JPH11103202A - Electronic component provided with inductance - Google Patents

Abstract

PROBLEM TO BE SOLVED: To permit miniaturization and high Q by constituting an electronic component of a dielectric, a stacked matter for capacitor arranged in the dielectric, first and second terminal conductor layers provided on the outer peripheral surface of the stacked matter, and the lead wire for inductance connected to the first and second terminal conductor layer arranged on the outer periphery of the stacked matter for providing an inductance. SOLUTION: A first terminal conductor layer 1 is provided in the left side area of upper and lower main surfaces 11 and 12 and the left side areas of fore and rear side faces 15 and 16. A second terminal conductor layer 2 is provided in the central areas of the upper and lower main surface 11 and 12 and the central area of the side face 15 and has a U-shaped pattern. A metal lead wire 6 for inductance is wound around a stacked matter 5 and a dielectric 10, its one end is connected to the 1st terminal conductor layer 1 and its other end is connected to the 2nd terminal conductor layer 2. Since this electronic component is composed of the internal conductor layers of the stacked matter 5, it is miniaturized, the wire diameter of the metal lead wire 6 can be determined regardless of inter-layer peeling or the like in the stacked matter 5, and insertion loss is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a multilayer capacitor or a multilayer dielectric filter having an inductance.

[0002]

2. Description of the Related Art In order to constitute a multilayer filter, a conductor layer for inductance may be buried in a dielectric layer or a magnetic layer.

[0003]

However, it is difficult to form a low-resistance conductor layer when the inductance is formed in a stacked type, and the Q of the inductance is low and the insertion loss is large.

An object of the present invention is to provide an electronic component capable of increasing the inductance Q while securing the advantage of miniaturization by a laminated structure.

[0005]

In order to solve the above-mentioned problems and to achieve the above-mentioned object, the present invention provides a laminate comprising a dielectric and at least a conductor layer for a capacitor disposed in the dielectric, At least first and second terminal conductor layers provided on the outer peripheral surface of the laminate, and the first and second terminal conductor layers are disposed on the outer peripheral surface of the laminate so as to obtain inductance. The present invention relates to an electronic component including a conductor for inductance connected to a terminal conductor layer. In addition, as described in claim 2, a stripline conductor layer for forming a dielectric resonator can be arranged in a dielectric. In addition, a magnetic layer can be provided on the surface of the dielectric material. Also,
As described in claim 5, the conductor for inductance can be a plurality of thin metal wires.

[0006]

According to the present invention, since the inductance is constituted by the outer conductor of the laminated body, the electric resistance of the inductance can be reduced as compared with the internal conductor layer of the conventional laminated body. And the insertion loss is reduced. In addition, since the capacitor and the like are configured in a stacked type as in the related art, and the conducting wires for inductance are arranged by using the surface of the stacked body, the miniaturization can be ensured and the characteristics can be improved. According to the first and third aspects of the present invention, it is possible to reduce the size and improve the characteristics of electronic components including a parallel circuit or a series circuit of a capacitor and an inductance. According to the second and fourth aspects of the present invention, it is possible to reduce the size and improve the characteristics of the filter including the dielectric resonator.
Further, according to the third and fourth aspects of the present invention, the inductance value increases due to the function of the magnetic layer, and the interference with the internal circuit due to the concentration of the magnetic flux decreases. According to the fifth aspect of the present invention, the inductance value can be easily adjusted by adjusting the number of conductors.

[0007]

Embodiments and Examples Next, embodiments and examples of the present invention will be described with reference to the drawings.

[0008]

First Embodiment A filter device as an electronic component according to a first embodiment is used for a transceiver of a mobile communication device. As shown in FIG. 1, first, second and third filter devices are used. And a laminate 5 having fourth terminal conductor layers 1, 2, 3, and 4, and a metal lead wire 6 for inductance, and configured to obtain an equivalent circuit shown in FIG. 8.

In the equivalent circuit shown in FIG.
a, antenna terminal 2a, ground terminal 3a, and reception output terminal 4a are first, second, third, and fourth terminal conductor layers 1,
2, 3, and 4. A first dielectric resonator 7 composed of a strip line is connected between the transmission input terminal 1a and the ground terminal 3a via a first capacitor C1 to constitute a transmission filter. An inductance L1 is connected between the transmission input terminal 1a and the antenna terminal 2a. This inductance L1 is shown in FIG.
2 shows an inductance based on the inductance conducting wire 6 of FIG. Antenna terminal 2a for forming a receiving filter
A series circuit of the second, third and fourth capacitors C2, C3, C4 is connected between the second and third capacitors C2, C3, C4, and the ground terminal 3a. Between the second strip line and the second
And a third dielectric resonator 9 consisting of a third strip line is connected between the third and fourth capacitors C3 and C4 and the ground terminal 3a. Have been. Second and third dielectric resonators 8,
9 is mutually inductively coupled as indicated by M and
Are also connected to each other by the capacitor C3.

In order to obtain the equivalent circuit shown in FIG.
Is composed of a laminate of the first, second, third, fourth and fifth dielectric layers 10a, 10b, 10c, 10d and 10e shown in FIG. That is, the laminated body 5 is formed by forming the capacitors C1 to C4 and the resonator 7 of FIG.
8 and 9 are formed by laminating and firing a printed conductor paste (for example, silver paste) composed of conductive particles, frit, ie, glass powder, and an organic binder. Here, for convenience of explanation, the same reference numerals 10a to 10e are given to the dielectric layers before and after lamination.

The laminated body 5, that is, the laminated dielectric 10 having an internal conductor layer has first and second main surfaces (upper and lower surfaces) 11 and 12.
Is a hexahedron having four side surfaces 13, 14, 15, and 16, and the outer peripheral surface of the first, second, and second portions is dotted with a dot to ignore the thickness and distinguish it from other regions. Third and fourth terminal conductor layers 1, 2, 3, and 4 are provided. First
The terminal conductor layer 1 is provided in the left region of the upper and lower main surfaces 11 and 12 and the left region of the left side surface 13 and the front and rear side surfaces 15 and 16 in FIG. The second terminal conductor layer 2 is provided in the central region of the upper and lower main surfaces 11, 12 and the central region of the side surface 15, and has a U-shaped pattern as a whole. The third terminal conductor layer 3 is provided in the central region of the upper and lower main surfaces 11, 12 and the central region of one side surface 16, and has a U-shaped pattern as a whole. The fourth terminal conductor layer 4 has upper and lower main surfaces 11,
12 are provided in the right side area, the right side face 14 and the right side areas of the front and rear side faces 15 and 16.

Second dielectric layer 10 constituting dielectric 10
5b, a ground conductor layer 17 is provided as shown in FIG. 5, and a part thereof is exposed on the fourth side surface 16 of the dielectric 10,
It is connected to the third terminal conductor layer 3 connected to the ground.

The third dielectric layer 10c is provided with first, second and third stripline conductor layers 7a, 8a and 9a as shown in principle in FIG. It is exposed to the fourth side face 16 via the portion and is connected to the third terminal conductor layer 3, and the other ends thereof are open. Second
And the third stripline conductor layers 8a and 9a are M-coupled to each other because they are arranged close to each other.

As shown in FIG. 7, the first, second, third and fourth capacitor conductor layers 1 are formed on the fourth dielectric layer 10d.
8, 19, 20, and 21 are provided. The first capacitor conductor layer 18 is for obtaining the first capacitor C1 shown in FIG. 8, and is provided with a third dielectric layer 10c on the first strip line conductor layer 7a shown in FIG. The first terminal conductor layer 1 is formed so as to have a portion opposed to the first terminal conductor layer 1 via a first side surface. The second capacitor conductor layer 19 is for obtaining the second capacitor C2 of FIG. 8 and is provided on the second strip line conductor layer 8a of FIG. , And is exposed to the third side surface 15 and connected to the second terminal conductor layer 2.

The third capacitor conductor layer 20 is for obtaining the third capacitor C3 shown in FIG. 8, and is a plan view showing the second and third strip line conductor layers 8a, 8a shown in FIG. It is arranged to have a portion facing 9a. Strictly, one coupling capacitor C3 shown in FIG. 8 comprises a series circuit of two capacitors obtained between the third capacitor conductor layer 20 and the second and third stripline conductor layers 8a and 9a.

The fourth capacitor conductor layer 21 is provided for obtaining the fourth capacitor C4 of FIG. 8, and the third strip line conductor layer 9a of FIG.
And is exposed to the second side surface 14 and connected to the fourth terminal conductor layer 4.

As shown in FIG. 1, the inductance metal conductor 6 is wound around the laminate 5, that is, the dielectric 10, and one end is connected to the first terminal conductor layer 1 and the other end is connected to the second terminal conductor layer. It is connected to the conductor layer 2. The metal conductor 6 is similar to a thin metal wire used for wire bonding, and is, for example, a soft copper wire having a diameter of 10 μm to 200 μm, and the resistance between one end and the other end is a laminated inductance. It is smaller than the resistance value of the conductor layer. In addition, lead 6
Any of a bare conductor and an insulated conductor can be used. When a bare conductor is used, it is desirable to provide an insulating coating layer on the wound portion of the conductor 6.

The electronic component of this embodiment, that is, the filter device,
The other elements except for the inductance L1 in FIG.
, The size is reduced. Further, since the metal conductor 6 for obtaining the inductance L1 is wound along the outer peripheral surface of the laminated body 5,
Miniaturization is maintained. Further, the wire diameter of the metal conductor 6 can be determined irrespective of delamination or the like in the laminate 5,
By lowering the resistance value between both ends, Q can be increased, and the insertion loss can be reduced.

[0019]

Second Embodiment Next, a filter device according to a second embodiment will be described with reference to FIG. However, FIG.
10 and 11 showing the fourth embodiment, the same reference numerals are given to substantially the same portions as those in FIG. 1, and the description thereof will be omitted. 9 is the same as that shown in FIG. 1 except that the inductance metal conductor 6 in FIG. 1 is changed to a conductor 6a, and the equivalent circuit is the same as that in FIG. The inductance metal conductor 6a shown in FIG. 9 is obtained by increasing the inductance by using an insulated conductor in a spiral pattern, and the first and second terminal conductor layers 1 are provided at both ends.
2 are connected. The spiral metal conductor 6a is fixed to the laminate 5 with an insulating adhesive (not shown). According to the second embodiment shown in FIG. 9, the same effect as that of the first embodiment can be obtained. Further, in FIG. 9, since the metal wire for inductance 6a is arranged only on one main surface 11, there is no restriction on the other surface, and it is easy to mount it on a circuit board or the like by the surface mounting method.

[0020]

Third Embodiment A filter device according to a third embodiment shown in FIG. 10 is the same as that shown in FIG. 1 except that the pattern of the metal conductor 6b for inductance is modified. FIG.
At 0, the inductance value is increased by meandering the metal conductor 6b. In addition, the metal conductive wire 6b is fixed to the laminated body 5 by an insulating adhesive (not shown). This third embodiment has the same effect as the second embodiment.

[0021]

Fourth Embodiment A filter device according to a fourth embodiment shown in FIG. 11 has the same structure as that of FIG. 1 except for a metal wire 6c for inductance. In FIG. 11, in order to obtain the inductance L1 shown in FIG.
Are bonded to the terminal conductor layers 1 and 2 by a known wire bonding method. In a high frequency band, even a linearly extending conductor has inductance. In the embodiment shown in FIG. 11, an insulating protective resin layer is provided so as to cover the conductive wire 6c in order to protect the conductive wire 6c. In addition, a gold wire having a diameter of 20 μm to 50 μm, an aluminum wire having a diameter of 50 μm to 200 μm, or the like is used as the conductive wire 6 c. The filter device of FIG. 11 has the same effect as the second embodiment, and also has the effect that the inductance value can be adjusted by the number and length of the conductors 6c.

[0022]

Fifth Embodiment FIG. 12 shows an LC composite device according to a fifth embodiment. This composite device is composed of a dielectric laminate 20 and a first laminate.
And the second terminal conductor layers 21 and 22. First, second, and third capacitor conductor layers 2 are provided in a laminate 20 to form a multilayer capacitor.
3, 24 and 25 are provided. Upper and lower first and third
The capacitor conductor layers 23 and 25 of the first terminal conductor layer 21
, And the second capacitor conductor layer 24 is connected to the second terminal conductor layer 22. The inductance metal conductor 26 is wound on the outer peripheral surface of the laminate 20, one end of which is connected to the first terminal conductor 21, and the other end of which is connected to the second terminal conductor 22.

The equivalent circuit of the composite device of FIG. 12 is a parallel circuit of a capacitor C10 and an inductance L10 as shown in FIG.

In the fifth embodiment, the inductance L
Since 10 is obtained by winding the conducting wire 26 around the laminate 20, the fifth embodiment has the same effect as the first embodiment shown in FIG.

[0025]

Sixth Embodiment FIGS. 14, 15 and 16 show an LC composite component according to a sixth embodiment. The LC composite component includes a dielectric layer 30, first, second, and third capacitor conductor layers 31, 32, and 33 disposed therein, and first and second capacitor layers disposed above and below the dielectric layer 30. 2 magnetic layers 34a, 34b
And a laminate 35 composed of The first, second and third terminal conductor layers 36, 37, 3
8 and a metal conductor 39 for inductance.
Is wound. First and third capacitor conductor layers 3
Reference numerals 1 and 33 are connected to a third terminal conductor layer 38 provided on the left end surface of the multilayer body 35. A part of the second capacitor conductor layer 32 is exposed on the side surface of the multilayer body 35 and is connected to the center second terminal conductor layer 37. The center second terminal conductor layer 37 is formed so as to surround the stacked body 35 in a ring shape. One end of the metal wire for inductance 39 is connected to the first terminal conductor layer 3 provided on the right end face of the laminate 35.
6 and the other end is connected to the second terminal conductor layer 37.

The equivalent circuit of the composite device of FIG. 14 is a series circuit of an inductance L20 and a capacitor C20 as shown in FIG. The terminals 36a, 37a and 38a of FIG.
4, first, second and third terminal conductor layers 36, 37, 38
It corresponds to.

In the sixth embodiment, as in the first embodiment, the effect of reducing the size and increasing the Q of the inductance L20 is obtained. Further, the effect of increasing the inductance value by the magnetic material layers 34a and 34b and the effect of the magnetic flux are reduced. The concentration has an effect of suppressing interference with the inside of the stacked body 35.

[0028]

[Modifications] The present invention is not limited to the above-described embodiment, and for example, the following modifications are possible. (1) The magnetic layers 34a and 34 shown in FIGS. 14 and 15
What corresponds to b can be provided on the outer peripheral surfaces of the laminates 5 and 20 of the first, second, third, fourth and fifth embodiments shown in FIGS. (2) FIGS. 14 and 15 show the magnetic layers 34a and 34b.
Are disposed so as to cover the upper and lower main surfaces of the dielectric layer 30, but a magnetic layer may be provided so as to cover the side surfaces of the dielectric layer 30 as well. That is, the magnetic layer can be provided so as to cover the dielectric in a cylindrical shape. (3) The electric circuits provided in the laminates 5, 20, 35 can be variously modified.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing a filter device according to a first embodiment.

FIG. 2 is an exploded front view of the laminate of FIG.

FIG. 3 is a rear view of the laminate of FIG.

FIG. 4 is a bottom view of the laminate of FIG.

FIG. 5 is a plan view showing a second dielectric layer of FIG. 2 and a conductor pattern thereon.

FIG. 6 is a plan view schematically showing a third dielectric layer of FIG. 2 and a conductor pattern thereon.

FIG. 7 is a plan view schematically showing a fourth dielectric layer of FIG. 2 and a conductor pattern thereon.

8 is an equivalent circuit diagram of the filter device of FIG.

FIG. 9 is a perspective view schematically showing a filter device according to a second embodiment.

FIG. 10 is a perspective view schematically showing a filter device according to a third embodiment.

FIG. 11 is a perspective view schematically showing a filter device according to a fourth embodiment.

FIG. 12 is a front view showing an LC composite device according to a fifth embodiment.

FIG. 13 is an equivalent circuit diagram of the composite device of FIG.

FIG. 14 is a perspective view showing an LC composite device according to a sixth embodiment.

FIG. 15 is a cross-sectional view of the composite device of FIG.

FIG. 16 is an equivalent circuit diagram of the composite device of FIG.

[Explanation of symbols]

 1-4 1st-4th terminal conductor layer 5 laminated body 6 metal wire for inductance

Claims (5)

[Claims] 1. A laminate comprising a dielectric and at least a capacitor conductor layer disposed in the dielectric, and at least first and second terminal conductor layers provided on an outer peripheral surface of the laminate. And an inductance conductor disposed on the outer peripheral surface of the laminate so as to obtain an inductance and connected to the first and second terminal conductor layers. 2. A laminate comprising: a dielectric; a strip line conductor layer for constituting a dielectric resonator disposed in the dielectric layer; and a conductor layer for constituting a capacitor; and the laminate. At least the first and second
An electronic device comprising: a third terminal conductor layer; and an inductance conducting wire disposed on the outer peripheral surface of the laminate so as to obtain an inductance and connected to the first and second terminal conductor layers. parts. 3. A laminate comprising: a dielectric; a conductor layer for at least a capacitor disposed in the dielectric; and a magnetic layer disposed so as to cover at least a part of a surface of the dielectric; At least first and second terminal conductor layers provided on the outer peripheral surface of the laminate; and at least a portion of the magnetic material layer disposed on the outer peripheral surface of the laminate so as to obtain inductance. An electronic component comprising: an inductance conductor disposed on the first and second terminal conductor layers and connected to the first and second terminal conductor layers. 4. A dielectric, a stripline conductor layer for forming at least a dielectric resonator disposed in the dielectric, and a conductor layer for forming a capacitor, and at least a part of a surface of the dielectric. And a magnetic layer disposed so as to cover the first layer and at least a first and a second layer provided on an outer peripheral surface of the layer.
And a third terminal conductor layer, disposed on the outer peripheral surface of the laminate so as to obtain inductance, and at least a part thereof is disposed on the magnetic layer, and the first and second terminals are provided. An electronic component comprising an inductance conductor connected to the conductor layer. 5. The electronic component according to claim 1, wherein the inductance conductor comprises a plurality of metal conductors connected to the first and second terminal conductor layers, respectively. .