JPH1117093A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vertically mounting type semiconductor device suitable for forming a high density mounting circuit device. SOLUTION: A semiconductor device 4 is provided with a flat plate type package 5, which has a flat sidewall at least on one side, and a group of terminals 6a for external connection, which are led out vertically from the flat side wall 5a on one side of the package 5. Lead terminals 6b and 6c for external connection are led out from at least one side 5b or 5c other than the flat side wall 5a from which the group of terminals 6a are led out.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device,
For more details, mount vertically in the mounting wiring board surface.
The present invention relates to a vertical mounting type semiconductor device to be mounted.

[0002]

2. Description of the Related Art A semiconductor device such as a resin-encapsulated semiconductor package is mounted on a surface of a mounting wiring board in a vertical direction (vertical type) in accordance with a reduction in the size of a mounting circuit device or an increase in functionality. A mounting circuit device formed by mounting is developed. FIG. 9 is a perspective view showing a configuration of a resin package semiconductor package of a vertical mounting type. The mold package section 1 has a flat plate shape with each side being a flat side wall, and only one side 1a of the mold package section 1 has The external connection terminal group 2 is vertically extended. Here, the external connection terminal 2 group is formed of, for example, a lead frame on which a semiconductor element is mounted, and is led out almost perpendicularly to only one flat side, and has a J-shaped shape whose free end side is bent horizontally 2a. Has formed. In this semiconductor device, as shown in a sectional view in FIG. 10, the bent horizontal portion 2a of the external connection terminal group 2 is brought into contact with the surface of the connected terminal 3a of the mounting wiring board 3 and soldered (shown in FIG. 10). (Omitted), etc., so that they are electrically and mechanically connected (mounted).

[0003]

In the vertical mounting type semiconductor device, the mounting surface for the mounting wiring board is greatly reduced as compared with the surface mounting type semiconductor device. However, the dimensions of the vertical mounting type semiconductor device (semiconductor package) or the minimum dimension of one side (mounting surface) 1a from which the two external connection terminals are vertically derived are determined by the lead pitch and overhang of the two external connection terminals. Is uniquely determined by That is, the vertical mounting type semiconductor device depends on the number of external connection terminals 2 depending on the number of external connection terminals 2.
Since the minimum dimension of one side 1a from which the group can be derived is restricted, the mounting surface of the mounting wiring board 3 can be significantly reduced, but there is a limit to downsizing. Such a problem hinders the vertical mounting of a high-performance and high-capacity semiconductor device in which the number of external connection terminals 2 is inevitably increased. This hinders the practical use of high-density mounted circuit devices.

The present invention has been made in view of such circumstances, and has as its object to provide a vertically mounted semiconductor device and a mounted circuit device suitable for forming a high-density mounted circuit device.

[0005]

According to a first aspect of the present invention, there is provided a flat package portion having at least one side having a flat side wall surface, and an external connection perpendicular to the flat one side wall surface of the package portion. A semiconductor device having a terminal group, wherein connection lead terminals are led out and arranged on at least one side other than the flat side wall surface from which the external connection terminal group is led out.

According to a second aspect of the present invention, in the semiconductor device according to the first aspect, the free end of the external connection terminal is bent substantially horizontally.

According to a third aspect of the present invention, in the semiconductor device according to the first or second aspect, the external connection terminals which are led out and arranged are plate-shaped.

According to a fourth aspect of the present invention, in the semiconductor device according to any one of the first to third aspects, a notch is formed in the external connection terminal that is led out and arranged.

According to a fifth aspect of the present invention, in the semiconductor device according to any one of the first to fourth aspects, at least one of the external connection terminals led out to one side surface of the flat side is connected to another side. It is characterized by being electrically connected to an external connection lead terminal which is led out and arranged on the side surface.

That is, according to the present invention, in a vertical mounting type semiconductor device (semiconductor package), external connection terminals are not led out and arranged only on one flat side mounting surface, but are mounted on other surfaces other than the mounting surface. Also, the main point is to derive and arrange some external connection terminals and to eliminate the limit of compactness of a semiconductor device which is limited by the number of external connection terminals.

According to the present invention, in a vertical mounting type semiconductor device, external connection terminals to be mounted on a mounting wiring board are mainly provided on a mounting surface, and other external connection terminals are provided on a surface other than the mounting surface. Derived and arranged. In other words, even if there are many external connection terminals, these external connection terminals are derived and arranged on a plurality of surfaces including the mounting surface,
The number of external connection terminals to be derived and arranged does not restrict the compactness of the semiconductor device.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment will be described below with reference to FIGS.

FIGS. 1 and 2 show the structure of the semiconductor device according to the first embodiment. FIG. 1 is a perspective view and FIG. 2 is a front view. 1 and 2, reference numeral 4 denotes a semiconductor device, which is a flat package portion (for example, a resin-sealed package) 5 having at least one side having a flat side wall surface;
A group of external connection terminals 6a which are vertically derived from a flat side surface 5a of the package portion 5 and at least one side surface 5b other than the flat side surface 5a from which the group of external connection terminals 6a are derived. , 5c and external connection lead terminals 6b and 6c.

In the semiconductor device having the above configuration, the flat surface 5a on which the external connection terminals 6a are led out and arranged is a mounting surface for the mounting wiring board, and the external connection terminals 6a are connected to the corresponding connection parts of the mounting wiring board. Electrically and mechanically.
On the other hand, the external connection lead terminals 6b and 6c derived and arranged on the other surfaces 5b and 5c other than the mounting surface are used for mounting other adjacent semiconductor devices and electronic components such as chip resistors, or mounting components. It is electrically and mechanically connected to another connected portion of the wiring board.

The semiconductor device has a surface other than the mounting surface 5a.
Since 5b and 5c are also used for deriving and arranging the connection lead terminals 6b and 6c, the mounting surface occupied by the semiconductor device on the mounting wiring board surface is reduced, and the mounting density is improved. Further, since the wiring length of the semiconductor device itself can be shortened, the electrical characteristics of the mounted circuit device can be improved, and the external connection lead terminals 6 can be further improved.
If the lead widths of b and 6c are widened, stable connection with other mounted electronic components, for example, a chip resistor or the like can be performed.

The above semiconductor device is manufactured by the following procedure. For example, a semiconductor element (semiconductor chip) is mounted on a lead frame having a mounting lead portion and a connection lead portion. Next, the lead frame on which the semiconductor chip is mounted is positioned and arranged in a predetermined mold, molded with a sealing resin, removed from the mold, and cut and separated at a predetermined position.

Thereafter, the mounting surface 5a is removed from the resin mold layer.
The leading end of the mounting lead (corresponding to the mounting connection terminal 6a) that is led out is bent and machined in a certain direction so as to form a flat surface. The connection leads (corresponding to the external connection terminals 6b and 6c) led out to the other surfaces 5b and 5c other than the mounting surface may be processed by molding or the like if necessary. A mounting type semiconductor package 4 is obtained.

FIGS. 3A and 3B show the structure of a semiconductor device according to the second embodiment. FIG. 3A is a front view, and FIG.
(b) is a side view. 3A and 3B, reference numeral 4 denotes a semiconductor device, which is a flat package portion (for example, a resin-sealed package) 5 having at least one flat side wall, and a flat package portion 5. An external connection terminal 6a group which is vertically led out to the side surface of one side 5a, and an external connection lead which is derived and arranged on the other side surface 5b other than the flat side surface 5a from which the external connection terminal 6a group is derived. It has a configuration having a terminal 6b.

That is, in the case of this embodiment, the mounting surface 5a
Other than the case of the first embodiment, only the external connection lead terminal 6b led out and arranged on the side surface 5b, and the outer connection lead terminal 6b has a cutout tip end surface It has the same configuration as.

In the semiconductor device having the above configuration, the flat surface 5a on which the external connection terminals 6a are led out and arranged becomes a mounting surface for the mounting wiring board, and the external connection terminals 6a correspond to the corresponding connection portions of the mounting wiring board. Electrically and mechanically.
On the other hand, the external connection lead terminals 6b led out and arranged on the other surface 5b other than the mounting surface are used for mounting other adjacent electronic devices such as semiconductor devices and chip resistors, or mounting wiring boards. Electrically and mechanically.

FIGS. 4A and 4B show the structure of a semiconductor device according to the third embodiment. FIG. 4A is a front view and FIG.
(b) is a side view. The basic configuration of this semiconductor device is the same as that of the first embodiment. Therefore, the same components as those in FIG. 1 are denoted by the same reference numerals. The difference is that, in addition to the flat side surface 5a from which the external connection terminals 6a are derived, only the external connection lead terminals 6b are derived and arranged on the other side surface 5b, and the external connection lead terminals are arranged. 6b has a partially cut-out shape.

Also in the case of the configuration according to this embodiment, the external connection lead terminal 6b utilizes another partially cut-out portion, as in the case of the second embodiment, to form another externally mounted lead terminal 6b. It is electrically and mechanically connected to electronic components such as semiconductor devices and chip resistors, or other connected parts of the mounting wiring board.

FIGS. 5A and 5B show the configuration of a semiconductor device according to the fourth embodiment. FIG. 5A is a front view, and FIG.
(b) is a side view. The basic configuration of this semiconductor device is the same as that of the first embodiment. Therefore, the same components as those in FIG. 1 are denoted by the same reference numerals. The difference is that, in addition to the flat side surface 5a from which the group of external connection terminals 6a is derived, only the external connection lead terminals 6b having an enlarged portion on the other side surface 5b are led out and arranged, and The enormous portion of the connection lead terminal 6b has a partially cut-out shape.

Also in the case of the structure according to this embodiment, the external connection lead terminal 6b is bent at its tip end so as to engage with a partially cutout portion of the external connection lead terminal 6b of another semiconductor device 4.
By soldering, similarly to the second embodiment, it is electrically connected to another semiconductor device mounted adjacently.

FIG. 6 is a side view schematically showing a configuration in which the semiconductor device is mounted on a mounting wiring board. That is, the mounting surface (the flat surface from which the external connection terminals 6a are derived) 5a of the semiconductor device 4 according to the second or third embodiment is aligned with a predetermined region of the mounting wiring board 7, and This shows an example of a configuration in which a plurality of semiconductor devices 4 are mounted and mounted on a mounting wiring board 7 by soldering, joining, or the like, of a connected portion 7a of the mounting wiring board 7 and an external connection terminal 6a.

The external connection lead terminal 6b led out and arranged on the side surface 5b is partially suspended by using the partial notch, and is joined and fixed by soldering or the like. The plurality of semiconductor devices 4 are electrically and mechanically joined by the conductor 8. In the case of this mounting structure, the same potential, for example, a power supply voltage can be supplied to the plurality of semiconductor devices 4 mounted and mounted.

FIG. 7 is a side view schematically showing another configuration in which the semiconductor device is mounted on a mounting wiring board. That is, the mounting surface (the flat surface from which the external connection terminals 6a are derived) 5a of the semiconductor device 4 according to the fourth embodiment is aligned with a predetermined region of the mounting wiring board 7, and the corresponding mounting wiring is formed. The plurality of semiconductor devices 4 are mounted on the mounting wiring board 7 by soldering and joining the connected portions 7a of the board 7 and the external connection terminals 6a.
It shows a configuration example implemented.

Here, the external connection lead terminals 6b led out and arranged on the side surface 5b of the semiconductor device 4 are bent, and the ends thereof are connected to the external connection of another semiconductor device 4 mounted adjacently. The plurality of semiconductor devices 4 are electrically and mechanically joined by fitting or engaging with the partially cutout portions of the lead terminals 6b for use and joining them by soldering or the like.
In the case of this mounting structure, not only electrical connection between the semiconductor devices 4 can be easily performed, but also a plurality of mounted and mounted semiconductor devices 4 can be supplied with the same potential power supply voltage.

FIG. 8 is a transparent front view schematically showing the configuration of the semiconductor device according to the fifth embodiment. The basic configuration of the semiconductor device 4 is the same as that of the second to fourth embodiments, but it is not always necessary to mount a semiconductor chip. The difference from the second to fourth embodiments is that at least one external connection terminal 6a is led out and arranged on the other side surface 5b among the flat side surfaces 5a and the external connection terminals 6a. That is, the configuration is such that it is electrically connected to the external connection lead terminal 6b.

In the case of this semiconductor device 4, the second to fourth
By combining the semiconductor device according to any one of the embodiments, a mounting circuit device with a simplified wiring circuit on the input / output terminal side can be configured. That is, the semiconductor device according to the fifth embodiment and the semiconductor device 4 according to the second embodiment and the like are vertically mounted on the mounting wiring board 7 by the respective mounting surfaces 5a. A mounting circuit in which the external connection lead terminals 6b led out and arranged on the side surface (upper side) 5b are electrically connected to each other, or the conductor 8 electrically connects the external connection lead terminals 6b. Configure the device.

In this way, when the mounting structure is adopted, the semiconductor devices to be mounted / mounted in the configuration of the mounting circuit device can be more easily connected to each other, or electrically connected to other electronic components. In addition, the same potential, for example, a power supply voltage can be supplied to the mounted and mounted semiconductor device 4 and electronic components.

The present invention is not limited to the above-described example, and various modifications can be made without departing from the spirit of the invention.

[0033]

According to the first to fifth aspects of the present invention, the external connection terminals to be mounted on the mounting wiring board are mainly derived on the mounting surface, and the other external connection terminals are also derived on surfaces other than the mounting surface.・
It adopts a configuration that is arranged. That is, since the external connection terminals are led out and arranged on a plurality of surfaces including the mounting surface, the size of the semiconductor device does not depend on the number of the external connection terminals led out and arranged.

Further, in the vertical mounting, electrical connection between semiconductor devices or other electronic components can be easily made via external connection terminals derived and arranged on a surface other than the mounting surface. Further, depending on the selection of the connection, a common potential can be applied to a plurality of mounted semiconductor devices, so that the configuration, functions, applications, and the like of the mounted circuit device can be expanded.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic configuration of a semiconductor device according to a first embodiment.

FIG. 2 is a front view showing a schematic configuration of a vertically mounted semiconductor device according to the first embodiment.

3A and 3B show a schematic configuration of a vertical mounting type semiconductor device according to a second embodiment, wherein FIG. 3A is a front view and FIG. 3B is a side view.

4A and 4B show a schematic configuration of a vertical mounting type semiconductor device according to a third embodiment, wherein FIG. 4A is a front view and FIG. 4B is a side view.

5A and 5B show a schematic configuration of a vertical mounting type semiconductor device according to a fourth embodiment, wherein FIG. 5A is a front view, and FIG. 5B is a side view.

FIG. 6 is a side view showing a schematic structure in which a plurality of vertically mounted semiconductor devices according to the present invention are mounted and mounted on a mounting wiring board.

FIG. 7 is a side view showing another schematic structure in which a plurality of vertically mounted semiconductor devices according to the present invention are mounted and mounted on a mounting wiring board.

FIG. 8 is a front view showing a schematic configuration of a vertically mounted semiconductor device according to a fifth embodiment in a see-through manner.

FIG. 9 is a perspective view showing a schematic configuration of a conventional vertical mounting type semiconductor device.

FIG. 10 is a side view showing another schematic structure in which a plurality of conventional vertical mounting semiconductor devices are mounted and mounted on a mounting wiring board.

[Explanation of symbols]

 4 Vertical mounting type semiconductor device 5 Mold package section 5a Semiconductor device mounting surface 5b, 5c Side surface of semiconductor device other than mounting surface 6a External connection terminals 6b, 6c on mounting surface ... Terminals for external connection other than the mounting surface 7... Wiring board for mounting 8.

Claims (5)

[Claims] 1. A semiconductor device comprising: a flat package portion having at least one side having a flat side wall surface; and an external connection terminal group perpendicularly extended to the flat one side wall surface of the package portion. A semiconductor device wherein connection lead terminals are led out and arranged on at least one side other than the flat one side wall surface from which the connection terminal group is led out. 2. The semiconductor device according to claim 1, wherein a free end of the derived external connection terminal is bent substantially horizontally. 3. The semiconductor device according to claim 1, wherein the external connection terminals led out and arranged are plate-shaped. 4. The semiconductor device according to claim 1, wherein a notch is formed in the external connection terminal which is led out and arranged. 5. At least one of the external connection terminals led out to one flat side surface is electrically connected to an external connection lead terminal led out and arranged on the other side surface. A semiconductor device.