JPH1117096A - Tape adhering equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tape adhering equipment which applies a suitable pressing force by a simplified constitution at the time of adhering an insulating tape to an electronic component. SOLUTION: A tape adhering equipment is provided with a punch 2 and a die 4 for cutting a polyimide tape 1 and a drive means for shifting the punch 2 to and from the die 4. The drive means is provided with a two-stage cylinder 6 and cuts the polyimide tape 1 between the punch 2 and the die 4 by pressing the punch 2. At the time of adhering the cut tape piece 1a to a lead frame L, the drive means presses the tape piece 1a to an inner lead part with a pressing force which is weaker than that applied for cutting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of cutting a strip-shaped insulating tape in a process of feeding the same to a lead frame,
The present invention relates to a tape attaching device for attaching electronic components such as a B tape and a resin substrate.

[0002]

2. Description of the Related Art Conventionally, when a lead frame for manufacturing a semiconductor device is manufactured, the number of pins is promoted with the high speed processing and large capacity of today's semiconductor device. In order to prevent the leads from becoming finer and the leads becoming finer and contacting each other in the transporting process to be damaged or bent, a process of attaching an insulating tape such as a polyimide tape is provided. When a semiconductor package is manufactured, an insulating tape is attached to a lead frame, a TAB tape, a resin substrate, or the like as an adhesive tape to an IC chip or a heat sink.

As an apparatus configuration for attaching an insulating tape to the lead frame or the like, for example, a punched or etched lead frame is pitch-fed below a die of a punching die having a punch and a die.
In addition, a band-shaped insulating tape is fed from the feeding side between the punch and the die, and is conveyed so as to be wound on the winding side. An adhesive is applied to one or both sides of the insulating tape. Further, a block for supporting the lead frame is provided at a position where the cut tape piece is attached to the lead frame. A punch for punching and cutting the insulating tape is moved up and down using an air cylinder as a drive source, and a cylinder having at least a pressing force necessary to punch and cut the tape is used as the air cylinder. .

[0004]

In the above-mentioned tape sticking apparatus, the pressing force required for cutting the insulating tape and the pressing force required for sticking the tape are usually larger than the former. Since the air cylinder used is selected based on the cutting operation, when sticking a piece of tape that has been cut out by punching out a part of the insulating tape to the inner lead part of the lead frame, the pressing force required for attachment is Since a large pressing force is applied to the tape piece at the time of cutting, there is a risk that the adhesive may protrude and enter between the inner leads, the position where the tape is attached may be displaced, or bubbles may enter the tape.

If the pressurizing speed of the air cylinder is reduced in order to solve these problems, the productivity is reduced. Further, if the air pressure is made variable in order to adjust the punching speed during the punching operation, the control operation becomes complicated and the work is not stable. There is also a method of moving the punch up and down by using a servomotor or the like instead of the air cylinder, but the equipment becomes large-scale and the production cost increases.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art and to provide a tape sticking apparatus which can obtain an appropriate pressing force with a simplified configuration when attaching an insulating tape to an electronic component. And

[0007]

The present invention has the following arrangement to achieve the above object. That is, in a tape attaching device that cuts and attaches an electronic component to a strip-shaped insulating tape in a process of feeding the pitch, a punch and a die for cutting the insulating tape, and driving means for moving the punch forward and backward to the die. The drive means comprises a multi-stage cylinder, and cuts the insulating tape between the die by pressing the punch, when attaching the cut insulating tape piece to the electronic component, The insulating tape piece is pressed against the electronic component with a weaker pressing force than at the time of cutting.

The multi-stage cylinder includes a two-stage cylinder having a first cylinder and a second cylinder arranged in series, and the first cylinder defines a first cylinder chamber which can move by receiving a fluid pressure. And a first piston rod having one end fixed to the first piston and the other end extending into a second cylinder chamber of the second cylinder, wherein the second cylinder receives fluid pressure. And a second piston having one end fixed to the second piston and the other end extending out of the second cylinder chamber and having the tip connected to the punch. A rod may be provided. Further, the stroke length of the second cylinder rod of the second cylinder is set to be longer than the stroke length of the first piston rod of the first cylinder, and both the first cylinder and the second cylinder are driven when the insulating tape is cut. When the insulating tape is cut by force and the cut insulating tape piece is attached, it is preferable that the insulating tape piece be pressed against the electronic component by the driving force of the second cylinder.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. The present embodiment uses a strip-shaped polyimide tape as an insulating tape, uses a lead frame for manufacturing a semiconductor device as an electronic component, and cuts and attaches the polyimide tape to an inner lead portion of the lead frame. explain. FIG. 1 is an explanatory diagram showing a configuration of a main part of the tape attaching device, FIG. 2 is an explanatory diagram showing a tape attaching operation, and FIG.
FIG. 4 is an explanatory diagram of a lead frame to which a tape piece is attached.

First, a schematic configuration of a tape sticking device will be described with reference to FIGS. The tape attaching device is provided for taping an inner lead portion of a lead frame formed by pressing or etching a thin metal plate such as copper. Reference numeral 1 denotes a strip-shaped polyimide tape having a thickness of about 30 μm as an example of an insulating tape, which is wound around a pay-out reel (not shown) and conveyed in a direction perpendicular to the plane of FIG. Is done. On the back side of the polyimide tape 1, a paste obtained by dissolving a thermosetting or thermoplastic resin in an appropriate solvent is applied and dried to a thickness of 30 μm.
A small amount of adhesive layer is formed. Note that the adhesive layer may be formed on both sides of the tape depending on the electronic component, and the thickness of the tape or the adhesive is arbitrary. The polyimide tape 1 is stretched so as to pass between a punch and a die which will be described later, and is fed at a pitch.

Reference numeral 2 denotes a punch, which punches out and cuts a part of the polyimide tape 1 and presses the cut piece of tape on the inner lead portion of the lead frame L to attach it. Reference numeral 4 denotes a die, and a cutting blade 4a is formed on a peripheral portion so that the punch 2 enters the opening 4b while pressing the polyimide tape 1 to cut a part of the polyimide tape 1.

Reference numeral 5 denotes a block disposed on the supporting portion.
The tape piece cut by the punch 2 is inserted into a lead frame L.
Is provided so as to support the inner lead portion when pressed against and bonded to the inner lead portion. Note that the block 5 may have a heater function. The lead frame L has a fixed size or a band shape and is pitch-fed in a direction perpendicular to the plane of FIG.

Reference numeral 6 denotes a two-stage cylinder as driving means, and an intermediate stop type air cylinder is preferably used. As shown in FIG. 2A, the two-stage cylinder 6 has a first cylinder 7 and a second cylinder 8 arranged in series. The two-stage cylinder 6 includes first and second cylinders 7 and 8.
Preferably, they are connected in series. This is because, when connected in series, it is easy to transmit the pressing force uniformly between the first and second cylinders 7 and 8, and when these are connected in parallel, the cylinder rods are inclined obliquely and the pressing force is transmitted uniformly. This is because it may not be done. The first cylinder 7 and the second cylinder 8 have the same inner diameter.

The first cylinder 7 is a first piston 7 that defines a first cylinder chamber 7a that can move by receiving air pressure.
b, and a first piston rod 7c having one end fixed to the first piston 7b and the other end extending to the second cylinder chamber 8a of the second cylinder 8. In addition, the second
The cylinder 8 has a second piston 8b defining the second cylinder chamber 8a movable by receiving air pressure, and one end fixed to the second piston 8b and the other end extending out of the second cylinder chamber 8a. A second piston rod 8c, to which the punch 2 is connected, is provided at the leading end.

In the first and second cylinder chambers 7a and 8a of the first and second cylinders, compressed air from an intake orifice (not shown) opens and closes solenoid valves by an air compressor such as a compressor (not shown). Is sent selectively. The first and second pistons 7b, 8b move up and down by the sent compressed air. Also, the second
Since the diameter of the exhaust orifice 12 provided in the cylinder 8 is formed to be smaller (smaller) than the diameter of the exhaust orifice 11 provided in the first cylinder 7, the first piston rod 7c is connected to the second piston rod 8c. It can move at a speed higher than the moving speed. For this reason, the lower end of the first piston rod 7c abuts on the upper surface of the second piston 8b and moves downward integrally with the second piston rod 8c. A stopper 9 is provided at the connection between the first cylinder 7 and the second cylinder 8 to stop the further downward movement when the first piston 7b abuts. The stopper 9 sets the stroke length of the second cylinder rod 8c of the second cylinder 8 longer than the stroke length of the first piston rod 7c.

Therefore, when the polyimide tape 1 is cut, the first piston rod 7c and the second piston rod 8c are driven by the driving force of both the first cylinder 7 and the second cylinder 8.
c moves downward integrally, and a part of the polyimide tape 1 is punched and cut by the punch 2. When the cut piece of tape 1a is applied, the first piston 7b abuts against the stopper 9 and cannot move down any further. Therefore, the tape piece 1a is moved only by the driving force of the second cylinder 8 to the lead frame. Press and attach to the inner lead. The driving force of the second cylinder 8 is weaker than the driving force of the first cylinder 7 because the diameter of the exhaust orifice 12 of the second cylinder 8 is smaller than the diameter of the exhaust orifice 11 of the first cylinder 7. Become. Therefore, compared to the pressing force at the time of cutting the polyimide tape 1,
The tape piece 1a can be pressed and adhered to the inner lead portion with a weak pressing force of / 2 or less.

Next, the sticking operation of the tape sticking apparatus will be described with reference to FIGS. In FIG. 2A, the belt-shaped polyimide tape 1 is transported between reels in a direction perpendicular to the drawing so as to pass above the opening 4b of the die 4. Further, the lead frame L is transported so that the back surface side is supported by the block 5 at the sticking position.

The first and second cylinder chambers 7a and 8a are opened from an intake orifice (not shown) by opening a solenoid valve (not shown).
When air is sent into the inside, the first piston rod 7c moves down at a higher speed than the second piston rod 8c, and
The piston 8b moves down integrally with the piston 8b while contacting the upper surface. Then, as shown in FIG. 2 (b), the punch 2 connected to the lower end of the second piston rod 8c moves down, presses against the polyimide tape 1 and pushes it further.
A part of the tape 1a is punched and cut when it enters the inside b, and the cut tape piece 1a is moved downward while the tip of the punch 2 is held as it is. At this time, the pressing force for lowering the punch 2 is a pressing force sufficient to punch and cut the polyimide tape, for example, about 500 kg.

When the first piston rod 7c abuts against the stopper 9 and the pressing force on the second piston rod 8c stops acting, only the air pressure supplied to the second cylinder chamber 8a is used as shown in FIG. ),
By moving the second piston rod 8c further downward, the tape piece 1a
Is pressed to the inner lead portion of the lead frame L and attached. The pressing force for pressing the second piston rod 8c is weaker than the pressing force for pressing the first and second piston rods 7c, 8c integrally, preferably 100 kg.
Preferably, it is weakened to some degree. After the tape has been pasted one time, the lead frame L and the polyimide tape 1 are respectively fed by a predetermined pitch in preparation for the next tape pasting.

According to the above configuration, when the tape piece 1a is attached to the inner lead portion, an excessive pressing force acts to cause the adhesive to protrude and enter an extra space between the inner leads, or to attach the tape. There is no possibility that the position will shift or bubbles will enter the adhesive surface of the tape, and a good attachment state can be maintained as shown in FIG. Therefore, it is possible to provide a tape attaching device that can obtain an appropriate pressing force with a simplified configuration when attaching the polyimide tape 1 to a semiconductor manufacturing component.

FIG. 3 shows a QFP (Quad Flat)
Although the embodiment in which the tape is attached to the inner lead portions 10 formed on the four sides of the package (Package) type lead frame has been described, the DIP (Dual Inline) is used.
A tape may be attached to both inner lead portions 7 of a (Package) type lead frame.

As shown in FIG. 4, when the polyimide tape 1 is cut relatively wide and the tape piece 1a is attached to the inner lead portion, the portion protruding from the end face of the die 4 is cut by the punch 2. Then, the tape piece 1a may be attached to the inner lead portion while adsorbing the tape piece 1a.

The first and second embodiments are described with respect to the above-described embodiment.
Although the case where the inner diameters of the cylinders 7 and 8 are the same has been described, as shown in FIG. 5, the diameters of the exhaust orifices 11 and 12 of the first and second cylinders 7 and 8 are formed to be the same, and May be larger than the inner diameter of the second cylinder 8. With such a configuration, the second
The driving force of the cylinder 8 can be made weaker than the driving force of the first cylinder 7. Therefore, polyimide tape 1
The tape piece 1a can be pressed and adhered to the inner lead portion with a weak pressing force of 1/2 or less of the pressing force at the time of cutting. Further, by making the air pressure supplied to the first cylinder chamber 7a higher than the air pressure supplied to the second cylinder chamber 8a, the first piston rod 7c
Can move at a higher speed than the moving speed of the second piston rod 8c, and the driving force of the second cylinder 8 can be made weaker than the driving force of the first cylinder 7.

In the above embodiment, the lead frame L
Although the case where the polyimide tape 1 is cut and pasted is described above, the tape pasting apparatus is not limited to this. For example, when the IC chip is bonded to a resin substrate or a TAB tape in a semiconductor package manufacturing process. May be used.

When laminating the lead frame, the power plane, and the ground, a double-sided adhesive tape having an adhesive layer formed by applying and drying a paste obtained by dissolving a thermosetting resin in a solvent of a belt-like insulating tape such as polyimide. Can also be applied when a multilayer lead frame is formed by cutting, thermocompression bonding, and lamination by the above-mentioned tape attaching device. Further, the punch, die, and block may be configured such that the tape can be simultaneously attached at a plurality of locations along the transport direction of the lead frame and the polyimide tape.

In each of the above embodiments, the punch is arranged on the upper side and the die is arranged on the lower side, and the tape is punched in the vertical direction and bonded. However, the tape is punched upward from the bottom and bonded. Or in the horizontal direction. Also,
In each of the above embodiments, a two-stage cylinder is used as the multi-stage cylinder. However, various modifications are possible without departing from the spirit of the invention, such as using three or more stages of cylinders to change the stroke length. Needless to say.

[0027]

As described above, the tape affixing apparatus according to the present invention uses a multi-stage cylinder as a driving means for moving the punch toward and away from the die, and pushes the punch to move the insulating tape to the die. In addition, when the cut insulating tape piece is attached to the electronic component, the insulating tape piece can be pressed and attached to the electronic component with a weaker pressing force than at the time of cutting. When attaching a tape piece to an electronic component, an excessive amount of pressing force acts and the adhesive protrudes and enters the electronic component side extra, the tape attachment position shifts, and air bubbles adhere to the adhesive surface of the tape. There is no danger of intrusion, and a good affixed state can be maintained. Therefore, it is possible to provide a tape attaching device that can obtain an appropriate pressing force with a simplified configuration when attaching a polyimide tape to an electronic component.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a configuration of a main part of a tape attaching device.

FIG. 2 is an explanatory diagram showing a tape attaching operation.

FIG. 3 is an explanatory view of a lead frame to which a tape piece is attached.

FIG. 4 is an explanatory diagram showing a configuration of a tape attaching device according to another example.

FIG. 5 is an explanatory diagram showing a configuration of a tape attaching device in which the inner diameters of a first cylinder and a second cylinder are changed.

[Explanation of symbols]

 Reference Signs List 1 polyimide tape 1a tape piece 2 punch 4 die 4a cutting blade 4b opening 5 block 6 two-stage cylinder 7 first cylinder 7a first cylinder chamber 7b first piston 7c first piston rod 8 second cylinder 8a second cylinder chamber 8b second 2 piston 8c 2nd piston rod 9 stopper 10 inner lead part 11, 12 exhaust orifice

Claims (3)

[Claims] 1. A tape sticking apparatus that cuts a band-shaped insulating tape in a process of feeding a pitch and attaches it to an electronic component, wherein the punch and the die cut the insulating tape, and the punch is moved to and away from the die. The driving means includes a multi-stage cylinder, and presses the punch to cut the insulating tape between the die and attaches the cut insulating tape piece to the electronic component. In this case, the tape sticking device presses the insulating tape piece against the electronic component with a weaker pressing force than at the time of cutting. 2. The multi-stage cylinder includes a two-stage cylinder having a first cylinder and a second cylinder arranged in series, and the first cylinder defines a first cylinder chamber that can move by receiving fluid pressure. A first piston, one end of which is fixed to the first piston, and the other end of which is a second piston of the second cylinder.
A first piston rod extending into a cylinder chamber, wherein the second cylinder is capable of receiving fluid pressure and being movable.
A second piston for partitioning the cylinder chamber;
2. The tape sticking apparatus according to claim 1, further comprising a second piston rod fixed to a piston, the other end of which extends outside the second cylinder chamber, and a tip portion to which the punch is connected. 3. The stroke length of the second cylinder rod of the second cylinder is set longer than the stroke length of the first piston rod of the first cylinder, and the first and second cylinders are cut when the insulating tape is cut. 3. The insulating tape according to claim 2, wherein the insulating tape is cut against the electronic component by the driving force of the second cylinder when the cut insulating tape is attached by cutting the insulating tape with both driving forces. 4. Tape sticking device.