JP2002217324A - Metal package for mounting and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin type metal package for mounting capable of utilizing a metal being easily obtained and enabling junction under a lead-free state. SOLUTION: The metal package for mounting has a metallic bottom plate 20 on which a part 10 is loaded. A metallic cover 30 has a top surface 31 and a side face 32 formed in an L shape in the periphery of the top surface, the part 10 is housed on the inside and the side face 32, and the cover 30 is joined with the periphery of the metallic bottom plate 20. The external angle sections 34a of the L-shaped corner sections 34 of the cover side face 32 are formed in a curved surface shape, stepped sections are formed to sections corresponding to the L-shaped corner sections 34 of the bottom plate 20, and contacting sections with the cover side face 32 of the bottom plate 20 are made thinner than a central section where the part 10 is arranged. The stepped sections 21 of the bottom plate are formed in the curved surface shape approximately fitted to the L-shaped corner sections 34 of the cover side face, and the bottom plate 20 and the cover 30 are joined under the state in which the curved surface- shape sections of these bottom plate and cover are fitted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for mounting a crystal or the like, and more particularly to a thin package used for portable equipment and the like.

[0002]

2. Description of the Related Art Conventionally, a thin mounting package for mounting a crystal or the like used in a cellular phone or the like is a ceramic base material having a concave portion for accommodating a crystal or the like and hermetically sealing the component. And a ceramic lid material, and joining them using melting of a low melting point glass or the like.

[0003]

However, the supply of ceramic base materials and lids cannot keep up with demand due to the limited number of manufacturers that produce them. Further, since a low-melting glass containing lead is used for joining the ceramic members, there is a possibility that some kind of influence will be exerted on the environment when such a package is used in the future. The present invention has been made to solve these problems, and it is an object of the present invention to provide a thin mounting metal package using a metal which is more easily available than a ceramic member and which can be joined in a lead-free manner. With the goal.

[0004]

SUMMARY OF THE INVENTION A package according to the present invention has a metal bottom plate on which components are mounted, a top surface, and an L-shaped side surface formed around the top surface, and contains the components inside. A metal lid having the side surface joined to the periphery of the metal bottom plate, and a mounting metal package, wherein an outer corner of an L-shaped corner of the lid side surface has a curved shape, and A step is provided at a portion corresponding to the L-shaped corner so that a contact portion of the bottom plate with the side surface of the lid is thinner than a central portion where the component is disposed, and a step portion of the bottom plate is formed by an L of the side surface of the lid.
It is characterized in that the bottom plate and the lid are joined in a state where the respective curved surface portions are fitted to each other, with a curved surface shape substantially fitting into a mold corner portion.

According to this, since the package material is metal, it is relatively easy to obtain it, and the bottom plate and the lid can be welded without using lead, solid welding, electron beam welding, etc., and are suitable for the environment. Package is obtained. In addition, since the bottom plate is provided with a step having a curved surface shape that substantially fits into the L-shaped corner portion of the side surface of the lid, it is possible to easily position the bottom plate and the lid by utilizing the curved step portion during manufacturing.
Furthermore, by using this curved surface step portion for the joining processing section, the area of the joining processing section can be enlarged, and the joining reliability can be improved. Further, by using the curved surface step portion for the joining processing portion, the peripheral projecting portion of the package can be reduced.

The curved shape of the L-shaped corner of the side surface is as follows:
For example, the radius of curvature of the outer corner portion may be substantially equal to the thickness of the side surface, and such a curved surface shape can be easily obtained by drawing. Further, if the step of the bottom plate is made larger than the thickness of the side surface, the joint area between the bottom plate and the lid inside the package can be further increased, and the peripheral projection of the package can be further reduced. Further, by making the fitting portion of the curved shape between the bottom plate and the lid a joining processing area, the peripheral edge protruding portion of the package can be reduced.

Further, by insulating the bottom surface of the bottom plate, the package can be closely arranged on the circuit board.

[0008] A method of manufacturing a package according to the present invention comprises a metal bottom plate on which components are mounted, a top surface, and an L-shaped side surface formed around the top surface, wherein the components are housed inside. A method of manufacturing a mounting metal package in which a side surface is bonded to a metal lid joined to the periphery of the metal bottom plate, the outer corner portion of the L-shaped corner portion of the lid side surface being curved, A step is provided at a portion corresponding to the L-shaped corner so that a contact portion of the bottom plate with the side surface of the lid is thinner than a central portion where the component is disposed, and a step portion of the bottom plate is formed into an L-shaped portion of the side surface of the lid. It is characterized in that the bottom plate and the lid are joined in a state where each of the curved surface portions is fitted together, with a curved surface shape that is substantially fitted to a corner portion.

According to this, since the package material is metal, it is relatively easy to obtain it. In addition, the joining of the bottom plate and the lid can be carried out by using lead-free welding, solid joining, electron beam welding, etc., and is suitable for the environment. It is possible to manufacture a package. In addition, since the bottom plate is provided with a curved step which fits into the L-shaped corner of the side surface of the lid, the bottom plate and the lid can be easily positioned using the curved step at the time of manufacturing. Further, by using the curved step portion for the joining processing section, the area of the joining processing section can be enlarged, and the joining reliability can be improved. Further, by using the curved surface step portion for the joining processing portion, the peripheral projecting portion of the package can be reduced.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below with reference to the drawings, using a crystal oscillator as a component housed in a package.

FIG. 1 is a plan view of a mounting metal package according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line AA of FIG.
3 is a detailed view of a portion B of FIG. 2, and FIG. 4 is a detailed view of a portion C of FIG. The metal package basically includes a metal bottom plate 20 on which the crystal unit 10 is mounted, and a metal cover 30 disposed on the bottom plate 20 to seal the crystal unit 10.
The bottom plate 20 and the lid 30 are formed by resistance welding,
The joining can be performed by using a solid joining method in which a metal is joined to a metal without a joining material, an electron beam welding, or the like.

As for the solid joining, see Japanese Patent Application Laid-Open No. 11-2
Although detailed description is omitted here since it is described in detail in Japanese Patent No. 39870, solid joining can be used for joining metal to metal, metal to ceramic, metal to glass, etc. without a joining material, and one of them is made of halogen. Are formed on the surface containing the halogen and the two are brought into contact with each other on the surface containing the halogen to bond them to each other.

The lid 30 includes a top surface 31 and L-shaped side surfaces 32 around the top surface (a vertical portion 33, an L-shaped corner portion 34, and a horizontal portion 3).
5) and a quartz oscillator 10
Is formed. In addition, L
The outer corner 34a of the mold corner 34 is formed into a curved surface, and the radius of curvature of the outer corner 34a can be made substantially equal to the thickness of the side surface 32, for example. Therefore, the lid 30 can be obtained by drawing a metal plate or the like. Note that L
The vertical portion 33 of the mold side 32 need not be perpendicular to the horizontal portion 35. In addition, the corners of the vertical portion 33 of the top surface 31 and the L-shaped side surface 32 and the corners of the vertical portion 33 and the horizontal portion 35 (L-shaped corner portions 34) are formed into curved surfaces having a large radius of curvature. , The vertical portion 33 may be omitted.

On the other hand, the bottom plate 20 is formed by
4 is provided with a step at a portion corresponding to the horizontal portion 3 of the side surface 32.
5 is made thinner than the central part 23 where the crystal unit 10 is arranged, and the step part 21 provided with the step is formed into a curved surface shape which almost fits into the corner bottom surface of the side surface 32. ing. In addition, a lead terminal lead-out hole 24 for leading the lead terminal 11 of the crystal unit 10 to the outside is formed in the bottom plate 20. Accordingly, the bottom plate 20 can be obtained by cutting or plastic working and drilling a metal plate.

An insulating bush 40 made of glass containing no lead (for example, soda glass) is joined to the lead terminal lead-out hole 24 of the bottom plate 20 by solid joining using plasma or the like. In addition, lead terminal lead-out hole 2
4 and the insulating bush 40 may be joined using welding sealing with an electron beam, lead-free bonding, or the like.

When the bottom plate 20 is thin, for example, a plate thickness of 0.2 m
In the case of about m, since the joining area between the insulating bush 40 and the bottom plate 20 is small, a flange 41 is formed at the upper end or lower end of the cylindrical insulating bush 40 as shown in FIG. 20 and this joining portion is also included in the joining process area to increase the joining force, and the insulating bush 4
0 does not fall off the bottom plate 20.

In addition, by utilizing a frustoconical insulating bush 50 and fitting it to the bottom plate 20 at the slope as shown in FIG.
The fitting portion may also be included in the bonding process area to increase the bonding strength so that the insulating bush 50 does not fall off the bottom plate 20.

The insulating bushes 40 and 50 have upper portions projecting from the bottom plate 20 and support the crystal resonator 10 by using the projecting upper end surfaces. Accordingly, the cost and labor for separately providing a member for supporting the crystal resonator 10 can be saved.

Further, as shown in FIG. 2, an insulating layer 60 such as SiO ₂ is formed on the bottom of the bottom
The package can be closely attached to a circuit board or the like by insulating the metal surface from the circuit board or the like on which the package is mounted.

The manufacture of the above package is performed as follows. First, the insulating bush 40 or 50 is closely attached to the lead terminal lead-out hole 24 of the bottom plate 20 by solid bonding or the like (Step 1). Subsequently, the lead terminal 11 is pulled out of the package through the through hole of the insulating bush 40 or 50, and the crystal unit 10 is fixed to the upper end of the insulating bush 40 or 50 (step 2). Furthermore, the bottom plate 20 and the lid 30 are positioned by fitting the side L-shaped corner 34 of the lid 30 to the step portion 21 of the bottom plate 20 (Step 3). Then, a solid joining process or a welding process is performed between the outer peripheral portion 22 of the bottom plate 20 and the side horizontal portion 35 of the lid 30 to join the bottom plate 20 and the lid 30 to seal the crystal unit 10 (Step 3). Through the above steps, a package is completed.

The order of step 1 and step 2 in the above manufacturing process is reversed, and the crystal unit 10 is fixed to the insulating bush 40 or 50 first, and the insulating bush 40 or 50 is inserted into the lead terminal lead hole. 24. Further, the outer peripheral portion 22 of the bottom plate 20 and the lid 3
In the case where the joining force is insufficient only by the joining process between the 0 side horizontal portions 35, the joining process is also performed on the fitting portion between the step portion 21 of the bottom plate 20 and the side L-shaped corner portion 34 of the lid 30. Shall be.

Although the embodiments of the present invention have been described above, according to these embodiments, the height from the bottom plate bottom surface to the lid top surface is 1 unit.
It is possible to obtain an ultra-thin package of not more than mm. Further, according to the present embodiment, the lid 30 can be composed of a metal plate having a thickness of about 0.1 mm, and the bottom plate 20 can be composed of a metal plate having a thickness of about 0.2 mm.

In the above embodiment, the components housed in the package are crystal oscillators. However, the package of the present invention is not limited to the parts housed in the package. In the above embodiment, the outer corner 34a of the L-shaped corner 34 has a curved shape over the entire circumference of the lid 30, but the present invention is not limited to this, and a part of the outer corner around the lid is formed. May have a curved surface shape. In this case, it is only necessary that the bottom plate has a curved stepped portion that substantially fits into the curved shape of the outer corner at a position corresponding to the curved shape of the outer corner.

[0024]

According to the present invention, it is possible to obtain a thin mounting metal package which can meet increasing demand and is environmentally friendly.

[Brief description of the drawings]

FIG. 1 is a plan view of a mounting metal package according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a detailed view of a portion B in FIG. 2;

FIG. 4 is a detailed view of a portion C in FIG. 2;

FIG. 5 is a detailed view showing another configuration of the part C in FIG. 2;

FIG. 6 is a detailed view showing another configuration of the part C in FIG. 2;

FIG. 7 is a detailed view showing another configuration of the part C in FIG. 2;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Crystal oscillator 11 ... Lead terminal of crystal oscillator 20 ... Bottom plate 21 ... Step part of bottom plate 22 ... Peripheral part of bottom plate 23 ... Central part of bottom plate 30 ... Lid 31 ... Top surface of lid 32 ... Side surface of lid 33 ... Vertical portion of lid side surface 34 L-shaped corner portion of lid side surface 35 Horizontal portion of lid side surface 40 Insulation bush 41 Flange of insulation bush 50 Insulation bushing 60 Insulating layer

Claims (12)

[Claims] 1. A metal bottom plate on which components are mounted, a top surface and an L-shaped side surface around the top surface, wherein the component is housed inside and the side surface is formed of the metal bottom plate. A metal package for mounting, comprising: a metal lid joined to a periphery thereof; wherein an outer corner of an L-shaped corner on the side of the lid has a curved shape, and a portion corresponding to the L-shaped corner of the bottom plate. A step is provided so that a contact portion of the bottom plate with the side surface of the lid is thinner than a central portion where the components are arranged, and a step portion of the bottom plate has a curved surface shape that substantially fits into an L-shaped corner of the side surface of the lid. A metal package for mounting, wherein the bottom plate and the lid are joined in a state where the curved surface portions are fitted together. 2. The mounting metal package according to claim 1, wherein the bottom plate and the lid are solidly joined. 3. The mounting metal package according to claim 1, wherein the bottom plate and the lid are welded to each other. 4. The mounting metal package according to claim 1, wherein said bottom plate and said lid are joined by electron beam welding. 5. The mounting metal package according to claim 1, wherein a radius of curvature of an outer corner of the L-shaped corner of the lid side surface is substantially equal to a plate thickness of the lid side surface. 6. The mounting metal package according to claim 1, wherein a step of the bottom plate is larger than a plate thickness of the side surface of the lid. 7. The mounting metal package according to claim 1, wherein the fitting portion having the curved surface is a joining processing area. 8. The mounting metal package according to claim 1, wherein a bottom surface of said bottom plate is insulated. 9. A metal bottom plate on which a component is mounted, a top surface, and an L-shaped side surface around the top surface, wherein the component is housed inside and the side surface is formed of the metal bottom plate. A method of manufacturing a mounting metal package in which a metal lid to be joined to the periphery is joined, wherein an outer corner of an L-shaped corner on the side of the lid is formed into a curved shape, and the outer corner of the L-shaped corner is formed on the bottom plate. A step is provided in a portion to be contacted to make the contact portion of the bottom plate with the side surface of the lid thinner than the central portion where the components are arranged, and the step portion of the bottom plate is substantially fitted to the L-shaped corner portion of the side surface of the lid. A method of manufacturing a mounting metal package, comprising: forming a curved surface, and joining the bottom plate and the lid while fitting each of the curved surface portions. 10. The method for manufacturing a mounting metal package according to claim 9, wherein said bottom plate and said lid are solid-bonded. 11. The method according to claim 9, wherein the bottom plate and the lid are welded to each other. 12. The method of manufacturing a mounting metal package according to claim 9, wherein said bottom plate and said lid are joined by electron beam welding.