* ,/-PA 36190twf.doc/n 六、^明說明： 【發明所屬之技術領域】 本發明是有關於一種連接器’且特別是有關於一種可 減少串音的連接器。 【先前技術】 為增加電子系統的可靠度，通常是將電子模組利用連 接器（Connector)以連接彼此間的訊號傳遞，進而形成一個 電子系統。這種作法有助於提升整個電子系統生產時的良 率，且可對電子系統後續的維修保養或次系統的升級及更 新提供便利性。 用來連接1C封裝(ic Package)模組與電路板(PCB)的 連接器(Connector)又稱為插座(Socket)。一般而言，插座的 用途"T刀為一類·（1)作為1C封裝的「預燒」（Burn-In)測 試用；（2)作為1C封的電路「測試」（Testing)用；（3)作為 1C封裝終端「產品」（pr〇ducti〇n)的「插座」。 以作為ic封裝終端產品的插座為例說明，IC封裝用 的插座通常用於傳送高速數位訊號，且隨著傳送的數位訊 號量需求愈來愈大，因此對插座的高速傳輸品質要求也更 為嚴格。伴隨著電子零組件尺寸愈趨小型化的設計趨勢 下’使得1C封裝的插座内的各訊號端子的設置距離更為接 近，而訊號端子的距離過於接近使得各訊號通路的雜訊干 擾更嚴重，影響高速訊號傳遞的完整性。為提升日益微型 化的1C封裝終端產品性能及連接器的傳輸能力，「串音」 201225428 ------./-PA 36190twf.doc/n (Crosstalk)的抑制有其必要性。 【發明内容】 本發明提供一種可以減少串音的連接器。 本發明提出一種電連接於一電子零件以及一電路板 之間的連接器，此連接器包括一絕緣本體、一導電端子陣 列以及多個遮蔽導體片。絕緣本體設置於電路板上，其具 φ 有相對遠離電路板的一第一表面以及相對鄰近電路板的一 第一表面。導電端子陣列設置於絕緣本體，且導電端子陣 列具有多個導電端子，其中每一導電端子具有一第一末 ，。、一第二末端以及連接於第一末端及第二末端之間的一 =號傳導部，這些第—末端突出於第—表面，而第二末端 :出於第二表面並與電路板的多個接點接觸，而訊號傳導 Z的軸向互相平行並與第一表面夾一角度。遮蔽導體片對 也插置於導電端子陣列，其中每一遮蔽導體片具有一本 ，以及一蜂巢式開孔，且遮蔽導體片的法線方向與訊號傳 • #部的轴向互相垂直。 在本發明之連接器的一實施例中，上述之導電端子的 訊說傳導部呈柱狀。 = 在本發明之連接器的一實施例中，上述之導電端子的 訊銳傳導部是由多個導電串珠串連而成。 在本發明之連接器的一實施例中，上述之角度的範圍 ;丨於45度至90度。 在本發明之連接器的一實施例中，上述之蜂巢式開孔 201225428 〇 ------./-PA 36190twf.doc/n 具有多個開孔，且開孔於本體均勻地分布。此外，這些開 孔可位於本體的邊緣。 在本發明之連接器的一實施例中，更包括設置於絕緣 本體上的一導體框架，此導體框架具有多個貫孔，而電子 零件的導電端子適於穿設於貫孔，以與導電端子的第一末 端接觸。絕緣本體可具有彈性，而電子零件施予一正向力 於第一末端時’絕緣本體受力變形，電子零件的導電端子 摩擦第一末端。此外’導體框架更具有凸伸於其中幾個貫 孔内的多個接地端，且接地端並與同時設置於同一貫孔内 的電子零件的接地導電端子接觸。 棊於上述’於本發明之連接器中，將遮蔽導體片傾斜 地設置於絕緣本體中，以將兩相鄰的行（或列）的導電端子 隔開，如此可以達到減少串音，增進訊號傳遞的完整性。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實雒方式】 圖1為本發明一實施例之連接器電連接於電子零件及 電路板之間的示意圖。請參考圖卜本實施例之連接器⑽ 用於將一電子零件以及—電路板300電連接在一起。 圖2為連接器的立體示意圖、圖3為圖上之連接器的剖視 圖’巧圖4為將圖1之連接器的絕緣本體透明化的示意圖， 且在圖2 3 4中，因應圖示能夠清楚地表現本實施例之 特徵的需求’對應地*出或省略電路板及電子零件的部 201225428r ττ-ΡΑ 36190twf.doc/n 件。請同時參考圖2、圖3及圖4，連接器loo包括一絕緣 本體110、一導電端子陣列以及多個遮蔽導體片13〇。絕緣 本體110設置於電路板300上，其具有相對遠離電路板30〇 的一第一表面112以及相對鄰近電路板3〇〇的一第二表面 114。導電端子陣列設置於絕緣本體11〇，且導電端子陣列 具有多個導電端子120，其中每一導電端子12〇具有一第 一末端122、一第二末端124以及連接於第一末端122及 第二末端124之間的一訊號傳導部126,這些第一末端122 突出於第一表面112,而第二末端124突出於第二表面114 並與電路板300的多個接點302接觸，而訊號傳導部126 的軸向A互相平行並與第一表面112夾一角度0，且此角 度Θ的範圍介於45度至90度。遮蔽導體片130對應地插置 於導電端子陣列，其中每一遮蔽導體片13〇具有一本體132 ，及一蜂巢式開孔’且遮蔽導體片13〇的法線方向N與訊 號傳導部的軸向A互相垂直。藉由將遮蔽導體片13〇對應 插置於導電端子陣列，遮蔽導體片130可以作為抑制雜訊 • 干擾的屏蔽，減少連接器100的串音現象。 詳細而言’本實施例之導電端子120的訊號傳導部126 呈柱狀，且導電端子120是以其訊號傳導部126的軸向A 互相平行的形式排成—個陣列，而每一個導電端子12〇的 訊號傳導部126的軸向A與第一表面112所夾的角度為0。 本發明並未限定訊號傳導部以的形式需為柱狀體，在其 他未，示的實施例中，導電端子12G的訊號傳導部 126也 可以疋由夕個導電串珠串連而成。訊號傳導部的形式 36190twf.doc/n 201225428 可依照實際需求而定。 柃外，在同一排的導電端子120的兩侧插置有兩片遮 蔽導韙片130,換言之沿著排列方向，遮蔽導體片130與 成排的導電端子120是交錯排列，但在最後一排的導電端 子120之外，仍會設置有遮蔽導體片130，以達到各訊號 傳輸結構一致性，使各訊號導體的阻抗值相同，並可防止 產生電磁干擾的問題。而本實施例所指之遮蔽導體片130 的蜂巢式開孔是由多個開孔134分布於本體132，以形成 如圖4之狀似蜂巢貌的多孔式結構。這些開孔134可以是 任意排列’也可以是以對稱的形式均勻地分布於本體 132。牝處的對稱是指任兩相鄰的開孔134的中心連線距離 與其他任意兩相鄰的開孔的中心連線距離相同，例如圖5 的三個開孔134a、134b、134c的中心連線距離dl、d2及 d3皆相同。另外，平行設置的各個遮蔽導體片13〇所具有 的開孔134與另一遮蔽導體片13〇的開孔134的形狀、尺 寸及位置可以是互相對應，如此可達到較各個遮蔽導體片 130的開孔134的形狀、尺寸及位置亂數設定更佳的遮蔽 效果。附帶一提，開孔134的形狀可以是圓形、橢圓形、 矩形、其他多邊形或是如圖6示之開孔134的形狀，本發 明並未對開孔134的形狀加以限制。更甚者，開孔134也 可以是位於本體132的邊緣，如圖7所示。 接著請繼續參考圖2、圖3及圖4，連接器1〇〇更包 括設置於絕緣本體11〇上的一導體框架14〇，此導體框架 140具有多個貫孔142，而電子零件2〇〇的導電端子21〇 201225428 …"-pA 36190twf.doc/n 適於穿過貫孔142以與導電端子120的第一末端122接觸。 以下將簡介本實施例之連接器100的形成方法。 將多個導電端子120擺放於一模具框架之中，並且使 ’導電端子120傾斜一角度排列，其中使導電端子120傾斜 一角度的方式可以是用機械手臂挟持這些導電端子12〇, 或是使用錯置的磁鐵分別吸附導電端子120的第一末端 122及第二末端124側，以使導電端子120傾斜一角度θ。 由上述可知，使導電端子120傾斜一角度Θ排列的方式有 多種，依照實際的需求決定，並不以本實施例為限制。接 著’將遮蔽導體片130以平行於訊號傳導部126的軸向A 的方式與成排的導電端子120父錯排列，並使每一成排的 導電端子120的兩侧皆設置有遮蔽導體片130。然後，將 用以形成絕緣本體110的絕緣材料注入模具框架之中，並 使絕緣材料固定成形’讓導電端子120及遮蔽導體片13〇 固定於絕緣本體110中。 特別的是’遮蔽導體片130所具有的蜂巢式開孔，可 • 以增加絕緣材料成形時的接觸面積，讓遮蔽導體片130可 以良好地與絕緣本體110附著在一起，增加穩固性。 之後，再將導體框架140裝設於絕緣本體11〇上，其 中導體框架140的貫孔142暴露出導電端子120的第一末 端122。附帶一提，遮蔽導體片130可更突出於絕緣本體 110的第一表面112 ’以接觸導體框架14〇。 當使用本實施例之連接器1〇〇時，是將連接器1〇〇固 定在電路板300上，其中導電端子12〇的第二末端124接 v-PA 36190twf.doc/n 201225428 觸電辂板300的接點302。特別的是，在將電子零件200 接合於連接器100時，電子零件200的導電端子210穿過 導體框架140的貫孔142以與第一末端122接觸，同時電 子零件200會施以一正向力於絕緣本體110，此正向力會 促使絕緣本體110變形，讓設置在絕緣本體110内的導電 端子,120的第一末端122隨著絕緣本體110的變形而產生 相對於導電端子210的移動，如圖8示，且在施予連接器 100的正向力解除後’絕緣本體110會恢復成原本的形狀， 同樣帶動導電端子120的第一末端122回復至原位。藉由 第一末端122相對於設置於其上的導電端子21〇移動時發 生的摩擦’可以將形成於第一末端122或導電端子21〇之 表面的氧化物400摩擦以除去，進而達到使第一末端122 及導霄端子210良好電性連接的效果。 圖9為習知的連接器中並未設置有遮蔽導體片的串音 現象的示意圖，而圖10為本實施例連接器的串音現象的示 意圖。比較圖9及圖1〇，可以發現本實施例之連接器1〇〇 可以較習知的連接器確實地減少7〇%的串音，進而達到高 速且i確地傳遞訊號的效果。 圖11為導體框架的示意圖。導體框架14〇更具有凸 伸於其中幾個貫孔142内的多個接地端144,且接地端144 用以在電子零件200裝設於連接器100時，讓電子零件2〇〇 之作為接地腳位用的導電端子21〇接觸接地端144，進而 形成一個接地系統。本實施例之接地端144可以依照電子 零件200的接地腳位的設置位置來決定。圖12及圖13為 201225428 * tV-PA 36190twf.doc/n 電子零件200的訊號腳位及接地腳位的不同配置方式。請 同時參考圖U、12及13，導體框架14〇的接地端144即 是對應電子零件200的接地腳位22〇設置，且接地端144 須避免與汛號腳位230對應設置。接地端144的設置位置 可以依照電子零件200的接地腳位的設置位置而變化，增 加了設計便利性。 曰 综上所述，使用本發明之連接器至少具有下列優點： 一、 連接益的遮蔽導體片作為抑制雜訊干擾的屏蔽， 減少連接器的串音現象，達到訊號高速且正確地傳遞的目 的。 二、 遮蔽導體片的蜂巢式開孔增加了絕緣本體與遮蔽 導體片的接觸面積，提升附著性，讓遮蔽導體穩固地設置 於絕緣本體内。 一、電子零件組裝於連接器時，電子零件施予絕緣本 體的正向力，造成絕緣本體的變形，進而讓電子零件的導 電端子與導電端子的第-末端產生摩擦並可同時移除其上 • 的氧化物，提升電子零件的導電端子與導電端子的第二末 端的電連接效果。 四、導體框架的接地端可因應電子零件的接地腳位設 置’具有設計便利性。 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明，任何所屬技術領域中具有通常知識者，在不脫離 本發明之精神和範圍内，當可作些許之更動與潤飾，故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。 36l90twf.doc/n 201225428ρδ »/"ΡΑ 【圖式簡單說明】 圖1為本發明一實施例之連接器電連接於電子零件及 電路板之間的示意圖。 圖2為連接器的立體示意圖。 圖3為圖1之連接器的剖視圖。 圖4為將圖1之連接器的絕緣本體透明化的示意圓。 圖5為遮蔽導體片的示意圖。 ffl 6為遮蔽導體片之開孔為另一種形狀的示意圖。 圖7為遮敝導體片之開孔設置於本體邊緣的示意圖。 圖8為電子零件接合於連接器時，電子零件對絕緣本 體施0正向力且使絕緣本體變形的示意圖。 圖9為習知的連接器中並未設置有遮蔽導體片的串音 現象的示意圖。 圖10為本實施例連接器的串音現象的示意圖。 圖11為導體框架的示意圖。 圖12及圖13為電子零件的訊號腳位及接地腳位的不 同配釁方式。 ί 【主要元件符號說明】 100 :連接器 no :絕緣本體 112 .第一表面 114 ·第二表面 120、210 :導電端子 12 201225428 v^-PA 36190twf.doc/n 122 :第一末端 124 :第二末端 126 :訊號傳導部 130 :遮蔽導體片 132 :本體 134、134a、134b、134c :開孔 140 :導體框架 142 :貫孔 144 :接地端 200 :電子零件 300 :電路板 302 :接點 400 :氧化物 Θ :角度 A :轴向 N :法線方向 dl、d2、d3 :中心連線距離 13*, /-PA 36190twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a connector' and particularly to a connector capable of reducing crosstalk. [Prior Art] In order to increase the reliability of an electronic system, an electronic module is usually connected by a connector to connect signals to each other to form an electronic system. This approach helps to increase the yield of the entire electronic system and facilitates subsequent maintenance or upgrades and updates to the electronic system. The connector used to connect the 1C package (ic package) module to the circuit board (PCB) is also called a socket. In general, the purpose of the socket is "T-knife" (1) for the "Burn-In" test of the 1C package; (2) for the 1C circuit "Testing"; 3) As the "socket" of the 1C package terminal "product" (pr〇ducti〇n). Taking the socket as the ic package terminal product as an example, the socket for IC package is usually used for transmitting high-speed digital signals, and as the number of digital signals transmitted is increasing, the high-speed transmission quality of the socket is also required. strict. With the trend toward smaller miniaturization of electronic components, 'the distance between the signal terminals in the socket of the 1C package is closer, and the distance between the signal terminals is too close, so that the noise interference of each signal channel is more serious. Affect the integrity of high-speed signal transmission. In order to improve the performance of the increasingly miniaturized 1C package terminal products and the transmission capability of the connector, the suppression of "crosstalk" 201225428 ------./-PA 36190twf.doc/n (Crosstalk) is necessary. SUMMARY OF THE INVENTION The present invention provides a connector that can reduce crosstalk. The present invention provides a connector electrically connected between an electronic component and a circuit board. The connector includes an insulative housing, an array of conductive terminals, and a plurality of shielded conductor segments. The insulative housing is disposed on the circuit board and has a first surface that is relatively far from the circuit board and a first surface that is adjacent to the circuit board. The array of conductive terminals is disposed on the insulative housing, and the array of conductive terminals has a plurality of conductive terminals, wherein each of the conductive terminals has a first end. a second end and a =-conducting portion connected between the first end and the second end, the first ends protruding from the first surface, and the second end: being from the second surface and being more than the circuit board The contacts are in contact, and the axial directions of the signal conduction Z are parallel to each other and at an angle to the first surface. The pair of shielding conductor pieces are also inserted in the array of conductive terminals, wherein each of the shielding conductor pieces has a book and a honeycomb opening, and the normal direction of the shielding conductor piece is perpendicular to the axial direction of the signal transmission portion. In an embodiment of the connector of the present invention, the conductive conducting portion of the conductive terminal is columnar. In an embodiment of the connector of the present invention, the abrupt conductive portion of the conductive terminal is formed by connecting a plurality of conductive beads in series. In an embodiment of the connector of the present invention, the range of angles described above is between 45 and 90 degrees. In an embodiment of the connector of the present invention, the honeycomb opening 201225428 ------ ------./-PA 36190twf.doc/n has a plurality of openings, and the openings are evenly distributed on the body. In addition, these openings can be located at the edge of the body. In an embodiment of the connector of the present invention, a conductor frame disposed on the insulative housing has a plurality of through holes, and the conductive terminals of the electronic component are adapted to pass through the through holes for conducting The first end of the terminal is in contact. The insulative body may have elasticity, and when the electronic component is applied with a positive force to the first end, the insulative body is deformed by force, and the conductive terminal of the electronic component rubs against the first end. In addition, the conductor frame further has a plurality of grounding ends projecting into the plurality of through holes, and the grounding ends are in contact with the grounding conductive terminals of the electronic components simultaneously disposed in the same through holes. In the connector of the present invention, the shielding conductor piece is obliquely disposed in the insulating body to separate the conductive terminals of two adjacent rows (or columns), thereby reducing crosstalk and improving signal transmission. Integrity. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] FIG. 1 is a schematic view showing a connector electrically connected between an electronic component and a circuit board according to an embodiment of the present invention. Referring to the connector (10) of the embodiment of the present invention, an electronic component and a circuit board 300 are electrically connected together. 2 is a schematic perspective view of the connector, and FIG. 3 is a cross-sectional view of the connector on the drawing. FIG. 4 is a schematic view showing the insulative body of the connector of FIG. 1 being transparent, and in FIG. The requirement to clearly express the features of the present embodiment 'corresponds to or omits the portion of the circuit board and the electronic component 201225428r ττ-ΡΑ 36190twf.doc/n. Referring to FIG. 2, FIG. 3 and FIG. 4 simultaneously, the connector loo includes an insulating body 110, an array of conductive terminals, and a plurality of shielding conductor pieces 13A. The insulating body 110 is disposed on the circuit board 300 and has a first surface 112 relatively far from the circuit board 30 以及 and a second surface 114 opposite to the circuit board 3 。. The conductive terminal array is disposed on the insulative housing 11 , and the conductive terminal array has a plurality of conductive terminals 120 , wherein each of the conductive terminals 12 〇 has a first end 122 , a second end 124 , and is connected to the first end 122 and the second A signal conducting portion 126 between the ends 124 protrudes from the first surface 112, and the second end 124 protrudes from the second surface 114 and contacts the plurality of contacts 302 of the circuit board 300, and the signal is conducted. The axial directions A of the portions 126 are parallel to each other and are at an angle 0 to the first surface 112, and the angle Θ ranges from 45 degrees to 90 degrees. The shielding conductor piece 130 is correspondingly inserted into the array of conductive terminals, wherein each of the shielding conductor pieces 13 has a body 132 and a honeycomb opening 'and a normal direction N of the shielding conductor piece 13 and an axis of the signal conducting part A to each other is perpendicular to each other. By interposing the shielding conductor pieces 13A in the array of the conductive terminals, the shielding conductor piece 130 can serve as a shield for suppressing noise and interference, and the crosstalk phenomenon of the connector 100 can be reduced. In detail, the signal conducting portion 126 of the conductive terminal 120 of the present embodiment has a columnar shape, and the conductive terminals 120 are arranged in an array in which the axial direction A of the signal conducting portion 126 is parallel to each other, and each of the conductive terminals The angle between the axial direction A of the 12-turn signal conducting portion 126 and the first surface 112 is zero. The present invention does not limit the form of the signal conducting portion to be a columnar body. In other embodiments, the signal conducting portion 126 of the conductive terminal 12G may also be formed by a series of conductive beads. The form of the signal transmission section 36190twf.doc/n 201225428 can be determined according to actual needs. In addition, two shielding guide sheets 130 are interposed on both sides of the same row of the conductive terminals 120. In other words, along the alignment direction, the shielding conductor sheets 130 and the rows of conductive terminals 120 are staggered, but in the last row. In addition to the conductive terminals 120, the shielding conductor pieces 130 are still provided to achieve uniformity of the signal transmission structures, so that the impedance values of the respective signal conductors are the same, and the problem of electromagnetic interference can be prevented. The honeycomb opening of the shielding conductor piece 130 referred to in this embodiment is distributed by the plurality of openings 134 in the body 132 to form a porous structure like a honeycomb in FIG. These openings 134 may be arranged arbitrarily or may be evenly distributed to the body 132 in a symmetrical form. The symmetry of the ridge means that the center line distance of any two adjacent openings 134 is the same as the center line distance of any two adjacent openings, such as the center of the three openings 134a, 134b, 134c of FIG. The connection distances dl, d2, and d3 are the same. In addition, the shape, size and position of the opening 134 of each of the shielding conductor pieces 13 平行 and the opening 134 of the other shielding conductor piece 13 平行 may correspond to each other, so that the shielding conductor pieces 130 can be achieved. The shape, size, and position of the opening 134 set a better shielding effect. Incidentally, the shape of the opening 134 may be circular, elliptical, rectangular, other polygonal or the shape of the opening 134 as shown in FIG. 6, and the shape of the opening 134 is not limited by the present invention. Moreover, the opening 134 may also be located at the edge of the body 132, as shown in FIG. Referring to FIG. 2, FIG. 3 and FIG. 4, the connector 1 further includes a conductor frame 14A disposed on the insulative housing 11b. The conductor frame 140 has a plurality of through holes 142, and the electronic component 2〇 The conductive terminals 21〇201225428 ..."-pA 36190twf.doc/n of the crucible are adapted to pass through the through holes 142 to be in contact with the first end 122 of the conductive terminal 120. The method of forming the connector 100 of the present embodiment will be described below. The plurality of conductive terminals 120 are placed in a mold frame, and the conductive terminals 120 are arranged at an angle, wherein the conductive terminals 120 are inclined at an angle by holding the conductive terminals 12 by a mechanical arm, or The first end 122 and the second end 124 side of the conductive terminal 120 are respectively adsorbed by using the staggered magnets to incline the conductive terminal 120 by an angle θ. As can be seen from the above, there are various ways in which the conductive terminals 120 are arranged at an angle Θ, which is determined according to actual needs, and is not limited by this embodiment. Then, the shielding conductor piece 130 is arranged in parallel with the row of the conductive terminals 120 in parallel with the axial direction A of the signal conducting portion 126, and the shielding conductor pieces are disposed on both sides of each of the rows of the conductive terminals 120. 130. Then, the insulating material for forming the insulating body 110 is injected into the mold frame, and the insulating material is fixedly formed, and the conductive terminal 120 and the shielding conductor piece 13A are fixed in the insulating body 110. In particular, the honeycomb opening of the shielding conductor piece 130 can increase the contact area when the insulating material is formed, so that the shielding conductor piece 130 can be adhered well to the insulating body 110 to increase the stability. Thereafter, the conductor frame 140 is mounted on the insulative housing 11b, wherein the through hole 142 of the conductor frame 140 exposes the first end 122 of the conductive terminal 120. Incidentally, the shielding conductor piece 130 may protrude from the first surface 112' of the insulative housing 110 to contact the conductor frame 14A. When the connector 1 of the embodiment is used, the connector 1 is fixed on the circuit board 300, wherein the second end 124 of the conductive terminal 12 is connected to the v-PA 36190twf.doc/n 201225428 electric shock board Contact 302 of 300. In particular, when the electronic component 200 is bonded to the connector 100, the conductive terminal 210 of the electronic component 200 passes through the through hole 142 of the conductor frame 140 to be in contact with the first end 122, and the electronic component 200 is subjected to a positive direction. For the insulating body 110, the positive force causes the insulating body 110 to deform, so that the first end 122 of the conductive terminal 120 disposed in the insulating body 110 generates movement relative to the conductive terminal 210 along with the deformation of the insulating body 110. As shown in FIG. 8 , after the positive force of the connector 100 is released, the insulating body 110 returns to the original shape, and the first end 122 of the conductive terminal 120 is also returned to the original position. The oxide 400 formed on the surface of the first end 122 or the conductive terminal 21 can be rubbed by the friction generated when the first end 122 moves relative to the conductive terminal 21 设置 disposed thereon to be removed, thereby achieving the first The effect of a good electrical connection between the one end 122 and the guide terminal 210. Fig. 9 is a schematic view showing a crosstalk phenomenon in which a shielded conductor piece is not provided in a conventional connector, and Fig. 10 is a schematic view showing a crosstalk phenomenon of the connector of the present embodiment. Comparing Fig. 9 with Fig. 1A, it can be seen that the connector 1 of the present embodiment can reliably reduce the crosstalk of 7〇% by the conventional connector, thereby achieving the effect of transmitting signals at a high speed and accurately. Figure 11 is a schematic view of a conductor frame. The conductor frame 14 has a plurality of grounding ends 144 protruding from the plurality of through holes 142, and the grounding end 144 is used to ground the electronic component 2 when the electronic component 200 is mounted on the connector 100. The conductive terminal 21 of the pin contacts the ground terminal 144 to form a grounding system. The ground terminal 144 of this embodiment can be determined in accordance with the set position of the grounding pin of the electronic component 200. 12 and 13 are different arrangements of the signal pin and the ground pin of the electronic component 200 of 201225428 * tV-PA 36190twf.doc/n. Referring to Figures U, 12 and 13, the grounding end 144 of the conductor frame 14A is disposed corresponding to the grounding pin 22 of the electronic component 200, and the grounding end 144 must be disposed corresponding to the pin position 230. The position at which the ground terminal 144 is disposed can be changed in accordance with the setting position of the grounding pin of the electronic component 200, which increases design convenience. In summary, the connector of the present invention has at least the following advantages: 1. The shielding conductor piece of the connection benefit is used as a shield for suppressing noise interference, reducing the crosstalk phenomenon of the connector, and achieving the purpose of high-speed and accurate transmission of the signal. . 2. The honeycomb opening of the shielding conductor piece increases the contact area between the insulating body and the shielding conductor piece, improves the adhesion, and allows the shielding conductor to be stably disposed in the insulating body. 1. When the electronic component is assembled in the connector, the positive force of the electronic component is applied to the insulating body, causing deformation of the insulating body, thereby causing the conductive terminal of the electronic component to rub against the first end of the conductive terminal and simultaneously removing the same. • An oxide that enhances the electrical connection between the conductive terminals of the electronic component and the second end of the conductive terminal. 4. The grounding end of the conductor frame can be set according to the grounding pin position of the electronic parts. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. 36l90twf.doc/n 201225428ρδ »/"ΡΑ [Simplified illustration of the drawings] Fig. 1 is a schematic view showing the connector electrically connected between an electronic component and a circuit board according to an embodiment of the present invention. 2 is a perspective view of the connector. Figure 3 is a cross-sectional view of the connector of Figure 1. 4 is a schematic circle in which the insulating body of the connector of FIG. 1 is made transparent. Figure 5 is a schematic view of a shielded conductor piece. Ffl 6 is a schematic view showing another shape of the opening of the shielding conductor piece. Fig. 7 is a schematic view showing the opening of the concealing conductor piece disposed on the edge of the body. Fig. 8 is a schematic view showing the electronic component applying a positive force to the insulating body and deforming the insulating body when the electronic component is joined to the connector. Fig. 9 is a schematic view showing a crosstalk phenomenon in which a shielded conductor piece is not provided in a conventional connector. FIG. 10 is a schematic diagram of the crosstalk phenomenon of the connector of the embodiment. Figure 11 is a schematic view of a conductor frame. Fig. 12 and Fig. 13 show different ways of configuring the signal pin and the ground pin of the electronic component. ί [Main component symbol description] 100 : Connector no : Insulating body 112 . First surface 114 · Second surface 120, 210 : Conductive terminal 12 201225428 v^-PA 36190twf.doc/n 122 : First end 124 : Two ends 126: signal conducting portion 130: shielding conductor piece 132: body 134, 134a, 134b, 134c: opening 140: conductor frame 142: through hole 144: grounding end 200: electronic component 300: circuit board 302: contact 400 : oxide Θ : angle A : axial direction N: normal direction dl, d2, d3 : center connection distance 13