JPH1111570A - Carrier for base board - Google Patents

Carrier for base board

Info

Publication number
JPH1111570A
JPH1111570A JP9167154A JP16715497A JPH1111570A JP H1111570 A JPH1111570 A JP H1111570A JP 9167154 A JP9167154 A JP 9167154A JP 16715497 A JP16715497 A JP 16715497A JP H1111570 A JPH1111570 A JP H1111570A
Authority
JP
Japan
Prior art keywords
corrosion
substrate
resistant resin
carrier
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP9167154A
Other languages
Japanese (ja)
Inventor
Yasuhiro Kitagawa
康弘 北川
Naomi Oguchi
直美 小口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP9167154A priority Critical patent/JPH1111570A/en
Publication of JPH1111570A publication Critical patent/JPH1111570A/en
Withdrawn legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To realize a new carrier structure in which even if the carrier is for a base board constituted to install a large-sized base board, processing liquid is hardly immersed into the carrier and further the carrier itself can be made small in size and light in weight. SOLUTION: This is comprised of a pair of side plates 10, four connecting shafts 20 for use in connecting the side plates 10 from each other and an assembling frame 30 connecting the side plates at the bottom part of it. The side plate 10 is made of anti-acid resin 12 in which metallic plates 11 made of titanium are embedded into an upper part, an intermediate part and a lower part, respectively. The connecting shaft 20 is also comprised of a shaft-like core member 21 and an anti-corrosion resin 22 covering the core member. The end part of the connecting shaft 20 is formed with a protrusion part 21a of the core member and inserted into a through-pass hole 10a formed in the side plate 10. The side plate 10 and the anti-corrosion resin of the connecting shaft 20 are integrally assembled by welding so as to perform a complete sealing of the inner metallic material and the core material.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は基板用キャリアに係
り、特に、半導体装置や液晶表示装置を製造するための
洗浄、エッチング等の工程に使用する場合に好適な基板
用キャリアの構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier for a substrate, and more particularly to a structure of a carrier for a substrate suitable for use in processes such as cleaning and etching for manufacturing a semiconductor device or a liquid crystal display device.

【0002】[0002]

【従来の技術】従来、半導体装置や液晶表示装置等の製
造工程においては、基板の洗浄、エッチング工程等にお
いて、耐蝕性樹脂からなる基板用キャリアが多く使用さ
れている。基板用キャリアの形状や構造は、搭載する基
板の形状や数、或いはキャリアをセットする装置の構造
等によって様々であるが、一般的には、小型の基板用キ
ャリアは耐蝕性樹脂の射出成形によって一体成形された
ものが多いが、例えば、大きな液晶基板用の大型の基板
用キャリアになると、耐蝕性樹脂で作られた部品を組み
立てた箱状、枠組状の構造を備えている。
2. Description of the Related Art Conventionally, in a manufacturing process of a semiconductor device, a liquid crystal display device, or the like, a carrier for a substrate made of a corrosion-resistant resin is often used in a process of cleaning and etching a substrate. The shape and structure of the substrate carrier vary depending on the shape and number of substrates to be mounted, the structure of the device for setting the carrier, and the like.In general, a small substrate carrier is formed by injection molding of a corrosion-resistant resin. Many are integrally molded. For example, a large substrate carrier for a large liquid crystal substrate has a box-like or frame-like structure in which parts made of a corrosion-resistant resin are assembled.

【0003】[0003]

【発明が解決しようとする課題】大型の基板用キャリア
においては、複数の部品、例えば板状体や軸状体をネジ
結合等によって組み立てたものがあるが、このようにし
て組み立てると、各部品の結合部に処理液が沁み込み、
その処理液が次工程や次作業時において沁みだして、基
板に付着して腐食させたり、シミを作ったり、或いは他
の設備に付着して腐食させるという問題点がある。
In a large substrate carrier, a plurality of parts, for example, a plate-like body or a shaft-like body is assembled by screw connection or the like. Processing liquid permeates into the joint of
There is a problem that the treatment liquid permeates in the next step or the next operation and adheres to the substrate to cause corrosion, forms stains, or adheres to other equipment to cause corrosion.

【0004】また、大型の基板用キャリアを構成する場
合には、基板の重量も増大するため、全体の剛性を高め
る必要があり、このため、耐蝕性樹脂で作られた各部品
も厚肉化せざるを得ず、キャリア自体が大型になり、重
量も増加するという問題点がある。
Further, when a large-sized substrate carrier is formed, the weight of the substrate also increases, and it is necessary to increase the overall rigidity. Therefore, each part made of a corrosion-resistant resin is also thickened. However, there is a problem that the carrier itself becomes large and the weight increases.

【0005】そこで本発明は上記問題点を解決するもの
であり、その課題は、大型の基板を搭載するように構成
された基板用キャリアであっても、処理液の沁み込みが
発生し難く、しかもキャリア自体の小型化及び軽量化を
図ることのできる新規のキャリア構造を実現することに
ある。
Accordingly, the present invention has been made to solve the above-mentioned problems, and an object of the present invention is to prevent a processing liquid from infiltrating even with a substrate carrier configured to mount a large-sized substrate. In addition, it is an object of the present invention to realize a novel carrier structure capable of reducing the size and weight of the carrier itself.

【0006】[0006]

【課題を解決するための手段】上記課題を解決するため
に本発明が講じた手段は、基板を搭載して処理、搬送等
を行うための基板用キャリアにおいて、芯材に耐蝕性樹
脂を被覆してなる複数の枠材を組み立てて枠組状に形成
した構造を備え、前記枠材間の結合部においては、一方
の前記枠材には前記芯材を前記耐蝕性樹脂から突出させ
た突出部を設け、他方の前記枠材には該突出部に対応し
た形状に形成され、前記耐蝕性樹脂から前記芯材にまで
到達する凹部若しくは貫通孔を設けて、前記突出部を前
記凹部若しくは貫通孔内の前記芯材に係合させた上で、
一方の前記枠材の前記耐蝕性樹脂と他方の前記枠材の耐
蝕性樹脂との接触部を封止してなることを特徴とする基
板用キャリアである。
In order to solve the above-mentioned problems, the present invention takes measures to cover a core material with a corrosion-resistant resin in a substrate carrier for mounting, processing and transporting the substrate. A framed structure formed by assembling a plurality of frame members formed as described above, and at a joint between the frame members, one of the frame members has a protruding portion in which the core material protrudes from the corrosion resistant resin. The other frame member is formed in a shape corresponding to the protruding portion, and a concave portion or a through hole reaching the core material from the corrosion resistant resin is provided, and the protruding portion is formed in the concave portion or the through hole. After engaging with the core material in,
A carrier for a substrate, wherein a contact portion between the corrosion-resistant resin of one frame material and the corrosion-resistant resin of the other frame material is sealed.

【0007】この手段によれば、芯材を耐蝕性樹脂で被
覆した枠材を結合させて構成されているので、厚肉化す
ることなく基板用キャリアの剛性を確保することができ
るから、キャリアの小型化を図ることができるととも
に、結合部において耐蝕性樹脂の接触部を封止してなる
ため、処理液の沁み込みや染み出しが発生し難くなり、
基板や設備に腐食や沁みが発生することを防止すること
ができる。
According to this means, the rigidity of the carrier for the substrate can be ensured without increasing the thickness of the carrier because the frame is formed by joining the frame material in which the core material is coated with the corrosion resistant resin. In addition to the fact that the contact portion of the corrosion-resistant resin is sealed at the joint portion, penetration and seepage of the processing liquid are less likely to occur,
It is possible to prevent the occurrence of corrosion or seepage on the substrate or equipment.

【0008】ここで、前記接触部は、前記耐蝕性樹脂同
士を溶接して一体化することによって封止されているこ
とが好ましい。
Here, the contact portion is preferably sealed by welding and integrating the corrosion resistant resins.

【0009】この手段によれば、耐蝕性樹脂同士を溶接
することによって接触部を封止しているため、処理液の
沁み込みや染み出しを完全に防止することができる。
According to this means, since the contact portion is sealed by welding the corrosion-resistant resins, it is possible to completely prevent seepage or seepage of the treatment liquid.

【0010】また、前記芯材は、Ti、若しくはTiを
主体とするTi合金で形成されていることが好ましい。
Preferably, the core is made of Ti or a Ti alloy mainly composed of Ti.

【0011】この手段によれば、芯材にTi又はTi合
金を用いることによって剛性を高めると同時に軽量化す
ることができるとともに、仮に芯材に処理液等が触れて
も腐食を防止することができる。
According to this means, by using Ti or a Ti alloy for the core material, the rigidity can be increased and the weight can be reduced, and corrosion can be prevented even if the processing liquid or the like touches the core material. it can.

【0012】さらに、前記枠材は、前記基板の側端部に
対して水平方向に係合し、略垂直方向に伸びる1又は複
数の係合溝を備えた一対の板状体と、該一対の板状体が
相互に対向姿勢となる状態に連結するための連結部材
と、底部において該連結部材に対して交差し略水平に渡
された、前記基板を支えるための支持部材とから構成さ
れることが好ましい。
Further, the frame member is engaged with a side end of the substrate in a horizontal direction and has a pair of plate-like bodies provided with one or a plurality of engagement grooves extending in a substantially vertical direction; A connecting member for connecting the plate-like members in a state where they face each other, and a supporting member for supporting the substrate, which is crossed substantially horizontally across the connecting member at the bottom. Preferably.

【0013】この手段によれば、板状体を側板として用
い、基板の側端部を係合溝に係合することによって保持
するとともに、支持部材によって基板を支えるように構
成されているので、液切れ性を向上させることができる
ことから、基板への液残りや沁みの発生を防止すること
ができる。
According to this means, the plate-like body is used as the side plate, and the side end of the substrate is held by engaging the engagement groove, and the substrate is supported by the support member. Since the liquid drainage property can be improved, it is possible to prevent the liquid remaining on the substrate and the occurrence of bleeding.

【0014】さらに、基板を搭載して処理、搬送等を行
うための基板用キャリアにおいて、一対の板状体を相互
に対向姿勢となる状態に複数の連結部材によって結合し
てなる構造を備え、前記板状体及び前記連結部材は、そ
れぞれ芯材に耐蝕性樹脂を被覆してなり、前記板状体を
被覆する前記耐蝕性樹脂と、前記連結部材を被覆する前
記耐蝕性樹脂とが一体化されていることを特徴とする。
Further, in a substrate carrier for mounting, processing, transporting, and the like, a substrate is provided with a structure in which a pair of plate-like bodies are connected to each other by a plurality of connecting members so as to face each other. The plate-like body and the connection member each have a core material coated with a corrosion-resistant resin, and the corrosion-resistant resin covering the plate-like body and the corrosion-resistant resin covering the connection member are integrated. It is characterized by having been done.

【0015】[0015]

【発明の実施の形態】次に、添付図面を参照して本発明
に係る実施形態について説明する。図1は本発明に係る
基板用キャリアの実施形態の全体構成を示す斜視図であ
る。この基板用キャリアは、液晶表示装置用の大型ガラ
ス基板を複数枚垂直姿勢で搭載するように構成されたも
のであり、一対の側板10と、この側板10同士を連結
するための4本の連結軸20と、側板を底部において連
結する組枠体30とから構成されている。
Next, an embodiment according to the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view showing an overall configuration of an embodiment of a substrate carrier according to the present invention. This substrate carrier is configured so that a plurality of large glass substrates for a liquid crystal display device are mounted in a vertical position, and a pair of side plates 10 and four connection plates for connecting the side plates 10 to each other. It is composed of a shaft 20 and a frame assembly 30 that connects the side plates at the bottom.

【0016】側板10は、厚さ3mm程度の3つのTi
製の金属板11を上部、中間部及び下部の内部にそれぞ
れ埋設させた耐蝕性樹脂12、例えば弗素樹脂からなる
ものである。金属板11の素材としては種々の剛性の高
い材料を用いることができるが、特に高剛性、軽量、高
耐蝕性の材料が好ましい。例えば純Ti、或いはTiを
主要組成とするTi合金が望ましい。耐蝕性樹脂12と
しては、弗素樹脂、弗化ゴム等が好ましく、例えば、ポ
リテトラフルオロエチレン、ポリクロロトリフルオロエ
チレン、二弗化ポリビニル、ポリ弗化ビニリデンなどで
ある。これらの中では、後述する理由により熱可塑性を
示す溶接可能な二弗化ポリビニル(PVDF)が最も好
ましい。側板10は、上記金属板をインサートとした耐
蝕性樹脂の射出成形法等によって製造することができ
る。
The side plate 10 is made of three Ti having a thickness of about 3 mm.
Made of a corrosion-resistant resin 12, for example, a fluorine resin, in which a metal plate 11 made of metal is embedded in the upper, middle and lower portions, respectively. As the material of the metal plate 11, various materials having high rigidity can be used, and materials having high rigidity, light weight, and high corrosion resistance are particularly preferable. For example, pure Ti or a Ti alloy containing Ti as a main composition is desirable. As the corrosion-resistant resin 12, a fluorine resin, a fluorinated rubber, or the like is preferable, and examples thereof include polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl difluoride, and polyvinylidene fluoride. Among them, weldable polyvinyl difluoride (PVDF) exhibiting thermoplasticity is most preferable for the reasons described below. The side plate 10 can be manufactured by an injection molding method or the like of a corrosion resistant resin using the above metal plate as an insert.

【0017】側板10の内面上には、基板を係合させる
ための垂直方向に伸びる断面V字状の係合溝12aが樹
脂成形若しくは成形後の切削加工によって形成されてい
る。また、外面上部には、搬送時に用いたり、液槽内部
に保持したりするための取っ手部14が形成されてい
る。さらに、側板10の上部両端寄りの2箇所、中間部
両端寄りの2箇所、及び下部両端寄りの2箇所にそれぞ
れ貫通孔10aが内部に埋設された金属板11を貫通し
た状態に切削加工によって形成されている。
On the inner surface of the side plate 10, a vertically extending V-shaped engaging groove 12a for engaging a substrate is formed by resin molding or cutting after molding. In addition, a handle 14 is formed in the upper portion of the outer surface for use during transportation and for holding the inside of the liquid tank. Further, the side plate 10 is formed by cutting in a state where it penetrates through the metal plate 11 in which through holes 10a are buried therein at two places near both upper ends, two places near both ends of the middle part, and two places near both lower ends. Have been.

【0018】側板10を連結するための連結軸20は、
図2に示すように、中心において軸線方向に伸びるTi
又はTi合金製の芯材21と、この芯材21を被覆する
耐蝕性樹脂22とから構成された丸棒状に形成されてい
る。芯材21及び耐蝕性樹脂22は、金属板11と耐蝕
性樹脂12とそれぞれ同じ材質である。連結軸20の両
端部には、芯材21が耐蝕性樹脂22の端部から突出す
るように形成された突出部21aが設けられている。
The connecting shaft 20 for connecting the side plates 10 is
As shown in FIG. 2, Ti extends in the axial direction at the center.
Alternatively, it is formed in a round bar shape composed of a core material 21 made of a Ti alloy and a corrosion-resistant resin 22 covering the core material 21. The core material 21 and the corrosion-resistant resin 22 are the same materials as the metal plate 11 and the corrosion-resistant resin 12, respectively. At both ends of the connecting shaft 20, there are provided protrusions 21 a formed so that the core 21 protrudes from the end of the corrosion-resistant resin 22.

【0019】組枠体30は、連結軸20と同様の丸棒状
の軸材を4本組み合わせた形状となっており、連結軸2
0と平行に伸びる一対の連結部30Aと、連結部30A
同士を繋ぐように取り付けられた一対の支持部30Bと
から構成されている。連結部30A及び支持部30Bを
備えた組枠体30は、Ti又はTi合金よりなる芯材3
1と、この芯材31を被覆する耐蝕性樹脂32によって
形成されている。芯材31及び耐蝕性樹脂32は、金属
板11と耐蝕性樹脂12とそれぞれ同じ材質であり、同
様の方法によって形成される。組枠体30の連結部30
Aの両端部には、それぞれ芯材31が耐蝕性樹脂32の
端部から突出するように形成された突出部31aが設け
られている。
The frame body 30 is formed by combining four round rod-shaped shaft members similar to the connecting shaft 20.
A pair of connecting portions 30A extending in parallel with 0;
And a pair of support portions 30B attached so as to connect them. The frame 30 including the connecting portion 30A and the supporting portion 30B is a core material 3 made of Ti or a Ti alloy.
1 and a corrosion-resistant resin 32 covering the core material 31. The core material 31 and the corrosion-resistant resin 32 are made of the same material as the metal plate 11 and the corrosion-resistant resin 12, respectively, and are formed by the same method. Connecting part 30 of frame assembly 30
At both ends of A, protruding portions 31 a are formed so that the core material 31 protrudes from the end of the corrosion-resistant resin 32.

【0020】連結軸20は、図3に示すように、突出部
21aを上記貫通孔10aの内部に挿入し、別途、耐蝕
性樹脂で構成された栓部材15を突出部21aとは反対
側から嵌合させることによって、図2に示すように、挿
通状態に取り付けられる。このようにすると、図4に示
すように、連結軸20の耐蝕性樹脂21の端部は、側板
10の耐蝕性樹脂12の表面にぴったりと当接するよう
になっている。
As shown in FIG. 3, the connecting shaft 20 has a projecting portion 21a inserted into the through hole 10a and a plug member 15 made of a corrosion-resistant resin separately from the side opposite to the projecting portion 21a. By fitting, as shown in FIG. 2, it is attached in an inserted state. In this way, as shown in FIG. 4, the end of the corrosion-resistant resin 21 of the connecting shaft 20 comes into contact with the surface of the corrosion-resistant resin 12 of the side plate 10 exactly.

【0021】ここで、溶接装置50によって耐蝕性樹脂
21の端部と耐蝕性樹脂12とを溶接することによっ
て、側板10と連結軸20とは一体化され、内部の金属
は完全に封止される。この場合、栓部材15を嵌合させ
る前に、突出部21aと貫通孔10aの内部に存在する
金属板11とを溶接や接着によって固着させることが望
ましい。或いは、金属板11の貫通孔に雌ねじを形成
し、突出部21aに雄ねじを形成することによって、金
属板11と突出部21aとを螺合させてもよい。
Here, by welding the end portion of the corrosion resistant resin 21 and the corrosion resistant resin 12 by the welding device 50, the side plate 10 and the connecting shaft 20 are integrated, and the metal inside is completely sealed. You. In this case, it is desirable that the projection 21a and the metal plate 11 existing inside the through hole 10a be fixed by welding or bonding before the plug member 15 is fitted. Alternatively, a female screw may be formed in the through hole of the metal plate 11 and a male screw may be formed in the protrusion 21a, so that the metal plate 11 and the protrusion 21a are screwed together.

【0022】さらに、栓部材15も、耐蝕性樹脂12に
対して、上記と同様に溶接によって固着され、封止され
るようになっている。
Further, the plug member 15 is also fixed to the corrosion-resistant resin 12 by welding in the same manner as described above, and is sealed.

【0023】組枠体30の突出部31aと側板10とに
おいても、上記突出部21aと側板10との関係と同様
にして取り付け、固定される。すなわち、突出部31a
は側板10の下部に形成された貫通孔10aに挿通さ
れ、栓部材15が反対側から嵌合されて、耐蝕性樹脂2
2及び栓部材15と耐蝕性樹脂12とが溶接され、封止
される。
The protruding portion 31a of the frame assembly 30 and the side plate 10 are attached and fixed in the same manner as the relationship between the protruding portion 21a and the side plate 10. That is, the protrusion 31a
Is inserted through a through-hole 10a formed in the lower part of the side plate 10, and the plug member 15 is fitted from the opposite side.
2 and the plug member 15 and the corrosion-resistant resin 12 are welded and sealed.

【0024】このようにして形成された基板用キャリア
は、図1に示すように、液晶用のガラス基板40の両側
端部を係合溝12に係合させ、ガラス基板40の底部が
組枠体30の支持部30Bに担持されるような状態にし
て、複数のガラス基板40を搭載することができる。
In the substrate carrier thus formed, as shown in FIG. 1, both ends of a liquid crystal glass substrate 40 are engaged with the engagement grooves 12, and the bottom of the glass substrate 40 is The plurality of glass substrates 40 can be mounted in a state where the glass substrates 40 are supported by the support portion 30B of the body 30.

【0025】上記実施形態によれば、芯材を耐蝕性樹脂
で被覆した構造としているため、大型基板を搭載するも
のであっても厚肉化することなく剛性を高めることがで
きるから、基板用キャリアの小型化を図ることができ
る。また、複数の部品を組み立てることによって構成し
ていても処理液等の沁み込み、染み出しが発生し難く、
基板や設備の腐食や沁みの発生を防止できる。
According to the above-described embodiment, since the core material is covered with the corrosion-resistant resin, the rigidity can be increased without increasing the thickness even when a large substrate is mounted. The size of the carrier can be reduced. In addition, even if it is constituted by assembling a plurality of parts, it is difficult for seepage and bleeding of the processing liquid to occur,
It is possible to prevent corrosion and bleeding of substrates and equipment.

【0026】さらに、本実施形態では、芯材にTi又は
Ti合金を用いているので、剛性を確保しながら、軽量
化を図ることができる。また、耐蝕性樹脂の溶接部に不
良があっても芯材の腐食が発生し難い。
Further, in the present embodiment, since Ti or Ti alloy is used for the core material, it is possible to reduce the weight while securing rigidity. Further, even if there is a defect in the welded portion of the corrosion resistant resin, corrosion of the core material hardly occurs.

【0027】上記実施形態では、側板と連結軸と組枠体
とをそれぞれ形成してから、それぞれを互いに接合して
いるが、耐蝕性樹脂の被覆処理が可能な形態であれば、
芯材を一体の枠組みとしてから、耐蝕性樹脂の被覆処理
を行うことができ、或いはまた、任意の部分を切断した
状態でそれぞれ部品を構成し、これを組み立てることに
よってキャリアを完成させてもよい。
In the above embodiment, the side plate, the connecting shaft, and the frame member are formed and then joined to each other.
After the core material is formed as an integral frame, a coating treatment with a corrosion-resistant resin can be performed. Alternatively, the carrier may be completed by configuring each part in a state where any part is cut and assembling the parts. .

【0028】また、上記実施形態では、側板10に形成
された係合溝12aによって基板を縦に保持するととも
に、底部において設けられた、連結軸20に対して交差
する軸状の支持部によって基板を支持しているので、基
板からの液切れを容易にすることができ、基板、特に基
板底部における液残りを低減することができるから、沁
みの発生を防止できる。この場合、特に、支持部におけ
る基板底部と接触する部分(上面側表面)は、接触面積
が少なくなるように、円弧状や山形状等のなるべく鋭利
な凸形状であることが好ましい。ただし、製造を容易に
するには、支持部を丸棒形状とすることが望ましい。
In the above embodiment, the board is held vertically by the engagement groove 12a formed in the side plate 10, and the board is provided by the shaft-shaped support section provided at the bottom and intersecting with the connecting shaft 20. , The drainage of the liquid from the substrate can be facilitated, and the liquid residue at the substrate, particularly at the bottom of the substrate, can be reduced. In this case, in particular, it is preferable that a portion (upper surface side) of the support portion that comes into contact with the substrate bottom has a convex shape that is as sharp as possible such as an arc shape or a mountain shape so as to reduce the contact area. However, in order to facilitate the manufacture, it is desirable that the support portion is formed in a round bar shape.

【0029】上記側板10には貫通孔10aを形成した
が、貫通孔ではなく、凹部又は穴を形成して、ここに突
出部を嵌合させてもよい。また、嵌合構造或いは係合構
造は適宜の形状に構成することができる。すなわち、結
果として、芯材同士が係合することによって剛性が確保
されており、しかも芯材の周囲を耐蝕性樹脂が完全に被
覆している構造であればよい。
Although the side plate 10 is formed with the through hole 10a, a concave portion or a hole may be formed instead of the through hole, and the protrusion may be fitted therein. Further, the fitting structure or the engaging structure can be formed in an appropriate shape. That is, as a result, the structure is sufficient if rigidity is ensured by the engagement of the core members and the corrosion-resistant resin completely covers the periphery of the core member.

【0030】[0030]

【発明の効果】以上説明したように本発明によれば以下
の効果を奏する。
As described above, according to the present invention, the following effects can be obtained.

【0031】請求項1によれば、芯材を耐蝕性樹脂で被
覆した枠材を結合させて構成されているので、厚肉化す
ることなく基板用キャリアの剛性を確保することができ
るから、キャリアの小型化を図ることができるととも
に、結合部において耐蝕性樹脂の接触部を封止してなる
ため、処理液の沁み込みや染み出しが発生し難くなり、
基板や設備に腐食や沁みが発生することを防止すること
ができる。
According to the first aspect of the present invention, since the core material is formed by bonding the frame material coated with the corrosion-resistant resin, the rigidity of the substrate carrier can be secured without increasing the thickness. The carrier can be reduced in size, and the contact portion of the corrosion-resistant resin is sealed at the joint portion, so that infiltration and seepage of the processing liquid are less likely to occur,
It is possible to prevent the occurrence of corrosion or seepage on the substrate or equipment.

【0032】請求項2によれば、耐蝕性樹脂同士を溶接
することによって接触部を封止しているため、処理液の
沁み込みや染み出しを完全に防止することができる。
According to the second aspect, since the contact portion is sealed by welding the corrosion-resistant resins, it is possible to completely prevent the treatment liquid from seeping or seeping out.

【0033】請求項3によれば、芯材にTi又はTi合
金を用いることによって剛性を高めると同時に軽量化す
ることができるとともに、仮に芯材に処理液等が触れて
も腐食を防止することができる。
According to the third aspect, by using Ti or a Ti alloy for the core material, the rigidity can be increased and the weight can be reduced, and corrosion can be prevented even if the processing liquid or the like touches the core material. Can be.

【0034】請求項4によれば、板状体を側板として用
い、基板の側端部を係合溝に係合することによって保持
するとともに、支持部材によって基板を支えるように構
成されているので、液切れ性を向上させることができる
ことから、基板への液残りや沁みの発生を防止すること
ができる。
According to the fourth aspect, the plate-like body is used as the side plate, and the side end of the substrate is held by engaging the engagement groove, and the substrate is supported by the support member. In addition, since the liquid drainage property can be improved, it is possible to prevent the liquid remaining on the substrate and the occurrence of bleeding.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る基板用キャリアの実施形態を示す
斜視図である。
FIG. 1 is a perspective view showing an embodiment of a substrate carrier according to the present invention.

【図2】同実施形態における側板と連結軸との結合部を
示す拡大断面図である。
FIG. 2 is an enlarged cross-sectional view showing a joint between a side plate and a connection shaft in the embodiment.

【図3】同実施形態における側板と連結軸及び組枠体と
の組み立て方法を示す説明図である。
FIG. 3 is an explanatory diagram showing a method of assembling a side plate, a connecting shaft, and a frame body in the embodiment.

【図4】同実施形態における側板と連結軸及び組枠体と
の組み立て方法を示す説明図である。
FIG. 4 is an explanatory diagram showing a method of assembling the side plate, the connection shaft, and the frame in the embodiment.

【符号の説明】[Explanation of symbols]

10 側板 10a 貫通孔 11 金属板 12 耐蝕性樹脂 20 連結軸 21 芯材 21a 突出部 22 耐蝕性樹脂 30 組枠体 30A 連結部 30B 支持部 31 芯材 31a 突出部 32 耐蝕性樹脂 DESCRIPTION OF SYMBOLS 10 Side plate 10a Through-hole 11 Metal plate 12 Corrosion-resistant resin 20 Connecting shaft 21 Core material 21a Projection 22 Corrosion-resistant resin 30 Assembly frame 30A Connection part 30B Supporting part 31 Core material 31a Projection 32 Corrosion-resistant resin

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 基板を搭載して処理、搬送等を行うため
の基板用キャリアにおいて、芯材に耐蝕性樹脂を被覆し
てなる複数の枠材を組み立てて枠組状に形成した構造を
備え、前記枠材間の結合部においては、一方の前記枠材
には前記芯材を前記耐蝕性樹脂から突出させた突出部を
設け、他方の前記枠材には該突出部に対応した形状に形
成され、前記耐蝕性樹脂から前記芯材にまで到達する凹
部若しくは貫通孔を設けて、前記突出部を前記凹部若し
くは貫通孔内の前記芯材に係合させた上で、一方の前記
枠材の前記耐蝕性樹脂と他方の前記枠材の耐蝕性樹脂と
の接触部を封止してなることを特徴とする基板用キャリ
ア。
1. A substrate carrier for mounting, processing, transporting, and the like on a substrate, comprising a frame formed by assembling a plurality of frame members each formed by coating a core material with a corrosion-resistant resin, At the joint between the frame members, one of the frame members is provided with a protrusion that projects the core from the corrosion-resistant resin, and the other frame member is formed in a shape corresponding to the protrusion. A recess or a through-hole that reaches the core from the corrosion-resistant resin is provided, and the protrusion is engaged with the core in the recess or the through-hole. A carrier for a substrate, wherein a contact portion between the corrosion-resistant resin and the corrosion-resistant resin of the other frame material is sealed.
【請求項2】 請求項1において、前記接触部は、前記
耐蝕性樹脂同士を溶接して一体化することにより封止さ
れていることを特徴とする基板用キャリア。
2. The substrate carrier according to claim 1, wherein the contact portion is sealed by welding and integrating the corrosion-resistant resins.
【請求項3】 請求項1において、前記芯材は、Ti、
若しくはTiを主体とするTi合金で形成されているこ
とを特徴とする基板用キャリア。
3. The method according to claim 1, wherein the core material is Ti,
Alternatively, a substrate carrier formed of a Ti alloy mainly composed of Ti.
【請求項4】 請求項1において、前記枠材は、前記基
板の側端部に対して水平方向に係合し、略垂直方向に伸
びる1又は複数の係合溝を備えた一対の板状体と、該一
対の板状体が相互に対向姿勢となる状態に連結するため
の連結部材と、底部において該連結部材に対して交差し
略水平に渡された、前記基板を支えるための支持部材と
から構成されることを特徴とする基板用キャリア。
4. The pair of plate-like members according to claim 1, wherein the frame member is horizontally engaged with a side end of the substrate and has one or a plurality of engagement grooves extending in a substantially vertical direction. A body, a connecting member for connecting the pair of plate-shaped bodies in a state of facing each other, and a support for supporting the substrate, which is crossed substantially horizontally across the connecting member at a bottom portion. A carrier for a substrate, comprising: a member;
【請求項5】 基板を搭載して処理、搬送等を行うため
の基板用キャリアにおいて、一対の板状体を相互に対向
姿勢となる状態に複数の連結部材によって結合してなる
構造を備え、前記板状体及び前記連結部材は、それぞれ
芯材に耐蝕性樹脂を被覆してなり、前記板状体を被覆す
る前記耐蝕性樹脂と、前記連結部材を被覆する前記耐蝕
性樹脂とが一体化されていることを特徴とする基板用キ
ャリア。
5. A substrate carrier for mounting, processing, transporting, and the like on a substrate, comprising a structure in which a pair of plate-like bodies are connected to each other by a plurality of connecting members so as to face each other, The plate-like body and the connection member each have a core material coated with a corrosion-resistant resin, and the corrosion-resistant resin covering the plate-like body and the corrosion-resistant resin covering the connection member are integrated. A carrier for a substrate, characterized in that it is made.
JP9167154A 1997-06-24 1997-06-24 Carrier for base board Withdrawn JPH1111570A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9167154A JPH1111570A (en) 1997-06-24 1997-06-24 Carrier for base board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9167154A JPH1111570A (en) 1997-06-24 1997-06-24 Carrier for base board

Publications (1)

Publication Number Publication Date
JPH1111570A true JPH1111570A (en) 1999-01-19

Family

ID=15844432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9167154A Withdrawn JPH1111570A (en) 1997-06-24 1997-06-24 Carrier for base board

Country Status (1)

Country Link
JP (1) JPH1111570A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200445735Y1 (en) 2008-01-08 2009-08-26 다르 양 인터내셔날 테크. 컴퍼니 리미티드 Panel transport apparatus
KR100993185B1 (en) 2010-03-30 2010-11-09 이프로링크텍(주) Cassette for manufacturing process of led
CN114250470A (en) * 2021-12-07 2022-03-29 富钰精密组件(昆山)有限公司 Jig tool

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200445735Y1 (en) 2008-01-08 2009-08-26 다르 양 인터내셔날 테크. 컴퍼니 리미티드 Panel transport apparatus
KR100993185B1 (en) 2010-03-30 2010-11-09 이프로링크텍(주) Cassette for manufacturing process of led
CN114250470A (en) * 2021-12-07 2022-03-29 富钰精密组件(昆山)有限公司 Jig tool
CN114250470B (en) * 2021-12-07 2023-09-26 富钰精密组件(昆山)有限公司 Jig tool

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