JPH11149953A - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve reliability in electrical connection between a module and an electronic device under vibration environment by providing a socket connector with a conductive spring part having one end fixed to an engagement part and the other end bonded to a substrate. SOLUTION: A socket contact 11 has one end bonded to a through hole of a substrate 4 through soldering, is provided with a spring part 111 electrically bonded to a conductor pattern on the substrate 4 through it and a slit part 113 engaged with a pin connector by insertion of a module 3 into a plate and electrically connected, and the other end of the spring part 111 is fixed to a connection portion having a root of the slit part 113 by soldering or the like. Therefore, by providing a socket connector 11 with the spring 111, even if relative displacement occurs between the module 2 and the substrate 4 due to vibration, the relative displacement is absorbed by slackening of the spring part 111, and sliding does not occur at a contact part between the socket contact 11 and the pin contact 21.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic apparatus in which a module containing electronic components is mounted at a high density.

[0002]

2. Description of the Related Art For example, in the case of an array antenna device which forms a radar and has a plurality of element antennas, a module corresponding to each element antenna for amplifying a signal received by each element antenna and performing required processing is provided. , It must be mounted at a fixed pitch. The pitch at which each module is mounted is determined by the frequency of radio waves transmitted and received by the array antenna device. In view of the balance, the shape is often elongated vertically in the direction perpendicular to the antenna array surface. On the other hand, since the module has built-in electronic components,
Inspection of individual modules and replacement in the event of a failure are required, and it is required that modules be easily detachable from the array antenna apparatus main body.

FIGS. 14, 15 and 16 show the structure of an electronic device such as a conventional array antenna device. FIG. 14 is a perspective view of a conventional electronic device, FIG. 15 is a sectional view thereof, and FIG. 16 is a sectional view showing details of a connector fitting portion. In the figure, reference numeral 51 designates a housing of an electronic device, a frame attached to a platform 6 of the electronic device, 3 incorporates electronic components,
A plurality of modules each having a pin connector 2 for making an electrical connection with an electronic device main body, 52 holds each module 3 by screw connection, and a plate screw-connected to a frame 51, and 4 holds and fixes the frame 51 And a substrate having a socket connector 1 for making an electrical connection with the module 3. Further, the socket connector 1 and the pin connector 2 are respectively provided with insulators 12 and 22 having electrically insulating properties, and the socket contacts 11 and pin contacts 21 held in the insulators 12 and 22 and having electrical conductivity, respectively. It is composed of Further, the socket contact 11 is
The pin contacts 21 are electrically connected to electronic components in the module 3 by soldering.

In the electronic device configured as described above, each module 3 is electrically connected to the substrate 4 by fitting the pin connector 2 of the module 3 with the socket connector 1 of the substrate held in the electronic device. And signals are exchanged between the individual modules 3 and the electronic device main body. The module 3 that has received the signal performs a predetermined signal processing, thereby performing a predetermined operation as a whole of the electronic device. At this time, the electrical connection between the module 3 and the board 4 is performed by the pin contacts 21 in the pin connector 2 and the socket contacts 11 in the socket connector 1 being fitted and making contact. On the other hand, module 3
Is mechanically held in the electronic device by being fixed to the plate 52 by coupling the screws 71.

[0005]

However, the electronic apparatus configured as described above has the following problems.
For example, when this electronic device is mounted on an aircraft, the electronic device is subjected to severe vibration from the airframe in an operation state, so that strict mass restrictions are imposed on the electronic device mounted on an aircraft, and the housing frame of the electronic device needs to be mounted. It is necessary to reduce the weight. However, when the weight is reduced, there is a limit in increasing the rigidity of the housing frame of the electronic device. Therefore, the housing frame is deformed under the above vibration environment. For example, when vibration is applied to the electronic device shown in FIG. 14, the frame 51 and the plate 52 are deformed. The substrate 4 fixed to the frame 51 by this deformation
For example, when vibration is applied in the longitudinal direction of the module 3 between the module 3 and the module 3 fixed to the plate 52, the vibration is performed in the direction in which the module 3 is inserted and withdrawn, and in the direction perpendicular to the longitudinal direction of the module 3. Is applied, a relative displacement occurs in the direction in which the module 3 falls. Therefore, as shown in FIG. 17, sliding occurs at the contact portion 211 between the pin contact 21 and the socket contact 11. In the case of an aircraft-mounted device, the device is subjected to a vibration environment for thousands of hours during flight until the aircraft reaches the end of its life, and the contact portion 211 is worn by repeated sliding. The sliding wears the surface treatment such as gold plating applied to the pin contact 21 and the socket contact 11 in order to stably perform the electrical connection as described above, and the frictional heat due to the sliding is exposed due to the wear of the contact mother. Oxidizes the material and increases the electrical resistance at the contact contacts. Due to the increase in the resistance of the contact portion, transmission and reception of signals between the module 3 and the substrate 4 cannot be performed normally, which eventually impairs the functions and performance of the entire electronic device. In order to solve such a problem, as shown in FIG. 18, a method of fixing the pin connector 2 and the socket connector 1 to each other with screws 72 to suppress relative displacement has been considered. Due to implementation issues, it is not a good solution. That is, in consideration of the state of attachment of the module 3 to the electronic device, the attachment / detachment operation of the module 3 at the time of maintenance must be performed from the plate 52 side. Because it is located in a recessed place,
Workability such as attachment / detachment of a component and insertion of a tool during access deteriorates. Also, considering access to the screw 72, FIG.
As shown in FIG. 8, the fixing portion of the screw 72 needs to protrude from the outer shape of the module 3, which hinders high-density mounting of the module 3, increases the size of the device, and reduces the space for mounting electronic components of the module 3. Become.

The present invention has been made to solve such a problem, and an object of the present invention is to improve the reliability of electrical connection between a module and an electronic device body under a vibration environment. To provide electronic equipment.

[0007]

According to a first aspect of the present invention, there is provided an electronic apparatus including a plurality of modules each having a built-in electronic component and having a pin connector for making an electrical connection, and each of the modules being inserted thereinto. A plurality of socket connectors electrically connected to each other, and a board electrically connected to the socket connector, wherein the socket connector is fitted with the pin connector when the module is inserted, and is inserted into and removed from the module. A movable conductive fitting portion, a conductive spring portion having one end fixed to the fitting portion and the other end bonded to the substrate, and the fitting portion fixed to the substrate when the module is inserted or removed; Has an insulating stopper with which it comes into contact.

[0008] An electronic apparatus according to a second aspect of the present invention includes a plurality of modules each having a built-in electronic component and having a pin connector for electrical connection, and the respective modules are inserted and electrically connected to the modules. A plurality of socket connectors, and a board electrically connected to the socket connector, wherein the socket connector includes a conductive fitting member that fits with the pin connector when the module is inserted; An insulating member that holds the module and is movable in the insertion and removal direction of the module, a flexible board having one end connected to the fitting member and the other end connected to the board, and the insulation when being fixed to the board and inserting and removing the module. It has an insulating stopper with which the member contacts.

An electronic apparatus according to a third aspect of the present invention includes a plurality of modules having a built-in electronic component and having a pin connector for making an electrical connection, and each of the modules is inserted and electrically connected to the module. A plurality of socket connectors, and a board electrically connected to the socket connector, wherein the socket connector includes a conductive fitting member that fits with the pin connector when the module is inserted; An insulating member that holds the module and is movable in the insertion / removal direction of the module, a lead wire having one end connected to the fitting member and the other end connected to the substrate and having a spring property, and an insertion / removal of the module fixed to the substrate. Sometimes it has an insulating stopper with which the insulating member comes into contact.

According to a fourth aspect of the present invention, in the electronic device, the floating portion has a claw-shaped grip portion, and the module has a projection fitted to the grip portion.

According to a fifth aspect of the present invention, in the electronic device, the floating portion has a slotted pin hole, and the module has a press-fit pin fitted into the pin hole.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a diagram showing a first embodiment of the present invention. The figure shows only the socket connector portion of the electronic device according to the present invention,
Substrate 4, frame 51 in the electronic device of module 3,
The holding method for the plate 52 and the configuration of the module 3 and the pin connector 2 attached to the module 3 are the same as those in the conventional example. In the drawing, reference numeral 11 denotes a spring portion 111 having one end joined to a through hole of the substrate 4 by soldering, and a spring portion 111 electrically connected to a conductor pattern on the substrate 4 through the through hole, and a plate 11 of the module 3 to the plate 52. A slot portion 113 which is fitted and electrically connected to the pin connector 2 by insertion, and the other end of the spring portion 111 is connected to the slot portion 1
13 is a socket contact fixed by soldering, welding, or the like to a connection portion 128 (a rectangular cross section of the socket contact 11 shown in FIG. 1) provided at the base of the socket 13. Numeral 12 includes the socket contact 11 and has insulation properties. It is an insulator having. The insulator 12 does not restrict the fitting portion of the socket contact 11 with the pin contact 21, and has a shape such that it can move up and down between the upper shoulder 126 and the lower shoulder 127 by the elasticity of the spring portion 111. The shoulder 126 and the lower shoulder 127 function as stoppers for restricting the vertical movement of the connecting portion 128 of the slot 13 of the socket contact 11. Upper shoulder 126
And the position of the lower shoulder 127 are such that the vertical movable range of the socket contact 11 at the time of insertion and extraction is within the elastic deformation range of the spring portion 111, and the socket contact 11 with respect to the insulator 12 is generated by the vibration of the module 3 under the vibration environment. By relative change, the socket contact 11
Of the upper shoulder 126 and the lower shoulder 127 do not interfere with each other. For example, the length between the upper shoulder 126 and the lower shoulder 127 is larger than twice the amplitude of the relative displacement due to the vibration.

As described below, the electronic device configured as described above prevents the occurrence of sliding at the contact portion between the socket contact 11 and the pin contact 21 even under a vibration environment, and improves the reliability of the device. . FIG. 2 shows the behavior of the connector section under a vibration environment. As shown in FIG. 2, by providing the spring portion 111 on the socket contact 11, even if a relative displacement occurs between the module 3 and the substrate 4 due to vibration, the spring portion 111 bends to absorb the relative displacement, and No sliding occurs at the contact portion between the contact 11 and the pin contact 21. At this time, a slit portion 113 for fitting with the pin contact 21 and a spring portion 11 for absorbing relative displacement between the module 3 and the substrate 4 are provided.
The shape of No. 1 increases the rigidity of the slit 113 and the spring 11
1 is set to be low, and the shape is determined so that the frictional force at the contact portion between the pin contact 21 and the slit portion 113 is larger than the elastic force of the spring portion 111. In addition, the material of the socket contact 11 and the shape of the spring portion 111 are such that the maximum stress generated in the spring portion 111 due to the vertical movement of the socket contact 111 generated under a vibration environment causes electronic devices to avoid breaking at the spring portion. The fatigue strength is set to be equal to or less than the number of repetitions of the up-and-down motion that occurs until the end of the life. On the other hand, (a), (b),
(C) shows the change of the connector portion when the module 3 is mounted in order. In (a), the socket contact 11 and the pin contact 21 first contact each other and start pushing the socket contact 11, and the spring portion 111 bends until the socket contact 11 hits the lower shoulder 127 of the insulator 12 (b). Contact 2
By inserting 1, the socket connector 11 is fitted, and finally the state shown in (c) is reached, and the mounting of the module 3 is completed. Further, when the module 3 is removed, the socket contact 11 is bent until it hits the upper shoulder 126 of the insulator 12, contrary to the mounting, and then the pin contact 2 is removed.
1 is removed, and the connection portion between the spring portion 111 and the slit portion 113 of the socket contact 11 is changed to the upper shoulder portion 12.
The spring returns to a substantially center position between the lower shoulder 6 and the lower shoulder 127. As described above, the upper and lower contact surfaces of the insulator 12 with the socket contact 11 and the positions of the upper shoulder portion 126 and the lower shoulder portion 127 are set so that the deformation of the spring portion 111 is within the elastic deformation range. Even when the spring portion 111 is provided, the socket connector 11 is not damaged when the module 3 is inserted and removed. Also,
Since the elastic force of the spring portion 111 is also set relatively weak, the elastic force of the spring portion 111 does not significantly change due to long-term vibration.

By providing the spring portion 111 on the socket contact 11 as described above, the occurrence of sliding at the contact portion between the socket contact 11 and the pin contact 21 in a vibration environment is prevented, and the reliability of the electronic device is improved. .

The fixing of the spring portion 111 to the substrate 4 may be performed by a method other than bonding to the through hole of the substrate 4. For example, the terminal plate may be screw-connected so as to be electrically connected to the wiring pattern on the substrate 4, and the screw portion 111 may be fixed to the terminal plate by soldering or welding.

Embodiment 2 FIG. 4 is a diagram showing a second embodiment of the present invention. The figure shows only the connector portion of the electronic device according to the present invention. The method of holding the board 4 and the module 3 in the electronic device and the configuration of the pin connector 2 attached to the module 3 are the same as those in the conventional example. . In the present invention, the socket connector 1 is divided into a floating part 121 and a fixed part 122. Floating part 121
Is composed of an insulating insulator and a socket contact held inside the insulator, and the socket contact is electrically connected to a pin contact of a module to be fitted. Also, the fixing part 122
Is fixed to the substrate 4 via an insulating insulator,
Inside the insulator, there is a conductor pattern electrically connected to the conductor pattern of the substrate 4. A socket contact in the floating portion 121;
The internal conductor patterns are electrically connected to each other through a flexible board 13 soldered to each of them, and signals from the module are transmitted to the pin connector, the floating section 121 of the socket connector 1, the flexible board 13, and the fixed section 1.
It is sent to the substrate 4 via 22. Note that the floating portion 121 is not mechanically fixed, and the upper shoulder portion 126 and the lower shoulder portion 127 of the fixed portion 122 are fixed so that interference does not occur due to relative displacement of the floating portion 121 with respect to the fixed portion 122 in a vibration environment. It is configured to be able to move up and down. The positions of the upper shoulder 126 and the lower shoulder 127 of the fixing part 122 are different from those of the floating part 12.
It is determined so that no stress is generated in the flexible substrate 13 when the movable member 1 moves.

The electronic device configured as described above prevents the occurrence of sliding at the connector fitting portion under a vibration environment as described below, and improves the reliability of the device. FIG.
Figure 9 shows the behavior of the connector under vibration environment. As shown in FIG. 5, the socket connector is divided into a floating portion 121 and a fixed portion 122, and both are connected by a flexible substrate 13, so that even if a relative displacement occurs between the module 3 and the substrate 4 due to vibration, Is bent,
The floating portion 121 follows the pin connector 2 to absorb the relative displacement, and no sliding occurs at the fitting portion. At this time, in order to minimize the stress generated in the flexible substrate 13 due to the vertical movement of the floating portion 121, the flexible substrate 13 should have an extra length within the allowable range for mounting. On the other hand, when the module 3 is attached or detached, the floating portion 121 contacts the upper shoulder portion 126 and the lower shoulder portion 127 of the fixing portion 122, and the flexible substrate 13 is not damaged.

As described above, the socket connector is divided into the floating portion 121 and the fixed portion 122, and the two are connected by the flexible substrate 13, so that the sliding at the connector fitting portion under the vibration environment can be prevented. Improve the reliability of electronic devices.

Embodiment 3 FIG. 6 is a view showing a third embodiment of the present invention, and is a cross-sectional view of a connector portion of an electronic device according to the present invention. The configuration of the pin connector 2 is the same as that of the conventional example. In the present invention, the socket connector 1 includes the floating portion 121 and the fixed portion 1.
22, the socket contact 11 held in the floating portion 121 has a resilient lead portion 112 as shown in the figure, and the lead portion 112 is connected to the substrate 4 without passing through the fixing portion 122. . Note that the floating portion 121 is held only by the lead portion 112, and is configured to be able to move up and down within a range in which the fixed portion 122 is restricted by bending the lead portion 112. The shape of the fixed portion 122 is determined such that the movable range of the floating portion 121 is within the elastic deformation range of the lead portion 112.

The electronic device constructed as described above has the pin connector 2 and the floating portion 12 in a vibration environment.
1 prevents the occurrence of sliding at the fitting portion and improves the reliability of the device. FIG. 7 shows the behavior of the connector section under a vibration environment. As shown in FIG. 7, by providing the lead portion 112 having a spring property to the socket contact 11, even if a relative displacement occurs between the module 3 and the substrate 4 due to vibration, the relative displacement is caused by the lead portion 112 bending. As a result, no sliding occurs at the fitting portion between the pin connector 2 and the floating portion 121. At this time, it is necessary to determine the shape of the lead portion 121 so that the fitting force between the pin connector 2 and the floating portion 121 is larger than the elastic force of the lead portion 112. In addition, the material of the socket contact 11 and the shape of the lead portion 112 are such that the maximum stress generated in the lead portion 112 due to the vertical movement of the floating portion 121 generated in a vibration environment causes electronic devices to avoid breakage at the lead portion. It is necessary to set the fatigue strength to be equal to or less than the fatigue strength with respect to the number of repetitions of the up-and-down motion generated until the life is extended. On the other hand, FIGS. 8A, 8B, and 8C sequentially show changes in the connector portion when the module 3 is mounted on the electronic device body. (A) at socket contact 1
1 and the pin contact 21 first contact each other to start pushing the floating portion 121, the lead portion 112 bends until the floating portion 121 hits the fixed portion 122 (b), and the socket contact 11 is inserted by further inserting the pin contact 21. Are fitted to each other, and finally the state of (c) is reached, and the mounting of the module 3 is completed. When the module 3 is removed, the lead portion 112 is bent until the floating portion 121 contacts the fixing portion 122 in the direction opposite to the mounting direction, and then the pin contact 21 is removed. By setting the contact surfaces of the fixed portion 122 above and below the floating portion 121 so that the deformation of the lead portion 112 is within the elastic deformation range, the lead portion 112 is not damaged when the module 3 is inserted or removed.

As described above, the socket connector is divided into the floating portion 121 and the fixed portion 122, and the connecting portion between the floating portion 121 and the substrate 4 of the electronic device main body is provided with the lead portion 112 having a spring property, thereby providing a vibration environment. Prevents sliding at the connector fitting part below,
Improve the reliability of electronic devices.

Embodiment 4 FIG. 9 is a diagram showing a fourth embodiment of the present invention. In the figure, the configuration is the same as that of the second embodiment except that a claw 123 is provided on the floating portion 121 and a step 221 is provided on the pin connector 2, and the claw 123 is hooked on the step 221 when the connector is fitted.

In the second embodiment, the flexible substrate 1
3 has been described, the floating portion 121 follows the pin connector 2 to prevent sliding in a vibration environment. In this case, the pin contact in the pin connector 2 and the socket contact in the floating portion 121 are prevented. The floating portion 121 is caused to follow the pin connector 2 only by the fitting force of the floating portion 121. When excessive vibration acceleration is applied to the floating portion 121 and a force greater than the fitting force is generated, sliding may occur at the fitting portion. There is.
Therefore, in the present embodiment, the claw 1 of the floating portion 121 is
23 is hooked on the step 221 of the pin connector 2 to increase the fitting force between the connectors and further improve the reliability of the electronic device. As shown in FIG. 10, when the module 3 is attached or detached, the claw 123 is bent by pulling out the module 3 with a force equal to or more than a predetermined amount to release the module 3 from being caught on the step 221. The shapes of the nail 123 and the step 221 are determined.

Embodiment 5 11 and 12 show a fifth embodiment of the present invention. FIG. 11 shows module 3
FIG. 12 is a perspective view of the connector before mounting, and FIG. 12 is a cross-sectional view of the connector when the module 3 is mounted. The pin connector 2 is provided with a press-fit pin 23, and the floating portion 121 is provided with a pin hole 124.
The configuration is the same as that of the second embodiment except that 3 is fitted into the pin hole 124.

Similar to the effect of the fourth embodiment, the press-fit pin 23 of the pin connector 2 is fitted into the pin hole 124 of the floating portion 121 to increase the fitting force between the connectors.
Further improve the reliability of electronic devices. The fitting force between the connectors is increased by increasing the shape of the distal end of the press-fit pin 23 as shown in the figure and providing a hook at the pin hole 124. A notch 125 is provided in the pin hole 124 so that the diameter of the pin hole increases when the press-fit pin 23 is inserted as shown in FIG.
3 can be easily inserted and removed, and the detachability of the module 3 is ensured.

[0026]

Since the present invention is configured as described above, it has the following effects.

According to the first aspect of the invention, by providing the socket connector with the spring portion, the occurrence of sliding at the fitting portion between the socket connector and the pin connector in a vibration environment is prevented, and the reliability of the electronic device is improved. Improve.

According to the second aspect of the present invention, the socket connector is divided into a floating portion and a fixed portion, and the floating portion and the board are connected by the flexible board. And improve the reliability of electronic devices.

According to the third aspect, the socket connector is divided into the floating portion and the fixed portion, and the connection portion between the floating portion and the substrate is provided with a resilient lead portion. The sliding at the joint is prevented from occurring, and the reliability of the electronic device is improved.

According to the fourth aspect, the grip portion provided on the floating portion of the socket connector is hooked on the pin connector, thereby further improving the reliability of the electronic device in a vibration environment.

According to the fifth aspect, the press-fit pin provided on the pin connector is fitted into the slotted pin hole provided on the socket connector, thereby further improving the reliability of the electronic device in a vibration environment. Let it.

[Brief description of the drawings]

FIG. 1 is a sectional view of a connector according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a behavior of the connector section under a vibration environment according to the first embodiment of the present invention.

FIG. 3 is a diagram showing a change at the time of fitting of the connector portion according to the first embodiment of the present invention.

FIG. 4 is a sectional view of a connector according to a second embodiment of the present invention.

FIG. 5 is a diagram showing a behavior of a connector section under a vibration environment according to a second embodiment of the present invention.

FIG. 6 is a sectional view of a connector according to a third embodiment of the present invention.

FIG. 7 is a diagram showing a behavior of a connector section in a vibration environment according to a third embodiment of the present invention.

FIG. 8 is a diagram showing a change at the time of fitting of a connector portion according to a third embodiment of the present invention.

FIG. 9 is a sectional view of a connector part according to a fourth embodiment of the present invention.

FIG. 10 is a cross-sectional view at the time of attachment / detachment of a connector according to a fourth embodiment of the present invention.

FIG. 11 is a perspective view of a module part according to a fifth embodiment of the present invention before fitting.

FIG. 12 is a sectional view of a connector part according to a fifth embodiment of the present invention.

FIG. 13 is a diagram showing a change in a pin hole when a module is fitted in a fifth embodiment according to the present invention.

FIG. 14 is a perspective view of a conventional electronic device.

FIG. 15 is a cross-sectional view of a conventional electronic device.

FIG. 16 is a cross-sectional view of a connector section in a conventional electronic device.

FIG. 17 is a diagram illustrating a behavior of a connector section in a vibration environment in a conventional electronic device.

FIG. 18 is a view of a connector section in a conventional electronic device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Socket connector, 2 pin connector, 3 modules, 4 boards, 6 platforms, 11 socket contacts, 12 insulators, 13 flexible boards, 21 socket contacts, 22 insulators, 23 press-fit pins, 51 frames, 52 plates, 71 screws, 72 screws , 111 spring part, 112
Lead part, 113 slot part, 121 floating part, 122 fixing part, 123 nail, 124 pin hole,
125 Notch, 126 Upper shoulder, 127 Lower shoulder, 128 Connection, 211 Contact, 221 Step.

Claims (5)

[Claims] 1. A plurality of modules each having a built-in electronic component and having a pin connector for electrical connection, a plurality of socket connectors into which the respective modules are inserted and electrically connected to the modules, and the socket A board electrically connected to the connector, wherein the socket connector is a conductive fitting portion that fits with the pin connector when the module is inserted and is movable in the insertion / removal direction of the module; A conductive spring portion fixed to the fitting portion and the other end bonded to the substrate; and an insulating stopper fixed to the substrate and contacting the fitting portion when the module is inserted and removed. And electronic equipment. 2. A plurality of modules each having a built-in electronic component and having a pin connector for electrical connection, a plurality of socket connectors into which the respective modules are inserted and electrically connected to the modules, and the socket. A socket electrically connected to the connector, wherein the socket connector has a conductive fitting member that fits with the pin connector when the module is inserted, and a module insertion / removal direction that holds the fitting member. A flexible substrate having one end connected to the fitting member and the other end connected to the substrate, and an insulating stopper fixed to the substrate and contacting the insulating member when the module is inserted or removed. An electronic device comprising: 3. A plurality of modules each having a built-in electronic component and having a pin connector for electrical connection, a plurality of socket connectors into which the respective modules are inserted and electrically connected to the modules, and the socket. A socket electrically connected to the connector, wherein the socket connector has a conductive fitting member that fits with the pin connector when the module is inserted, and a module insertion / removal direction that holds the fitting member. An insulating member that is movable to the other end; a resilient lead wire having one end connected to the fitting member and the other end connected to the substrate; and an insulating member fixed to the substrate and in contact with the insulating member when the module is inserted and removed. An electronic device, comprising: an electronic stopper. 4. The electronic device according to claim 2, wherein the floating portion has a claw-shaped grip portion, and the module has a protrusion fitted to the grip portion. 5. The floating portion has a slotted pin hole, and the module has a press-fit pin fitted into the pin hole.
Electronic device as described.