resistance, and excellent reliability. it can.
In addition, since the hoop material is provided with a mounting tool having a cylindrical projection for circuit connection, it is not necessary to perform a difficult operation of inserting and caulking minute rivets one by one into the through holes of the film substrate, The work of inserting the cylindrical projection into the through hole can be performed easily and quickly, and furthermore, the connection terminal does not peel off from the circuit at the connection portion, and a stable circuit connection can be performed. In addition, since it is attached to a single-sided circuit, there is no possibility that the tip of the curved portion of the rivet will cut the circuit during swaging.

According to a second aspect of the present invention, there is provided an IC card connecting terminal according to the first aspect, wherein a plurality of protrusions are formed around the cylindrical projection. In this case, the ridges cut into the film, and the attachment can be firmly attached to the film.

According to a third aspect of the present invention, there is provided a connection terminal for electrically connecting a circuit in an IC card film having an electric circuit printed on one side and having a through hole for circuit connection at a required portion. A plurality of cutouts are formed at a position corresponding to the through hole formed of a metal of the same material as the electric circuit, and a large number of fixtures formed by bending the cutouts to the surface side are connected to form a hoop material. Since this is a connection terminal for an IC card, the following effects can be obtained. That is, since the circuits are connected by the same material metal and connected by a plurality of bent portions, the electrical conductivity is stable, the electrical resistance value is low, and an IC card with excellent reliability can be obtained. . In addition, since the hoop material is provided with a fixture with a bent part for circuit connection, it does not require the difficult work of inserting and caulking minute rivets one by one into the through hole of the film substrate, The work of inserting the bent portion into the hole can be performed easily and quickly, and furthermore, the connection terminal does not come off the circuit at the connection portion, and a stable circuit connection can be performed. In addition, since it is attached to a single-sided circuit, there is no possibility that the tip of the curved portion of the rivet will cut the circuit during swaging.

According to a fourth aspect of the present invention, there is provided the IC card connection terminal according to the third aspect, wherein an adhesive is applied to a bent portion of the cut.
At the time of manufacturing the card, the fixture can be securely fixed to the film, and the connection terminal does not peel off from the circuit at the connection portion, and stable circuit connection can be performed.

The invention according to claim 5 is characterized in that an adhesive film or an adhesive made of an insulating material is provided between the plurality of cylindrical projections or between the cut portions of the cuts. Since the connection terminal of the IC card according to any one of 1 to 4, the attachment can be firmly and reliably fixed to the film when the IC card is manufactured.

According to a sixth aspect of the present invention, the film surface is provided with I
The electric circuit of the C card is printed and the film is wound on a bobbin, and a hoop material having the same material as the electric circuit is formed with a mounting tool provided with a plurality of cylindrical projections. Then, the film is sent to a caulking portion of a caulking machine, and the hoop material is sent from another direction toward the caulking portion, and one attachment is cut off before the film and sent to the caulking portion. The method of manufacturing an IC card is characterized in that the protrusions are inserted into through holes provided in an electric circuit of the film and then caulked, and then the film is cut into a predetermined length. Eliminates the need for inserting and caulking one by one into the through-holes, making it easy and quick to insert cylindrical protrusions into the through-holes, and providing stable electrical conductivity The IC card electrical resistance and excellent low reliability has can be easily manufactured.

According to a seventh aspect of the present invention, the film surface is
The electric circuit of the C card is printed and this film is wound on a bobbin, and a hoop material made of the same material as the electric circuit is provided with a plurality of cuts, and the cuts are bent toward the front side to form a fixture. The hoop material is wound on another bobbin, and then the film is sent to the caulking portion of the caulking machine, and the hoop material is sent toward the caulking portion from another direction, and one mounting device is cut off in front of the film and caulked. The cut portion is inserted into a through-hole provided in an electric circuit of the film, folded back on the film surface and crimped, and then the film is cut into a predetermined length. Since it is a simple method of inserting a bent part into a through hole and turning it back, it has stable electrical conductivity and low electrical resistance. Excellent IC card reliability can be easily manufactured.

According to an eighth aspect of the present invention, there is provided a film having an electric circuit printed on one side and having a through hole for circuit connection at a required portion, and a plurality of films formed of a metal of the same material as the electric circuit and having a plurality of surfaces on the surface. An IC card comprising a mounting member provided with a cylindrical projection, wherein the cylindrical projection is inserted into a through hole and caulked to integrate the film and the mounting member. Because of this, the circuits are connected by the same material metal and connected by a plurality of cylindrical projections, so that an IC card having a low electric resistance value, stable conductivity, and excellent reliability can be obtained.

According to a ninth aspect of the present invention, there is provided a film having an electric circuit printed on one side and having a through hole for connecting a circuit at a required position, and a film formed of a metal of the same material as the electric circuit and having a plurality of surfaces on the surface. A cut is provided, and the cut is configured to be bent to the front surface side, and the film and the mount are integrated by inserting the bent portion into a through hole and caulking. Therefore, the circuit is connected by the same material metal and connected by a plurality of bent portions, so that an IC card having a low electric resistance value, stable conductivity, and excellent reliability is obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a preferred embodiment of a connection terminal of an IC card according to the present invention.

FIG. 2 is a perspective view of the attachment removed from the hoop material.

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIG. 4 is a cross-sectional view showing an example in which a cylindrical projection is a through hole.

FIG. 5 is a diagram for explaining an example of a method for manufacturing a connection terminal of an IC card according to the present invention.

FIG. 6 is a perspective view showing a modified example of the attachment.

FIG. 7 shows the mounting fixture shown in FIG.
It is an outline sectional view showing signs that it attached to a C card film.

FIG. 8 is a perspective view showing another modification of the attachment.

FIG. 9 is a perspective view showing another modification of the attachment.

FIG. 10 is a perspective view showing another embodiment of the connection terminal of the IC card according to the present invention.

FIG. 11 is a perspective view of the attachment removed from the hoop material of FIG. 10;

FIG. 12 is a plan view of the fixture removed from the hoop material of FIG. 10;

FIG. 13 is a perspective view showing an example in which an adhesive is applied between bent portions in the attachment shown in FIG. 11;

FIG. 14 is an explanatory diagram illustrating a method of manufacturing an IC card according to the present invention.

FIG. 15 is an explanatory diagram illustrating a method of manufacturing an IC card according to the present invention.

FIG. 16 is a schematic sectional view of an IC card obtained by the method for manufacturing an IC card according to the present invention.

FIG. 17 is a schematic sectional view of an IC card obtained by an IC card manufacturing method according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cylindrical protrusion 2 Mounting tool 5 Rise 6 Notch 7 Folded part 8 Film 83 Through hole 9 Bobbin 10 Hoop material 12 IC card 14 Bobbin

Claims (9)

[Claims] 1. A connection terminal for electrically connecting a circuit in an IC card film having an electric circuit printed on one side and having a through hole for connecting a circuit at a required position, wherein said connection terminal is used to electrically connect said circuit. A connection of an IC card, wherein a large number of attachments formed of a metal of the same material and having a plurality of cylindrical projections on the surface corresponding to the positions of the through holes are connected to form a hoop material. Terminal. 2. The connection terminal of an IC card according to claim 1, wherein a plurality of protrusions are formed around the cylindrical projection. 3. A connection terminal for electrically connecting a circuit in an IC card film having an electric circuit printed on one side and having a through hole for connecting a circuit at a required position, wherein the connection terminal is used to electrically connect the circuit. A plurality of notches are provided at positions corresponding to the through holes made of a metal of the same material, and a plurality of attachments formed by bending the notches to the surface side are connected to form a hoop material. IC card connection terminal. 4. The connection terminal of an IC card according to claim 3, wherein an adhesive is applied to a bent portion of the cut. 5. The IC according to claim 1, wherein an adhesive film or an adhesive made of an insulating material is provided between the plurality of cylindrical projections or between the notches. Card connection terminal. 6. An electric circuit of an IC card is printed on the surface of the film, and the film is wound around a bobbin, and a hoop member made of the same material as the electric circuit is provided with a mounting member provided with a plurality of cylindrical projections. This hoop material is wound on another bobbin, and then the film is sent to a caulking portion of a caulking machine, and the hoop material is sent toward the caulking portion from another direction, and one mounting tool is cut off in front of the film. After feeding into the caulking portion and inserting the cylindrical protrusion into a through hole provided in the electric circuit of the film and caulking,
A method for manufacturing an IC card, comprising cutting a film into a predetermined length. 7. An electric circuit of an IC card is printed on the surface of a film, and the film is wound around a bobbin. A plurality of cuts are provided in a hoop material of the same material as the electric circuit, and the cuts are bent toward the front side. The hoop material is wound on another bobbin, and then the film is sent to a caulking portion of a caulking machine, and the hoop material is sent from another direction toward the caulking portion. Separating the attachments and sending them to the caulking portion, inserting the bent portion of the cut into a through hole provided in the electric circuit of the film, folding the film back to the film surface, and cutting the film to a predetermined length. A method for manufacturing an IC card, comprising: 8. A film having an electric circuit printed on one side and having a through hole for circuit connection at a required position, and a plurality of cylindrical projections formed on the surface of a metal of the same material as the electric circuit. An IC card, comprising: a mounting member comprising a film and a mounting member formed by inserting the cylindrical projection into a through hole and caulking. 9. A film in which an electric circuit is printed on one side and has a through hole for circuit connection at a required portion, and a plurality of cuts are formed on the surface of the same metal as the electric circuit, and the cuts are provided. And an attachment which is bent toward the front side, and wherein the bent portion is inserted into a through hole and caulked, whereby the film and the attachment are integrated.