JPH111084A - Ic card for identification of certification and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure a part for forming an image for identification of certification wherein no component is present by a method wherein the component is disposed in a biased manner on the upstream side of a card formed in the direction of carriage of surface sheets, a bonding agent is cast and pressure welding is conducted. SOLUTION: Surface sheets of an IC card are constituted of polyethylene terephthalate and the card has an image 8 for identification of certification in a part wherein an IC chip 3 protected by a sealing material 5 and an antenna coil 7 are not present. The surface sheets opposed to each other may be identical or different and a material such as polyvinyl chloride, polycarbonate, polystyrene or ABS resin is used preferably other than the polyethylene terephthalate. The part for forming the image for identification of certification wherein no component is present can be ensured, in other words, by disposing the component in a biased manner on the upstream side of the card formed in the direction of carriage of the surface sheets, by casting a bonding agent and by conducting pressure welding. As for the bonding agent, thermosetting epoxy resin is preferable particularly.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card suitable for use as an identification card such as a driver's license, an employee card, a membership card, an alien registration card, a student card, etc. The improvement in the case of manufacturing by

[0002]

2. Description of the Related Art A non-contact type IC card has no components on its surface, so it is advantageous for forming an authentication identification image such as a face image on the surface, performing printing, and preventing forgery and falsification. It is suitable for use as a card. As the manufacturing method, a heat bonding method, an adhesive bonding method, and an injection molding method are known. Among them, the adhesive bonding method has a low processing temperature,
Since there are few restrictions on the card base material to be used, there is superiority in selection of a receiving layer, a writable layer, and the like in a thermal transfer and thermal sublimation image forming method for forming an authentication identification image and bibliographic information.

FIG. 1 is a schematic view showing the structure of a non-contact type IC card prepared by an adhesive bonding method.

In the IC card shown in FIG. 1, an IC chip 3 is mounted between two top sheets 1 and 2, and an IC mounting substrate 4 on which an antenna and a capacitor are printed is sealed with a sealing material 5. It is protected and sealed in the adhesive 6. Components such as an antenna and a capacitor may be encapsulated as separate components such as a coil antenna instead of a printed circuit board.

FIG. 2 shows an example of a manufacturing process of the adhesive bonding method.

A sheet (hereinafter abbreviated as “sheet 1”) roll forming the top sheet 1 and a sheet (hereinafter abbreviated as “sheet 2”) roll forming the top sheet 2 are fed to rollers 211 and 212 of the transport mechanism 21. Each sheet is set, and the leading end of the sheet 1 is
And is passed between the press-contact mechanisms 22 and stopped by the roller 214 to be bridged. IC on sheet 2
The mounting board 4 has already been mounted.

[0007] The roller 214 is rotated at a constant speed by the driving means 215, the adhesive supply means 23 flows the adhesive between the sheets 1 and 2, and is pressed by the pressing mechanism 22. The IC card sheet wound around the roller 214
An IC card is cut into a predetermined size.

[0008]

Since the non-contact type IC card prepared by the adhesive bonding method encloses all components between the facing surface sheets as described above, the internal components are not sealed. Due to this, unevenness is easily formed on the surface not only at the time of manufacturing but also after aging. In recent years, a face image for authentication and identification is often formed by a sublimation thermal transfer method with high gradation and excellent resolution. The sublimation heat transfer method cannot be used for forming a face image on a card having such surface irregularities.

In this case, it is sufficient that no part, especially an IC chip or a coil antenna, is present in the portion where the face image is formed. However, since the step of pouring and pressing the adhesive is performed, the adhesive is mainly applied to the pressing portion. The components may be washed away due to the flow of the adhesive caused by overflow, and the components may enter the face image forming unit.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method of manufacturing an IC card suitable for authentication and identification.

[0011]

SUMMARY OF THE INVENTION It is an object of the present invention to provide at least one of a first surface sheet and a second surface sheet, each of which has an IC chip mounted thereon and is conveyed synchronously and is long. A step of pouring the adhesive by the adhesive supply means and pressing the sheet by a pressing mechanism; and a step of cutting the sheet into a predetermined size including the part enclosed by the cured adhesive between the opposed sheets. In a method of manufacturing an IC card, at least an IC chip is unevenly distributed on an upstream side of a card formed in a transport direction, and a component manufactured by the above method and located on a downstream side in the transport direction at the time of manufacture. Identification I having an authentication identification image on the outer surface of at least one of the topsheets in a position where no
Achieved by C card.

That is, when the present inventor makes a non-contact type IC card by the adhesive bonding method, the components are unevenly distributed on the upstream side of the card formed in the conveying direction of the top sheet, and the adhesive is applied. It has been found that the flow-pressure welding can secure an authentication / identification image forming section where no component exists.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to embodiments, but embodiments of the present invention are not limited thereto.

FIG. 3 shows an authentication / identification IC card obtained by the manufacturing method of the present invention.

The IC card shown in FIG. 3 has a polyethylene terephthalate sheet as the top sheets 1 and 2 and has an authentication identification image 8 in a portion where the IC chip 3 protected by the sealing material 5 and the antenna coil 7 do not exist.

The facing surface sheets 1 and 2 may be the same or different, and materials other than polyethylene terephthalate, such as polyvinyl chloride, polycarbonate, polystyrene, and ABS resin, are suitably used.

Examples of the material of the sealing material 5 include silicone rubber, polyisobutylene, butyl rubber, polysulfide rubber, and elastic epoxy resin.

As the adhesive 6, a thermosetting resin is generally used, and specifically, an epoxy resin, a polyurethane, an acrylic resin or the like is used, and an epoxy resin is particularly preferable.

In particular, when an authentication identification image such as a face image is formed by using the sublimation heat transfer method, as shown in FIG.
It is preferable that the distance from the C chip 3 (d in FIG. 3) is more than 1/2 of the distance L between the end and the card end. or,
When the authentication identification image is formed inside the antenna coil as shown in FIG. 3A, it is preferable that the distance from each side of the image facing the coil to the nearest coil is substantially equal. When the authentication identification image is formed outside the antenna coil as described above, the antenna coil facing the image is preferably substantially parallel to the image end.

[0020]

According to the method of manufacturing an IC card of the present invention, it is possible to secure a smooth authentication / identification image forming section having no components.

[Brief description of the drawings]

FIG. 1 is a non-contact type IC prepared by an adhesive bonding method.
FIG. 2 is a schematic diagram of a configuration of a card.

FIG. 2 is a diagram illustrating an example of a manufacturing process of an adhesive bonding method.

FIG. 3 is a diagram showing an example of the configuration of an authentication / identification IC card of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 2 Top sheet 3 IC chip 4 IC mounting board 5 Sealing material 6 Adhesive 7 Antenna coil 8 Face image 21 Transport mechanism 211, 212, 213, 214 Roller 215 Driving means 22 Pressure contact mechanism 221 and 222 Roller 23 Adhesive supply means

Claims (2)

[Claims] An adhesive supply means is provided between at least one of a first surface sheet and a second surface sheet which are conveyed synchronously and at least one of which includes an IC chip. In the IC card manufacturing method having a step of pouring and pressing by a pressing mechanism, and a step of cutting the sheet into a predetermined size including the part enclosed by the cured adhesive between the opposed sheets. A method of manufacturing an IC card, wherein at least an IC chip is unevenly distributed on an upstream side of a formed card. 2. The method according to claim 1, wherein an authentication identification image is provided on an outer surface of at least one of the top sheets at a position where there is no component on the downstream side in the conveyance direction at the time of manufacture. Characteristic identification IC card.