JPH11176723A - Connection identifying apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To automatically discriminate mis-wirings and a non-connections in connection of a cable and a connector. SOLUTION: An identification signal transmission circuit 15 is provided in each of drive circuits 3, 4, 5, 6 of an aligner 32, and an identification signal is supplied via an identification signal line 16. Furthermore, a wire change-over circuit 17 is arranged between an apparatus connector 13 and respective control substrates 7, 8, 9, 10 on a side of a main controller 33. The identification signal from the identification signal transmission circuit 15 is transmitted to a CPU board 18 via the wire change-over circuit 17 by an identification signal line 20 from a first pin of the equipment connector 13. Based on the identification signal so-obtained, the CPU board 18 identifies a connection between the respective drive circuits 3, 4, 5, 6 of the aligner 32 and the apparatus connector 13 of the main controller 33, to decide to the correspondence between the respective control substrates 7, 8, 9, 10 and the apparatus connector 13. In accordance to a wire control signal from a wire control signal line 19, a wire is changed over so as to impart an apparatus signal to the respective control substrates 7, 8, 9, 10 which are originally to be transmitted, and a required line information state can be attained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection identification device, and more particularly to a connection identification device effective for an apparatus using a large number of cables, such as an exposure apparatus.

[0002]

2. Description of the Related Art Conventionally, for example, in an exposure apparatus, FIG.
The wafer loader drive circuit 3 and the wafer loader control board 7, the reticle loader drive circuit 4 and the reticle loader control board 8, and the alignment adjustment device drive circuit 5, which are the connection devices for the exposure apparatus main body 1 and the control rack 2, respectively.
When connecting the alignment control board 9 and the stage drive circuit 6 to the stage control board 10, a tag 22 is added to the connection cable 11 in each wiring, and the shape of each connector is different for each corresponding one. Or
For example, a key or a pin for preventing incorrect insertion is used for each connector so that the device connector 13 and the cable connector 14 connected to the device signal line 12 are in one-to-one correspondence, and wiring is performed while selecting the corresponding connector. I was going.

[0003]

However, in this conventional wiring, every time one cable connector is connected to a connector of one device, a cable connector corresponding to the device is found out of a number of cable connectors. You have to connect them. In this case, there is a possibility that erroneous wiring or connection leakage may occur due to the erroneous insertion prevention pin coming off. Once the wiring work is completed, if any erroneous wiring is suspected, it is necessary to check the correspondence of all connectors and cables.

In an exposure apparatus, the number of cables is as large as several tens, and performing such an operation on the cable requires a large amount of work time and labor. An object of the present invention is to improve the working efficiency in connecting such a cable or the like to a connector, and to eliminate erroneous wiring, and to automatically determine erroneous wiring or connection leakage.

[0005]

The connection identification device of the present invention has a first connector (13), and a first device (15) for transmitting an identification signal unique to the first connector; A second connector (13) that can be connected to the first connector, and a second device (18) that identifies connection with the first device in response to the identification signal. .
When the second device (18) does not receive the identification signal and determines that it is not connected to the first connector, it can identify a connector that is not connected. preferable.

Further, the first connector and the second connector are a plurality of connectors, and the second device is a connection switching means (17) for switching a connection relationship of the plurality of connectors based on the identification signal. ) Can be used simply by ignoring the connector connection
This is preferable because the original connection relationship of the connector can be obtained. It is preferable to have a warning means (21) for giving a warning based on the identification signal, because a connection omission or a connection error can be confirmed, and in some cases, the location thereof can also be confirmed. Further, it is preferable to provide a tube for connecting the first connector and the second connector, since the connection for supplying gas or liquid can be identified.

[0007]

FIG. 4 shows a specific example of an exposure apparatus suitable for applying the connection identification apparatus of the present invention. The exposure apparatus includes a coater / developer apparatus 31, an exposure apparatus 32 for exposing the wafer 100, a main controller 33 for performing overall control of the entire apparatus, and a storage device 34 connected to the main controller 33. Have. Coater / developer device 31
Is a wafer cassette 35 for accommodating a plurality of wafers and a coater 36 for applying a photoresist to the surface of the wafer 100.
And a developing device (developer) 37 for developing the exposed wafer 100, an inspection device 38 for measuring an alignment error of the developed wafer 100, and an articulated robot arm 39 and a guide rail 40 for transporting the wafer. Have.

The exposure device 32 includes an articulated robot arm 43 for transferring the wafer 100 to and from the coater / developer device 31, a bar code reader 44 for reading a bar code formed on the wafer 100, and a A laser processing device 45 for forming a bar code, a pre-alignment device 47, and an exposure unit (50, 53, 54, 5)
6). The transfer and unloading of the wafer 100 to and from the pre-alignment device 47 is performed by the articulated robot arm 43 moving on the guide 46. The wafer is transferred between the pre-alignment device 47 and the exposure device 32 by a slider arm 51 that slides on a guide 52.
Done by

In FIG. 4, one of a plurality of wafers 100 stored in a wafer cassette 35 is extracted by an articulated robot arm 39, and the wafer 100 is coated by a coater 36.
Transport to The wafer 100 having the surface coated with the photoresist by the coater 36 is transported to the standby position 41 by the robot arm 39. Wafer 10 at standby position 41
Numeral 0 is held by an articulated robot arm 43 provided in the exposure device 32 and transported to a device (bar code reader) 44 that reads an identification code (for example, a bar code) formed on each layer on the wafer 100. The reading device 44 outputs the read information (exposure and alignment conditions when a pattern is formed on each layer) to the main control device 33.

The robot arm 43 further moves along the guide 46, and moves the wafer 100 to the pre-alignment device 47.
To the turntable 48. The pre-alignment apparatus 47 irradiates a parallel light beam of a non-exposure wavelength by a sensor 49 while rotating the wafer 100 with the turntable 48 and photoelectrically detects a light beam not blocked by the wafer 100. Then, the rotation of the turntable 48 is stopped according to the output of the sensor 49, and the orientation flat of the wafer 100 is adjusted in a predetermined direction. Thereafter, the wafer is moved to the wafer stage 50 by the slider arm 51.
, And is vacuum-sucked to the wafer holder 53.

A pattern is formed on each of a plurality of layers on the wafer 100 so as to overlap each other. An alignment mark (not shown) attached to at least one pattern of the plurality of layers is detected by an alignment sensor 56. . Then, the wafer stage 50 is driven based on the output of the alignment sensor 56 and a predetermined correction amount (alignment condition) to align the pattern on the wafer 100 with the pattern on the reticle. Thereafter, the uppermost layer on the wafer 100 (the photoresist covering it) is exposed to an image of the pattern on the reticle via the projection optical system 54.

A wafer 100 overlaid and exposed with a reticle pattern image in all shot areas (patterns)
Is carried out of the wafer stage 50 by the slider arm 51 and transferred to the robot arm 43. Further, the wafer 100 is set in the wafer (top layer) 10 by the robot arm 43 under the conditions for exposure and alignment.
It is transported to the laser processing device 45 that records 0. The laser processing device 45 irradiates the wafer 100 with a laser beam in a wavelength range for exposing the photoresist, and writes conditions relating to exposure and alignment on the wafer (photoresist) 100 in the form of a barcode (or numbers or alphabets).

Now, a wafer 100 on which various conditions are recorded
Is transported by the robot arm 43 to the standby position 41,
Further, it is carried into the developing device 37 by the robot arm 39. Wafer 100 subjected to development processing by development device 37
Is carried into the inspection device 38 by the robot arm 39, where the alignment error is measured. Inspection device 3
Numeral 8 illuminates several shot areas on the wafer 100, and photoelectrically detects light generated from the wafer 100 by an image sensor (for example, a CCD). Further, the image signal from the image sensor is scanned by a plurality of scanning lines, and the pattern formed on at least one layer on the wafer 100 and the exposure device 32
The alignment error with the pattern (resist pattern) to be formed on the uppermost layer, which has been exposed by the above, is measured, and the measurement result is output to the main controller 33.

FIG. 5 shows a configuration of an exposure unit of the exposure apparatus 32. In the figure, exposure light output from an exposure light source 60 illuminates a reticle 62 held on a reticle stage 64. A predetermined circuit pattern is formed on the reticle 62, and the pattern is projected onto the wafer 100 via the projection optical system 54. The wafer stage 50 is
The stage driving device 68 enables step movement in the XY two-dimensional directions. The alignment device 56
The wafer 1 is shifted from the optical axis of the projection optical system 54 by a predetermined amount.
The alignment mark attached to the 00 shot area is photoelectrically detected. A reflection mirror 70 is fixed on the wafer stage 50 and receives light by an interferometer 72 to detect the position of the wafer stage 50. The projection optical system 54 is connected to an imaging characteristic control device 74 for controlling the imaging characteristics.

As shown in FIG. 1, the exposure apparatus 32 includes a wafer loader drive circuit 3 for driving the articulated robot arm 43 and the slider arm 51, a reticle loader drive circuit 4 for driving a reticle loader (not shown), Alignment preparation device driving circuit 5 for driving alignment sensor 56, stage driving circuit 6 for driving wafer stage 50 and reticle stage 64, and identification signal transmitting circuit 15
And further.

The main controller 33 includes a wafer loader control board 7 for controlling the wafer loader drive circuit 3, a reticle loader control board 8 for controlling the reticle loader drive circuit 4, and an alignment control for controlling the alignment preparation equipment drive circuit 5. The substrate includes a substrate 9 and a stage control substrate for controlling the stage drive circuit 6. Further, the main controller 3
Reference numeral 3 includes a wiring switching circuit 17, a CPU board 18, and a warning LED 21 (details will be described later).

In order to connect the exposure device 32 to the main controller 33, an identification signal transmitting circuit 15 is provided in each of the drive circuits 3, 4, 5, and 6 of the exposure device 32, and connected devices connected to the device connector 13. An identification signal line 16 is provided in addition to the signal line 12. One of the identification signal lines 16 is connected to, for example, the first pin of the device connector 13, and the other is connected to the identification signal transmission circuit 15. And
The identification signal is transmitted from the identification signal transmission circuit 15. On the main controller 33 side, a wiring switching circuit 17 (for example, a multiplex circuit) is installed between the device connector 13 and each of the control boards 7, 8, 9, 10. The identification signal from the identification signal transmitting circuit 15 is transmitted from the first pin of the device connector 13 to the CPU board 18 via the wiring switching circuit 17 via the identification signal line 20. Based on the identification signal thus obtained, the CPU board 18 controls the exposure device 32
The connection between each of the drive circuits 3, 4, 5, and 6 and the device connector 13 of the main control device 33 is identified, and each of the control boards 7, 8,
The correspondence between the connector 9 and the device connector 13 is determined, and the wiring is controlled so that the device control signal from the wiring control signal line 19 is given to each of the control boards 7, 8, 9 and 10 to which the device signal should be transmitted. Switching so that the necessary connection state can be obtained.

If the connection itself is not made or the connection is incomplete, the identification signal line 2
0, no identification signal is supplied, and this is determined by the CPU board 18 and each of the drive circuits 3,
4, 5, 6 and each control board 7, 8, 9,
A warning LED 21 or the like indicates that there is some connection failure with the device connector 13 in association with each device connector 13. Since the wiring is switched by the wiring switching circuit 17 in this manner, it is not necessary to take the correspondence between the device connector 13 and the cable 11 at the time of connection, assuming that all the connectors have the same shape.

Also, by using such a configuration, when connecting the equipment connector 13 and the cable connector 14, even if any cable connector 14 is connected to any equipment connector 13, a correct connection state can be obtained. Even if it does not work properly after connection, it is possible to avoid having to check the correspondence between the cable connector and the device connector. If only the required number of cable connectors and device connectors are connected, a connection error Can be dealt with assuming that the trouble is not caused by the above.

FIG. 2 shows another embodiment. In this embodiment, the identification signal line 20 can be switched by the wiring switching circuit 17 in the same manner as the other connected device signal lines, and it is necessary to provide the wiring switching circuit 17 with a dedicated output terminal for the identification signal line 20. There is no such thing.
Since the CPU board 18 controls the wiring switching state of the wiring switching circuit 17, the CPU board 18 recognizes what kind of wiring switching state it is currently in. Therefore, it is not possible to determine which device connector 13 the identification signal is from. You will understand
Based on this information, the exposure device 32 is used in the same manner as in the above embodiment.
The connection between each of the drive circuits 3, 4, 5, and 6 and the device connector 13 of the main control device 33 is identified, and each of the control boards 7, 8,
The correspondence between the connector 9 and the device connector 13 is determined, and the wiring is controlled so that the device control signal from the wiring control signal line 19 is given to each of the control boards 7, 8, 9 and 10 to which the device signal should be transmitted. Switching is performed so that a necessary connection state can be obtained.

Also in this embodiment, a connection failure can be displayed as a warning by the warning LED 21 or the like. Note that the identification signal may be a digital signal or an analog signal. In the case of a digital signal, the ID recognition number of each of the drive circuits 3, 4, 5, and 6 of the exposure apparatus 32 can be used. Also, the number of identification signal lines may be plural.

Further, the connection between the drive circuits 3, 4, 5, and 6 of the exposure device 32 and the device connector 13 of the main control device 33 and the wiring switching are always performed by the above-described configuration. In this case, a warning can be immediately displayed when a connection failure occurs by chance. However, in particular, without providing the identification signal line 20, one of the connected device signal lines can be used.
Alternatively, a configuration may be adopted in which a plurality of identification signal lines 20 are used for identification and wiring switching only immediately after connection of a cable, and thereafter the wiring is maintained.

Further, the wiring switching circuit 17 is not always necessary, and when the connection is different from the original connection, this may be simply identified and displayed as a warning. The number of connectors connected by one cable is not limited to one-to-one, but may be one-to-many or plural-to-many. In addition to an electric cable, a general gas or liquid such as air, a vacuum source that vacuum-adsorbs the wafer 100 or a reticle, or a cooling source such as a heat source is supplied to the exposure apparatus. Tube may be used. In this case, it is necessary to provide an identification signal line.

The exposure apparatus exposes the pattern of the reticle 62 while the reticle 62 and the wafer 100 are stationary, and the step-and-repeat type exposure apparatus in which the wafer 100 is moved in a stepwise manner. The present invention can also be applied to a scanning type exposure apparatus that exposes the pattern of the reticle 62 by moving the wafer 100 synchronously. Further, a KrF excimer laser (2
48 nm), ArF excimer laser (193 nm), F
Not only _two lasers (157 nm) but also charged particle beams such as X-rays and electron beams can be used. For example, when an electron beam is used, a thermionic emission type lanthanum hexaborite (LaB ₆ ) or tantalum (Ta) can be used as an electron gun.

The magnification of the projection optical system 54 may be not only a reduction system but also an equal magnification system or an enlargement system. Further, as the projection optical system PL, when an excimer laser is used, quartz or fluorite is used as a glass material, and when an X-ray is used, a catadioptric optical system is used (a reticle is also of a reflection type). When an electron beam is used, an electro-optical system including an electron lens and a deflector may be used as the optical system. It goes without saying that the optical path through which the electron beam passes is evacuated. Further, the reticle 62 and the wafer 100 are brought into close contact with each other without using the projection optical
The present invention can also be applied to a proximity exposure apparatus that exposes the second pattern.

[0026]

As described above, when the present invention is applied to an exposure apparatus, it is not necessary to investigate the correspondence in connecting the equipment connector, so that the efficiency of the connection work is improved. Further, since there is no one-to-one correspondence between the device connector and the cable or the like, no erroneous wiring occurs. In addition, by confirming the reception of the identification signal, the connection leakage can be confirmed. Confirmation work is not required. As a result, the wiring work can be greatly reduced in quality and the production time can be reduced.In addition, equipment damage and malfunction due to incorrect wiring or wiring leakage can be prevented or reduced. Be shortened.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a configuration in which the present invention is applied to an exposure apparatus.

FIG. 2 is a diagram illustrating another embodiment of the present invention.

FIG. 3 is a diagram illustrating a conventional technique.

FIG. 4 is a diagram illustrating a specific example of an exposure apparatus.

FIG. 5 is a diagram illustrating a main part of the exposure apparatus of FIG. 4;

[Explanation of symbols]

 REFERENCE SIGNS LIST 11 connection cable 12 device signal line 13 device connector 14 cable connector 15 identification signal transmission circuit 16 identification signal line 17 wiring switching circuit 22 tag 31 coater / developer 32 exposure device 33 main control device 34 storage device 35 wafer cassette 36 coater 37 developing device (Developer) 38 Inspection device

Claims (5)

[Claims] A first device for transmitting an identification signal unique to the first connector; a second connector connectable to the first connector; A second device for identifying a connection with the first device according to a signal. 2. The connection identification device according to claim 1, wherein the second device determines that it is not connected to the first connector when the second device does not receive the identification signal. apparatus. 3. The connection identification device according to claim 1, wherein said first connector and said second connector are a plurality of connectors, and said second device is said plurality of connectors based on said identification signal. A connection switching means for switching a connection relationship between the two. 4. The connection identification device according to claim 1, further comprising a warning unit that warns based on the identification signal. 5. The connection identification device according to claim 1, further comprising a tube connecting the first connector and the second connector.