JPH1092657A - Thin film chip parts and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide thin film chip parts in which the occurrence of the peeling of a thin film in a flat section is eliminated and which is improved in environmental resistance, by using glass for a flattened section and a protective film. SOLUTION: A flattened section 2 is formed by screen-printing glass paste on a scribed ceramic substrate 1 for thick film in a block-like shape and flattening the paste in a desired block-like shape by baking the paste. Then, a grid-like pattern 3 is formed on the exposed surface of the substrate 1 with a photoresist, and a metallic thin film 4 is formed on the entire surface of the substrate 1 by means of a thin film forming device. After a thin film 4 is formed, a lift-off process is performed on the substrate 1 by using ultrasonic waves in an organic solvent. Then, a thin film element is formed through each process and a protective film is formed with glass. Therefore, thin film chip parts in which the peeling of the thin film 4 in the flat section 2 is eliminated and which is improved in environmental resistance is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin-film chip component and a method of manufacturing the thin-film chip component, and more particularly, to a method of flattening a surface of a scribed ceramic substrate in a chip size area in a block shape with printing glass. A thin film element is formed on a flattened portion, and a thick film printing method is used for processing a protective film and terminals.

[0002]

2. Description of the Related Art In a conventional method of manufacturing a thin film chip component, for example, when a ceramic substrate is used, the entire surface of the substrate is flattened by spin-coating a heat-resistant resin or the like, followed by thin film formation, photolithography, and the like. Form a thin-film element by etching, etc., protect the thin-film element with heat-resistant resin, perform slit processing using a dicing saw, and form a metal thin film on both sides of the terminals under the solder plating base. In this method, a chip component is manufactured by splitting a chip and performing solder plating.

[0003]

In this manufacturing method, since the flattening process is performed on the entire surface of the substrate, there is a disadvantage that the thin film of the terminal portion is easily peeled at the time of slitting with a dicing saw and chip division, and the yield is poor.

In addition, even if the peeling does not occur at the time of the above-mentioned processing, the barrel plating method is used at the time of solder plating, so that there is a disadvantage that plating failure due to peeling or the like occurs at that time.
Further, when the metal thin film is etched by ion milling or the like, there is a disadvantage that etching residue is apt to occur, resulting in a short circuit between terminals.

Further, in the conventional method, since a heat-resistant resin is used for the flattening process and the protective film, if there is a high-temperature step of 400 ° C. or more, there is a disadvantage that this step cannot be used. In such a method, there is a disadvantage that the manufacturing cost is increased because a substrate having scribe lines cannot be used.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional drawbacks, and when manufacturing a chip component using a thin film, only a flattening process using glass is performed on a thin film element forming area, and the thin film element portion is protected. It is an object of the present invention to provide a thin-film chip component which is excellent in heat resistance by using glass as a film, does not lose breakability at the time of chip division, and can prevent peeling of a thin film, and a method for manufacturing the same. .

[0007]

A thin-film chip component according to the present invention is characterized in that glass is used for a flattening section and a protective film.

As a result, the thin film on the flattened portion is not peeled off, and is excellent in environmental protection.

According to a second aspect of the present invention, there is provided a method of manufacturing a thin film chip component, the method comprising the steps of: It is characterized in that the surface is flattened in a block shape by a printing method using a glass paste.

As a result, the flattening process using glass is performed only on the thin film element formation area, so that the heat resistance is excellent, the breakability is not lost during chip division, and the thin film is prevented from peeling.

According to a third aspect of the present invention, a thin film is formed on a ceramic substrate which has been planarized in a block shape,
The method is characterized in that a step of forming a lattice pattern is provided at a chip component dividing position.

As a result, unlike the prior art, there is no occurrence of slitting with a dicing saw and peeling of the thin film of the terminal portion at the time of chip division.

According to a fourth aspect of the present invention, a protective film is formed on the thin film element portion by using a printing method with a glass paste.

Thus, a thin-film chip component excellent in environmental friendliness can be obtained.

According to the fifth aspect, the second aspect is provided.
In the method of manufacturing a thin film chip component according to any one of the first to fourth aspects, a thick film forming step and a thin film forming step are mixed.

This makes it easy to set each step,
Excellent thin-film chip components can be easily manufactured.

[0017]

1A and 1B show a block-like flattening portion in a process of manufacturing a thin film chip component according to the present invention. FIG. 1A is a plan view, FIG. 1B is a cross-sectional view, and FIG. FIG. 4 is a cross-sectional view showing a state in which is formed with a photoresist and removed.

For example, a glass paste is screen-printed in a block shape on the scribed thick-film ceramic substrate 1 and fired to be subjected to a flattening process in a desired block shape to form a flattened portion 2. Further, before the metal thin film 4 is formed on the entire surface of the substrate by the thin film forming apparatus, a pattern is formed in a lattice pattern mainly using the exposed portions of the ceramics substrate using the photoresist 3. However, the baking temperature after pattern formation is the same as the pre-bake temperature in order to improve the lift-off property.

Thereafter, a metal thin film (Cr / Cu / Cr, Al) is formed by a thin film forming apparatus (sputtering method, vapor deposition method, CVD method, etc.).
Etc.) 4 is formed on the entire surface. Thereafter, lift-off processing is performed by ultrasonic waves in an organic solvent. The lift-off process at this time prevents the remaining etching. Further, there is no metal thin film at the location of the lattice pattern. As a result, a short circuit between the terminals can be prevented in advance. Further, a desired pattern is formed by a photoresist, and the resist is removed by etching by ion milling or the like.

Next, an insulating film (such as silicon dioxide) is formed by a thin film forming apparatus, etched by reactive ion etching, and the resist is removed. Further, a metal thin film is formed. In this case as well, a metal thin film is formed after forming a lattice pattern as described above. Thereafter, a partial plating pattern is formed by a photoresist, and gold or the like is plated to a desired film thickness by an electroplating method or the like, and then, the photoresist is removed. At this time, the lattice pattern is also removed by ultrasonic waves in the organic solvent, whereby the lattice pattern portion is also lifted off. This prevents etching residue and the like in advance. Thereafter, portions other than the plating pattern are etched by ion milling or the like. After forming the thin film element in this way, a protective film is formed by screen printing using a glass paste, and after calcination,
A strip is formed along the scribe line, and a metal paste is dip-coated on the front and back surfaces and both end surfaces as a plating base on the chip terminal portion. Then, it is baked, divided into chips along scribe lines, and plated with Ni and solder by a barrel plating method. A thin-film chip component is formed by the above steps.

By manufacturing according to the above method,
Since the flattening process is performed in a block shape, the breakability at the time of chip division is not lost, and there is no peeling of the thin film at the flattened part, and the thin film is directly formed on the ceramic surface at the chip terminal part. Very strong adhesion strength,
The film does not peel off, and the film does not peel off during barrel plating (solder plating).

In addition, the chips are laid out uniformly on the substrate, and the ceramic surface is exposed between adjacent chips, but the photoresist is formed in a lattice shape, so that the metal thin film does not directly adhere. As a result, the etching residue, which is the cause of the short circuit between chip terminals, can be eliminated. Moreover, since the thin-film element is protected by glass, it is excellent in environmental protection.

[0023]

According to the thin-film chip component of the present invention, the thin film in the flattened portion does not peel off, and the thin-film chip component is excellent in environmental friendliness.

According to the method of manufacturing a thin-film chip component according to the present invention, in the device of the second aspect, only the thin-film element forming area is flattened with glass, so that it has excellent heat resistance and can be used for chip division. In this case, the breakability is not lost, and the peeling of the thin film can be eliminated.

According to the third aspect of the present invention, the slit processing by the dicing saw and the peeling of the thin film of the terminal portion at the time of chip division do not occur as in the prior art.

According to the fourth aspect of the present invention, a thin-film chip component excellent in environmental friendliness can be easily manufactured.

According to the fifth aspect, setting of each step is easy, and an excellent thin-film chip component can be easily manufactured.

As described above, according to the manufacturing method of the present invention, a thin film element can be formed on a scribed ceramic substrate for thick film printing, and the material cost can be further reduced. In addition, the short circuit between the terminals of the chip component can be eliminated, and the film peeling does not occur, so that the yield is greatly improved. Moreover, since a scribed substrate can be used, the manufacturing cost can be significantly reduced.

[Brief description of the drawings]

FIG. 1 shows an outline of a block-shaped flattened portion and a lattice pattern formed by a photoresist in a method of manufacturing a thin-film chip component according to the present invention, wherein (A) is a plan view and (B) is a cross-sectional view.

FIG. 2 is a cross-sectional view showing a state in which a lattice pattern is formed of a photoresist and removed.

[Explanation of symbols]

 Reference Signs List 1 ceramic substrate 2 flattened part 3 photoresist 4 metal thin film

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kaoru Nemoto 8682 Nakaminowa, Minowa-machi, Kamiina-gun, Nagano Prefecture Tad Electronics Co., Ltd.

Claims (5)

[Claims] 1. A thin-film chip component wherein glass is used for a flattening section and a protective film. 2. A method of manufacturing a thin-film chip component, comprising: flattening a surface of a scribed thick film printing ceramic substrate into a block shape using a glass paste by a printing method when the ceramic substrate is flattened. Characteristic method of manufacturing thin film chip components. 3. A method for manufacturing a thin-film chip component, comprising the steps of: forming a thin film on a ceramic substrate that has been planarized in a block shape; and forming a grid pattern at a chip component division. 4. A method of manufacturing a thin-film chip component, comprising forming a protective film on a thin-film element portion using a glass paste by a printing method. 5. The method of manufacturing a thin-film chip part according to claim 2, wherein a step of forming a thin film and a step of forming a thin film are mixed in the step of manufacturing the thin-film chip part.