JPH109826A - Measuring method of dimensions of pga base - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a measuring method of dimensions of a PGA(pin grid array) base which enables improvement of the accuracy in measurement of the dimensions of the PGA base and further simultaneous execution of measurement of a center-parted dimension of a through hole, by a relatively simple constitution. SOLUTION: In a method for measuring dimensions Y and X in two orthogonal directions, i.e., the longitudinal direction and the lateral direction, of the outlines of a PGA base 1 having a rectangular shape and having a large number of through holes 2 arranged at equal intervals to be rectangular along the outlines, the distances between the centers of the through holes 2 positioned in the outermost end parts on both right and left sides in respect to the longitudinal and lateral directions and the side end edges of the PGA base 1 are measured respectively by local image processing of each corner part of the PGA base 1, and the sums obtained by adding to the measured distances the distances between the through holes 2 positioned in the outermost end parts on both the right and left sides in respect to the directions of the axis (y) and the axis (x) are calculated respectively as the dimension Y in the longitudinal direction and the dimension X in the lateral direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for measuring the outer dimensions of a Pinglit Array (PGA) substrate.

[0002]

2. Description of the Related Art Conventionally, in manufacturing a PGA substrate having a rectangular shape and a large number of through holes arranged in a grid pattern, there is a step of cutting the individual circuits after forming a circuit. At that time, the dimensional inspection of the obtained PGA substrate is performed. In the dimension inspection of the PGA substrate, an outer dimension of the PGA substrate, a central distribution dimension for confirming a formation position of a through hole in the PGA substrate, and the like are measured and compared with prescribed dimensions.

Conventionally, for measuring the external dimensions of a PGA substrate, a method of measuring the vertical and horizontal dimensions of the external shape of the PGA substrate by performing image processing on the entire PGA substrate at once. The center distribution dimension refers to the distance from the center of the through hole to the side edge of the PGA substrate in each of the vertical and horizontal directions for the through hole located at the outermost edge of the PGA substrate. This is for checking the presence / absence of deviation, and the central distribution dimension is measured with a caliper or the like. In the dimension inspection of the PGA substrate, for example, ± 10
When it deviated from 0 μm, it was determined that the size was defective. Therefore, in the dimensional inspection, a high level of accuracy is required for the measurement accuracy of the dimension measurement. For example, a measurement accuracy of ± 50 μm has been desired.

[0004]

However, when the external dimensions of the PGA substrate are measured by collectively performing image processing as described above, the resolution is reduced by the number of pixels, and the measurement accuracy is low. Was something. On the other hand, if the resolution is improved by increasing the number of pixels of the image processing device, the measurement accuracy can be increased, but an extremely expensive image processing device is required.

In addition, since the measurement of the outer diameter of the PGA substrate and the measurement of the central distribution of the through hole are performed separately, it has been desired that the efficiency can be improved by performing them all at once.

The present invention has been made in view of the above circumstances, and can improve the measurement accuracy of the outer dimensions of a PGA substrate with a relatively simple configuration. Can be performed simultaneously
An object of the present invention is to provide a method for measuring the outer dimensions of a GA substrate.

[0007]

According to a first aspect of the present invention, there is provided a method for measuring the outer dimensions of a PGA substrate, wherein the outer dimensions of the PGA substrate are rectangular and are arranged at regular intervals along the outer shape. A method for measuring the outer and vertical dimensions of an outer shape of a PGA substrate having a large number of through-holes, the method comprising: locally measuring an image of each corner of the PGA substrate; The sum of the distance between the through hole located at the extreme end and the side edge of the PGA substrate was measured, and the sum of the distances between the extreme ends of the through holes located on both the left and right sides in the vertical and horizontal directions was calculated. It is characterized in that it is calculated as the outer dimensions in the vertical and horizontal directions.

According to a second aspect of the present invention, there is provided a method for measuring an outer dimension of a PGA substrate according to the first aspect, further comprising the step of: Is characterized by using a value obtained by multiplying the distance between adjacent through holes by the number obtained by subtracting 1 from the number of through holes arranged in the same direction.

According to a third aspect of the present invention, there is provided a method for measuring the outer dimensions of a PGA substrate according to the first aspect, wherein one of the PGA substrate and the camera for image processing is placed on an xy table in the vertical and horizontal biaxial directions. The PGA substrate or the camera for image processing when moving either one of the PGA substrate or the camera for image processing in the vertical and horizontal biaxial directions to perform image processing on each corner of the PGA substrate. The moving distance is characterized by a distance between the through holes located at the extreme left and right ends in the moving direction.

According to a fourth aspect of the present invention, there is provided a method for measuring the outer dimension of a PGA substrate according to the third aspect, wherein one of the image processing camera and the PGA substrate is moved in two axial directions. When image processing is performed on each corner of the PGA substrate, the misalignment dimension between the through hole located at the end and the image center at each corner is measured in the vertical and horizontal biaxial directions, and the measured value at this time is measured. Thus, an error between the moving distance of the PGA substrate or the image processing camera and the distance between the through holes located at the extreme left and right ends in the moving direction is calibrated.

[0011]

Embodiments of the present invention will be described below.

FIG. 1 shows a PGA for measuring external dimensions in a method for measuring the external dimensions of a PGA substrate according to an embodiment of the present invention.
It is a top view which shows a board | substrate.

According to the method for measuring the outer dimensions of a PGA substrate according to the present invention, the outer shape of a PGA substrate 1 having a rectangular shape and having a large number of through holes 2 arranged at regular intervals along the outer shape is perpendicular to two directions, ie, The vertical dimension Y and the horizontal dimension X are measured. Each corner portion of the PGA substrate 1 is locally image-processed, and is positioned at the leftmost and rightmost ends in the vertical direction and the horizontal direction, respectively. Surhole 2
The distance obtained by measuring the distance between the center and the side edge of the PGA substrate 1 and adding the distance between the through holes 2 and 2 located at the left and right extreme ends in the x-axis direction and the y-axis direction, respectively, The vertical dimension Y and the horizontal dimension X, respectively.
Is calculated as

A method for measuring the outer dimensions of a PGA substrate according to the first embodiment of the present invention will be described. FIG. 2 is an explanatory diagram of a method for measuring the outer dimensions of the PGA substrate according to the first embodiment. Based on FIG.
The principle of measuring the external dimensions will be described. The four corners of the PGA substrate 1 are locally enlarged and photographed by an image processing camera, and the image processing is performed, whereby the through holes 2 located at the extreme end of each corner are brought close to the through holes 2. The distance between the vertical and horizontal side edges of the PGA substrate 1 and the center of the through hole 2 is measured. At this time, for example, the case of calculating the lateral dimension X of the PGA substrate 1 will be described. The right and left corners of the PGA substrate 1 measured at the left and right corners on one side in the lateral direction by the above-described image processing are respectively located. 2 and P
The distance X3 between the centers of the through holes 2 and 2 at the left and right ends in the horizontal direction is calculated and added to the distances X1 and X2 with the side edge of the vertical side of the GA substrate 1, and the sum is defined as a dimension X. At this time, the distance X3 between the centers of the through holes 2 and 2 located at the left and right ends in the lateral direction is the distance a between the adjacent through holes 2 and 2 in the same direction and the total number of the through holes 2 aligned in the same direction. n
This is calculated by multiplying (n is an integer of 2 or more) by subtracting 1. That is, the formula for calculating the dimension X is as follows: X = X1 + X2 + X3 = X1 + X2 + a × (n-1)

In the method for measuring the outer dimensions of the PGA substrate,
The dimension Y in the vertical direction of the PGA substrate 1 can be obtained in the same manner as the dimension X described above. In this way, all dimensions of the outer four sides, which are the external dimensions of the PGA substrate 1, can be measured. It is.

As described above, in the method for measuring the outer dimensions of the PGA substrate, each corner portion of the PGA substrate 1 is locally enlarged and image-processed, so that each corner portion is image-processed with high resolution. Therefore, the through holes 2 and P located at the extreme ends at each corner are
The distance between the vertical and horizontal edges of the GA substrate 1 can be measured with high accuracy. In general, in the PGA substrate 1, the through holes 2 are formed at a predetermined interval with high precision by a precision drilling machine controlled by a computer. Therefore, the distance a between the through holes 2 and 2 adjacent in the same direction is the same in the same direction. The sum can be regarded as being equal to the distance between the centers of the through holes 2 at the left and right ends in the same direction. Therefore, the method for measuring the outer dimension of the PGA substrate can accurately measure the outer diameter of the PGA substrate 1 and can be performed by a relatively simple device. At the same time, at the same time, the through holes 2 located at the end portions at the respective corner portions of the PGA substrate 1 are formed.
Since the measurement of the distance between the PGA substrate 1 and the vertical and horizontal edges of the PGA substrate 1, that is, the measurement of the central distribution dimension of the through hole 2, the dimensional inspection of the PGA substrate 1 can be performed efficiently.

In this embodiment, as shown in FIG. 3, a chamfered portion 3 is formed by cutting a part at one of the four corners of the PGA substrate 1. In the corner portion, as shown by a dotted line in the figure, a straight line is complemented, and an extension line of both the vertical and horizontal sides of the PGA substrate 1 is imagined. It measures the distance to the edge.

A method for measuring the outer dimensions of a PGA substrate according to a second embodiment of the present invention will be described. FIG. 4 is an explanatory diagram of a method for measuring the outer dimensions of a PGA substrate according to the second embodiment. Based on FIG. 4, the principle of measuring the outer dimensions of the PGA substrate 1 in the second embodiment will be described. In the second embodiment, similarly to the first embodiment, the four corners of the PGA substrate 1 are locally enlarged and photographed by an image processing camera, and the image processing is performed to obtain the maximum of each corner. With respect to the through hole 2 located at the end, the distance between the longitudinal and lateral side edges of the PGA substrate 1 close to the through hole 2 and the center of the through hole 2 is measured, and the above measured values in the same direction are measured. The outer dimension is measured by taking the sum of the distance between the centers of the through holes 2 and 2 at both ends in the same direction as the dimension of the PGA substrate 1 in that direction, but in the second embodiment, The method of calculating the distance between the centers of the through holes 2 at the left and right ends in the same direction is different from that of the first embodiment.

In the second embodiment, the camera for image processing is P
The camera is mounted on an xy table facing the GA substrate 1 so as to be movable in the vertical and horizontal directions. When the image processing camera is moved in the vertical and horizontal directions, image processing of each corner of the PGA substrate 1 is performed. The distance between the centers of the through holes 2 and 2 located at the left and right ends in the moving direction at this time is calculated from the moving distance of the image processing camera moving from one corner to another corner. It is.

In the method for measuring the outer dimensions of a PGA substrate according to the second embodiment, for example, a case where the lateral dimension X of the PGA substrate 1 is calculated will be described. As shown in FIG.
The distances X1 and X2 between the center of the through hole 2 located at the outermost end and the side edge on the longitudinal side of the PGA substrate 1 were measured by the above-described image processing for both the left and right corners on one side in the horizontal direction of the GA substrate 1, The distance X3 between the centers of the through holes 2 at the right and left ends in the horizontal direction is calculated from the moving distance X5 of the image processing camera in the horizontal direction, and the sum is added.
And

At this time, the moving distance X5 of the image processing camera with respect to the left and right corners in the horizontal direction is the distance between the image centers S1 and S2 when the image processing camera has photographed the left and right corners, respectively. Will be equal. Here, the image centers S1 and S2 do not always coincide with the centers of the through holes 2 and 2 at the left and right ends in the horizontal direction. In this case, the image centers S1 and S2 and the through holes 2 and 2
The distance X3 between the centers of the through holes 2 at the left and right ends and the moving distance X5 of the image processing camera do not coincide with each other by the distances X6 and X7 that are shifted in the horizontal direction. Therefore,
In calculating the distance X3 between the centers of the through holes 2 at the left and right ends from the moving distance X5 of the image processing camera,
Calibration is required based on the shifted distances X6 and X7. For example, the shifted distances X6 and X7 when the image centers S1 and S2 are shifted inward with respect to the centers of the through holes 2 and 2 at the left and right ends are set to plus values, and the shifted distance X6 when the image centers S1 and S2 are shifted outward. , X7 is defined as a negative value, the distance X3 between the centers of the through holes 2 at the left and right ends is equal to the sum of the moving distance X5 of the image processing camera and the displaced distances X6, X7. Become. Therefore, in this case, PGA
The formula for calculating the lateral dimension X of the substrate 1 is as follows: X = X1 + X2 + X3 = X1 + X2 + (X5 + X6 + X7)

In the method for measuring the outer dimensions of a PGA substrate, P
The dimension Y in the vertical direction of the GA substrate 1 can be obtained in the same manner as the dimension X described above.
The outer dimensions of the GA substrate 1 can be measured on all four sides.

As described above, in the method of measuring the outer dimensions of the PGA substrate, each corner portion of the PGA substrate 1 is locally enlarged and image-processed, so that the through hole located at the outermost end at each corner portion is obtained. The distance between the two centers and the vertical and horizontal edges of the PGA substrate 1 can be measured with high accuracy. Further, the distance between the centers of the through holes 2 and 2 at the left and right ends can be accurately calculated from the moving distance of the image processing camera. Therefore, the method for measuring the outer dimension of the PGA substrate can accurately measure the outer diameter of the PGA substrate 1 and can be performed by a relatively simple device. At this time, at the same time, the distance between the through hole 2 located at the end of each corner of the PGA substrate 1 and the vertical and horizontal edges of the PGA substrate 1, that is, the central distribution dimension of the through hole 2 was measured. Therefore, the dimensional inspection of the PGA substrate 1 can be performed efficiently.

[0024]

As described above, according to the first aspect of the present invention,
According to the method for measuring the outer dimensions of a PGA substrate according to claim 4, each corner portion of the PGA substrate 1 is locally image-processed, and the through hole 2 located at the leftmost and rightmost ends in the vertical and horizontal directions respectively. The distance obtained by measuring the distance between the center and the side edge of the PGA substrate 1 and adding the distance between the through holes 2 and 2 located at the left and right extreme ends in the x-axis direction and the y-axis direction, respectively, By the method of calculating the vertical dimension Y and the horizontal dimension X, respectively, it is possible to improve the measurement accuracy of the outer dimensions of the PGA substrate with a relatively simple configuration, and it is also possible to measure the central distribution dimension of the through hole. It can be done at the same time.

[Brief description of the drawings]

FIG. 1 is a PG for measuring external dimensions according to an embodiment of the present invention.
It is a top view which shows A board | substrate.

FIG. 2 is an explanatory diagram of a PGA substrate outer dimension measuring method according to the first embodiment of the present invention.

FIG. 3 is a top view showing a chamfered portion of the PGA substrate according to the embodiment of the present invention.

FIG. 4 is an explanatory diagram of a method for measuring the outer dimensions of a PGA substrate according to a second embodiment of the present invention.

[Explanation of Signs] 1 PGA substrate 2 Through hole

Claims (4)

[Claims] 1. A PGA substrate outer dimension measuring method for measuring the vertical and horizontal dimensions of an outer shape of a PGA substrate having a large number of through holes formed in a rectangular shape and arranged at regular intervals along the outer shape of the PGA substrate. Each corner is locally image-processed to measure the distance between the through hole located at the leftmost end on each of the left and right sides and the side edge of the PGA substrate in the vertical direction and the horizontal direction, respectively. A method for measuring the outer dimensions of a PGA substrate, wherein a sum of the distances between the through holes located at the extreme left and right ends in each of the directions is calculated as the outer dimensions in the vertical and horizontal directions. 2. The number of through holes arranged in the same direction as the distance between the adjacent through holes in the longitudinal direction and the lateral direction of the PGA substrate, the distance between the through holes located at the left and right end portions. 2. A numerical value obtained by multiplying a value obtained by subtracting 1 from the value of the number.
The method for measuring the outer dimensions of a PGA substrate described in the above. 3. A PGA substrate or an image processing camera is mounted on an xy table so as to be movable in two vertical and horizontal directions, and one of the PGA substrate and the image processing camera is moved in two vertical and horizontal directions. When performing image processing on each corner of the PGA substrate, the moving distance of the PGA substrate or the camera for image processing is set to the distance between the through holes located at the extreme left and right ends in the moving direction. The method for measuring the outer dimensions of a PGA substrate according to claim 1, wherein: 4. When one of the image processing camera and the PGA substrate is moved in two vertical and horizontal directions to perform image processing on each corner of the PGA substrate, the corner is located at the end of each corner. The displacement between the through hole and the center of the image is measured in the vertical and horizontal biaxial directions, and the measured value at this time indicates the moving distance of the PGA substrate or the image processing camera and the right and left ends in the moving direction. 4. The method for measuring an outer dimension of a PGA substrate according to claim 3, wherein an error with a dimension of a distance between the located through holes is calibrated.