JPH11181052A - Epoxy resin composition, prepreg and lamtnated plate - Google Patents

Epoxy resin composition, prepreg and lamtnated plate

Info

Publication number
JPH11181052A
JPH11181052A JP34956197A JP34956197A JPH11181052A JP H11181052 A JPH11181052 A JP H11181052A JP 34956197 A JP34956197 A JP 34956197A JP 34956197 A JP34956197 A JP 34956197A JP H11181052 A JPH11181052 A JP H11181052A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
heat resistance
prepreg
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP34956197A
Other languages
Japanese (ja)
Other versions
JP3592056B2 (en
Inventor
Akihiko Tobisawa
晃彦 飛澤
Kazuhiko Shibata
和彦 芝田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP34956197A priority Critical patent/JP3592056B2/en
Publication of JPH11181052A publication Critical patent/JPH11181052A/en
Application granted granted Critical
Publication of JP3592056B2 publication Critical patent/JP3592056B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Phenolic Resins Or Amino Resins (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain the subject epoxy resin composition that gives the excellent properties relating to the through hole reliability, improves the heat resistance of epoxy resin and is useful as a material for printed circuit boards. SOLUTION: This epoxy resin composition contains, as essential components, (A) an epoxy resin that is represented by formula I (n is 0 or >=1 and has the dicyclopentadiene skeleton and (B) a terpene-modified novolak resin of formula II(Me is methyl; iPr is isopropyl). In a preferred embodiment, 15-40 wt.% of the component A may bear halogen substituents on the basis of its whole weight and other epoxy resin as phenol novolak epoxy resin may be used in combination.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、低誘電率でかつ耐
熱性に優れたエポキシ樹脂組成物、これを用いたプリプ
レグ及び積層板に関するものである。TECHNICAL FIELD The present invention relates to an epoxy resin composition having a low dielectric constant and excellent heat resistance, a prepreg and a laminate using the same.

【０００２】[0002]

【従来の技術】ノート型パーソナルコンピューターや携
帯電話等の情報処理用機器は小型化が求められている。
ＬＳＩ等の電子部品を搭載するプリント配線板において
も小型軽量化の要求は強くなっている。小型軽量化のた
めには配線巾を小さくすることや、スルーホール径を小
さくし、メッキ厚を薄くすることが必要である。しか
し、メッキ厚を薄くした場合、熱衝撃時にメッキクラッ
クが発生する恐れがあり、スルーホール信頼性が低下す
る。メッキクラックを防ぐためにはプリント板の厚さ方
向の線膨張係数が小さくかつ耐熱性が高い必要がある。
また同時にこれらの情報処理用機器の高速化も要求され
ておりＣＰＵクロック周波数が高くなっている。そのた
め信号の伝搬速度の高速化が要求されており、高速化に
有利な、誘電率の低いプリント板であることが要求され
る。2. Description of the Related Art Miniaturization of information processing equipment such as notebook personal computers and mobile phones is required.
There is a strong demand for smaller and lighter printed wiring boards on which electronic components such as LSIs are mounted. In order to reduce the size and weight, it is necessary to reduce the wiring width, the diameter of the through hole, and the plating thickness. However, when the plating thickness is reduced, plating cracks may occur at the time of thermal shock, and the reliability of the through hole is reduced. In order to prevent plating cracks, it is necessary that the linear expansion coefficient in the thickness direction of the printed board is small and the heat resistance is high.
At the same time, speeding up of these information processing devices is also required, and the CPU clock frequency is increasing. Therefore, a higher signal propagation speed is required, and a printed circuit board having a low dielectric constant, which is advantageous for the higher speed, is required.

【０００３】上記の説明で明らかなように情報処理用機
器の小型化に伴い、耐熱性と誘電特性を同時に満足する
材料が求められている。これらの要求を同時に満足する
樹脂としてはポリイミド樹脂やポリフェニレンエーテル
樹脂などがあるが、これらの樹脂はエポキシ樹脂に比べ
て高価である点が難点であり、価格と特性を両立させる
材料とは言い難い。また近年種々の高耐熱性エポキシ樹
脂が開発され、耐熱性の点では著しい向上が見られる
が、プリント板の厚さ方向の線膨張係数は依然として大
きく、スルーホール信頼性が十分でない。特開平５−３
０１９４１公報で見られるようなナフタレンエポキシと
ビスフェノールＡノボラック樹脂硬化系ではプリント板
の厚さ方向の線膨張係数を小さくし、かつ耐熱性の改善
が出来るが、この樹脂硬化系では誘電特性が不十分であ
った。As is apparent from the above description, with the miniaturization of information processing equipment, there has been a demand for a material that simultaneously satisfies heat resistance and dielectric properties. Resins that simultaneously satisfy these requirements include polyimide resins and polyphenylene ether resins, but these resins are disadvantageous in that they are more expensive than epoxy resins, and it is difficult to say that they are materials that balance price and characteristics. . In recent years, various high heat resistant epoxy resins have been developed, and a remarkable improvement in heat resistance can be seen. However, the coefficient of linear expansion in the thickness direction of the printed board is still large, and the reliability of the through hole is not sufficient. JP-A-5-3
In the case of the naphthalene epoxy and bisphenol A novolak resin cured system as disclosed in JP-A No. 19441, the coefficient of linear expansion in the thickness direction of the printed board can be reduced and the heat resistance can be improved, but the dielectric properties are insufficient with this resin cured system. Met.

【０００４】[0004]

【発明が解決しようとする課題】本発明は、このような
問題を解決すべく検討結果なされたものであり、プリン
ト配線板の材料に適用された場合に、スルーホール信頼
性に優れた特性を与え、かつ誘電率が低い特性を与える
べく、エポキシ樹脂の耐熱性、厚さ方向の線膨張係数、
並びに誘電特性を改良することを目的とするものであ
る。DISCLOSURE OF THE INVENTION The present invention has been made in order to solve such a problem, and when applied to a material of a printed wiring board, it has a characteristic that is excellent in through-hole reliability. Heat resistance of epoxy resin, coefficient of linear expansion in the thickness direction,
Another object is to improve the dielectric properties.

【０００５】[0005]

【課題を解決するための手段】前述のように、プリント
配線板用のエポキシ樹脂の耐熱性、厚さ方向の線膨張係
数、誘電特性が同時に求められている。特開平５−３０
１９４１公報で述べられているように、エポキシ樹脂の
耐熱性、厚さ方向の線膨張係数を向上させるには、ナフ
タレン含有エポキシのような剛直なエポキシを使用し、
かつ架橋密度を上昇させればよい。ところが、エポキシ
樹脂の架橋密度を上昇させるとそれに伴う水酸基濃度の
上昇を伴う。水酸基は分極が大きく誘電率を低くするに
は不利である。誘電率を低くするためには、アルキル基
などのかさ高い置換基を導入すれば良いが、アルキル基
は熱により分子運動を起こしやすく、厚さ方向の線膨張
係数を低くするには不利である。As described above, the heat resistance, the coefficient of linear expansion in the thickness direction, and the dielectric properties of an epoxy resin for a printed wiring board are required at the same time. JP-A-5-30
As described in the 1941 publication, in order to improve the heat resistance of the epoxy resin and the coefficient of linear expansion in the thickness direction, a rigid epoxy such as a naphthalene-containing epoxy is used,
In addition, the crosslink density may be increased. However, increasing the crosslinking density of the epoxy resin is accompanied by an increase in the hydroxyl group concentration. Hydroxyl groups have large polarization and are disadvantageous for lowering the dielectric constant. In order to lower the dielectric constant, a bulky substituent such as an alkyl group may be introduced, but the alkyl group is liable to cause molecular motion due to heat, and is disadvantageous for lowering the linear expansion coefficient in the thickness direction. .

【０００６】本発明者は上記の課題を解決するために鋭
意研究を重ねた結果、ジシクロペンタジエン骨格を含有
するエポキシ樹脂とテルペン変性フェノールノボラック
樹脂を用いることで、プリント配線板用のエポキシ樹脂
の耐熱性、厚さ方向の線膨張係数、誘電特性を改善でき
ることを見いだした。すなわちジシクロペンタジエン構
造は剛直かつかさ高い構造であるため誘電率を低くする
と同時に、熱が加えられても分子運動を起こすことがで
きないため、耐熱性、厚さ方向の線膨張係数が優れてい
る。またテルペン構造もかさ高い構造をもつので誘電率
を低くするのに有利である。The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, by using an epoxy resin containing a dicyclopentadiene skeleton and a terpene-modified phenol novolak resin, the epoxy resin for a printed wiring board has been developed. It has been found that the heat resistance, the coefficient of linear expansion in the thickness direction, and the dielectric properties can be improved. That is, since the dicyclopentadiene structure is a rigid and bulky structure, the dielectric constant is lowered, and at the same time, molecular motion cannot be caused even when heat is applied, so that the heat resistance and the coefficient of linear expansion in the thickness direction are excellent. . The terpene structure also has a bulky structure, which is advantageous for lowering the dielectric constant.

【０００７】即ち、本発明は、（Ａ）下記一般式で表さ
れるジシクロペンタジエン変性エポキシ樹脂、及びThat is, the present invention provides (A) a dicyclopentadiene-modified epoxy resin represented by the following general formula:

【化１】 （Ｂ）下記一般式で表されるテルペン変性ノボラック樹
脂Embedded image (B) Terpene-modified novolak resin represented by the following general formula

【化２】 を必須成分としてなることを特徴とするエポキシ樹脂組
成物であり、好ましくはエポキシ樹脂がその全量のうち
１５〜４０重量％のハロゲン置換基を有することを特徴
とするエポキシ樹脂組成物である。更に、前記記載の樹
脂組成物を基材に含浸させてなることを特徴とするプリ
プレグであり、前記記載のプリプレグの１枚以上と銅箔
とを重ね合わせ加熱加圧してなることを特徴とする銅張
積層板、に関するものである。Embedded image Is an essential component, and is preferably an epoxy resin composition characterized in that the epoxy resin has a halogen substituent of 15 to 40% by weight based on the total amount of the epoxy resin composition. Furthermore, a prepreg characterized by impregnating a substrate with the resin composition described above, wherein one or more of the prepregs described above and a copper foil are overlapped and heated and pressed. A copper-clad laminate.

【０００８】本発明で用いる(Ａ)ジシクロペンタジエン
骨格を有するエポキシ樹脂は、前記の一般式化４で示さ
れる物が使用される。また耐熱性を向上させることを目
的としてこのエポキシ樹脂にフェノールノボラックエポ
キシ、クレゾールノボラックエポキシ、トリグリシジル
パラアミノフェノール、などのエポキシ樹脂を併用して
もよいし、また、これらに限定されるものではなく、ま
た数種類を同時に用いても差し支えない。また、樹脂組
成物に耐燃性をもたせることを目的として、ハロゲン化
エポキシを併用することは差し支えない。プリント配線
板を難燃化するために、エポキシ樹脂は１０〜３０重量
％のハロゲン置換基を有することが望ましい。１０重量
％未満であると難燃効果が十分でなく、３０重量％を越
えると気中耐熱性が低下するので好ましくない。As the epoxy resin (A) having a dicyclopentadiene skeleton used in the present invention, the epoxy resin represented by the above general formula (4) is used. In addition, phenol novolak epoxy, cresol novolak epoxy, triglycidyl para aminophenol, and the like epoxy resin may be used in combination with this epoxy resin for the purpose of improving heat resistance, and is not limited thereto. Also, several types may be used at the same time. Further, for the purpose of imparting flame resistance to the resin composition, a halogenated epoxy may be used in combination. In order to make the printed wiring board flame-retardant, the epoxy resin preferably has a halogen substituent of 10 to 30% by weight. If it is less than 10% by weight, the flame-retardant effect is not sufficient, and if it exceeds 30% by weight, the heat resistance in the air deteriorates, which is not preferable.

【０００９】本発明で用いる（Ｂ）テルペン変性フェノ
ールノボラック樹脂は、前記の一般式化４で示される物
が使用される。また耐熱性を向上させることを目的とし
てフェノールノボラック樹脂、クレゾールノボラック樹
脂などのノボラック型フェノール樹脂を併用してもよ
い。As the terpene-modified phenol novolak resin (B) used in the present invention, those represented by the aforementioned general formula (4) are used. Further, for the purpose of improving heat resistance, a novolak type phenol resin such as a phenol novolak resin and a cresol novolak resin may be used in combination.

【００１０】本発明のエポキシ樹脂組成物は、上述した
ジシクロペンタジエン骨格をもつエポキシ樹脂、テルペ
ン変性フェノールノボラック樹脂を必須成分とするが、
本発明の目的に反しない範囲において、硬化促進剤、カ
ップリング剤、その他の成分を添加することは差し支え
ない。The epoxy resin composition of the present invention comprises the above-mentioned epoxy resin having a dicyclopentadiene skeleton and a terpene-modified phenol novolak resin as essential components.
A curing accelerator, a coupling agent, and other components may be added without departing from the object of the present invention.

【００１１】本発明のエポキシ樹脂組成物は種々の形態
で利用されるが、基材に含浸する際には通常溶剤が使用
される。用いられる溶剤は組成の一部に対して良好な溶
解性を示すことが必要であるが、悪影響を及ぼさない範
囲で貧溶媒を使用しても構わない。Although the epoxy resin composition of the present invention is used in various forms, a solvent is usually used when impregnating a substrate. The solvent used must have good solubility for a part of the composition, but a poor solvent may be used as long as it does not adversely affect the composition.

【００１２】本発明の樹脂組成物を溶剤に溶解して得ら
れるワニスはガラス織布、ガラス不織布紙、あるいはガ
ラス以外を成分とする布等の基材に塗布、含浸させ、８
０〜２００℃で乾燥させることによりプリント配線板用
プリプレグを得ることが出来る。プリプレグは加熱加圧
してプリント配線板を製造することに用いられるが、本
発明のエポキシ樹脂組成物は、耐熱性、厚さ方向の線膨
張係数に優れ、誘電特性が低い特性をもつエポキシ樹脂
組成物であり、積層板等に好適に使用されるものであ
る。The varnish obtained by dissolving the resin composition of the present invention in a solvent is applied and impregnated on a substrate such as glass woven fabric, glass non-woven paper, or a cloth containing a component other than glass.
By drying at 0 to 200 ° C., a prepreg for a printed wiring board can be obtained. The prepreg is used for producing a printed wiring board by heating and pressing.The epoxy resin composition of the present invention has an excellent heat resistance, an excellent coefficient of linear expansion in the thickness direction, and an epoxy resin composition having low dielectric properties. Which are suitably used for laminated boards and the like.

【００１３】[0013]

【実施例】（実施例１）ジシクロペンタジエン骨格含有
エポキシ樹脂（大日本インキ社製エピクロンＨＰ７２０
０Ｈ）を４１．９重量部、ブロモ化ビスフェノールＡエ
ポキシ樹脂（大日本インキ社製エピクロン１５３）を５
８．１重量部、テルペン変性フェノールノボラック樹脂
（油化シェルエポキシ社製ＭＰ４０２ＦＰＹ）を４９．
８重量部、２Ｐ４ＭＺを０．００４重量部に、メチルエ
チルケトンを加え、不揮発分濃度６０％となるようにワ
ニスを調整した。このワニスを用いて、ガラスクロス
（厚さ０．１８ｍｍ、日東紡績（株）製）１００部にワ
ニス固形分で８０重量部含浸させて、１５０℃の乾燥機
炉で５分乾燥させ、樹脂含有量４４．４重量％のプリプ
レグを作製した。上記プリプレグを６枚を重ね、上下に
厚さ３５μｍの電解銅箔を重ねて、圧力４０ｋｇｆ／ｃ
ｍ２ 、温度１９０℃で１２０分加熱加圧成形を行い、
厚さ１．２ｍｍの両面銅張積層板を得た。EXAMPLES Example 1 Dicyclopentadiene skeleton-containing epoxy resin (Epiclon HP720 manufactured by Dainippon Ink and Chemicals, Inc.)
0H) was added to 41.9 parts by weight, and brominated bisphenol A epoxy resin (Epiclon 153 manufactured by Dainippon Ink and Chemicals, Inc.) was added to 5 parts by weight.
8.1 parts by weight of a terpene-modified phenol novolak resin (MP402FPY manufactured by Yuka Shell Epoxy Co., Ltd.)
To 8 parts by weight, 0.004 parts by weight of 2P4MZ was added methyl ethyl ketone, and the varnish was adjusted so that the non-volatile content concentration became 60%. Using this varnish, 100 parts of a glass cloth (0.18 mm thick, manufactured by Nitto Boseki Co., Ltd.) was impregnated with 80 parts by weight of varnish solids, dried in a dryer oven at 150 ° C. for 5 minutes, and contained resin. A prepreg having an amount of 44.4% by weight was prepared. Six sheets of the above prepreg are stacked, and an electrolytic copper foil having a thickness of 35 μm is stacked on the top and bottom, and the pressure is 40 kgf / c.
m2, heat and pressure molding at 190 ° C for 120 minutes,
A double-sided copper-clad laminate having a thickness of 1.2 mm was obtained.

【００１４】得られた積層板について、以下の特性を評
価した。難燃性は、ＵＬ−９４規格に従い垂直方により
評価した。半田耐熱性はＪＩＳ Ｃ ６４８１に準じて測
定し、半田耐熱性は煮沸２時間の吸湿処理を行った後、
２６０℃の半田槽に１２０秒浸漬した後の外観の異常の
有無を調べた。ピール強度はＪＩＳ Ｃ ６４８１に準じ
て測定した。厚み方向の線膨張係数はＴＭＡ（熱機械分
析）で測定し、５０℃から１５０℃の平均値を示した。
ガラス転移温度は粘弾性法によりｔａｎδのピーク温度
から求めた。誘電率、誘電正接の測定はＪＩＳ Ｃ ６４
８１に準じて行い、周波数１ＭＨｚの静電容量を測定し
て求めた。これらの結果を表１に示す。The following characteristics were evaluated for the obtained laminate. Flame retardancy was evaluated vertically according to the UL-94 standard. Solder heat resistance was measured in accordance with JIS C 6481, and solder heat resistance was measured after 2 hours of boiling water absorption.
After immersion in a solder bath at 260 ° C. for 120 seconds, the presence or absence of abnormal appearance was examined. The peel strength was measured according to JIS C6481. The coefficient of linear expansion in the thickness direction was measured by TMA (thermomechanical analysis) and showed an average value from 50 ° C to 150 ° C.
The glass transition temperature was determined from the peak temperature of tan δ by the viscoelasticity method. Measurement of dielectric constant and dielectric loss tangent are based on JIS C 64
The measurement was performed in accordance with No. 81, and the capacitance was measured at a frequency of 1 MHz. Table 1 shows the results.

【００１５】[0015]

【表１】 [Table 1]

【００１６】（表１の注） （１）大日本インキ社製ジシクロペンタジエン骨格含有
エポキシ樹脂 （２）大日本インキ社製ブロモ化ビスフェノールＡエポ
キシ樹脂 （３）住友化学社製３官能エポキシ樹脂（トリヒト゛ロキシフェニル
メタン の トリク゛リシシ゛ルエーテル) （４）油化シェルエポキシ社製テルペン変性フェノール
ノボラック樹脂 （５）日本石油社製ジシクロペンタジエン変性フェノー
ルノボラック樹脂 （６）５０℃から１５０℃までの平均線膨張率 （７）煮沸２時間の吸湿処理を行った後、２６０℃の半
田槽に２０秒浸漬した後の外観(Notes in Table 1) (1) Dicyclopentadiene skeleton-containing epoxy resin manufactured by Dainippon Ink and Chemicals Co., Ltd. (2) Brominated bisphenol A epoxy resin manufactured by Dainippon Ink and Chemicals (3) Trifunctional epoxy resin manufactured by Sumitomo Chemical Co. (4) Terpene-modified phenol novolak resin manufactured by Yuka Shell Epoxy Co., Ltd. (5) Dicyclopentadiene-modified phenol novolak resin manufactured by Nippon Oil Co., Ltd. (6) Average linear expansion from 50 ° C to 150 ° C (7) Appearance after immersion in a solder bath at 260 ° C. for 20 seconds after performing moisture absorption treatment for 2 hours at boiling

【００１７】[0017]

【表２】 [Table 2]

【００１８】（表２の注） （８）大日本インキ社製ナフタレン骨格含有エポキシ樹
脂 （実施例２〜４、及び比較例１〜３）表１及び表２に示
した配合処方で、これ以外は全て実施例１と同様の方法
で両面銅張積層板を作成した。評価結果を表１及び表２
に示す。表１に示す実施例では、いずれも誘電率が低
く、耐熱性に優れ、厚さ方向の線膨張係数が小さいこと
がわかる。(Note in Table 2) (8) Naphthalene skeleton-containing epoxy resin manufactured by Dainippon Ink and Chemicals (Examples 2 to 4, and Comparative Examples 1 to 3) All prepared a double-sided copper-clad laminate in the same manner as in Example 1. Tables 1 and 2 show the evaluation results.
Shown in In the examples shown in Table 1, it is understood that the dielectric constant is low, the heat resistance is excellent, and the linear expansion coefficient in the thickness direction is small.

【００１９】[0019]

【発明の効果】本発明のエポキシ樹脂組成物は、プリン
ト配線板の材料に適用された場合に、高耐熱性を有し、
スルーホール信頼性に優れた特性を与え、かつ誘電率が
低い特性をもち、今後、小型情報処理用機器のプリント
配線板に最適な新規エポキシ樹脂組成物を提供するもの
である。The epoxy resin composition of the present invention has high heat resistance when applied to a printed wiring board material,
An object of the present invention is to provide a novel epoxy resin composition which has excellent characteristics of through-hole reliability and low dielectric constant, and is most suitable for a printed wiring board of a small information processing device in the future.

フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｃ０８Ｊ 5/24 ＣＦＣ Ｃ０８Ｊ 5/24 ＣＦＣ // Ｃ０８Ｌ 63:00 Continued on the front page (51) Int.Cl. 6 Identification symbol FI C08J 5/24 CFC C08J 5/24 CFC // C08L 63:00

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 （Ａ）下記一般式で表されるジシクロペ
ンタジエン骨格を有するエポキシ樹脂、及び 【化１】 （Ｂ）下記一般式で表されるテルペン変性ノボラック樹
脂 【化２】 を必須成分としてなることを特徴とするエポキシ樹脂組
成物。(A) an epoxy resin having a dicyclopentadiene skeleton represented by the following general formula; and (B) Terpene-modified novolak resin represented by the following general formula: An epoxy resin composition characterized by comprising as an essential component. 【請求項２】 エポキシ樹脂がその全量のうち１５〜４
０重量％のハロゲン置換基を有することを特徴とする請
求項１記載のエポキシ樹脂組成物。2. An epoxy resin having a total amount of 15 to 4
The epoxy resin composition according to claim 1, having 0% by weight of a halogen substituent. 【請求項３】 請求項１又は２記載のエポキシ樹脂組成
物を基材に含浸させてなることを特徴とするプリプレ
グ。3. A prepreg obtained by impregnating a substrate with the epoxy resin composition according to claim 1 or 2. 【請求項４】 請求項３記載のプリプレグの１枚以上と
銅箔とを重ね合わせ加熱加圧してなることを特徴とする
銅張積層板。4. A copper-clad laminate obtained by laminating one or more of the prepregs according to claim 3 and a copper foil and applying heat and pressure.
JP34956197A 1997-12-18 1997-12-18 Epoxy resin composition, prepreg and laminate Expired - Fee Related JP3592056B2 (en)

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JP2001122949A (en) * 1999-10-28 2001-05-08 Hitachi Chem Co Ltd Thermosetting resin composition and prepreg and laminate for electric wiring board using the same
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