JPH11135409A - Apparatus for detecting and removing foreign matter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove dust attached to the front and rear surfaces of a reticle without damaging even a sticked thin film of pellicle, by blowing air to foreign matter attached portions so as to blow off the dust attached to the surface and near of the reticle when the reticle is rejected by a foreign matter detecting device. SOLUTION: This apparatus for detecting and removing foreign matters prevents reattachment of dust by fixing an exhausting device 24 to a foreign matter removing device so as to suck dust dispersed by charged air through an exhaust port. Foreign matters attached to a reticle R (pericle) are blown off by the charged air, however, the blown foreign matters descend again after flying in the sir. In order to prevent the descendent foreign matters from reattaching to the reticle R, the exhausting device 24 is provided at a side opposite to air nozzles 23 so as to release the dispersed foreign matters outside a reducing projection aligner. Elimination of the exhausting device 24, i.e., arrangement of only the exhaust port may suffice to prevent reattachment of the blown foreign matters to the reticle R.

Description

DETAILED DESCRIPTION OF THE INVENTION

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a foreign matter inspection and removal apparatus for removing dust and other foreign matter adhering to a reticle when transferring a reticle pattern onto a semiconductor substrate, and more particularly, to a reduction projection exposure apparatus. The present invention relates to a suitable foreign matter inspection and removal apparatus.

[0002]

2. Description of the Related Art A semiconductor integrated circuit is formed by reducing exposure of a reticle pattern using a reduction projection exposure apparatus, and this operation is performed in a clean room in which cleanliness is maintained. FIGS. 6 and 7 show the configuration of a reduction projection exposure apparatus used for this purpose. The reticle (3) is placed on a housing (7) provided with a vacuum chuck mechanism and fixed after positioning is completed.

Next, the pattern on the reticle is reduced and exposed to 1/5 with a reduction projection lens.

On the other hand, a semiconductor substrate (4) on which a semiconductor chip is to be formed is set on a stage (5) which can be moved in the XYZ directions on a base with the photoresist coated thereon. ing.

[0005] An ultra-high pressure mercury lamp (6) is used as a light source.
By automatically moving the stage (5) by one chip, a reduced pattern composed of many chips is exposed.

In the reduction projection exposure operation, if dust is present on the reticle (3), the reduction projection exposure is fatal because it is directly subjected to the reduction projection exposure. Therefore, conventionally, before being set in the housing (7) of the reduction projection exposure apparatus, it is conveyed to a foreign matter inspection section, irradiated with a laser and examined for the presence or absence of dust adhesion by scattered light. Notify the worker of the position where it is attached. The worker is a reticle (3)
Was taken out of the reduction projection exposure apparatus, washed with a reticle cleaning apparatus, and after confirming that dust was not attached to the front and back surfaces of the reticle, the reticle was set on the housing (7) again.

As a mechanism for preventing dust from adhering, as shown in FIG. 9, Japanese Patent Application Laid-Open No. 60-83034 discloses a mechanism in which the front and rear surfaces of the reticle 30 are constantly supplied with weak air to cover them with an air flow. There is known a method for preventing dust from adhering.

Further, as a new technique, there is a technique in which a thin film called a pellicle film is attached to the reticle 30 and a reticle having a structure such that dust does not adhere to the reticle itself is used to prevent the dust from being directly reduced and projected.

[0009]

A first problem is that, in the prior art, when dust is confirmed by a foreign matter inspection section, cleaning is performed by a reticle cleaning machine. The technology using a reticle on which a thin film has been applied has advanced, and cleaning has become impossible. The reason is that when a pellicle film is applied to the reticle, the film is very thin.
This is because washing with a reticle washing machine breaks the pellicle film.

A second problem is that when dust adheres to the pellicle film, the dust is removed by blowing air onto the adhered portion, but the pellicle film may be damaged during the dust removing operation. there were. The reason is that the dust removal operation is manually performed by a human, and thus the pellicle film may be damaged by an air gun.

An object of the present invention is to provide a method for removing dust adhering to the front and back surfaces of a reticle without damaging the pellicle even when a pellicle thin film is applied.

[0012]

The gist of the present invention is that when a reticle pattern is transferred onto a semiconductor substrate,
A foreign matter inspection and removal apparatus for removing dust and other foreign matter attached to a reticle, wherein the foreign matter inspection apparatus for inspecting whether or not foreign matter is attached to the reticle, and the foreign matter inspection apparatus has failed the inspection. In this case, there is provided a foreign matter inspection and removal apparatus characterized by comprising a foreign matter removing apparatus that blows off foreign matter by blowing air to a portion where the foreign matter is attached. The gist of the present invention is a foreign matter inspection and removal apparatus for removing dust and other foreign matter attached to a reticle when transferring a reticle pattern onto a semiconductor substrate, wherein the foreign matter is attached to the reticle. A foreign matter inspection device that inspects the foreign matter, a foreign matter removal device that blows off foreign matter by blowing air to an adhered portion of the foreign matter when the inspection fails, and a foreign matter that is blown off by the air supply mechanism. A foreign matter inspection / removal device characterized by comprising an exhaust device for collecting. The gist of the invention according to claim 3 is a foreign matter inspection and removal apparatus that removes dust and other foreign matter attached to a reticle when transferring a reticle pattern onto a semiconductor substrate, wherein the foreign matter is attached to the reticle. A foreign matter inspection device that inspects the foreign matter, a foreign matter removal device that blows off foreign matter by blowing air to an adhered portion of the foreign matter when the inspection fails, and a foreign matter that is blown off by the air supply mechanism. A foreign matter inspection and removal device is provided with an exhaust device for collecting and an air adjusting mechanism for adjusting air blown out from the foreign matter removal device. The gist of the invention according to claim 4 is a foreign matter inspection and removal apparatus for removing dust and other foreign matter attached to a reticle when transferring a reticle pattern onto a semiconductor substrate, wherein the foreign matter is attached to the reticle. A foreign matter inspection device for inspecting whether a foreign matter is removed, and a foreign matter removal device that blows off foreign matter by blowing air to a portion where the foreign matter is attached when the inspection fails, and a foreign matter removal device is provided downstream of the foreign matter removal device. A foreign matter inspection device, comprising: a measured exhaust port, a pressure gauge for measuring a pressure of air blown from the foreign matter removing device, and an air adjusting mechanism for adjusting the pressure based on the pressure measured by the pressure gauge. Exists in the removal device. The gist of the invention according to claim 5 is a foreign matter inspection and removal apparatus for removing dust and other foreign matter attached to a reticle when transferring a reticle pattern onto a semiconductor substrate, wherein the foreign matter is attached to the reticle. A foreign matter inspection device for inspecting whether a foreign matter is removed, and a foreign matter removal device that blows off foreign matter by blowing air to a portion where the foreign matter is attached when the inspection fails, and a foreign matter removal device is provided downstream of the foreign matter removal device. An exhaust port for discharging the blown foreign matter,
An exhaust device for collecting the foreign matter blown off by the exhaust port, a pressure gauge for measuring a pressure of air blown from the foreign matter removing device, and an air adjusting mechanism for adjusting the pressure based on the pressure measured by the pressure gauge are provided. The foreign matter inspection and removal apparatus is characterized in that: The gist of the invention according to claim 6 resides in a reduced projection exposure apparatus having the foreign matter inspection and removal apparatus according to any one of claims 1 to 4. The gist of the present invention resides in a semiconductor manufacturing apparatus having the foreign matter inspection and removal apparatus according to any one of claims 1 to 4. The gist of the invention according to claim 8 is that, when a reticle formed by forming a pattern on a glass substrate is mounted on a reduction projection exposure apparatus and a reticle pattern is transferred onto a semiconductor substrate, foreign matter inspection is performed on the reduction projection exposure apparatus. A foreign matter inspection and removal method, comprising: providing an apparatus and an air supply mechanism, and, if the inspection result fails in the foreign matter inspection, removing the foreign matter by applying air from the air supply mechanism to the adhered portion of the foreign matter. Exist. The gist of the invention according to claim 9 is that, when a reticle having a pattern formed on a glass substrate is mounted on a reduction projection exposure apparatus and a reticle pattern is transferred onto a semiconductor substrate, foreign matter inspection is performed on the reduction projection exposure apparatus. If the inspection result is failed in the foreign matter inspection, the foreign matter is removed by applying air to the adhesion part of the foreign matter from the air supply mechanism, and the foreign matter blown by the air is provided. The present invention resides in a foreign matter inspection and removal method characterized in that the foreign matter is discharged from an exhaust device. The gist of the invention described in claim 10 is:
10. The foreign matter inspection is performed again after removing or discharging the foreign matter, and if foreign matter is present, the foreign matter is removed and the foreign matter inspection is performed until the foreign matter is eliminated. It is in the foreign matter inspection and removal method.

[0013] Foreign matter adhering to the reticle (pellicle) is automatically inspected by a foreign matter inspection device, and if foreign matter is found, air is applied to the portion where the foreign matter is attached to remove the foreign matter. When the air application is completed, the foreign substance inspection is performed again to check whether the foreign substance has been removed.

By automatically performing the foreign substance inspection and foreign substance removal, there is no need to carry out the reticle loading / unloading operation and the reticle cleaning operation, thereby reducing the reticle transport time, the cleaning operation time, and preventing the reticle from being damaged by the cleaning operation. I do.

[0015]

Embodiments of the present invention will be described in detail with reference to the drawings. First, a first embodiment will be described.

(First Embodiment) A foreign matter inspection and removal apparatus according to an embodiment of the first invention is provided in a reduction projection exposure apparatus. As shown in FIG. 1, a foreign matter inspection device (1) for a reticle R (pellicle), an output device such as a display device or a printing device for displaying a result of the foreign matter inspection, and a foreign matter removing device when foreign matter is found attached (2).

The foreign matter inspection device (1) is a mechanism for irradiating a laser on the reticle R surface and detecting the presence or absence of a foreign material based on the reflected light, and a laser transmission device (11) and an optical path switch for changing the optical path of the laser. A mirror (12) and a photomultiplier (13) for receiving scattered light from the reticle R are provided.

When a foreign substance is detected by the foreign substance inspection device (1), the size of the foreign substance predicted from the magnitude of the scattered light is represented by A,
The results are classified into three stages of B and C, and the output device displays the inspection result and the position where the foreign matter is attached.

The foreign matter removing device (2) includes a filter (21) for removing air, a pressure gauge for displaying air pressure and an air pressure adjusting mechanism (22), and air to the reticle R (pellicle). Air nozzle for applying (23)
The foreign matter is removed by applying clean air at a constant pressure to the position of the foreign matter detected by the foreign matter inspection device (1). Further, the air nozzle is not mounted perpendicularly to the reticle R surface, but at an angle such that foreign matter is easily removed.

Next, the operation of the embodiment of the present invention will be described with reference to FIGS.

When foreign matter is detected on the reticle R (pellicle) by the foreign matter inspection device (1), the presence or absence of foreign matter is displayed on a display, and then the foreign matter is automatically conveyed to the foreign matter removal device (2). Foreign matter is removed by applying air.

When the reticle R (pellicle) is placed on the scanning arm of the foreign matter inspection device (1), the carrier moves at a constant speed into the detecting section. The entire surface of the reticle R (pellicle) is scanned by the laser light from the laser transmitting device (11) that is scanned in a direction orthogonal to the moving direction.

The laser light from the laser transmitting device (11) is scattered by a pattern or dust, and the scattered light is received by the photomultiplier (13), and the presence or absence of foreign matter is automatically detected.

The foreign substance inspection is performed on the pattern surface and the glass surface of the reticle R (pellicle). If there is a foreign substance as a result of the inspection, the foreign substance is classified into three stages of A, B, and C according to the size, and is mapped on a display. Is displayed. here,
The presence / absence of foreign matter on the reticle R (pellicle) and the position where the foreign matter adheres on the reticle R are clear.

The foreign matter removing device (2) includes a filter (21) for removing air, a pressure gauge for displaying air pressure and an air pressure adjusting mechanism (22), and air to the reticle R (pellicle). Air nozzle for applying (23)
The foreign matter is removed by applying clean air to the position of the foreign matter detected by the foreign matter inspection device (1) for a predetermined time. At this time, the air pressure is adjusted by the air pressure adjusting mechanism (22) so as not to damage the pellicle film.

The air nozzle (23) is mounted at an angle suitable for blowing off foreign matter. When the application of the air is completed, the foreign substance inspection is performed again by the foreign substance inspection device (1). According to the inspection result, if the result is OK, the reticle R is automatically conveyed to the exposure unit, and if the inspection result is NG, the adhesion portion of the foreign matter is displayed on a map on a display, and air is again applied by the foreign matter removing device. Whether or not to perform the operation is an operator call, and "Do you want to remove foreign substances again? Y / N" is displayed on the display.

Next, the configuration of an embodiment of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, an embodiment of the present invention provides a foreign matter inspection device (1) for a reticle R (pellicle), an output device such as a display device or a printing device for displaying a result of the foreign matter inspection, and And a foreign matter removing device (2) when recognized.

The foreign matter inspection device (1) is a mechanism for irradiating a laser on the reticle R surface and detecting the presence or absence of a foreign material based on the reflected light, and a light transmitting device (11) and an optical path switch for changing the optical path of the laser. A mirror (12) and a photomultiplier (13) for receiving scattered light from the reticle R are provided.

When a foreign substance is detected by the foreign substance inspection device (1), the size of the foreign substance predicted from the magnitude of the scattered light is represented by A,
The results are classified into three stages of B and C, and the output device displays the inspection result and the position where the foreign matter is attached.

The foreign matter removing device (2) is provided with a filter (21) for removing air, a pressure gauge for displaying air pressure, an air pressure adjusting mechanism (22), and air supply to the reticle R (pellicle). And an air nozzle (23) for removing the foreign matter by applying clean air of a constant pressure to the position of the foreign matter detected by the foreign matter inspection device (1). Further, the air nozzle is not mounted perpendicularly to the reticle R surface, but at an angle such that foreign matter is easily removed.

Next, the operation of the embodiment of the present invention will be described with reference to FIG. 4, FIG. 1 and FIG. First, the reticle R is transported (step s1), and it is determined whether or not to perform a foreign substance inspection (step s2). When the foreign substance inspection is performed, the foreign substance inspection is performed by the foreign substance inspection apparatus (1) (step s1). s3).

When the reticle R (pellicle) is placed on the scanning arm of the foreign matter inspection device (1), the carrier moves at a constant speed into the detecting section. The entire surface of the reticle R (pellicle) is scanned by the laser light from the laser transmitting device (11) that is scanned in a direction orthogonal to the moving direction.

The laser light from the laser transmitting device (11) is scattered by a pattern or dust, and the scattered light is received by the photomultiplier (13), and the presence or absence of foreign matter is automatically detected.

The foreign substance inspection is performed on the pattern surface and the glass surface of the reticle R (pellicle). If there is a foreign substance as a result of the inspection, the foreign substance is classified into three stages of A, B, and C according to the size and mapped on a display. Is displayed. here,
The presence or absence of foreign matter on the reticle R (pellicle) and the position of the foreign matter on the reticle R become clear.

When foreign matter is detected on the reticle R (pellicle) by the foreign matter inspection device (1) (step s4), it is determined whether or not to remove the foreign matter (step s5). Above the presence or absence of foreign matter, the position where the foreign matter is attached, and the size of the foreign matter are displayed. Thereafter, the foreign matter is automatically conveyed to the foreign matter removing device (2) (Step s6), and the foreign matter is removed by applying air (Step s7). If the foreign matter is not removed, the reticle R is carried out (step s5).

The foreign matter removing device (2) includes a filter (21) for removing air, a pressure gauge for displaying air pressure and an air pressure adjusting mechanism (22), and air to the reticle R (pellicle). Air nozzle for applying (23)
The foreign matter is removed by applying clean air at a pressure of about 2 kg to the position of the foreign matter detected by the foreign matter inspection device (1). At this time, the air pressure is adjusted to about 2 kg so as not to damage the pellicle film (22).
Has been adjusted.

The air nozzle (23) is attached at an angle suitable for blowing off foreign matter. The air application time can be set arbitrarily. After the application of the air is completed, it is determined whether or not to perform the foreign substance inspection again.
8).

According to the inspection result, if the result is OK,
The reticle R is automatically conveyed to the exposure unit (step s4),
If the inspection result is NG, a display is made on the display to show the attached portion of the foreign matter on the display, and it is an operator call whether or not to apply air again by the foreign matter removing device, and the display asks, "Do you want to remove foreign matter again? Y / N "is displayed (step s5). The foreign substance inspection is performed again, and if the result of the foreign substance inspection is NO, the above steps s5 to s2
repeat. If the result of the foreign matter inspection is OK, the foreign matter is transported to the exposure unit (step s8).

Thereafter, as in the normal semiconductor manufacturing process,
Reticle alignment (step s9) and exposure (step 10) are performed.

The foreign matter is inspected and removed by the above steps.
Semiconductors can be manufactured. Next, the effect of the reduced projection exposure apparatus having such a configuration will be described. The first effect is
Since the foreign matter removing operation is automatically performed by the reduction projection exposure apparatus, reticle R (pellicle) damage due to an operation error can be prevented. The reason is that if you find a foreign body,
Although air has been manually blown on the reticle R (pellicle) to blow off foreign matter, the foreign matter removal operation is automatically performed by the reduced projection exposure apparatus as described above.
The second effect is that the operation time required for the foreign matter removing operation is shortened, so that the operation loss time of the reduced projection exposure apparatus is shortened. The reason is that when foreign matter is found, the reticle R (pellicle) is unloaded from the reduced projection exposure apparatus, and air is manually applied to the reticle R (pellicle) to blow off the foreign matter. As described above, the reticle R
This is because there is no need to carry out the (pellicle).

(Second Embodiment) Next, a second embodiment of the present invention will be described.
An embodiment will be described in detail with reference to the drawings.
The foreign matter inspection and removal apparatus according to the second embodiment of the present invention includes:
By attaching the exhaust device 24 to the foreign matter removing device, and sucking dust scattered by applying air from the exhaust port 25,
Prevents dust from re-adhering.

Foreign matter adhering to the reticle R (pellicle) is blown off by applying air. The foreign matter blown off in the air and descends again. In order to prevent the dropped foreign matter from re-adhering to the reticle R (pellicle), an exhaust device 24 is provided on the opposite side of the air nozzle 23.
Is provided, and the scattered foreign matter is released outside the reduced projection exposure apparatus. Other configurations are the same as those of the first embodiment.
Note that only the exhaust port 25 may be provided without providing the exhaust device 24.

According to the foreign matter inspection and removal apparatus according to the second embodiment, it is possible to prevent the blown foreign matter from re-adhering to the reticle R together with the effect according to the first embodiment.

In the above embodiment, the present invention is applied to a reticle to which a pellicle is stuck, but of course, the present invention can also be applied to a reticle R to which a pellicle is not stuck.

The number, position, shape, and the like of the above-mentioned constituent members are not limited to the above-described embodiment, but can be set to a number, position, shape, and the like suitable for carrying out the present invention. In each drawing, the same components are denoted by the same reference numerals.

[0046]

The first effect is that the foreign matter inspection and removal apparatus
Since the foreign matter removal operation is automatically performed, reticle (pellicle) damage due to an operation error can be prevented. The reason is that, when a foreign substance is found, air is manually applied to the reticle (pellicle) to blow off the foreign substance, but according to the present invention, the foreign substance removal operation is automatically performed by the foreign substance inspection and removal apparatus. To do that.

The second effect is that the operation time required for the foreign matter removing operation is shortened, so that the operation loss time of the reduced projection exposure apparatus is shortened. The reason is that when foreign matter is found, the reticle (pellicle) is carried out from within the reduced projection exposure apparatus, and air is manually applied to the reticle (pellicle) to blow off the foreign matter. This is because there is no need to carry out a reticle (pellicle) because the foreign matter removal operation is automatically performed by the foreign matter inspection and removal device.

Therefore, according to the present invention, even if the reticle has a pellicle film attached thereto, foreign matter can be removed without peeling the pellicle film.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a reduction projection exposure apparatus according to a first embodiment of the present invention.

FIG. 2 is a conceptual diagram showing a reduced projection exposure apparatus according to the first embodiment of the present invention.

FIG. 3 is a conceptual perspective view showing a reduction projection exposure apparatus according to the first embodiment of the present invention.

FIG. 4 is a flowchart showing an operation of the reduction projection exposure apparatus according to the first embodiment of the present invention.

FIG. 5 is a conceptual diagram showing a reduction projection exposure apparatus according to a second embodiment of the present invention.

FIG. 6 is a conceptual diagram showing a reduction projection exposure apparatus according to a conventional example.

FIG. 7 is a conceptual perspective view showing a reduction projection exposure apparatus according to a conventional example.

FIG. 8 is a side view showing a reduction projection exposure apparatus according to another conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 foreign matter inspection device 2 foreign matter removing device 11 laser transmitting device 12 optical path switching mirror 13 photomultiplier 21 filter 22 air pressure adjusting mechanism 23 air nozzle 24 exhaust device 25 exhaust port

Claims (10)

[Claims] 1. A foreign matter inspection and removal apparatus for removing dust and other foreign matter adhering to a reticle when transferring a reticle pattern onto a semiconductor substrate, wherein the foreign matter is inspected for whether foreign matter is adhered to the reticle. What is claimed is: 1. A foreign matter inspection and removal apparatus, comprising: an inspection apparatus; and a foreign matter removal apparatus that blows off foreign matter by blowing air onto an adhered portion of the foreign matter when the inspection fails in the foreign matter inspection apparatus. 2. A foreign matter inspection and removal apparatus for removing dust and other foreign matter adhering to a reticle when transferring a reticle pattern onto a semiconductor substrate, wherein the foreign matter inspects whether the foreign matter is adhered to the reticle. An inspection device, a foreign matter removing device that blows off foreign matter by blowing air to a portion where the foreign matter is attached when the inspection fails in the foreign matter inspection device, and an exhaust device that collects the foreign matter blown off by the air supply mechanism. A foreign matter inspection and removal apparatus comprising: 3. A foreign matter inspection and removal apparatus for removing dust and other foreign matter adhering to a reticle when transferring a reticle pattern onto a semiconductor substrate, the foreign matter inspecting whether or not foreign matter is attached to the reticle. An inspection device, a foreign matter removing device that blows off foreign matter by blowing air to a portion where the foreign matter is attached when the inspection fails in the foreign matter inspection device, and an exhaust device that collects the foreign matter blown off by the air supply mechanism. And an air adjusting mechanism for adjusting air blown from the foreign matter removing device. 4. A foreign matter inspection and removal apparatus for removing dust and other foreign matter adhering to a reticle when transferring a reticle pattern onto a semiconductor substrate, wherein the foreign matter inspects whether the foreign matter is adhered to the reticle. An inspection device, a foreign matter removing device that blows off foreign matter by blowing air to an adhered portion of the foreign matter when the inspection fails in the foreign matter inspection device, and an exhaust port provided on the downstream side of the foreign matter removing device. And a pressure gauge for measuring the pressure of air blown from the foreign matter removing device, and an air adjusting mechanism for adjusting the pressure based on the pressure measured by the pressure gauge. 5. A foreign matter inspection and removal apparatus for removing dust and other foreign matter adhering to a reticle when transferring a reticle pattern onto a semiconductor substrate, the foreign matter inspecting whether or not foreign matter has adhered to the reticle. Inspection device, when the inspection is failed in the foreign matter inspection device, a foreign matter removal device that blows out foreign matter by blowing air to the adhesion portion of the foreign matter, and the foreign matter removal device that is provided on the downstream side of the foreign matter removal device An exhaust port for discharging foreign matter, an exhaust device for collecting foreign matter blown off by the exhaust port, a pressure gauge for measuring the pressure of air blown from the foreign matter removing device, and a pressure gauge based on the pressure measured by the pressure gauge. A foreign matter inspection and removal device comprising an air adjustment mechanism for adjusting. 6. A reduction projection exposure apparatus having the foreign matter inspection and removal apparatus according to claim 1. 7. A semiconductor manufacturing apparatus comprising the foreign matter inspection and removal apparatus according to claim 1. 8. When a reticle having a pattern formed on a glass substrate is mounted on a reduction projection exposure apparatus and a reticle pattern is transferred onto a semiconductor substrate, a foreign matter inspection apparatus and an air supply mechanism are provided to the reduction projection exposure apparatus. And a method for removing foreign matter by applying air to an adhered portion of the foreign matter from an air supply mechanism when the inspection result fails in the foreign matter inspection. 9. When a reticle formed by forming a pattern on a glass substrate is mounted on a reduction projection exposure apparatus and a reticle pattern is transferred onto a semiconductor substrate, a foreign matter inspection apparatus and an air supply mechanism are provided to the reduction projection exposure apparatus. If the inspection result fails in the foreign matter inspection, the foreign matter is removed by applying air to the adhesion part of the foreign matter from the air supply mechanism, and the foreign matter blown by the air is discharged from the exhaust device. A foreign matter inspection and removal method characterized by the above-mentioned. 10. The method according to claim 1, wherein after the foreign matter is removed or discharged, the foreign matter inspection is performed again. If there is any foreign matter, the foreign matter is removed and the foreign matter inspection is performed until the foreign matter is eliminated. 10. The method for removing and inspecting foreign matter according to 8 or 9. [0001]