JPH11165299A - Drilling method for multilayer printed circuit board and its device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce manufacturing cost by carrying out rough positioning and corrected value measurement by using a common X-ray plant and to shorten tact time by carrying out simultaneous treatment of the corrected value measurement and drilling work. SOLUTION: An X-ray measurement part measures rough positioning quantity of a multilayer printed circuit board at a large visual field measurement level in a measuring region B, and a carry-in hoist 16 carries out rough positioning of the multilayer printed circuit board. Additionally, the X-ray measurement part measures a corrected value to move a drilling part 13 to the optimum position at a small visual field level. After a board fixing table 18a carries the multilayer printed circuit board to a working region C from the measuring region B, a driving part 19 drives the drilling part 13 in the working region C, and the drilling part 13 performs drilling work at the optimum position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for measuring / drilling a multilayer printed circuit board having a reference mark, and more particularly, to measuring and positioning a reference mark within a predetermined range during reference mark recognition and measurement. In terms of technology, improvements were made to the measurement method including field switching, and to the coarse positioning technology, and to the processing efficiency, improvements were made to the processing technology such as the provision of two tables capable of simultaneous processing of two steps of measurement and drilling. Things.

[0002]

2. Description of the Related Art In recent years, in the field of printed wiring boards mounted inside electronic equipment, multilayer printed boards in which conductive layers and insulating layers are alternately laminated and a conductive pattern is formed inside are widely used. . The number of multilayer printed circuit boards varies from a relatively simple configuration of about four layers to several tens of layers for a computer. Higher density and higher multilayers are being promoted. The demand for such a multilayer printed circuit board is high, and there is a strong demand for improvements in production volume and production efficiency.

Here, a six-layer multilayer printed circuit board will be described with reference to FIG. That is, two double-sided boards 21 each having a conductive pattern formed of copper foil on both sides, and a single-sided copper-clad board 20 arranged on the upper and lower sides, and a prepreg 22 having appropriate performance and thickness are sandwiched between the boards. , These four substrates 20,
The multilayer printed board P is formed by laminating and heating the prepreg 21 and the prepreg 22.

[0004] In order to secure conduction between the layers, it is indispensable to laminate a double-sided board having a conduction hole called a via hole with high positional accuracy on such a multilayer printed board P. Therefore, usually, the reference mark 1 is printed on each inner layer double-sided board 21.
It is necessary to accurately drill a reference hole using the reference mark 12. The reference hole is a hole that serves as a reference for a post-process such as confirmation of lamination accuracy, drilling after lamination, and formation of a wiring pattern.

[0005] However, the multilayer printed circuit board P is a composite material composed of copper foil, glass fiber, and resin.
Due to the influence of heat shrinkage of the material, XY axis (horizontal direction), θ axis direction (rotation direction), and Z axis direction (vertical direction)
8 and FIG. 9, an interlayer displacement of the reference mark 12 occurs between the respective layers as shown in FIGS. 8 and 9. Moreover, the single-sided copper-clad plate 20 is a copper foil on the entire surface, and it is impossible to visually identify the reference mark 12 from the appearance.

Therefore, conventionally, a reference mark 12 having two holes is detected and measured using an X-ray transmission image, and the position of the center of gravity or
There has been proposed a multi-layer printed circuit board boring apparatus which performs boring processing for distributing errors between hole pitches. An example of such a drilling device will be described with reference to FIG.

[Construction of Conventional Example] The drilling apparatus shown in FIG. 10 is provided with a processing table 1 on which a multilayer printed circuit board P can be placed and fixed by suction, and two columns with the processing table 1 interposed therebetween. 2, 2 are arranged facing each other. The columns 2 and 2 are configured to be movable in the X-axis and Y-axis directions, and a drilling section 3 that is movable in the Z-axis direction is provided above the columns 2 and 2. An X-ray measuring unit 4 is fixed to the upper part of the column 2 at a predetermined interval adjacent to the drilling unit 3.

The X-ray measuring section 4 is provided with an X-ray TV camera 4a for measuring the position of the reference mark 12 by X-ray transmission at the upper part, and an X-ray tube 4b is arranged concentrically below the camera. Among them, the X-ray TV camera 4a is provided so as to be vertically movable by a cylinder, and is configured to switch between a large-field measurement level of 20 mm square and a small-field measurement level of 2 mm square by changing the focal length. .

Further, a drilling section 3 and an X-ray measuring section 4
Is defined as a measurement processing area H. In the measurement processing area H, the multilayer printed board P is fixed to the processing table 1 by suction. In addition,
The drilling unit 3 and the X-ray measuring unit 4 are composed of two columns 2 and 2
Are provided at the positions opposing each other, so that the measurement of two reference marks and the drilling of two places can be simultaneously performed on the multilayer printed circuit board P.

[0010] A beam 5 is provided above the processing table 1 in parallel with the longitudinal direction of the processing table 1.
A rack 5a is cut above the beam 5, and a carry-in hoist 6 and a carry-out hoist 7 are slidably mounted on the rack 5a. Adsorption pads 6a and 7a for adsorbing the multilayer printed circuit board P are provided below the carry-in hoist 6 and the carry-out hoist 7 so as to be vertically movable. Note that reference numeral 8 in the drawing denotes a board take-out section for taking out the multilayer printed boards P before punching one by one, and Q denotes a carry-in table on which the multilayer printed boards P taken out of the board take-out section 8 are placed. .

[Operation of Conventional Example] The procedure of the drilling operation of the multilayer printed circuit board P by the conventional drilling apparatus having the above configuration will be described.

First, the loaded multilayer printed boards P are sequentially taken out one by one from the board take-out section 8 and are suction-transported to the carry-in table Q. Next, the suction pad 6 of the carry-in hoist 6
a descends and sucks the multilayer printed circuit board P on the carry-in table Q, and moves and conveys along the beam 5 to the measurement processing area H. When the multilayer printed circuit board P reaches the measurement processing area H, the multilayer printed circuit board P is lowered onto the processing table 1, and the processing table 1 sucks and fixes the multilayer printed circuit board P, and sucks the suction pad 6 a of the carry-in hoist 6. To release.

Correction Value Measuring Step Subsequently, the X-ray measuring unit 4 sets a large visual field measurement level (approximately
(m square), it is confirmed that the reference mark 12 of the multilayer printed circuit board P is within the allowable range. Thereafter, the X-ray TV camera 4a operates as a cylinder to change the focal length, and reaches a small visual field measurement level (approximately 2 mm square) to accurately measure and calculate the distance between the pitches of the reference mark 12 and the like. Thereby, the comparison with the error tolerance set in advance on the multilayer printed circuit board P is performed, and when the drilling unit 3 installed at a certain distance is moved to the measurement position, the measured coordinate value and the predetermined target are set. A value is added or subtracted, and a process of calculating a correction value of a movement amount for moving the value to an optimum position is executed.

Drilling Step The drilling section 3 is moved by the movement amount obtained by adding or subtracting the correction value, so that the drilling section 3 is positioned at the optimum position where the correction value processing based on the measured coordinate values has been performed. Become
Here, the drilling section 3 moves up and down to execute the reference drilling of the multilayer printed circuit board P.

Unloading Step After drilling, the fixing of the multilayer printed board P is released, and the suction pad 7a of the unloading hoist 7 descends to suck the multilayer printed board P. Then, the unloading hoist 7 moves along the beam 5 to a predetermined position, and unloads the multilayer printed circuit board P.

In the case of a drilling apparatus in which the X-ray measuring unit 4 recognizes the position of the reference mark 12 on the multilayer printed circuit board P, it is necessary to use a reference to surely measure the correction value after being input to the processing table 1. It is necessary to prevent the mark 12 from being inserted into the processing table 1 in a state where the position deviates significantly from the measurable range of the X-ray measuring unit 4. For this purpose, it is necessary to perform so-called coarse positioning for positioning the multilayer printed circuit board P with a certain degree of accuracy before being put into the processing table 1. However, it is difficult to recognize the position of the reference mark 12 from the appearance of the multilayer printed board P as described above.

In order to cope with this, conventionally, in addition to the above-mentioned components, a rough positioning device 9 having X-ray devices 9a and 9b is installed between the substrate take-out section 8 and the carry-in table Q, and a reference mark is provided. Coarse positioning was performed so that No. 12 could be within the measurement range. In the coarse positioning, the multilayer printed circuit board P taken out from the board take-out section 8 is mounted on a coarse positioning table movable in the XYθ axes, the reference mark 12 is recognized by X-rays during conveyance, and fine movement coarse movement is performed within a predetermined measurement range. Execute positioning. Multilayer printed circuit board P roughly positioned
Is transported to the carry-in table Q as it is,
The position of the reference mark 12 can be reliably set within the measurable range of the X-ray measurement unit 4, thereby improving the working efficiency.

[0018]

However, the above-mentioned prior art has the following problems.
That is, an expensive X-ray apparatus is required in the coarse positioning step in addition to the correction value measuring step. As a result, the manufacturing cost of the drilling device has increased. In addition, in the process of transporting the multilayer printed circuit board P, it takes time to load and unload the multilayer printed circuit board P with respect to the coarse positioning device 9 and further to perform coarse positioning.

Moreover, in the above-described drilling apparatus, a plurality of operations as described below must be continuously performed at the same position (measurement processing area E). 1:
Fixing of the multilayer printed circuit board P, 2: confirmation of the reference mark 12, 3: X-ray transmission measurement, 4: correction value calculation, 5: movement of the drilling unit 3 to the optimum position based on the correction value, 6: drilling Processing was one operation cycle. For this reason, the cycle time required for drilling a single multilayer printed circuit board takes at least about 15 seconds. Therefore,
This has led to a prolonged continuous processing tact time, and it has been urgently required to shorten the time.

The present invention has been proposed in view of the above situation, and has as its object to manufacture by performing coarse positioning and correction value measurement using a common X-ray apparatus at the same position. High-accuracy, high-speed multilayer printed circuit board that reduces cost and enables simultaneous processing of correction value measurement and drilling by performing drilling at a position different from the position where the correction value was measured It is an object of the present invention to provide a drilling method and a device therefor.

[0021]

In order to achieve the above object, according to the first aspect of the present invention, a multi-layer printed circuit board provided with a reference mark detectable by X-rays in each layer is formed by a perforated portion. A multi-layer printed circuit board drilling method, wherein the step of coarsely positioning the multilayer printed circuit board to put the fiducial mark within a predetermined measurement range, and the step of coarsely positioning the fiducial mark of the multilayer printed circuit board. A high-precision coordinate value measurement, calculates an error amount between the high-precision coordinate value and a predetermined target value, and a correction value measurement step of measuring and calculating a correction value for moving the drilling unit to an optimum position, A drilling step of drilling a multilayer printed circuit board after the drilling unit has moved to the optimum position according to the correction value, the rough positioning step and the Carried a positive value measuring step in the same position, the reference mark using common X-ray measuring unit in both steps, characterized by measuring roughness and high-precision coordinate values.

In the first aspect of the present invention,
Since the coarse positioning step and the correction value measuring step are performed at the same position, the substrate transport path from the coarse positioning step to the correction value measuring step can be omitted.
Therefore, the loading and unloading time of the multilayer printed circuit board with respect to the coarse positioning device, and the substrate transport time from the coarse positioning step to the correction value measuring step can be omitted,
The processing tact time can be shortened. In addition, while the conventional X-ray measurement unit is used for each step, the present invention measures the reference mark using the common X-ray measurement unit in both steps, so that an expensive X-ray measurement unit is one.
Just one. Therefore, the manufacturing cost of the device can be significantly reduced.

According to a second aspect of the present invention, in the method for drilling a multilayer printed circuit board according to the first aspect, the rough positioning step and the correction value measuring step are performed at a first position, and the drilling step is performed. Is performed at the second position, the multi-layer printed circuit board is suction-fixed while the correction value is measured, and a conveyance step of suction conveyance from the first position to the second position is performed. The step of measuring the correction value at the position and the step of drilling at the second position are simultaneously or continuously processed.

In the second aspect of the present invention,
The rough positioning step and the correction value measuring step at the first position and the drilling step at the second position can be performed simultaneously or continuously without interfering with each other. Therefore, the continuous processing tact time can be significantly reduced, and the working efficiency can be improved.

According to a third aspect of the present invention, in the method for drilling a multilayer printed circuit board according to the first or second aspect, in the rough positioning step, the printed circuit board includes an error of about 15 mm between the end face of the substrate and the position of the reference mark. It is characterized in that rough positioning is performed on the substrate.

In the third aspect of the present invention,
By performing the coarse positioning with an accuracy of about 15 mm in the coarse positioning step, the automation of the coarse positioning step can be reliably performed.

According to a fourth aspect of the present invention, there is provided a multi-layer printed circuit board drilling apparatus for performing X-ray measurement and drilling on a multi-layer printed circuit board provided with a reference mark detectable by X-rays on each layer. An X-ray measurement unit for measuring the reference mark using the X-ray transmission image is arranged in the measurement area, and a drilling processing unit for making a hole in the multilayer printed circuit board is arranged in the processing area. A large field of view for measuring the reference mark in the multilayer printed circuit board to be measured with a 20 mm square X-ray transmission image of a large field of view and measuring the amount of movement for coarse positioning to measure the reference mark with high precision coordinate value In order to measure the measurement level and the reference mark with high precision coordinate values, an X-ray transmission image of a small visual field of 2 mm square is enlarged and displayed to measure coordinate values, and an error amount and a distribution amount from a predetermined target value are automatically calculated. ,Calculation result It is configured to be switchable to a small visual field measurement level for measuring a correction value for moving the drilling processing part to an optimum position based on the X-ray measurement part while loading the multilayer printed circuit board to the measurement area. A carry-in / coarse positioning means is provided for performing coarse positioning of the multilayer printed circuit board, which finely moves the reference mark within a predetermined range in which the small visual field can be measured based on the measurement result of the large visual field measurement level, is coarsely positioned, and the small visual field measurement is performed. A substrate suction-fixing table for reciprocating between the measurement area and the processing area is provided while the multi-layer printed circuit board is suction-fixed, and a small field of view of the X-ray measurement section is provided in the drilling section. Drilling that measures high-precision coordinate values at the measurement level and moves the drilling part to the optimal position according to the correction value calculated based on the measurement result Characterized by comprising a fine movement mechanism.

In the invention of claim 4 as described above,
When the carry-in / rough positioning means carries the multilayer printed circuit board into the measurement area, the X-ray measuring unit detects the reference mark of the multilayer printed circuit board at a large visual field measurement level, and determines the amount of movement for coarse positioning of the multilayer printed circuit board. measure. The carry-in / rough positioning means moves the reference mark within a predetermined range based on the measurement result of the large visual field measurement level, and performs rough positioning of the multilayer printed circuit board.

Next, the multilayer printed circuit board on which the substrate suction fixing table is roughly positioned is suction-fixed. X in this state
The measurement level of the X-ray measurement unit is switched from the large-field measurement level to the small-field measurement level. The X-ray measurement unit measures the reference mark of the multilayer printed circuit board at the small-field measurement level, and moves the drilling unit to the optimum position. Correction value is calculated.

After obtaining the correction value, the board fixing table moves from the measurement area to the processing area while the multilayer printed board is fixed. In the processing area, the drilling unit driving means drives the drilling unit to the optimum position according to the correction value, and the drilling unit performs the drilling of the multilayer printed board at the optimum position.

According to the fourth aspect of the present invention, the carry-in / coarse positioning means can perform coarse positioning of the multilayer printed circuit board based on the measurement result of the large-field measurement level of the X-ray measuring unit. Need not be added independently. In addition, since the coarse positioning and the correction value measurement can be performed at one position called a measurement area,
It is possible to omit the substrate transport path and shorten the tact time as compared with the related art. In addition, by switching the measurement level of the X-ray measurement unit between the large field of view and the small field of view, coarse positioning and correction value measurement can be reliably performed. Therefore, it is not necessary to use separate X-ray measurement units for coarse positioning and correction value measurement, and only one expensive X-ray measurement unit is required, so that the manufacturing cost of the apparatus can be significantly reduced.

According to a fifth aspect of the present invention, there is provided the multi-layer printed circuit board boring apparatus according to the fourth aspect, wherein two substrate suction fixing tables are provided.

In the fifth aspect of the present invention,
One substrate suction fixing table can be arranged in the measurement area, and the other can be arranged in the processing area. Therefore, the operation cycle such as the coarse positioning and the correction value measurement in the measurement area and the operation cycle such as the driving and the drilling of the drilling unit by the drilling unit driving unit in the processing area are simultaneously performed without interfering with each other. It is possible to process. Therefore, the continuous processing tact time can be greatly reduced, and the working efficiency can be improved.

According to a sixth aspect of the present invention, there is provided an apparatus for punching a multilayer printed circuit board according to the fourth or fifth aspect, wherein
The coarse positioning means sets the fiducial mark in the large field of view of 20 mm square to within the small field of view of 2 mm square by 15 mm.
It is characterized in that it is configured to perform fine adjustment of the degree.

In the sixth aspect of the present invention,
When the carry-in / coarse positioning means performs the coarse positioning with an accuracy of about 15 mm, the coarse positioning can be automatically and reliably performed.

The invention of claim 7 is the invention of claim 4, 5 or 6.
In the apparatus for punching a multi-layer printed board according to the aspect, the multi-layer printed board is unloaded from the processing area, and the multi-layer printed board is processed for an end face in a next step.
The present invention is characterized in that there is provided a carry-out / adjustment means for adjusting the position of the multilayer printed circuit board so as to be inserted into a predetermined pin with reference to the reference mark hole drilled in the drilling section.

In the invention of claim 7 as described above,
The position of the multilayer printed board at the time of unloading can be freely adjusted by the unloading / adjusting means. Therefore, even if another processing is performed after the drilling processing of the multilayer printed circuit board is completed, the position of the multilayer printed circuit board can be appropriately adjusted, and the processing can be performed smoothly.

[0038]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be specifically described below with reference to the drawings. FIG.
The same reference numerals as in the prior art shown in FIG.
Description is omitted.

(1) Overall Configuration of Apparatus--See FIGS. 1 to 3 In the multi-layer printed circuit board punching apparatus according to the present embodiment, the carry-in position A, the measurement area B , A processing area C, and an unloading position D are formed. An X-ray measuring section 14 for detecting the reference mark 12 of the multilayer printed board P is arranged in the measurement area B, and a drilling section 13 for drilling the multilayer printed board P is arranged in the processing area C. I have.

A carry-in hoist 16 and a carry-out hoist 17 are slidably mounted on the beam 5. The carry-in hoist 16 reciprocates between the carry-in position A and the measurement area B, and the carry-out hoist 17 reciprocates between the processing area C and the carry-out position D. Further, between the measurement area B and the processing area C, two substrate fixing tables 18a and 18b that reciprocate between the two areas B and C by the actuator 15 are provided.

(2) Configuration of Each Member [Drilling Unit 13 and X-ray Measuring Unit 14... See FIG. 4] In the drilling unit 13, the drilling unit 13 itself is moved in the X-axis direction and the Y-axis direction. A drive unit 19 for performing the operation is mounted. The driving unit 19 is provided on the column 2 and is a motor 19 for driving the drilling unit 13 in the X-axis direction.
a guide portion 19b movable in the X-axis direction and a motor 19c for driving the drilling portion 13 in the Y-axis direction
And a guide portion 19d movable in the Y-axis direction, a motor 19e for driving the drilling portion 13 in the Z-axis direction (vertical direction), and a guide portion 19f movable in the Z-axis direction. .

The X-ray measuring unit 14 is provided with an X-ray TV camera 14a for measuring the position of the reference mark 12 by X-ray transmission, and an X-ray TV below it, similarly to the conventional X-ray measuring unit 4. The tube 14b is arranged concentrically. Also, X
The line TV camera 14a and the X-ray tube 14b are provided with collimators (not shown) for holding the multilayer printed circuit board P from above and below.

Further, the X-ray TV camera 14a has a field-of-view switching mechanism by switching lenses using a cylinder.
20mm square large visual field measurement level and 2
It is configured to be switchable to a small visual field measurement level of mm square. At the large visual field measurement level, the reference mark 12 of the multilayer printed circuit board P is set within a predetermined range, and the amount of movement for coarse positioning of the multilayer printed circuit board is measured. A correction value for moving the unit 13 to the optimum position is measured.

[The carry-in hoist 16 and the carry-out hoist 17
... See FIG. 5] The carry-in hoist 16 is the carry-in / rough positioning means according to claim 4, and determines the reference mark 12 with an accuracy of about 15 mm based on the measurement result of the large-field measurement level in the X-ray measurement unit 14. In the X-axis direction, the Y-axis direction,
Further, it is provided so as to be movable in the θ-axis direction (horizontal direction in the horizontal plane).

The carry-out hoist 17 is a carry-out / adjustment means according to claim 7, and can be moved in the X-axis direction, the Y-axis direction, and the θ-axis direction (horizontal direction in the horizontal plane) similarly to the carry-in hoist 16. Is provided. In addition, like the conventional carry-in hoist 6 and carry-out hoist 7, the multilayer printed circuit board P is provided below the carry-in hoist 16 and the carry-out hoist 17.
The suction pads 16a and 17a for sucking are vertically movable.

[Substrate fixing tables 18a, 18b ... FIG.
Reference] The board fixing tables 18a and 18b are configured to suction-fix the multilayer printed board P. The substrate fixing tables 18a and 18b are provided with a cylinder 18c for vertically moving the tables. Cylinder 18
c is the ascending position when the substrate fixing tables 18a and 18b move in the forward direction from the measurement area B to the processing area C, and are opposite to when the substrate fixing tables 18a and 18b move from the processing area C to the measurement area B. In the case of movement, it is configured to be at the lowered position.

(3) Operation The operation procedure of the perforating operation of the multilayer printed circuit board P by the perforating apparatus of the present embodiment having the above configuration will be described.

[Loading step] ... from the substrate unloading section 8 to the loading position A. First, the multi-layer printed circuit boards P are stacked and installed on the board take-out section 8, and the multi-layer printed circuit boards P are placed one by one from the board take-out section 8.
And is carried to the carry-in position A.

[Coarse positioning step]: Measurement area B. Next, the suction pad 16a of the carry-in hoist 16 descends to suck and raise the multilayer printed circuit board P on the carry-in position A, and the carry-in hoist 16 moves the beam 5 from the carry-in position A to the measurement area B.
Move along. When the carry-in hoist 16 carries in the multilayer printed circuit board P to the measurement area B, the X-ray measuring unit 14 sets the multilayer printed circuit board P at a large visual field measurement level (20 mm square).
The reference mark 12 is detected, and a moving amount for performing the rough positioning of the multilayer printed circuit board P is measured. Then, the carry-in hoist 16 moves so as to put the reference mark 12 within a predetermined range based on the measurement result of the large visual field measurement level, and performs rough positioning of the multilayer printed circuit board P. At this time, the carry-in hoist 16 performs the rough positioning with an accuracy of about 15 mm, so that the rough positioning can be automatically and reliably performed.

[Correction value measurement step]... Next, the suction pad 16a of the carry-in hoist 16 descends,
The multilayer printed board P roughly positioned on the board fixing table 18a is fixed by suction. In this state, the X-ray measurement unit 14
The measurement level is switched from the large visual field measurement level to the small visual field measurement level (2 mm square), and the X-ray measurement unit 14 measures the reference mark of the multilayer printed circuit board at the small visual field measurement level, and moves the drilling processing part to the optimum position. A correction value for moving is calculated. At this time, the X-ray TV camera 14a and the X-ray tube 14
Since the collimator (not shown) provided in b holds the multilayer printed circuit board P from above and below, it is possible to prevent accuracy deterioration due to sagging or warping of the multilayer printed circuit board P.

[Transport Step] From the measurement area B to the processing area C. After obtaining the correction value, the board fixing table 18a moves from the measurement area B to the processing area C while the multilayer printed circuit board P is fixed, thereby transferring the multilayer printed board P from the measurement area B to the processing area C. . At this time, the other board fixing table 18b is moved from the processing area C to the measurement area B in such a manner as to replace the table 18a. Is in the ascending position and moves at a high position, whereas the table 18b is a no-load reverse movement after unloading the multilayer printed circuit board P, so that the cylinder 18c
Is in the lowered position and moves at a lower position. Therefore, the substrate fixing tables 18a and 18b can move without colliding with each other.

[Drilling step] ... processing area C. When the substrate fixing table 18a reaches the processing area C, the drive unit 19 drives the drilling unit 13 to the optimum position according to the correction value, and the drilling unit 13 drills the multilayer printed circuit board P at the optimum position. Is carried out. In addition, as the drilling processing, selection such as distribution processing and reference mark position center drilling processing can be selected by presetting. In drilling, the multilayer printed circuit board P is generally held by a pressure foot or a substrate support to prevent bending, processing burrs, burrs, and the like of the multilayer printed circuit board P.
Further, in order to recognize the front, rear, left, and right of the multilayer printed circuit board P, recognition discarding is performed.

[Unloading Step] From the processing area C to the unloading position D. After drilling, the suction pad 17 of the unloading hoist 17
a descends and adsorbs, and the unloading hoist 17 transfers the processed multilayer printed circuit board P to the unloading position D along the beam 5. At this time, when the drilling processing line is connected to the end face processing line of the multilayer printed circuit board P, the correction amount at the time of drilling is corrected again by the unloading hoist 17, and
The θ-axis movement is considered in consideration of a 90 ° turn or the like in the line configuration, and the position of the multilayer printed circuit board P is appropriately adjusted, whereby a smooth transition to the end face processing can be performed.

(4) Operation and Effect The operation and effect of the present embodiment as described above are as follows. That is, the carry-in hoist 16 can perform the coarse positioning of the multilayer printed circuit board P based on the measurement result of the large-field measurement level of the X-ray measuring unit 14, so that it is not necessary to independently add a coarse positioning device. Further, since the rough positioning and the correction value measurement can be performed at one position of the measurement area B, it is possible to omit the substrate transfer path and to shorten the tact time as compared with the related art. In addition, by switching the measurement level of the X-ray measurement unit 14 between the large field of view and the small field of view, coarse positioning and correction value measurement can be reliably performed. Therefore, only one expensive X-ray measurement unit 14 is required, and the manufacturing cost of the apparatus can be significantly reduced.

In this embodiment, since two suction fixing tables 18a and 18b are provided, one substrate fixing table 18a is arranged in the measurement area B, and the other substrate fixing table 18b is processed in the processing area C. The rough positioning step and the correction value measuring step can be performed in the measurement area B, and the drilling processing step can be performed in the processing area C at the same time. Therefore,
The continuous processing tact time can be greatly reduced, and the working efficiency can be improved.

The present invention is not limited to the above-described embodiment. For example, the following embodiment is provided as a method for boring a multilayer printed circuit board according to the first aspect of the present invention. Is also included. That is, in the conventional example shown in FIG. 10, the X-ray measuring unit 4 fixed to the column 2 is removed, and the coarse positioning device 9 including the X-ray device performs not only the coarse positioning step but also the correction value measuring step. The configuration is as follows. According to such an embodiment, the coarse positioning step and the correction value measuring step are performed at the same position, and a common X
The reference mark 12 can be measured using a line measuring unit (the X-ray device of the coarse positioning device 9). Therefore, similarly to the above-described embodiment, it is possible to reduce the manufacturing cost of the apparatus and the processing tact time.

[0057]

As described above, according to the present invention,
By performing coarse positioning and correction value measurement using the same X-ray device at the same position, manufacturing costs can be reduced, and by drilling at a position different from the position where the correction value measurement was performed. The simultaneous processing of the measurement of the correction value and the drilling was made possible, and a highly accurate and high-speed drilling method for a multilayer printed circuit board and a device therefor were provided.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the overall configuration of the present embodiment according to the present invention.

FIG. 2 is a side view showing the overall configuration of the embodiment.

FIG. 3 is a plan view showing the overall configuration of the embodiment.

FIG. 4 is a perspective view showing a drilling unit 13 and an X-ray measurement unit 14 according to the embodiment.

FIG. 5 is a perspective view showing a carry-in hoist 16 and a carry-out hoist 17 of the present embodiment.

FIG. 6 is a view showing the substrate fixing tables 18a and 18 according to the embodiment;
FIG.

FIG. 7 is a side cross-sectional view illustrating a configuration of a multilayer printed circuit board P.

FIG. 8 is a plan view of FIG. 7, and is an enlarged view showing a shift of a reference mark 12 on the multilayer printed circuit board P.

FIG. 9 is a plan view showing a shift of a reference mark 12 on the multilayer printed circuit board P.

FIG. 10 is a perspective view illustrating the overall configuration of a conventional apparatus for drilling and lowering a multilayer printed circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Processing table 2 ... Column 3, 13 ... Drilling part 4, 14 ... X-ray measuring part 4a, 14a ... X-ray TV camera 4b, 14b ... X-ray tube 5 ... Beam 5a ... Rack 6, 16 ... Carry in Hoists 6a, 7a, 16a, 17a ... Suction pads 7, 17 ... Unloading hoist 8 ... Substrate unloading section 9 ... Rough positioning device 9a, 9b ... X-ray device 12 ... Reference mark 15 ... Actuator 18a, 18b ... Substrate fixing table 18c ... Cylinder 19: Driving unit 19a, 19c, 19e: Motor 19b, 19d, 19f: Guide unit 20: Single-sided copper-clad plate 21: Double-sided plate 22: Prepreg A: Loading position B: Measurement area C: Processing area D: Unloading position H … Measurement processing area P… Multilayer printed circuit board Q… Load-in table

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takao Komai 1-8-1 Moon Ring, Otsu City, Shiga Prefecture Inside Shimadzu Mectem Corporation

Claims (7)

[Claims] 1. A method for boring a multilayer printed circuit board, wherein a reference mark detectable by X-rays is provided in each layer by a drilling section. Coarsely positioning the multilayer printed circuit board to fall within the measurement range of, and performing high-precision coordinate value measurement of the coarsely positioned reference mark of the multilayer printed circuit board, and an error between the high-precision coordinate value and a predetermined target value. Calculating a correction amount, and measuring and calculating a correction value for moving the drilling unit to an optimal position; and a multi-layer after the drilling unit moves to the optimal position according to the correction value. And a drilling step of drilling a printed circuit board, wherein the coarse positioning step and the correction value measuring step are performed at the same position, and There is a common X
A method for boring a multilayer printed circuit board, wherein coarse and high precision coordinate values of the reference mark are measured using a line measuring unit. 2. The method according to claim 1, wherein the rough positioning step and the correction value measuring step are performed at a first position, the drilling step is performed at a second position, and the multi-layer is formed while the correction value is measured. While carrying out a transfer step of sucking and fixing the printed circuit board from the first position to the second position, the correction value measuring step at the first position and the drilling step at the second position are simultaneously performed. The method according to claim 1, wherein the processing is performed continuously. 3. The multilayer printing according to claim 1, wherein in the rough positioning step, rough positioning is performed on a multilayer printed circuit board having an error of about 15 mm between the end face of the board and the reference mark position. Drilling method of substrate. 4. A multi-layer printed circuit board drilling apparatus for performing X-ray measurement and drilling on a multilayer printed circuit board provided with a reference mark detectable by X-ray on each layer, wherein the reference mark is X-ray An X-ray measurement unit that measures using a transmission image is arranged in a measurement region, and a drilling unit that drills a multilayer printed circuit board is arranged in a processing region. In order to measure coordinate values, the reference mark on the multilayer printed circuit board
In order to measure the determination of whether or not measurement is possible and to determine the amount of movement for performing coarse positioning on the X-ray transmission image of the 0 mm square large field of view, and to measure the reference mark with high precision coordinate values,
An X-ray transmission image of a small visual field of 2 mm square is enlarged and displayed, coordinate values are measured, an error amount and a distribution amount from a predetermined target value are automatically calculated, and the perforated portion is moved to an optimum position based on the calculation result. The multi-layer printed circuit board is carried into the measurement area, and the reference mark is set based on the measurement result of the large-field measurement level in the X-ray measurement unit. A carry-in / coarse positioning means for performing coarse positioning of the multilayer printed circuit board that finely moves within a predetermined range capable of measuring the small visual field is provided, and the coarsely positioned and small-field measured multilayer printed circuit board is fixed by suction. A substrate suction fixed table that reciprocates continuously between the measurement area and the processing area is provided. Further, a small visual field measurement level in the X-ray measurement section is provided in the drilling processing section. Drilling apparatus for a multilayer printed circuit board, comprising: a drilling section fine movement mechanism for measuring the coordinate values with high precision and moving the drilling section to an optimum position in accordance with a correction value calculated based on the measurement result. . 5. The apparatus according to claim 4, further comprising two substrate suction fixing tables. 6. The carrying-in / rough positioning means has a length of 20 mm.
The hole of the multilayer printed circuit board according to claim 4 or 5, wherein a fine movement adjustment of about 15 mm is performed so that the reference mark in a large visual field of a corner is within a small visual field of 2 mm square. Dawn processing equipment. 7. The multi-layer printed circuit board is unloaded from the processing area, and the multi-layer printed circuit board is fixed to a predetermined pin with reference to a reference mark hole drilled in a drilling section for end face processing in the next step. 7. An apparatus according to claim 4, further comprising an unloading / adjusting means for adjusting a position of the multilayer printed board for insertion.