JPH11156457A - Method for forming tapered hole, and manufacture op optical element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily and surely obtain a tapered hole high in precision only by the pressing by press-inserting a swollen part projecting on the other surface side using a chamfering punch from the other surface side to form a chamfered part after the tapered hole is pierced from one surface side to the other surface side of a work. SOLUTION: A prepared hole 11e for a tapered hole is pierced in a work 11. A punching punch having the diameter slightly larger than the diameter on the small diameter side of the tapered hole is processed from one surface side of the work 11 to the other surface side. A small swollen part is formed in the tapered hole on the other surface side of the work 11 by burrs generated by the punching punch and residual parts of the swollen part generated in the tapered hole forming process. The chamfered part forming process is achieved by press-inserting a chamfering punch from the other surface side of the work 11 to form a chamfered part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a tapered hole for forming a tapered hole in a workpiece by press working and a method for manufacturing an optical element.

[0002]

2. Description of the Related Art Conventionally, as a method of forming a tapered hole for forming a tapered hole in a workpiece by press working, for example, a method disclosed in Japanese Patent Application Laid-Open No. 8-281346 is known. In this method of forming a tapered hole, as shown in FIG. 10A, the tapered portion 1a formed at the tip of the punch 1 is replaced with a plate material 4 disposed between the upper die 2 and the lower die 3.
By projecting from the lower surface of the tapered hole, a tapered hole 4a as shown in FIGS.

[0003] The pressing of the tapered portion 1a causes the plate material 4 to move.
A predetermined tapered hole 4a as shown in (d) is obtained by cutting and removing the swelling portion 4b protruding from the lower surface of the substrate by the cutter 5.

[0004]

However, in such a conventional method of forming a tapered hole, the bulging portion 4 protruding from the lower surface of the plate 4 by pressing the tapered portion 1a of the punch 1.
Since b is cut and removed by the cutter 5, a cutting step is required in addition to the pressing step, and there is a problem that the processing cost is increased due to the complexity of the step.

A bulging portion 4 protruding from the lower surface of the plate 4
b is cut off by the cutter 5, burrs are generated on the lower surface of the tapered hole 4a, and the tapered hole 4a with high precision is formed.
There is a problem that it becomes difficult to obtain The present invention has been made to solve such a conventional problem, and it is possible to easily form a highly accurate tapered hole only by press working.
An object of the present invention is to provide a method for forming a tapered hole and a method for manufacturing an optical element that can be reliably obtained.

[0006]

According to a first aspect of the present invention, there is provided a method of forming a tapered hole, wherein a tapered hole is formed by penetrating from one surface of the workpiece to the other surface using a tapered hole forming punch having a tapered portion. Forming a tapered hole, and squeezing the bulging portion formed on the other surface of the workpiece by inserting and chamfering a chamfering punch from the other surface of the workpiece. Forming a chamfer on the other surface of the object.

According to a second aspect of the present invention, in the method of forming a tapered hole according to the first aspect, the tapered hole is formed between the tapered hole forming step and the chamfered portion forming step by the tapered hole forming step. The present invention is characterized in that a punching step is provided for removing a bulging portion protruding from the other surface of the workpiece by penetrating a punch from one surface of the workpiece toward the other surface.

According to a third aspect of the present invention, in the method of forming a tapered hole according to the first or second aspect, before the step of forming the tapered hole, a pilot hole for the tapered hole is previously formed in the workpiece. It is characterized by being formed through. According to a fourth aspect of the present invention, there is provided a method of manufacturing an optical element, comprising forming a mirror-shaped tapered hole from one surface of a workpiece to another surface by using a tapered hole-forming punch having a tapered portion polished to a mirror surface. Process, a bulge formed to project from the other surface of the workpiece,
Forming a chamfered portion on the other side of the workpiece by crushing the chamfering punch by inserting and pressing the punch from the other side of the workpiece. .

According to a fifth aspect of the present invention, there is provided the optical element manufacturing method according to the fourth aspect, wherein the tapered hole forming step includes the tapered hole forming step between the tapered hole forming step and the chamfered part forming step. The present invention is characterized in that a punching step is provided for removing a bulging portion protruding from the other surface of the workpiece by penetrating a punch from one surface of the workpiece toward the other surface.

According to a sixth aspect of the present invention, in the method for manufacturing an optical element according to the fourth or fifth aspect, before the step of forming the tapered hole, a pilot hole for the tapered hole is previously formed in the workpiece. It is characterized by being formed through. The method for manufacturing an optical element according to claim 7 is the method for manufacturing an optical element according to claim 4, wherein the tapered hole is
It is a reflecting surface for guiding excitation light from a semiconductor laser to a solid-state laser crystal.

(Function) In the method of forming a tapered hole according to the first aspect, the tapered hole is formed from one surface of the workpiece to the other surface by using a tapered hole forming punch in which a tapered portion is formed in the tapered hole forming step. Are formed through. Then, in the chamfering part forming step, the bulging portion projectingly formed on the other side of the workpiece is crushed by inserting and pressing a chamfering punch from the other side of the workpiece. A chamfered part is formed on the other side.

In the method of forming a tapered hole according to a second aspect of the present invention, the bulging portion formed on the other side of the workpiece in the tapered hole forming step is formed by punching the punch for punching on one side of the workpiece in the punching step. The bulge is removed by penetrating from the other side to the other surface, and the remaining bulging portion is reduced. In the method of forming a tapered hole according to the third aspect, before the tapered hole forming step, a prepared hole for the tapered hole is formed through the workpiece in advance,
In the tapered hole forming step, a tapered hole is formed by penetrating the prepared hole through the tapered portion of the tapered hole forming punch.

According to a fourth aspect of the present invention, in the tapered hole forming step, the tapered portion is mirror-polished from one surface to the other surface by using a tapered hole forming punch whose mirror surface is polished to a mirror surface. A tapered hole is formed through. Then, in the chamfering part forming step, the bulging portion projectingly formed on the other side of the workpiece is crushed by inserting and pressing a chamfering punch from the other side of the workpiece. A chamfered part is formed on the other side.

In the method of manufacturing an optical element according to the fifth aspect, the bulging portion protrudingly formed on the other surface side of the workpiece in the tapered hole forming step is formed by punching the punch for punching the one surface of the workpiece in the punching molding step. The bulge is removed by penetrating from the other side to the other surface, and the remaining bulging portion is reduced. In the method of manufacturing an optical element according to the sixth aspect, before the tapered hole forming step, a prepared hole for the tapered hole is formed through the workpiece in advance,
In the tapered hole forming step, a tapered hole is formed by penetrating the prepared hole through the tapered portion of the tapered hole forming punch.

According to a seventh aspect of the present invention, the tapered hole is a reflecting surface for guiding the excitation light from the semiconductor laser to the solid-state laser crystal.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a method for forming a tapered hole according to the present invention will be described in detail with reference to the drawings.

In the method of forming a tapered hole according to this embodiment,
As shown in FIG. 1, a plate-shaped workpiece 11 is
A tapered hole 11c having a smaller diameter is formed from the front surface to the other surface 11b, and the chamfered portion 1 is formed on the other surface 11b side of the tapered hole 11c.
1d is formed. The workpiece 11 is, for example, a plate material such as iron, brass, or copper. And the tapered hole 11c is
The mirror is formed with very high precision.

That is, in this embodiment, first, FIG.
As shown in the figure, a pilot hole 11e for the tapered hole 11c is formed through the workpiece 11. The pilot hole 11e is formed slightly smaller than the diameter of the tapered hole 11c on the small diameter side, and is formed by, for example, press working. In addition, taper hole 1
When 1c has a relatively acute angle and the amount of excess wall thickness due to plastic deformation is small, the formation of the pilot hole 11e can be omitted.

Next, a tapered hole forming step is performed, and a tapered hole 11c is formed in the workpiece 11 as shown in FIG. In this tapered hole forming step, as shown in FIG.
This is performed by forming a tapered hole 11c from 1a toward the other surface 11b.

The taper hole forming punch 13 is made of high-speed steel or superhard metal, and has a tapered portion 13a at its tip.
Are formed. The tapered portion 13a is mirror-finished by grinding after grinding. The polishing is performed using an oil-based diamond paste.

The grain size of the diamond abrasive grains of the diamond paste is initially a mesh conversion value # 1200 (grain size 12 to
22 μm) to # 1800 (grain size 8 to 12 μm), and when the tool mark due to the grinding process is almost eliminated, the mesh conversion value # 8000 (grain size 2 to 4 μm)
Finish polishing is performed with a particle size of about # 14000 (particle size 0 to 2 μm).

The tapered hole forming punch 13 is fixed to an upper die set 15 of a press. On the other hand, a lower die 19 is fixed to the lower die set 17 of the press, and the workpiece 11 is placed on the upper surface of the lower die 19.

In the lower die 19, a relief hole 19a for releasing the tapered portion 13a of the taper hole forming punch 13 is formed coaxially with the pilot hole 11e formed in the workpiece 11. Further, a stripper 21 is disposed so as to cover the lower mold 19. This stripper 21 allows the taper hole 1
When the tapered hole forming punch 13 formed with 1c is separated from the workpiece 11, the workpiece 11 is prevented from lifting together with the tapered hole forming punch 13.

Further, the workpiece 11 is tilted and the punch 13 for forming the tapered hole is damaged.
The inner surface of c is prevented from being damaged. By lowering the upper die set 15 from the state shown in FIG. 4, the tapered portion 13a of the tapered hole forming punch 13 is formed so as to penetrate from the one surface 11a of the workpiece 11 to the other surface 11b. A hole 11c is formed.

Next, in this embodiment, as shown in FIG. 3, the other surface 11 of the workpiece 11 is formed by a tapered hole forming step.
A punch forming step is performed in order to almost remove the bulging portion 11f protruding to the b side. As shown in FIG. 5, the punch forming step includes a punch 23 having a diameter slightly larger than the diameter of the tapered hole 11c on the small diameter side.
Through the workpiece 11 from one surface 11a to the other surface 11b.

After the end of the punch forming step, FIG.
As shown in the figure, the return generated by the punching punch 23 and the bulging portion 11f generated by the tapered hole forming step.
, A slight bulging portion 11h is formed in the tapered hole 11c on the other surface 11b side of the workpiece 11. Next, in this embodiment, the bulging portion 11h protruding from the other surface 11b of the workpiece 11 is crushed, and the bulging portion 11h is crushed.
In order to eliminate, a chamfered part forming step is performed.

This chamfer forming step is performed by inserting and pressing a chamfering punch 25 from the other surface 11b of the workpiece 11 as shown in FIG. That is, a flat portion 25a is formed at the tip of the chamfering punch 25, and a protruding portion 25b is formed to protrude from the flat portion 25a. A chamfered tapered portion 25c is formed between the protruding portion 25b and the flat portion 25a.

The bulging portion 11h protruding from the other surface 11b of the workpiece 11 is pressed by the flat portion 25a and the chamfered tapered portion 25c, thereby forming the chamfered portion 11d shown in FIG. Is molded. The chamfered portion 11
It is desirable that the value of d be as small as possible.
In the above-described method for forming a tapered hole, the tapered hole 11c is formed through the tapered hole forming step from one surface 11a of the workpiece 11 toward the other surface 11b, and then the workpiece 11 is formed by the chamfered part forming step. The bulged portion 11h protruding from the other surface 11b is crushed by inserting and pressing the chamfering punch 25 from the other surface 11b of the workpiece 11 to chamfer the bulged portion 11h on the other surface 11b of the workpiece 11. Since the portion 11d is formed, the tapered hole 11 with high accuracy can be formed only by pressing.
c can be obtained easily and reliably.

The workpiece 1 is formed by a tapered hole forming step.
At least a part of the bulging portion 11f protruding toward the other surface 11b is removed by penetrating the punch 23 from the one surface 11a of the workpiece 11 toward the other surface 11b by a punch forming process. Therefore, before the chamfered part forming step, the other surface 11b of the workpiece 11 is formed.
The amount of the bulging portion 11h protruding to the side of the workpiece 11 can be extremely reduced, and the bulging portion 11h protruding to the other surface 11b side of the workpiece 11 can be reliably formed by the chamfered portion forming step. Can be crushed.

Further, in the above-described method of forming a tapered hole, the pilot hole 11e for the tapered hole 11c is formed in the workpiece 11 in advance before the tapered hole forming step. 11c can be easily formed, and the accuracy of the tapered hole 11c can be increased.

The method of forming a tapered hole according to the present invention is not limited to this embodiment. In some cases, the step of punching the bulging portion 11f using the punch 23 can be omitted. For example, depending on the selection of the thickness of the workpiece 11 or the like, the amount of bulging of the bulging portion 11f formed in the tapered hole forming step may be small. In this case, it is not necessary to punch out the bulged portion 11f using the punching punch 23, and after the tapered hole forming process, without performing the punched-out forming process of the bulged portion 11f, the chamfered portion forming process is performed. You may go.

FIG. 8 shows an optical element 27 manufactured by the method for manufacturing an optical element according to the present invention. The optical element 27 is configured by forming a tapered hole 11c in the workpiece 11 made of a metal plate material such as iron, brass, or copper. The thickness W of the plate is, for example, about 0.5 to 1.5 mm.

The diameter R1 on the large diameter side of the tapered hole 11c
Is, for example, 0.7 mm, and the diameter R2 on the smaller diameter side is, for example, 0.5 mm. And the diameters R1, R2
Is within ± 0.02 mm. Also,
A small chamfered portion 11d is formed on the small diameter side of the tapered hole 11c so as not to affect the performance as the optical element 27.

Since the optical element 27 is manufactured by the same method as the above-described method of forming the tapered hole, a detailed description of the method of manufacturing the optical element will be omitted. This optical element 27
Has been filed by the present applicant as Japanese Patent Application No. 9-61832, and as shown in FIG.
The pumping light 31 from the semiconductor laser 29 is used to efficiently guide the pumping light 31 from the
Is reflected by the tapered hole 11 c and guided to the solid-state laser crystal 33.

Actually, in order to improve the reflectance of the excitation light 31, gold plating is applied to the tapered hole 11c. However, the gold plating is only for improving the reflectance, and the gold plating is performed. Before, the surface roughness of the tapered hole 11c is
For example, it is required that the mirror surface state be within about 0.1 μm in Rmax. In the method for manufacturing an optical element according to this embodiment, similar to the method for forming a tapered hole described above,
After a tapered hole 11c is formed through the tapered hole forming step from one surface 11a of the workpiece 11 toward the other surface 11b, the other surface 11b of the workpiece 11 is formed by a chamfered part forming step.
The protruding portion 11h protruding from the side is
Is pressed and crushed by being inserted and pressed from the other surface 11b side of the workpiece 11 to form a chamfered portion 11 on the other surface 11b side of the workpiece 11.
Since d is formed, the optical element 27 having the highly accurate tapered hole 11c can be easily formed only by pressing.
Can be obtained reliably.

Then, in the taper hole forming step, the taper hole forming punch 13 having the tapered portion 13a polished to a mirror surface.
Is used to form the tapered hole 11c, so that the optical element 27 having the highly accurate mirror-shaped tapered hole 11c is formed.
Can be obtained. In addition, the bulging portion 11 protrudingly formed on the other surface 11b side of the workpiece 11 by the tapered hole forming step.
f is punched by a punching molding process.
Is removed by penetrating from one surface 11a of the workpiece 11 toward the other surface 11b, so that the bulge formed to project toward the other surface 11b of the workpiece 11 before the chamfered part forming step. The amount of the protruding portion 11h can be made very small, and the protruding portion 11h formed to protrude on the other surface 11b side of the workpiece 11 can be reliably crushed by the chamfered portion forming step, An optical element 27 with high accuracy of the tapered hole 11c can be obtained.

Furthermore, since the pilot hole 11e for the tapered hole 11c is formed in the workpiece 11 in advance before the tapered hole forming step, the tapered hole 11c can be easily formed in the tapered hole forming step. It is possible to obtain the optical element 27 with higher accuracy of 11c. In addition, the semiconductor laser 2
An optical element 27 having a tapered hole 11c serving as a reflection surface for guiding the pumping light 31 from 9 to the solid-state laser crystal 33 can be obtained easily and reliably.

[0038]

As described above, in the method for forming a tapered hole according to the first aspect, after the tapered hole is formed from one surface of the workpiece to the other surface in the tapered hole forming step, the chamfered portion is formed. The bulging portion formed on the other side of the workpiece by the forming step is crushed by inserting and pressing a chamfering punch from the other side of the workpiece to the other side of the workpiece. Since the recess is formed, a highly accurate tapered hole can be easily and reliably obtained only by pressing.

In the method of forming a tapered hole according to a second aspect of the present invention, the bulging portion protrudingly formed on the other surface of the workpiece in the tapered hole forming step is formed by punching a punch for punching on one side of the workpiece in the punching step. Therefore, before the chamfered portion forming step, the amount of the bulging portion projecting to the other surface side of the workpiece can be extremely reduced. It is possible to reliably crush the bulging portion projecting from the other surface of the workpiece by the chamfer forming step.

According to the third aspect of the present invention, since the pilot hole for the tapered hole is formed in the workpiece before the tapered hole forming step, the tapered hole can be easily formed in the tapered hole forming step. And the accuracy of the tapered hole can be increased. In the method of manufacturing an optical element according to claim 4, the tapered hole is formed from one surface of the workpiece to the other surface in the tapered hole forming step, and then the other side of the workpiece is formed in the chamfered part forming step. Since the bulging portion formed to protrude from the other side of the workpiece is crushed by inserting and pressing a chamfering punch from the other side of the workpiece, so that a chamfered section is formed on the other side of the workpiece.
An optical element having a highly accurate tapered hole can be easily and reliably obtained only by pressing.

In the tapered hole forming step, the tapered portion 13a is formed into a tapered hole by using a tapered hole forming punch whose surface is polished to a mirror surface. An element can be obtained.
In the method of manufacturing an optical element according to the fifth aspect, the bulging portion protrudingly formed on the other surface side of the workpiece by the tapered hole forming step is formed by punching the punch for punching from one surface of the workpiece to the other surface by the punching molding step. Before the chamfered portion forming step, the amount of the bulging portion formed on the other surface of the workpiece can be greatly reduced before the chamfered portion forming step. In addition, the bulged portion protruding from the other surface of the workpiece can be reliably crushed by the chamfered portion forming step, and an optical element having a highly accurate tapered hole can be obtained.

In the method of manufacturing an optical element according to the sixth aspect, the pilot hole for the tapered hole is previously formed in the workpiece before the tapered hole forming step, so that the tapered hole can be easily formed in the tapered hole forming step. Thus, an optical element having a higher precision of the tapered hole can be obtained. In the method for manufacturing an optical element according to the seventh aspect, an optical element having a tapered hole serving as a reflection surface for guiding excitation light from a semiconductor laser to a solid-state laser crystal can be easily and reliably obtained.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a tapered hole formed by one embodiment of a tapered hole forming method of the present invention.

FIG. 2 is a cross-sectional view showing a pilot hole formed by a taper hole forming method according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a state of a workpiece after a tapered hole forming step according to an embodiment of the tapered hole forming method of the present invention.

FIG. 4 is a cross-sectional view showing a tapered hole forming step of one embodiment of the tapered hole forming method of the present invention.

FIG. 5 is a cross-sectional view showing a punching forming step of the tapered hole forming method according to one embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating a state of a workpiece after a punch forming step of an embodiment of the method of forming a tapered hole according to the present invention.

FIG. 7 is a cross-sectional view showing a chamfered portion forming step of the tapered hole forming method according to one embodiment of the present invention.

FIG. 8 is a cross-sectional view showing an optical element manufactured by one embodiment of the method for manufacturing an optical element of the present invention.

FIG. 9 is a sectional view showing a method of using the optical element of FIG.

FIG. 10 is an explanatory view showing a conventional method for forming a tapered hole.

[Explanation of symbols]

 Reference Signs List 11 Workpiece 11a One surface 11b Other surface 11c Tapered hole 11d Chamfered portion 11e Prepared hole 11f Swelled portion 11h Swelled portion 13 Tapered hole forming punch 13a Tapered portion 23 Punching punch 25 Chamfering punch 27 Optical element

Claims (7)

[Claims] 1. A tapered hole forming step of forming a tapered hole from one surface of a workpiece to another surface using a tapered hole forming punch having a tapered portion, and a tapered hole forming step of forming the tapered portion. A chamfered portion for forming a chamfered portion on the other surface side of the workpiece by squeezing the bulged portion protruding from the other surface side of the workpiece by inserting and pressing a chamfering punch from the other surface side of the workpiece. A method of forming a tapered hole, comprising: a forming step. 2. The method for forming a tapered hole according to claim 1, wherein between the tapered hole forming step and the chamfered part forming step,
A punch forming step of removing a bulge formed by projecting to the other surface side of the workpiece by the tapered hole forming step by penetrating a punch from one surface of the workpiece toward the other surface. A method for forming a tapered hole, comprising: 3. The method of forming a tapered hole according to claim 1, wherein a pilot hole for the tapered hole is formed in advance in the workpiece before the tapered hole forming step. Hole forming method. 4. A tapered hole forming step of forming a mirror-shaped tapered hole from one surface of the workpiece to the other surface using a tapered hole forming punch having a tapered portion polished to a mirror surface, The bulging portion protrudingly formed on the other side of the workpiece is crushed by inserting and pressing a chamfering punch from the other side of the workpiece to form a chamfered part on the other side of the workpiece. A method for manufacturing an optical element, comprising: forming a chamfered portion to be formed. 5. The method of manufacturing an optical element according to claim 4, wherein: between the taper hole forming step and the chamfered part forming step
A punch forming step of removing a bulge formed by projecting to the other surface side of the workpiece by the tapered hole forming step by penetrating a punch from one surface of the workpiece toward the other surface. A method for producing an optical element, comprising: 6. The method for manufacturing an optical element according to claim 4, wherein before the step of forming a tapered hole, a pilot hole for a tapered hole is formed in the workpiece in advance. Device manufacturing method. 7. The method for manufacturing an optical element according to claim 4, wherein the tapered hole is a reflection surface for guiding excitation light from a semiconductor laser to a solid-state laser crystal. A method for manufacturing an optical element.