JPH05301941A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH05301941A JPH05301941A JP4107898A JP10789892A JPH05301941A JP H05301941 A JPH05301941 A JP H05301941A JP 4107898 A JP4107898 A JP 4107898A JP 10789892 A JP10789892 A JP 10789892A JP H05301941 A JPH05301941 A JP H05301941A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- epoxy
- pts
- novolak
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ナフタレン環を含有す
るエポキシ樹脂にノボラック樹脂を硬化剤として含有し
てなり、低い線膨張係数を有するエポキシ樹脂組成物に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition having a low coefficient of linear expansion, which comprises an epoxy resin containing a naphthalene ring and a novolac resin as a curing agent.
【０００２】[0002]
【従来の技術】コンピューター等の情報処理用機器は小
型化、高速化及び大容量化が求められている。ＬＳＩ等
の電子部品を搭載する多層プリント配線板においても信
号伝送速度の高速化が要求されている。このため、多層
プリント配線板に使用する積層材料においては高密度実
装可能な耐熱性、寸法安定性、特に厚さ方向の低熱膨張
性が要求されている。代表的なプリント配線板はポリイ
ミド樹脂、エポキシ樹脂などの熱硬化性樹脂とガラス布
との積層構造を成している。現在１０層以上の多層材料
としてはポリイミド樹脂が主流であり、エポキシ樹脂は
８層以下に用いられているのみである。その理由は、耐
熱性並びに寸法安定性の点で従来のビスフェノールＡタ
イプのエポキシ樹脂はポリイミド樹脂に比べ劣っている
ためである。ところが一方でポリイミド樹脂はエポキシ
樹脂に比べ極めて高価であるという難点を持ち、価格と
特性を両立させる材料とはいえなかった。2. Description of the Related Art Information processing equipment such as a computer is required to be small, high speed and large in capacity. Higher signal transmission speed is also required in a multilayer printed wiring board on which electronic components such as LSI are mounted. Therefore, the laminated material used for the multilayer printed wiring board is required to have heat resistance capable of high-density mounting, dimensional stability, and particularly low thermal expansion in the thickness direction. A typical printed wiring board has a laminated structure of thermosetting resin such as polyimide resin and epoxy resin and glass cloth. Currently, polyimide resin is the mainstream as a multi-layer material of 10 layers or more, and epoxy resin is used only for 8 layers or less. The reason is that the conventional bisphenol A type epoxy resin is inferior to the polyimide resin in terms of heat resistance and dimensional stability. However, on the other hand, the polyimide resin has a drawback that it is extremely expensive as compared with the epoxy resin, and cannot be said to be a material that achieves both price and characteristics.
【０００３】また、近年種々の多官能性エポキシ樹脂が
開発され、耐熱性の点では著しい向上が見られるもの
の、配線板の厚さ方向の線膨張係数は依然として大き
く、温度サイクルテストなどの信頼性試験においてはス
ルホール導通部分にクラックが発生し、プリント配線板
としての信頼性は不充分であった。従って、エポキシ樹
脂において、多層材料としての特性がポリイミド樹脂と
同等である材料が強く望まれていた。In addition, various polyfunctional epoxy resins have been developed in recent years, and although the heat resistance is remarkably improved, the linear expansion coefficient in the thickness direction of the wiring board is still large, and the reliability of the temperature cycle test and the like is high. In the test, a crack was generated in the through-hole conducting portion, and the reliability as a printed wiring board was insufficient. Therefore, there has been a strong demand for a material that has the same characteristics as a multilayer material in the epoxy resin as the polyimide resin.
【０００４】[0004]
【発明が解決しようとする課題】本発明はかかる状況を
鑑みなされたものであって、多層プリント配線板の材料
に適用した場合にスルホール信頼性に優れた特性を与え
るエポキシ樹脂の耐熱性並びに厚さ方向の寸法安定性を
改良することを目的とするものである。SUMMARY OF THE INVENTION The present invention has been made in view of such a situation, and when applied to a material of a multilayer printed wiring board, the heat resistance and the thickness of an epoxy resin giving excellent characteristics of through hole reliability. It is intended to improve the dimensional stability in the depth direction.
【０００５】[0005]
【課題を解決するための手段】すなわち本発明は、
（Ａ）ノボラック樹脂、及び（Ｂ）エポキシ樹脂におい
て、ナフタレン環含有エポキシ樹脂を全エポキシ樹脂
中、ナフタレン骨格部分の占める割合が１〜３０重量％
であるエポキシ樹脂、を含有してなるエポキシ樹脂組成
物に関する。本発明において用いられるノボラック樹脂
とは、フェノール、ｏ−クレゾール、ｐ−クレゾール、
ｔ−ブチルフェノール、クミルフェノール、ノニルフェ
ノール、β−ナフトール等分子中に１個のフェノール性
水酸基を有するアルキル置換フェノール誘導体又はビス
フェノールＡ、ビスフェノールＦ、ビスフェノールＳ、
１，６−ジヒドロキシナフタレン等分子中に２個以上の
フェノール性水酸基を有する化合物を、ホルムアルデヒ
ドとを酸性触媒下に縮合して得られるものであって、エ
ポキシ樹脂の硬化剤としては加熱変色性の少ない点でビ
スフェノールＡノボラック樹脂が最も好ましい。That is, the present invention is as follows.
In the novolak resin (A) and the epoxy resin (B), the naphthalene ring-containing epoxy resin accounts for 1 to 30% by weight of the total naphthalene skeleton.
An epoxy resin composition comprising: The novolak resin used in the present invention includes phenol, o-cresol, p-cresol,
alkyl-substituted phenol derivatives having one phenolic hydroxyl group in the molecule such as t-butylphenol, cumylphenol, nonylphenol, β-naphthol, or bisphenol A, bisphenol F, bisphenol S,
It is obtained by condensing a compound having two or more phenolic hydroxyl groups in a molecule such as 1,6-dihydroxynaphthalene with formaldehyde under an acidic catalyst, and has a heat discoloration property as a curing agent for an epoxy resin. Bisphenol A novolac resin is the most preferable because of its small number.
【０００６】本発明においてエポキシ樹脂とは分子中に
２個以上のエポキシ樹脂を有する化合物であり、ビスフ
ェノールＡ等多価フェノールとエピクロルヒドリンとの
反応によって得られるもの、フェノールノボラックのポ
リグリシジルエーテル、クレゾールノボラックのポリグ
リシジルエーテル、フタル酸、ヘキサヒドロフタル酸等
の多塩基酸のポリグリシジルエーテル、アミンアミド又
は複素式窒素塩基を有する化合物のＮ−ポリグリシジル
誘導性、脂環式エポキシ等を挙げることができるが、多
層プリント配線板のスルホール信頼性を向上させるため
に厚さ方向の線膨張係数をできるだけ小さくする硬化物
を与える必要がある。従って、エポキシ樹脂においてナ
フタレン環含有エポキシ樹脂を全エポキシ樹脂中、ナフ
タレン骨格部分の占める割合が１〜３０重量％であるこ
とが好ましい。１重量％未満であると剛直で分子間パッ
キング性が良好であるというナフタレン骨格の低熱膨張
率化効果が充分に発揮できないので好ましくなく、３０
重量％を越えると樹脂の剛直性が高くなり過ぎ硬化物が
脆くなるため、プリント配線板の穴開けドリル加工性が
低下するので好ましくない。ナフタレン骨格部分の割合
が１〜３０重量％であれば、耐熱性、スルホール信頼性
等良好な硬化物を与えることができる。In the present invention, the epoxy resin is a compound having two or more epoxy resins in the molecule, which is obtained by the reaction of polyphenol such as bisphenol A and epichlorohydrin, polyglycidyl ether of phenol novolac, and cresol novolak. Examples thereof include polyglycidyl ethers, polyglycidyl ethers of polybasic acids such as phthalic acid and hexahydrophthalic acid, N-polyglycidyl derivatives of amine amides or compounds having a heterocyclic nitrogen base, and alicyclic epoxies. In order to improve the through hole reliability of the multilayer printed wiring board, it is necessary to provide a cured product that has a linear expansion coefficient in the thickness direction as small as possible. Therefore, in the epoxy resin, the naphthalene ring-containing epoxy resin preferably accounts for 1 to 30 wt% of the total epoxy resin. If it is less than 1% by weight, the effect of lowering the coefficient of thermal expansion of the naphthalene skeleton, which is rigid and has good intermolecular packing property, cannot be sufficiently exerted, which is not preferable.
If the content exceeds 10% by weight, the rigidity of the resin becomes too high and the cured product becomes brittle, which deteriorates the workability of the printed wiring board for drilling holes. When the proportion of the naphthalene skeleton portion is 1 to 30% by weight, a cured product having good heat resistance and through hole reliability can be provided.
【０００７】また、プリント配線板の難燃性を維持する
ためにエポキシ樹脂は１０〜３０重量％のハロゲン置換
基を有することが望ましい。１０重量％未満であると難
燃化効果が充分得られないので好ましくなく、３０重量
％を越えると気中耐熱性が低下するので好ましくない。
ハロゲン置換基は特に限定されるものではないが、臭
素、塩素等を挙げることができる。また必要に応じて難
燃助剤を添加することもできる。本発明のエポキシ樹脂
組成物は特定のエポキシ樹脂とノボラック樹脂を含有し
てなるものであるが、硬化速度を調整するために硬化促
進剤を用いることができる。硬化促進剤としては、イミ
ダゾール化合物、有機リン化合物、第３級アミン、第４
級アンモニウム塩などが用いられる。これらの促進剤は
何種類かを併用することも可能である。配合量はエポキ
シ樹脂に対して ０.０１〜５重量％が好ましい。 ０.０
１重量％未満であると促進効果が小さく、５重量％を越
えると保存安定性が低下する。Further, in order to maintain the flame retardancy of the printed wiring board, the epoxy resin preferably has 10 to 30% by weight of a halogen substituent. If it is less than 10% by weight, the flame retarding effect cannot be sufficiently obtained, and if it exceeds 30% by weight, the heat resistance in the air is deteriorated, which is not preferable.
The halogen substituent is not particularly limited, but examples thereof include bromine and chlorine. Further, a flame retardant aid may be added if necessary. The epoxy resin composition of the present invention contains a specific epoxy resin and a novolac resin, but a curing accelerator can be used to adjust the curing rate. As the curing accelerator, an imidazole compound, an organic phosphorus compound, a tertiary amine, a quaternary amine
A graded ammonium salt or the like is used. It is also possible to use several kinds of these accelerators in combination. The blending amount is preferably 0.01 to 5% by weight with respect to the epoxy resin. 0.0
If it is less than 1% by weight, the promoting effect is small, and if it exceeds 5% by weight, the storage stability is lowered.
【０００８】本発明のエポキシ樹脂組成物は種々の形態
で利用されるが、基材に塗布含浸する際にはしばしば溶
剤が用いられる。用いられる溶剤は組成物の一部あるい
は全てに対して良好な溶解性を示すことが必要である
が、悪影響を及ぼさない範囲で貧溶媒を用いることもで
きる。用いられる溶剤の例を挙げると、アセトン、メチ
ルエチルケトン、メチルイソブチルケトン、シクロヘキ
サノン等のケトン系溶剤、トルエン、キシレン、メシチ
レン等の芳香族炭化水素系溶剤、メチルセルソルブ、エ
チルセルソルブ、ブチルセルソルブ、イソブチルセルソ
ルブ、ジエチレングリコールモノメチルエーテル、トリ
エチレングリコールモノメチルエーテル、プロピレング
リコールモノメチルエーテル、ジプロピレングリコール
モノメチルエーテル、プロピレングリコールモノプロピ
ルエーテル、ジプロピレングリコールモノプロピルエー
テル、エチレングリコールモノイソプロピルエーテル、
ジエチレングリコールモノイソプロピルエーテル、ジエ
チレングリコールモノブチルエーテル等の各種グリコー
ルエーテル系溶剤、メチルセルソルブアセテート、エチ
ルセルソルブアセテート、ブチルセルソルブアセテー
ト、酢酸エチル等のエステル系溶剤、エチレングリコー
ルジメチルエーテル、ジエチレングリコールジメチルエ
ーテル、ジエチレングリコールジエチルエーテル、ジエ
チルグリコールジブチルエーテル等のジアルキルグリコ
ールエーテル系溶剤、Ｎ，Ｎ−ジメチルアセトアミド、
Ｎ，Ｎ−ジメチルホルムアミド、Ｎ−メチル−２−ピロ
リドン等のアミド系溶剤、メタノール、エタノールなど
のアルコール系溶剤があり、これらは何種類かを併用し
て用いることもできる。The epoxy resin composition of the present invention is used in various forms, but a solvent is often used when coating and impregnating a substrate. The solvent used is required to have good solubility in a part or the whole of the composition, but a poor solvent can be used as long as it does not adversely affect the composition. Examples of the solvent used include acetone, methyl ethyl ketone, methyl isobutyl ketone, ketone solvents such as cyclohexanone, toluene, xylene, aromatic hydrocarbon solvents such as mesitylene, methyl cellosolve, ethyl cellosolve, butyl cellosolve, Isobutyl cellosolve, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, propylene glycol monopropyl ether, dipropylene glycol monopropyl ether, ethylene glycol monoisopropyl ether,
Diethylene glycol monoisopropyl ether, various glycol ether solvents such as diethylene glycol monobutyl ether, methyl cellsolve acetate, ethyl cellsolve acetate, butylcellosolve acetate, ester solvents such as ethyl acetate, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, Dialkyl glycol ether solvent such as diethyl glycol dibutyl ether, N, N-dimethylacetamide,
There are amide-based solvents such as N, N-dimethylformamide and N-methyl-2-pyrrolidone, and alcohol-based solvents such as methanol and ethanol, and these may be used in combination.
【０００９】本発明のエポキシ樹脂組成物を上記溶剤を
用いて得られるワニスはガラス布、ガラス不織布、また
は紙、ガラス以外を成分とする布等の基材に塗布含浸さ
せ、乾燥炉中で８０〜２００℃の範囲内で乾燥させるこ
とにより、プリント配線板用プリプレグを得ることがで
きる。プリプレグは加熱加圧してプリント配線板を製造
することに用いられるが、本発明のエポキシ樹脂組成物
は優れた耐熱性と厚さ方向の線膨張係数の小さい硬化物
を与えるので、従来エポキシ樹脂では得られなかった１
０層以上の高多層のプリント配線板のスルホール信頼性
を満足させることができるものである。The varnish obtained by using the above-mentioned solvent with the epoxy resin composition of the present invention is coated and impregnated on a base material such as glass cloth, glass non-woven cloth, paper, or cloth containing components other than glass, and then dried in a drying oven. A prepreg for a printed wiring board can be obtained by drying within a range of up to 200 ° C. The prepreg is used for producing a printed wiring board by heating and pressing, but the epoxy resin composition of the present invention gives a cured product having excellent heat resistance and a small linear expansion coefficient in the thickness direction. Not obtained 1
It is possible to satisfy the through-hole reliability of a high multilayer printed wiring board having 0 or more layers.
【００１０】[0010]
【実施例】以下本発明を実施例によりさらに詳しく説明
する。 実施例１ エポキシ当量が１５３である１，６−ジヒドロキシナフ
タレンのジグリシジルエーテルの５０重量部（以下、単
に「部」と略す）とエポキシ当量が２３０であるクレゾ
ールノボラック型エポキシ樹脂１６部からなる混合物に
テトラブロモビスフェノールＡの３４部を加えて１２０
℃に加熱撹拌し、さらに２−メチルイミダゾールの ０.
０１部を添加して１５０℃で４時間反応させ、エポキシ
当量が４７０、ナフタレン骨格含有量が約２３％、臭素
含有率が２０％である固形のエポキシ樹脂を得た（以
下、このエポキシ樹脂を樹脂（Ｉ）と略記する）。水酸
基当量１２０なるビスフェノールＡノボラック樹脂を樹
脂（Ｉ）に対して当量比（エポキシ基モル数／水酸基モ
ル数）が１になるように添加し、さらに両者の固形分の
合計１００部に対して ０.５部の硬化促進剤２−エチル
−４−メチルイミダゾールを加え、メチルエチルケトン
で不揮発分濃度５５％となるようにワニスを調整した。
しかる後このワニスを用いて、ガラスクロス(厚さ０.１
０mm、日東紡績(株)製 WEA-116E-RB84）１００部にワニ
スを固形分で５２部含浸させ、５０℃の乾燥炉で４分間
乾燥させてプリプレグを作成した。上記乾燥プリプレグ
４８枚及びその両表面に１８μｍ厚の銅箔各１枚を積層
し、接触圧下（１kg／cm2 ）で１７０℃で３分間、続い
て４０kg／cm2 の圧力下で１７０℃で９０分間というプ
レス条件で成形し、厚さ約５mmの銅張積層板を得た。こ
の積層板の表面銅箔をエッチング除去した後、１２１℃
で圧力２.０atmのプレッシャークッカー条件下で２０時
間処理し重量増加率を測定した。結果を表１に示した。
また厚み方向の線膨張係数をＴＭＡ（熱機械分析）で測
定し、５０℃から１２０℃の平均値を表１に示した。ま
た、プリプレグ３枚とその両表面に３５μｍ厚の銅箔各
１枚を用いて、１７５℃、６０分、５０kg／cm2 の条件
で積層成形して銅張積層板を得、内層回路加工を施し
た。この内層回路板３枚用い、その間にプリプレグ各３
枚を配して６層配線板を作製した。この配線板によって
ドリル加工性、半田耐熱性、銅箔引き剥し強さ、耐バレ
ルクラック性を評価した。結果を表１に示す。EXAMPLES The present invention will be described in more detail with reference to examples. Example 1 A mixture of 50 parts by weight of diglycidyl ether of 1,6-dihydroxynaphthalene having an epoxy equivalent of 153 (hereinafter simply referred to as "part") and 16 parts of a cresol novolac type epoxy resin having an epoxy equivalent of 230. Add 34 parts of tetrabromobisphenol A to 120
The mixture was heated to ℃ and stirred, and the amount of 2-methylimidazole was adjusted to 0.0.
After adding 01 parts and reacting at 150 ° C. for 4 hours, a solid epoxy resin having an epoxy equivalent of 470, a naphthalene skeleton content of about 23% and a bromine content of 20% was obtained. Resin (I) is abbreviated). A bisphenol A novolac resin having a hydroxyl equivalent of 120 was added to the resin (I) in an equivalent ratio (epoxy group mole number / hydroxyl group mole number) of 1, and 0 based on 100 parts of the total solid content of both. 0.5 parts of the curing accelerator 2-ethyl-4-methylimidazole was added, and the varnish was adjusted with methyl ethyl ketone so that the nonvolatile concentration was 55%.
Then, using this varnish, glass cloth (thickness 0.1
A prepreg was prepared by impregnating 100 parts of 0 mm, WEA-116E-RB84 manufactured by Nitto Boseki Co., Ltd. with 52 parts of varnish with a solid content, and drying in a drying oven at 50 ° C. for 4 minutes. Forty-eight dry prepregs and one copper foil each having a thickness of 18 μm were laminated on both surfaces thereof, and contact pressure (1 kg / cm 2 ) was applied at 170 ° C. for 3 minutes, followed by pressure 40 kg / cm 2 at 170 ° C. Molding was performed under a pressing condition of 90 minutes to obtain a copper clad laminate having a thickness of about 5 mm. After removing the surface copper foil of this laminate by etching,
Was treated under pressure cooker conditions of pressure of 2.0 atm for 20 hours and the rate of weight increase was measured. The results are shown in Table 1.
Further, the linear expansion coefficient in the thickness direction was measured by TMA (thermomechanical analysis), and the average value from 50 ° C to 120 ° C is shown in Table 1. In addition, three prepregs and one copper foil each having a thickness of 35 μm on both surfaces are laminated and molded under the conditions of 175 ° C., 60 minutes, 50 kg / cm 2 to obtain a copper clad laminate, and inner layer circuit processing is performed. gave. 3 inner circuit boards are used, with 3 prepregs in between.
A six-layer wiring board was prepared by arranging the sheets. This wiring board was used to evaluate drill workability, solder heat resistance, copper foil peeling strength, and barrel crack resistance. The results are shown in Table 1.
【００１１】実施例２、３および比較例１〜３ 表１に示したように、１，６−ジヒドキシナフタレンの
ジグリシジルエーテル、クレゾールノボラックエポキシ
樹脂の割合及び硬化剤の種類及び割合を変更した以外す
べて実施例１と同様の方法で積層板及び６層配線板を作
成し、上記各種の特性を評価した。結果を表１に示す。Examples 2 and 3 and Comparative Examples 1 to 3 As shown in Table 1, the ratio of the diglycidyl ether of 1,6-dihydroxynaphthalene, the cresol novolac epoxy resin and the kind and ratio of the curing agent were changed. A laminated board and a 6-layer wiring board were prepared in the same manner as in Example 1 except for the above, and the above various characteristics were evaluated. The results are shown in Table 1.
【００１２】[0012]
【表１】 [Table 1]
【００１３】測定方法は次の通りである。 （１）吸水率：プレッシャークッカー処理（１２１℃、
２.０atm、飽和水蒸気圧下）を２０時間行い、重量増加
率を算出した。 （２）線膨張係数：５０℃から１２０℃までの平均線膨
張率。 （３）ドリル加工性：１mmφのドリルで１万個の穴をあ
け、そのうち１００個を選びスミア発生率を求めドリル
加工性とした。 （４）半田耐熱性：２６０℃の半田槽に３６０秒間浮か
べた後外観を調べ、ふくれのないものをＯＫ、ふくれの
あるものをＮＧとした。プレッシャークッカー処理は１
２１℃、２.０atmの飽和水蒸気圧下で３時間処理した。 （５）外観銅箔引き剥し強さ：外層銅箔の引き剥し強さ
をJIS C 6481に従って測定した。 （６）耐バレルクラック性：ドリル加工した６層配線板
にスルホールメッキを施した後、−６５℃、３０分及び
１２５℃、３０分の冷熱サイクル処理を１０００サイク
ル行った後スルホール抵抗を計測し、初期抵抗値より１
０％増加している場合をＮＧ、１０％未満の場合をＯＫ
とした。The measuring method is as follows. (1) Water absorption: Pressure cooker treatment (121 ° C,
(2.0 atm, under saturated water vapor pressure) was performed for 20 hours, and the weight increase rate was calculated. (2) Linear expansion coefficient: Average linear expansion coefficient from 50 ° C to 120 ° C. (3) Drill machinability: 10,000 holes were drilled with a 1 mmφ drill, 100 of them were selected, and the smear occurrence rate was determined as the machinability. (4) Solder heat resistance: After floated in a solder bath at 260 ° C. for 360 seconds, the appearance was examined, and those without blisters were OK and those with blisters were NG. Pressure cooker processing is 1
It was treated at 21 ° C. under a saturated steam pressure of 2.0 atm for 3 hours. (5) Appearance Copper foil peeling strength: The peeling strength of the outer layer copper foil was measured according to JIS C 6481. (6) Barrel crack resistance: After performing through-hole plating on a drilled 6-layer wiring board, 1000 cycles of thermal cycle treatment at -65 ° C, 30 minutes and 125 ° C, 30 minutes were performed, and then the through-hole resistance was measured. , 1 from the initial resistance
NG if 0% increase, OK if less than 10%
And
【００１４】[0014]
【発明の効果】以上の説明から明らかなように、本発明
のエポキシ樹脂組成物は、特定割合のナフタレン環を含
有するエポキシ樹脂を使用し、かつ硬化剤としてノボラ
ック樹脂を使用しているので、従来のビスフェノールＡ
系エポキシ樹脂やこれとノボラック型エポキシ樹脂の混
合物を使用した場合に比べて低い熱膨張係数を有し、ド
リル加工性、耐バレルクラック性が著しく改善されてい
る。また、ジシアンジアミド硬化系に比べてノボラック
樹脂硬化系を用いることで大幅に吸湿性を下げることが
でき、吸湿後の半田耐熱性にも優れている。このように
本発明のエポキシ樹脂組成物は、特に多層配線板の材料
として用いると耐熱性並びに厚さ方向の寸法安定性が良
好であるため高いスルーホール信頼性が得られる。As is apparent from the above description, the epoxy resin composition of the present invention uses an epoxy resin containing a specific proportion of naphthalene rings, and uses a novolac resin as a curing agent. Conventional bisphenol A
It has a lower coefficient of thermal expansion than the case of using a system epoxy resin or a mixture of this and a novolac type epoxy resin, and the drilling workability and barrel crack resistance are remarkably improved. In addition, by using the novolac resin curing system as compared with the dicyandiamide curing system, the hygroscopicity can be significantly reduced, and the solder heat resistance after moisture absorption is also excellent. Thus, when the epoxy resin composition of the present invention is used particularly as a material for a multilayer wiring board, it has excellent heat resistance and dimensional stability in the thickness direction, and thus high through hole reliability can be obtained.
Claims (3)
シ樹脂を全エポキシ樹脂中、ナフタレン骨格部分の占め
る割合が１〜３０重量％であるエポキシ樹脂、を含有し
てなるエポキシ樹脂組成物。1. A novolac resin (A) and an epoxy resin (B), which comprises a naphthalene ring-containing epoxy resin in which the proportion of the naphthalene skeleton in the total epoxy resin is 1 to 30% by weight. An epoxy resin composition comprising:
ラック樹脂であることを特徴とする請求項１記載のエポ
キシ樹脂組成物。2. The epoxy resin composition according to claim 1, wherein the novolac resin is bisphenol A novolac resin.
０重量％のハロゲン置換基を有することを特徴とする請
求項１記載のエポキシ樹脂組成物。3. Epoxy resin is 10 to 3 out of the total amount.
The epoxy resin composition according to claim 1, which has 0% by weight of a halogen substituent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4107898A JPH05301941A (en) | 1992-04-27 | 1992-04-27 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4107898A JPH05301941A (en) | 1992-04-27 | 1992-04-27 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05301941A true JPH05301941A (en) | 1993-11-16 |
Family
ID=14470870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4107898A Pending JPH05301941A (en) | 1992-04-27 | 1992-04-27 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05301941A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06136091A (en) * | 1992-10-26 | 1994-05-17 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| JP2006036798A (en) * | 2004-07-22 | 2006-02-09 | Sumitomo Bakelite Co Ltd | Resin composition, prepreg and laminate |
| WO2008035815A1 (en) | 2006-09-21 | 2008-03-27 | Sumitomo Bakelite Company Limited | Resin composition, prepreg and laminate |
| US9078365B2 (en) | 2006-04-28 | 2015-07-07 | Hitachi Chemical Co., Ltd. | Resin composition, prepreg, laminate, and wiring board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0586167A (en) * | 1991-09-30 | 1993-04-06 | Dainippon Ink & Chem Inc | Production of epoxy resin, and epoxy resin composition |
| JPH05271386A (en) * | 1992-03-27 | 1993-10-19 | Dainippon Ink & Chem Inc | Epoxy resin composition and laminated sheet using the same |
-
1992
- 1992-04-27 JP JP4107898A patent/JPH05301941A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0586167A (en) * | 1991-09-30 | 1993-04-06 | Dainippon Ink & Chem Inc | Production of epoxy resin, and epoxy resin composition |
| JPH05271386A (en) * | 1992-03-27 | 1993-10-19 | Dainippon Ink & Chem Inc | Epoxy resin composition and laminated sheet using the same |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06136091A (en) * | 1992-10-26 | 1994-05-17 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| JP2006036798A (en) * | 2004-07-22 | 2006-02-09 | Sumitomo Bakelite Co Ltd | Resin composition, prepreg and laminate |
| US9078365B2 (en) | 2006-04-28 | 2015-07-07 | Hitachi Chemical Co., Ltd. | Resin composition, prepreg, laminate, and wiring board |
| WO2008035815A1 (en) | 2006-09-21 | 2008-03-27 | Sumitomo Bakelite Company Limited | Resin composition, prepreg and laminate |
| US8865311B2 (en) | 2006-09-21 | 2014-10-21 | Sumitomo Bakelite Company Limited | Resin composition, prepreg, and laminate |
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