JPH11162780A - Laminated ceramic capacitor combination and manufacture of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated ceramic capacitor combination whose reliability is extremely high in which any crack due to stress from a substrate or solder can not be generated even when a temperature in use is changed according to a substrate mounting state, and a method for manufacturing this. SOLUTION: A laminated ceramic capacitor 10 of a capacitor combination is electrically and mechanically connected to a metallic part 2 through a first face 1a on which the inside electrode of the ceramic capacitor 10 is led out and a second face 2a of one part of the constituting face of a metallic part 2 faced to the first face 1a with the metallic part 2. The rate of the area of the first face 1a to the area of the second face 2a range from 10% to 70%.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped multilayer ceramic capacitor combination and a method of manufacturing the same, and more particularly, to an external electrode terminal for coupling a metal component of the multilayer ceramic capacitor combination with the multilayer ceramic capacitor. Regarding the structure.

[0002]

2. Description of the Related Art A multilayer ceramic capacitor in the form of a chip has advantages in that it has a small size and a large capacitance, and since it can be mounted on a substrate, the occupied area and height on the substrate can be reduced. For this reason, it is currently used in a wide range of electronic devices, but in recent years, a further increase in capacity is required.

In order to increase the capacitance of a multilayer ceramic capacitor, generally, the following (i) and (ii)
The method is adopted. (I) Increase the number of layers. (I
i) Increasing the size increases the area of the opposing internal electrodes. According to the method (i), there is a problem that uniform firing becomes difficult with an increase in the number of laminations, or a yield is reduced due to an increase in lamination deviation. In addition, a large-sized, for example, EI
In the case of a multilayer ceramic capacitor of AJ5750 size (JIS C 6429 external dimension code 6), cracks are generated in the multilayer ceramic capacitor due to thermal distortion of the substrate when mounting the substrate or deflection of the substrate due to fluctuations in the ambient temperature during use, There is a problem that reliability is reduced.

[0004] In order to solve these problems, for example, there is a method disclosed in Japanese Utility Model Publication No. 6-14458 (hereinafter referred to as prior art 1). That is,
In prior art 1, a large-capacity capacitor is manufactured by laminating a plurality of multilayer ceramic capacitors in parallel and then bonding a metal terminal plate to external electrodes of the multilayer ceramic capacitor via solder. According to the method of the prior art 1, since the multilayer ceramic capacitor and the substrate are not in direct contact with each other, the occurrence of cracks due to the bending of the substrate can be prevented to some extent.

[0005]

However, when an accelerated test (temperature cycle test) simulating a change in operating temperature is performed using the multilayer ceramic capacitor manufactured by the method of the prior art 1 described above, the bending stress from the substrate is increased. In addition, alternating stress occurs due to the difference in the coefficient of thermal expansion between the multilayer ceramic capacitor and the solder. As a result, cracks occur in the ceramic body of the multilayer ceramic capacitor, causing defects such as a decrease in capacitance and insulation resistance. Occurs.

On the other hand, as disclosed in Japanese Patent Application Laid-Open No. 4-259205 (hereinafter referred to as prior art 2), by controlling the amount of lead in the solder, the Young's modulus of the solder is reduced, and cracks are less likely to occur. There is a way to make it happen.

However, according to the experiments of the present inventors, the problem of cracking of the multilayer ceramic capacitor by the temperature cycle test cannot be solved only by controlling the amount of lead in the solder, and a product having sufficient reliability is required. It was impossible to supply.

Accordingly, it is an object of the present invention to provide a large-capacity multilayer ceramic capacitor combination excellent in reliability and a method of manufacturing the same in order to solve such problems.

[0009]

According to the present invention, a multilayer ceramic capacitor and a metal component are provided with a first surface from which an internal electrode of the multilayer ceramic capacitor is drawn out and a metal component facing the first surface. In the combined multilayer ceramic capacitor electrically and mechanically coupled via the second surface which is a part of the component surface of the above, the area ratio between the first surface and the second surface is 10%. % Or more and 70%
Is obtained, a combined multilayer ceramic capacitor characterized by being in the range not exceeding.

Further, according to the present invention, in the multilayer ceramic capacitor combination, the metal component has at least one through hole in the second surface. Can be

Further, according to the present invention, in the combined multilayer ceramic capacitor, the constituent surface of the metal component including the second surface has a skewered shape. A conjugate is obtained.

According to the present invention, in the multilayer ceramic capacitor combination, the second surface of the metal component is solder-plated or tin-plated.
And a second portion which has not been subjected to solder plating and tin plating.

Further, according to the present invention, the multilayer ceramic capacitor and the metal component are placed such that the first surface from which the internal electrode of the multilayer ceramic capacitor is drawn out and the component surface of the metal component face each other. In the method of manufacturing a multilayer ceramic capacitor combined body electrically and mechanically coupled via the first surface and a second surface that is a part of the constituent surface, the first surface and the second surface are combined. And electrical and mechanical coupling within an area ratio of 10% or more and not exceeding 70%.

Further, according to the present invention, in the method for manufacturing a combined multilayer ceramic capacitor, it is preferable that the metal component having at least one through hole in a constituent surface including the second surface is used. As a result, a method of manufacturing a combined multilayer ceramic capacitor is obtained.

Further, according to the present invention, in the method for manufacturing a multilayer ceramic capacitor combined body, the metal part whose constituent surface including the second surface has a skewer shape is used. The manufacturing method of the laminated ceramic capacitor combined body described above is obtained.

Further, according to the present invention, in the method for manufacturing a combined multilayer ceramic capacitor according to the present invention, as the metal component, the first surface having the second surface and the second surface may be formed by solder plating or tin plating. And a method of manufacturing a combined multilayer ceramic capacitor using a second portion which is not subjected to solder plating and tin plating.

In general, a multilayer ceramic capacitor has an external electrode formed on a surface from which an internal electrode is extended. This external electrode is usually formed by applying a silver powder paste containing glass and then baking to form a thin layer of silver and glass. Furthermore, in order to improve the wettability with the molten solder, a silver powder paste, a silver-platinum alloy powder (or coprecipitated powder) paste, or a silver-palladium alloy powder is formed on the silver and glass layers. Apply (or coprecipitated powder) paste and bake.

That is, according to the present invention, the alloy comprises one of silver, a silver-platinum alloy, and a silver-palladium alloy.
By setting the area of the second layer of the external electrode within a range of 10% or more and less than 70% of the area of the surface from which the internal electrode of the multilayer ceramic capacitor is drawn out, the multilayer ceramic capacitor and the metal parts are electrically and mechanically connected. The ratio of the area where the internal electrodes of the multilayer ceramic capacitor are electrically connected to the area of the surface from which the internal electrodes of the multilayer ceramic capacitor are drawn is in the range of 10% or more and less than 70%. , Easily obtained.

[0019]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(First Embodiment) FIG. 1 is a perspective view showing the appearance of a multilayer ceramic capacitor combination according to an embodiment of the present invention. FIG. 2 is a perspective view showing the appearance of the multilayer ceramic capacitor used in the multilayer ceramic capacitor combination of FIG. FIG. 3 is a perspective view of a metal component used in the multilayer ceramic capacitor combination of FIG.

Referring to FIGS. 1 to 3, a multilayer ceramic capacitor combination 20 is formed by connecting two multilayer ceramic capacitors 10, 10 to a surface (first surface) 1a from which the internal electrode of the external electrode 1 is drawn out. And electrically and mechanically connecting the metal parts 2 and 2 with the solder 3 by opposing the constituent surfaces 2b including the connecting surface (second surface) 2a to the surfaces 1a and 1a on both sides. Is formed by Reference numeral 2c is a bottom surface.

The multilayer ceramic capacitor combination 20 shown in FIG. 1 is manufactured as follows. Referring to FIGS. 1 to 3, first, one or a plurality of multilayer ceramic capacitors 10 are prepared. When a plurality of multilayer ceramic capacitors 10 are used, as shown in FIG.
First surface 1a, which is one end surface from which the internal electrode is drawn out
And stack them. At this time, the multilayer ceramic capacitor 10 may be fixed using an adhesive.

Here, for convenience of explanation, the following description will be made on the case where two multilayer ceramic capacitors 10 are used.

Next, as shown in FIG. 3, a predetermined amount of solder is applied to the metal part 2 having an L-shaped cross section, fixed using an appropriate jig (not shown), and laminated by a reflow furnace or hot plate (not shown). The first surface from which the internal electrode of the ceramic capacitor 10 is extended and the metal component 2 are connected to the second surface.
1 is electrically and mechanically coupled to the surface 2a of FIG.
The multilayer ceramic capacitor combination shown in (1) is manufactured.
At this time, by accurately adjusting the amount of solder applied to the metal component 2, the area of the solder 3 on the first surface 1a from which the internal electrodes of the multilayer ceramic capacitor 10 are drawn out after bonding, that is, The area of the actual surface (second surface 2a) where the multilayer ceramic capacitor 10 and the metal component 2 are electrically and mechanically coupled, and the first surface from which the internal electrodes of the multilayer ceramic capacitor 10 are drawn out. The ratio with the area of 1a is set to be in a range of 10% or more and less than 70%.

Next, a specific example of manufacturing the multilayer ceramic capacitor combination 20 according to the first embodiment will be described.

(Example 1) In Example 1, first, the outer dimensions are set to 5.
As shown in FIG. 2, two laminated ceramic capacitors 10 each having a size of 7 × 5.0 × 3.0 mm and a nominal capacitance of 22 μF were stacked with the external electrodes aligned. Next, after applying a predetermined amount of two types of commercially available eutectic solder to the L-shaped metal part 2 shown in FIG. 3, it is fixed to a stacked ceramic capacitor using a jig (not shown). Then, a multilayer ceramic capacitor combined body 20 having the shape shown in FIG. 1 was manufactured by a reflow furnace.

In general, the basic constituent elements of solder are lead and tin, but the effect of the present invention can of course be obtained even when there are additional elements such as silver and antimony. The lead content of the solder used in Example 1 of the present invention was about 78% by weight.
And 90% by weight. Hereinafter, a solder having a lead content of 78% is referred to as solder A, and a solder having a lead content of 90% is referred to as solder B.

The amount of the solder applied to the metal component 2 is set to 3 ± 1 mg, 5 ± 1 mg, 10 ± 1 mg for each solder.
By changing to 5 types of 1 mg and 20 ± 1 mg, 20 laminated ceramic capacitor combinations were manufactured.

Next, these multilayer ceramic capacitor combined bodies 20 are mounted on an aluminum substrate using solder, and
A temperature cycle test was performed in a temperature range of 25 ° C. to + 125 ° C. Table 1 below shows the number of defective occurrences after 500 cycles. Samples whose capacitance was reduced by 20% or more before and after the test and those whose insulation resistance was reduced to 1/100 or less were judged to be defective.

[0030]

[Table 1]

After the temperature cycle test, the metal component 2 is peeled off from the multilayer ceramic capacitor combined body 20 and the area of the solder 3 adhered to the external electrode 1 of the multilayer ceramic capacitor 10, that is, the multilayer ceramic capacitor 10 and the metal component 2 The area of the surface (second surface) 2a electrically and mechanically coupled was measured. The ratio of the area of the bonded solder to the area of the first surface from which the internal electrodes of the multilayer ceramic capacitor are drawn out (hereinafter, unless otherwise specified, is abbreviated as the area ratio) is expressed in%, and the solder is applied. The results arranged for the amounts are shown in FIG.

FIG. 4 shows that the area where the multilayer ceramic capacitor and the metal component are electrically and mechanically coupled can be freely set by accurately adjusting the amount of solder applied.

From the test results shown in Table 1 and FIG. 4, it can be seen that the failure was caused by the ratio of the area of the solder adhered to the external electrode 1 of the multilayer ceramic capacitor to the area 1a from which the internal electrode of the multilayer ceramic capacitor was drawn out. The change in the number of occurrences is shown in FIG. In FIG. 5, a black circle indicates a defective insulation of the solder A, a white circle indicates a defective capacitance of the solder A, a black triangle indicates a defective insulation resistance of the solder B, and a white triangle indicates the capacitance of the solder B. Indicates a defect.

It can be seen from FIG. 5 that, regardless of the type of solder, a capacitance failure occurs when the area ratio is 10% or less, and an insulation resistance failure occurs when the area ratio is 70% or more.

After the test, three samples were arbitrarily extracted from the non-defective product, the defective product having poor capacitance, and the defective product having poor insulation resistance, and polished and observed. Solder peeling, which is considered to be caused by insufficient soldering, was confirmed for all the defective capacitors. Also,
It was found that cracks occurred in the ceramic body of all the insulation resistance defective products. No abnormalities were found in good products.

As described above, the multilayer ceramic capacitor 1
0 is the ratio of the area of the surface (second surface 2a) where the metal component 2 is electrically and mechanically coupled to the area of the first surface 1a from which the internal electrodes of the multilayer ceramic capacitor 10 are drawn out. Is set within the range of 10% or more and less than 70%, and regardless of the type of solder (the amount of lead), it is electrically and mechanically stable and has excellent reliability without cracks. Multilayer ceramic capacitor combination 20
Was obtained.

According to the present invention, of course, a multilayer ceramic capacitor having excellent reliability can be obtained by using the metal part 2 having the simple shape shown in FIG. In order to control, it is necessary to precisely adjust the amount of solder applied, which causes a problem during mass production. Therefore, the following modified example was studied.

(Second Embodiment) FIG. 6 shows a second embodiment of the present invention.
It is a perspective view which shows the multilayer ceramic capacitor coupling body by embodiment. FIG. 7 is a perspective view of a metal component used in the multilayer ceramic capacitor combination of FIG. 6 has the same configuration as the multilayer ceramic capacitor combination 20 shown in FIG. 1 except that the metal component 4 is different.

That is, as shown in FIG. 7, a metal component 4 having one through-hole 5 in a component surface 6 including a second surface electrically and mechanically coupled to a multilayer ceramic capacitor 10.
By using, it is possible to make the area of the solder 3 after bonding substantially constant even when the amount of solder applied changes, so that a multilayer ceramic capacitor combination excellent in reliability can be more easily obtained.

Next, a specific example of manufacturing the multilayer ceramic capacitor combination according to the second embodiment of the present invention shown in FIG. 6 will be described.

(Example 2) The metal component 4 and the solder A shown in FIG.
Was used to produce a multilayer ceramic capacitor combination (FIG. 6) in the same manner as in Example 1. Here, the solder application amount is 5 ± 1.
mg, 10 ± 1 mg, and 20 ± 1 mg, and in each case, 20 were produced. In the same manner as in Example 1, a temperature cycle test was performed to check the occurrence of defects in the capacitance and the insulation resistance, and then the area ratio where the metal parts were bonded was measured.

(Third Embodiment) FIG. 8 shows a third embodiment of the present invention.
It is a perspective view which shows the multilayer ceramic capacitor coupling body by embodiment. FIG. 9 is a perspective view of a metal component used in the multilayer ceramic capacitor combination of FIG. The multilayer ceramic capacitor combination 22 shown in FIG. 8 has the same configuration as the multilayer ceramic capacitor combinations 20 and 21 shown in FIGS. 1 and 6 except that the metal component 7 is different. That is, as shown in FIG. 9, by using a metal component having a plurality of through holes 8 on the constituent surface 9 including the second surface electrically and mechanically coupled to the multilayer ceramic capacitor 10, the solder is applied. Even if the amount changes, the area of the solder after bonding can be kept almost constant.
A more reliable multilayer ceramic capacitor combination 22 can be obtained more easily than the example of FIG.

Next, a specific example of manufacturing the multilayer ceramic capacitor combination according to the third embodiment of the present invention shown in FIG. 8 will be described.

(Example 3) The metal component 7 and the solder A shown in FIG.
Was used to manufacture and evaluate a multilayer ceramic capacitor combined body (FIG. 8) in the same manner as in Example 2.

(Fourth Embodiment) FIG. 10 is a perspective view showing a multilayer ceramic capacitor combined body according to a fourth embodiment of the present invention. FIG. 11 is a perspective view of a metal component used in the multilayer ceramic capacitor combination of FIG. Combined multilayer ceramic capacitor 2 shown in FIG.
1 is a multilayer ceramic capacitor combined body 20, 21, 22 shown in FIG. 1, FIG. 6, and FIG.
It has a similar configuration except that is different. That is, FIG.
As shown in FIG. 1, by using a metal part having a skewer-shaped configuration surface 12 including a surface electrically and mechanically coupled to the multilayer ceramic capacitor 10, even if the amount of solder applied changes, Since the area of the solder can be made substantially constant, a multilayer ceramic capacitor combination having excellent reliability can be obtained more easily than the example shown in FIG.

Next, a specific manufacturing example of the multilayer ceramic capacitor combination according to the fourth embodiment of the present invention shown in FIG. 10 will be described.

(Example 4) Using the metal component 11 and the solder A shown in FIG. 11, a multilayer ceramic capacitor combined body 23 shown in FIG. 10 was manufactured and evaluated in the same manner as in Example 2.

(Fifth Embodiment) FIG. 12 is a perspective view showing a multilayer ceramic capacitor combination according to a fifth embodiment of the present invention. FIG. 13 is a perspective view of a metal component used in the multilayer ceramic capacitor combination of FIG. Multilayer ceramic capacitor combination 2 shown in FIG.
Reference numeral 4 denotes a multilayer ceramic capacitor combination 20, 21, 22, 22, and 23 shown in FIGS. 1, 6, 8, and 10.
Has a similar configuration except that the metal part 13 is different. That is, as shown in FIG. 13, a metal part 1 having a skewer-like shape in which a plurality of constituent surfaces 12 including a surface electrically and mechanically coupled to a multilayer ceramic capacitor 10 are arranged side by side.
The use of No. 3 makes it possible to make the area of the solder after bonding substantially constant even if the amount of solder applied changes, so that the multilayer ceramic having higher reliability than the example of FIG. A capacitor combination is obtained.

Next, a specific example of the multilayer ceramic capacitor combination according to the fifth embodiment of the present invention shown in FIG. 12 will be described.

(Example 5) Using the metal component 13 and the solder A shown in FIG. 13, a multilayer ceramic capacitor combined body (FIG. 12) was manufactured and evaluated in the same manner as in Example 2.

(Sixth Embodiment) FIG. 14 is a perspective view showing a metal part of a combined multilayer ceramic capacitor according to a sixth embodiment of the present invention. As shown in FIG. 14, the metal component 2 may be made of any material as long as it has electrical conductivity, but is preferably plated with solder (or tin plating) for the purpose of improving solder wettability.

When applying this solder plating, it is possible to control the portion to be solder-plated into an arbitrary shape by masking the metal component.

Therefore, even in the metal part 2 having the simple shape shown in FIG. 3, the surface electrically and mechanically coupled to the multilayer ceramic capacitor is solder plated in the shape shown in FIG. A first portion 15 and a second portion 16 not formed are formed. Since the solder is hardly bonded to the second portion 16 that is not solder-plated, the bonding area of the solder can be made substantially constant regardless of the amount of the solder applied. Is obtained.

A specific example of the multilayer ceramic capacitor combination according to the sixth embodiment of the present invention will be described.

(Example 6) The entire surface of a metal component having the shape shown in FIG. 3 was plated with nickel and further plated with solder. When solder plating is performed, a commercially available adhesive tape is attached to the surface of the metal component that is to be connected to the multilayer ceramic capacitor to form a portion that is not solder-plated, and the metal component having the shape shown in FIG. Created. Using this metal part, a multilayer ceramic capacitor combined body (not shown because of the same shape as in Example 2) was manufactured and evaluated in the same manner as in Example 2.

(Seventh Embodiment) FIG. 15 is a perspective view showing a metal part of a combined multilayer ceramic capacitor according to a seventh embodiment of the present invention. As shown in FIG. 15, the metal component 2 may be made of any material as long as it has electrical conductivity, but is preferably plated with solder (or tin plating) for the purpose of improving solder wettability. When applying this solder plating, it is possible to control the portion to be solder-plated to an arbitrary shape by masking the metal component. Therefore, even in the metal part 2 having the simple shape shown in FIG. 3, the components including the surface electrically and mechanically coupled to the multilayer ceramic capacitor are plated with solder as shown in FIG. Surface (first part) 15
And a plurality of untreated surfaces (second portions) 16 are formed. As described in the sixth embodiment, the solder is hardly bonded to the plurality of second portions 16 which are not plated with solder, so that the bonding area of the solder is kept substantially constant regardless of the amount of solder applied. It is possible to obtain the same effect as in the case of having the above-described through-hole or the case of the skewered shape.

A specific example of the multilayer ceramic capacitor combination according to the seventh embodiment of the present invention will be described.

(Example 7) In the same procedure as in Example 6, the metal part 2 shown in FIG. 15 was manufactured. Using this metal part 2,
In the same manner as in Example 2, a multilayer ceramic capacitor combined body (the appearance is the same as in Example 2 and not shown) was manufactured and evaluated.

Table 2 below shows the results of the temperature cycle test in Examples 2 to 7 of the multilayer ceramic capacitor combination according to the above embodiment.

[0060]

[Table 2]

As shown in Table 2 above, from the results of Examples 2 and 3, at least one or more through-holes are provided on the surface of the metal component that is electrically and mechanically connected to the multilayer ceramic capacitor. , Easy area ratio is more than 10%,
It has been confirmed that a multilayer ceramic capacitor combination excellent in reliability within a range of less than 70% can be obtained.

Further, from the results of Examples 4 and 5, the surface ratio of the metal component, which is electrically and mechanically connected to the multilayer ceramic capacitor, is skewered, so that the area ratio is easily 10% or more. , Less than 70%, it was confirmed that a highly reliable multilayer ceramic capacitor combined body could be obtained.

Further, from the results of Examples 6 and 7, it can be seen from the results that the surface of the metal component that is electrically and mechanically connected to the multilayer ceramic capacitor has a portion plated with solder (or tin plated) and a portion not plated with solder. Thus, it was confirmed that a multilayer ceramic capacitor combination having an area ratio in the range of 10% or more and less than 70% and having excellent reliability can be easily obtained.

(Eighth Embodiment) FIG. 16 is a perspective view showing a multilayer ceramic capacitor of a combined multilayer ceramic capacitor according to an eighth embodiment of the present invention.
As shown in FIG. 16, a silver-platinum alloy (or silver, silver-palladium alloy) is used as the external electrode 1 for 10% or more of the area of the first surface 1a from which the internal electrode is drawn.
% By using a multilayer ceramic capacitor 10 ′ provided with a contact layer 17 coated and baked in a range of less than
Even if a metal part 2 having the shape shown in FIG. 3 and the entire surface is subjected to solder plating (or tin plating) is used, the reliability is easily improved without accurately adjusting the amount of solder applied. A multilayer ceramic capacitor can be obtained. In addition, since plating is hardly performed on the surface on which silver-platinum alloy is not applied, silver-platinum alloy is applied and baked on the external electrodes of the multilayer ceramic capacitor as described above, and then solder plating (or tin plating) is performed. )
May be applied.

Hereinafter, a specific example of the multilayer ceramic capacitor combination according to the eighth embodiment of the present invention will be described.

(Example 8) During the production of a multilayer ceramic capacitor, external electrodes were applied in the following manner. First, a glass-containing silver powder paste is applied to the entire surface of the ceramic body from which the internal electrodes are drawn out, and baked to form a glass-containing Ag layer 18. The contact layer 17 was formed in the shape shown by applying and baking so as to cover about 50% of the surface 1a from which the internal electrodes of the ceramic body were drawn out. Using the multilayer ceramic capacitor 10 'and the metal part 2 having the shape shown in FIG. 3 and the whole surface being subjected to solder plating, a multilayer ceramic capacitor combined body (the external appearance is the same as that shown in FIG. No) was manufactured and evaluated.
The results of the temperature cycle test in Example 8 are shown in Table 3 below.

[0067]

[Table 3]

From the results shown in Table 3 above, the one having good bonding with solder, such as silver, a silver-platinum alloy or a silver-palladium alloy, was removed from the surface from which the internal electrodes of the multilayer ceramic capacitor were drawn out. It has been confirmed that by setting the area of the surface from which the electrodes are drawn out to 10% or more and less than 70%, a multilayer ceramic capacitor combination having excellent reliability can be obtained.

[0069]

As described above, according to the present invention,
In a multilayer ceramic capacitor combination, in which the multilayer ceramic capacitor and the metal component are electrically and mechanically connected via the surface from which the internal electrodes of the multilayer ceramic capacitor are drawn out, the multilayer ceramic capacitor and the metal component are electrically connected. In addition, since the ratio of the area of mechanical coupling and the area of the surface from which the internal electrodes of the multilayer ceramic capacitor are drawn out is in the range of 10% or more and less than 70%, fluctuations in the operating temperature in the state of board mounting Even when cracks occur, stress from the substrate and solder acting on the multilayer ceramic capacitor can be reduced, and at the same time, stable electrical and mechanical coupling can be obtained, so the multilayer ceramic capacitor has excellent reliability without cracks And a method for manufacturing the same can be provided.

Further, according to the present invention, a metal part having at least one through hole on the surface to be electrically and mechanically coupled to the multilayer ceramic capacitor, or electrically and mechanically coupled to the multilayer ceramic capacitor. By using metal parts that have a skewered shape, the area where the multilayer ceramic capacitor and the metal parts are electrically and mechanically coupled, and the area where the internal electrodes of the multilayer ceramic capacitor are drawn out The ratio with the area can be easily set to a range of 10% or more and less than 70%,
Further, it is possible to provide a multilayer ceramic capacitor combination excellent in reliability and a method of manufacturing the same.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an appearance of a multilayer ceramic capacitor combination according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing the appearance of the multilayer ceramic capacitor used in the multilayer ceramic capacitor combination of FIG. 1;

FIG. 3 is a perspective view showing a metal component used in the multilayer ceramic capacitor combined body of FIG. 1;

FIG. 4 is a diagram showing a relationship between a solder application amount and an area ratio of the combined multilayer ceramic capacitor of FIG. 1;

FIG. 5 is a diagram showing the relationship between the area ratio of the combined multilayer ceramic capacitor of FIG. 1 and the defect occurrence rate.

FIG. 6 is a perspective view showing an appearance of a multilayer ceramic capacitor combination according to a second embodiment of the present invention.

FIG. 7 is a perspective view showing an external appearance of a metal component used in the multilayer ceramic capacitor combined body of FIG. 6;

FIG. 8 is a perspective view showing an appearance of a multilayer ceramic capacitor combination according to a third embodiment of the present invention.

FIG. 9 is a perspective view showing a metal part of the combined multilayer ceramic capacitor of FIG. 8;

FIG. 10 is a perspective view showing the appearance of a multilayer ceramic capacitor combination according to a fourth embodiment of the present invention.

FIG. 11 is a perspective view showing a metal part of the multilayer ceramic capacitor combined body of FIG. 10;

FIG. 12 is a perspective view showing an appearance of a multilayer ceramic capacitor combination according to a fifth embodiment of the present invention.

FIG. 13 is a perspective view showing a metal part of the combined multilayer ceramic capacitor of FIG. 12;

FIG. 14 is a perspective view showing an appearance of a metal component of a multilayer ceramic capacitor combined body according to a sixth embodiment of the present invention.

FIG. 15 is a perspective view showing a metal part of a combined multilayer ceramic capacitor according to a seventh embodiment of the present invention.

FIG. 16 is a perspective view showing a multilayer ceramic capacitor of a multilayer ceramic capacitor combination according to an eighth embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 External electrode 1a 1st surface (The surface from which an internal electrode is drawn out) 2,4,7,11,13 Metal parts 3 Solder 5,8 Through-hole 6,9,12,14 The surface combined with a multilayer ceramic capacitor 10, 10 'multilayer ceramic capacitor 15 solder-plated surface (part) 16 non-solder-plated surface (part) 17 contact layer (Ag-Pt alloy) 18 glass-containing Ag layer

Claims (10)

[Claims] 1. A multilayer ceramic capacitor and a metal component are a first surface from which internal electrodes of the multilayer ceramic capacitor are drawn out and a second surface which is a part of a component surface of the metal component facing the first surface. Wherein the ratio of the area of the first surface to the area of the second surface is 1 in the multilayer ceramic capacitor combination electrically and mechanically coupled via the surface of
A multilayer ceramic capacitor combination characterized by being in the range of not less than 0% and not exceeding 70%. 2. The multilayer ceramic capacitor combination according to claim 1, wherein the metal component has at least one through hole in a constituent surface including the second surface. . 3. The multilayer ceramic capacitor combination according to claim 1, wherein the coupling surface including the second surface of the metal component has a skewered shape. . 4. The multilayer ceramic capacitor assembly according to claim 1, wherein the constituent surface including the second surface of the metal component is formed by solder-plated or tin-plated first portion and solder-plated or tin-plated. A multilayer ceramic capacitor combination comprising a second portion that is not applied. 5. The multilayer ceramic capacitor assembly according to claim 1, wherein any one of silver, silver-platinum alloy, and silver-palladium alloy is provided on the first surface.
Characterized in that it is applied in a range of not less than 10% and not more than 70% of the area of the surface of the multilayer ceramic capacitor. 6. A multilayer ceramic capacitor and a metal component, wherein the first surface from which the internal electrode of the multilayer ceramic capacitor is drawn out and the component surface of the metal component face each other, and In the method for manufacturing a multilayer ceramic capacitor combined body that is electrically and mechanically coupled via a second surface that is a part of the constituent surface, the area ratio between the first surface and the second surface is reduced. A method for manufacturing a multilayer ceramic capacitor combined body, wherein electrical and mechanical coupling is performed within a range of not less than 10% and not exceeding 70%. 7. The method for manufacturing a multilayer ceramic capacitor assembly according to claim 6, wherein the metal component includes:
A method of manufacturing a combined multilayer ceramic capacitor, comprising using at least one through hole in the second surface. 8. The method of manufacturing a multilayer ceramic capacitor assembly according to claim 6, wherein the metal component is
A method for manufacturing a combined multilayer ceramic capacitor assembly, wherein a component surface including the second surface has a skewered shape. 9. The method of manufacturing a multilayer ceramic capacitor assembly according to claim 6, wherein the metal component is:
A multilayer ceramic capacitor characterized in that a component surface including the second surface includes a first portion plated with solder or tin and a second portion not plated with solder and tin. Method for producing conjugate. 10. The method for manufacturing a multilayer ceramic capacitor assembly according to claim 6, wherein the multilayer ceramic capacitor includes silver, silver-platinum alloy, and silver-palladium alloy on the first surface. A method of manufacturing a multilayer ceramic capacitor combined body, characterized in that the coated area is used in a range of not less than 10% and not more than 70% of the area of the first surface.