JPH1084195A - Composite magnet body and electromagnetic interference suppressor equipped therewith - Google Patents
Composite magnet body and electromagnetic interference suppressor equipped therewithInfo
- Publication number
- JPH1084195A JPH1084195A JP8237724A JP23772496A JPH1084195A JP H1084195 A JPH1084195 A JP H1084195A JP 8237724 A JP8237724 A JP 8237724A JP 23772496 A JP23772496 A JP 23772496A JP H1084195 A JPH1084195 A JP H1084195A
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- JP
- Japan
- Prior art keywords
- electromagnetic interference
- composite magnetic
- organic binder
- composite
- magnetic body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Measuring Magnetic Variables (AREA)
- Hard Magnetic Materials (AREA)
- Soft Magnetic Materials (AREA)
- Coils Or Transformers For Communication (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は主に高耐熱性、高熱
伝導性を要求される電子部品に用いられる複合磁性体、
及び複合磁性体を用いた電磁干渉抑制体に属し、さらに
は、高周波領域において不要電磁波の干渉によって生じ
る電磁障害を抑制するために用いられる複合磁性体、及
び複合磁性体を用いた電磁干渉抑制体に属する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to a composite magnetic material used for electronic parts which require high heat resistance and high thermal conductivity.
And a composite magnetic body used for suppressing electromagnetic interference caused by interference of unnecessary electromagnetic waves in a high-frequency region, and an electromagnetic interference suppressor using the composite magnetic body Belongs to.
【０００２】[0002]
【従来の技術】従来、過密に実装された電子部品類やプ
リント配線には、信号処理速度の高速化が図られている
ため、静電及び電磁結合による線間結合の増大化や放射
ノイズによる干渉が生じ、電子機器類の正常な動作を妨
げる事態が少なからず生じている。2. Description of the Related Art Conventionally, electronic components and printed wirings which are densely mounted are designed to have a higher signal processing speed. There are not a few situations where interference occurs and hinders normal operation of electronic devices.
【０００３】このようないわゆる電磁障害に対して、従
来は回路の出力端子毎にローバスフィルタ等を接続し、
不要な高周波電流を抑制したり、問題となる回路を遠ざ
けるような方策を講じる等で電磁障害の原因となる電磁
結合、不要輻射や伝導ノイズ等を抑制していた。Conventionally, a low-pass filter or the like is connected to each output terminal of a circuit to cope with such a so-called electromagnetic interference.
Unnecessary high-frequency currents have been suppressed, and measures to keep the problematic circuits away have been taken to suppress electromagnetic coupling, unnecessary radiation, conduction noise, and the like that cause electromagnetic interference.
【０００４】これら高周波電子機器のさらなる小型、軽
量化を実現する具体策として、例えば、一枚のプリント
配線基板に異なる回路を混在（例えば、電力回路と小信
号回路）させたり、回路ごとに小基板化し、それらを重
ね合わせて実装するといった手段が取られることが多く
なってきている。As specific measures for realizing further reduction in size and weight of these high-frequency electronic devices, for example, different circuits are mixed on a single printed wiring board (for example, a power circuit and a small signal circuit), or each circuit is reduced in size. Means of forming substrates and mounting them on top of each other are increasing.
【０００５】しかし、特に、複数の配線基板を重ね合わ
せて実装する場合においては、部品間や配線基板間の電
磁干渉に由来する電磁障害の起こりうる可能性が極めて
高くなり、何等かの対策が不可欠となる。これらの配線
基板間における干渉の対策手段としては、一般に、導電
性のシールド材（銅、アルミニウム等）を配線基板間に
挿入することが行われている。上記した配線基板では、
部品実装密度が高くなっているために、高周波磁界波は
ノイズ源に対して低インピーダンスとなっている。[0005] However, particularly when a plurality of wiring boards are mounted on top of each other, the possibility of electromagnetic interference resulting from electromagnetic interference between components and wiring boards becomes extremely high. Become indispensable. As a measure against interference between these wiring boards, generally, a conductive shielding material (copper, aluminum, or the like) is inserted between the wiring boards. In the above wiring board,
Due to the increased component mounting density, high-frequency magnetic field waves have low impedance to noise sources.
【０００６】しかし、上述した配線基板では、ノイズ源
となる一方の配線基板に対向する他方の配線基板に対し
ての遮蔽効果は期待できるものの、同じ基板面に対して
は、不要輻射の反射が生じてしまい、ノイズ源側の同一
配線基板内での二次的な電磁結合が助長される。[0006] However, in the above-mentioned wiring board, although a shielding effect can be expected for the other wiring board opposite to the one wiring board serving as a noise source, reflection of unnecessary radiation does not occur on the same board surface. This causes secondary electromagnetic coupling within the same wiring board on the noise source side.
【０００７】そこで、電磁波の透過に対しては、導電性
のシールド材と同等の遮蔽効果をもち、電磁波の反射に
対しては、少なくとも反射による電磁結合を助長させる
ことのない複合磁性体を用いた電磁干渉抑制体が特開平
７−２１２０７９号公報によって提案されている。Therefore, a composite magnetic material having the same shielding effect as that of a conductive shielding material with respect to transmission of electromagnetic waves, and at least not promoting electromagnetic coupling by reflection is used with respect to reflection of electromagnetic waves. An electromagnetic interference suppressor has been proposed in Japanese Patent Application Laid-Open No. 7-212079.
【０００８】以下、特開平７−２１２０７９号公報によ
って開示されている従来の複合磁性体を用いた電磁干渉
抑制体の一例を説明する。複合磁性体を用いた電磁干渉
抑制体は、図４に示すように、導電性支持体１０と、こ
の導電性支持体１０に設けられた複合磁性体２とを有し
ている。複合磁性体２は扁平状（もしくは針状）の軟磁
性粉末３と有機結合剤４とを含む。An example of a conventional electromagnetic interference suppressor using a composite magnetic material disclosed in Japanese Patent Application Laid-Open No. 7-212079 will be described below. As shown in FIG. 4, the electromagnetic interference suppressor using the composite magnetic body has a conductive support 10 and a composite magnetic body 2 provided on the conductive support 10. The composite magnetic body 2 includes a flat (or acicular) soft magnetic powder 3 and an organic binder 4.
【０００９】導電性支持体１０は導電体薄板、網目状導
電体板、もしくは導電性繊維の織物により構成ほか、軟
磁性金属板、網目状軟磁性金属板、もしくは軟磁性金属
繊維の織物により構成される。The conductive support 10 is made of a conductive thin plate, a mesh-like conductive plate, or a woven fabric of conductive fibers, or a soft magnetic metal plate, a mesh-like soft magnetic metal plate, or a woven fabric of soft magnetic metal fibers. Is done.
【００１０】複合磁性体２の形成に用いられる有機結合
溶剤４としては、ポリエステル系樹脂、ポリ塩化ビニル
系樹脂、ポリビニルブチラール樹脂、ポリウレタン樹
脂、セルロース系樹脂、ニトリル−ブタジエン系ゴム、
スチレン−ブタジエン系ゴム等の熱可塑性樹脂或いはそ
れらの共重合体、エポキシ樹脂、フェノール樹脂、アミ
ド系樹脂、イミド系樹脂等の熱硬化性樹脂等を採用して
いる。The organic binding solvent 4 used for forming the composite magnetic body 2 includes polyester resin, polyvinyl chloride resin, polyvinyl butyral resin, polyurethane resin, cellulose resin, nitrile-butadiene rubber,
A thermoplastic resin such as styrene-butadiene rubber or a copolymer thereof, a thermosetting resin such as an epoxy resin, a phenol resin, an amide resin, or an imide resin is used.
【００１１】軟磁性粉末３としては、高周波透磁率の大
きな鉄アルミ珪素合金（センダスト）、鉄ニッケル合金
（パーマロイ）をその代表的素材として挙げることがで
き、粉末のアスペクト比は十分に大きい（おおよそ１
０：１以上）ことが望ましい。Examples of the soft magnetic powder 3 include iron aluminum silicon alloy (Sendust) and iron nickel alloy (Permalloy) having high high-frequency magnetic permeability, and the powder has a sufficiently large aspect ratio (approximately). 1
0: 1 or more).
【００１２】図５は、電磁干渉抑制体１の応用例を示し
ており、電磁干渉抑制体１を互いに対向して配置された
２つの配線基板２１、２３間に実装した状態を示してい
る。FIG. 5 shows an application example of the electromagnetic interference suppressor 1 and shows a state in which the electromagnetic interference suppressor 1 is mounted between two wiring boards 21 and 23 arranged to face each other.
【００１３】配線基板２１，２３には各々複数個の電子
部品２４、２５、２６が実装され、配線基板２１，２３
の電子部品２４、２５、２６同士が向かい合うように配
線基板２１，２３同士が対向配置されている。電磁干渉
抑制体１は、配線基板２１，２３の間に挿入される。A plurality of electronic components 24, 25, 26 are mounted on the wiring boards 21, 23, respectively.
The wiring boards 21 and 23 are arranged so as to face each other such that the electronic components 24, 25 and 26 face each other. The electromagnetic interference suppressor 1 is inserted between the wiring boards 21 and 23.
【００１４】図６（ａ）及び図６（ｂ）に電磁干渉抑制
体１の特性評価系を示している。図６（ａ）は、透過レ
ベルの評価系であり、図６（ｂ）は、結合レベルの評価
系である。各々の場合とも、電磁界波源用発振器２８及
び電磁界強度測定器（受信用素子）２９には、電磁界送
信用微小ループアンテナ３１，電磁界受信用微小ループ
アンテナ３２を用いている。透過もしくは結合レベルの
測定にはネットワークアナライザ（図示せず）を使用し
ている。FIGS. 6A and 6B show a system for evaluating the characteristics of the electromagnetic interference suppressor 1. FIG. FIG. 6A shows a transmission level evaluation system, and FIG. 6B shows a coupling level evaluation system. In each case, an electromagnetic field transmitting small loop antenna 31 and an electromagnetic field receiving small loop antenna 32 are used as the electromagnetic wave source oscillator 28 and the electromagnetic field strength measuring device (receiving element) 29. A network analyzer (not shown) is used to measure the transmission or coupling level.
【００１５】導電性支持体１０として、１２０メッシュ
のステンレス網を用い、この導電性支持体１の両面に乾
燥、硬化後の全厚が１．２ｍｍとなるように下記の＜組
成１＞の配合からなる軟磁性体ペーストをドクターブレ
ード法により塗工し、８５℃にて２４時間キュアリング
を行い評価用試料を得る。ここで、得られた評価用試料
は振動型磁力径並びに走査型電子顕微鏡を用いた解析に
より、磁化容易軸及び磁性粒子配向方向が試料面内方向
であることが確認されている。A 120 mesh stainless steel mesh was used as the conductive support 10, and the following <Composition 1> was blended on both sides of the conductive support 1 so that the total thickness after drying and curing was 1.2 mm. Is applied by a doctor blade method, and cured at 85 ° C. for 24 hours to obtain a sample for evaluation. Here, the obtained evaluation sample is confirmed by analysis using a vibration type magnetic force diameter and a scanning electron microscope that the easy axis of magnetization and the orientation direction of the magnetic particles are in the in-plane direction of the sample.
【００１６】 ＜組成＞ 扁平状軟磁性微粉末 …… ９０重量部 組 成：Ｆｅ−Ａｌ−Ｓｉ合金 平均粒径：１０μｍ アスペクト比：＞１０ ポリウレタン樹脂 …… ８重量部 硬化剤（イソシアネート化合物） …… ２重量部 溶剤（シクロヘキサノンとトルエンとの混合物） …… ４０重量部 したがって、例えば図５に示したような複数の電子部品
２４、２５、２６を実装する配線基板２１、２３が重ね
合わされるように存在する電子機器等において、各々の
配線基板２１、２３間に電磁干渉抑制体を挿入すること
で同一配線基板２１、２３内の結合（クロストーク）を
増大化させることなく配線基板２１、２３間の電磁干渉
を抑制することが可能となる。<Composition> Flat soft magnetic fine powder 90 parts by weight Composition: Fe-Al-Si alloy Average particle size: 10 μm Aspect ratio:> 10 Polyurethane resin 8 parts by weight Curing agent (isocyanate compound) ... 2 parts by weight Solvent (mixture of cyclohexanone and toluene) ... 40 parts by weight Therefore, for example, wiring boards 21 and 23 for mounting a plurality of electronic components 24, 25 and 26 as shown in FIG. In the electronic devices and the like existing in the above, the insertion of the electromagnetic interference suppressor between the respective wiring boards 21 and 23 does not increase the coupling (crosstalk) in the same wiring boards 21 and 23 without increasing the wiring boards 21 and 23 It is possible to suppress electromagnetic interference between them.
【００１７】その他の従来技術としては、特開平８−１
８２７１号公報、特開平８−５６０９２号公報に、電磁
干渉抑制体の応用例が開示されている。Another conventional technique is disclosed in Japanese Unexamined Patent Publication No.
No. 8271 and JP-A-8-56092 disclose application examples of the electromagnetic interference suppressor.
【００１８】[0018]
【発明が解決しようとする課題】しかしながら、複合磁
性体２２の形成に用いる有機結合剤４は、熱によって影
響されやすく、変形、劣化等が発生することから発熱が
大きな電子部品２４、２５、２６に密着させて用いるこ
とができないという問題がある。However, the organic binder 4 used to form the composite magnetic body 22 is susceptible to heat, and is likely to be deformed, deteriorated, etc., and thus generates large amounts of electronic components 24, 25, 26. There is a problem that it cannot be used in close contact with the substrate.
【００１９】また、有機結合剤４は熱伝導性の劣ること
から、発熱量の大きな電子部品２４、２５、２６からの
放熱を妨げるという問題がある。Further, since the organic binder 4 has poor thermal conductivity, there is a problem that heat radiation from the electronic components 24, 25, and 26 that generate a large amount of heat is prevented.
【００２０】それ故に本発明の課題は、熱による影響を
受けにくく、熱放熱性を向上することができる複合磁性
体、及び複合磁性体を用いた電磁干渉抑制体を提供する
ことにある。SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a composite magnetic body which is hardly affected by heat and which can improve heat dissipation, and an electromagnetic interference suppressor using the composite magnetic body.
【００２１】[0021]
【課題を解決するための手段】本発明によれば、電磁障
害を抑制するための軟磁性粉末及び有機結合剤を含む複
合磁性体において、前記有機結合剤は、ガラス転移温度
１２０℃以上の熱可塑性樹脂であることを特徴とするこ
とを特徴とする複合磁性体が得られる。According to the present invention, in a composite magnetic body containing a soft magnetic powder for suppressing electromagnetic interference and an organic binder, the organic binder has a glass transition temperature of 120 ° C. or higher. A composite magnetic material characterized by being a plastic resin is obtained.
【００２２】また、本発明によれば、電磁障害を抑制す
るための軟磁性粉末及び有機結合剤を含む複合磁性体に
おいて、窒化アルミニウム粉末を含むことを特徴とする
複合磁性体が得られる。Further, according to the present invention, a composite magnetic body containing an aluminum nitride powder in a composite magnetic body containing a soft magnetic powder for suppressing electromagnetic interference and an organic binder is obtained.
【００２３】また、本発明によれば、前記有機結合剤
は、熱可塑性ポリイミドであることを特徴とする複合磁
性体が得られる。According to the present invention, there is provided a composite magnetic material characterized in that the organic binder is a thermoplastic polyimide.
【００２４】また、本発明によれば、前記有機結合剤
は、液晶ポリマーであることを特徴とする複合磁性体が
得られる。According to the present invention, there is obtained a composite magnetic material characterized in that the organic binder is a liquid crystal polymer.
【００２５】また、本発明によれば、導電性支持体と、
該導電性支持体の少なくとも一方面に設けられた電磁障
害を抑制するための軟磁性粉末及び有機結合剤を含む複
合磁性体とを有している電磁干渉抑制体において、前記
有機結合剤はガラス転移温度１２０℃以上の熱可塑性樹
脂であることを特徴とする電磁干渉抑制体が得られる。According to the present invention, there is also provided a conductive support,
An electromagnetic interference suppressor having a soft magnetic powder for suppressing electromagnetic interference and a composite magnetic body containing an organic binder provided on at least one surface of the conductive support, wherein the organic binder is glass. An electromagnetic interference suppressor characterized by being a thermoplastic resin having a transition temperature of 120 ° C. or higher is obtained.
【００２６】また、本発明によれば、前記複合磁性体
は、前記熱可塑性樹脂に加えて窒化アルミニウム粉末を
含むことを特徴とする電磁干渉抑制体が得られる。According to the present invention, there is provided an electromagnetic interference suppressor characterized in that the composite magnetic material contains aluminum nitride powder in addition to the thermoplastic resin.
【００２７】また、本発明によれば、前記有機結合剤
は、熱可塑性ポリイミドであることを特徴とする電磁干
渉抑制体が得られる。According to the present invention, there is provided an electromagnetic interference suppressor, wherein the organic binder is a thermoplastic polyimide.
【００２８】さらに、本発明によれば、前記有機結合剤
は、液晶ポリマーであることを特徴とする電磁干渉抑制
体が得られる。Further, according to the present invention, there is obtained an electromagnetic interference suppressor, wherein the organic binder is a liquid crystal polymer.
【００２９】[0029]
【作用】本発明の複合磁性体、及び複合磁性体を用いた
電磁干渉抑制体は、例えば、発熱の大きな電子部品の熱
放出のためにヒートシンクを使用する場合において、複
合磁性体に高い耐熱性を付与できるとともに、さらに窒
化アルムニウムの粉体を添加することで、熱伝導性が良
好となることから、発熱性の大きな電子部品に密着させ
て発熱性の大きな電子部品の熱放出の効率を改善するこ
とが可能となる。The composite magnetic body of the present invention and the electromagnetic interference suppressor using the composite magnetic body have a high heat resistance when a heat sink is used for releasing heat of an electronic component generating a large amount of heat. In addition to the addition of aluminum nitride powder, the thermal conductivity is improved, so it is closely attached to electronic components with high heat generation and the heat release efficiency of electronic components with high heat generation is improved. It is possible to do.
【００３０】また、導電性基材を配線基板間に挿入する
ことにより生じる不要輻射の反射による電磁結合の増大
化は、軟磁性粉末と有機結合剤からなる軟磁性層により
抑制される。この軟磁性層は、本来、導電性物質である
軟磁性金属を微細粉末化し、絶縁性の有機結合剤と混練
分散されることにより絶縁層としており、軟磁性層面で
の不要輻射の反射が起こり難い。Further, an increase in electromagnetic coupling due to reflection of unnecessary radiation caused by inserting the conductive base material between the wiring boards is suppressed by the soft magnetic layer composed of the soft magnetic powder and the organic binder. This soft magnetic layer is essentially an insulating layer by finely pulverizing a soft magnetic metal, which is a conductive substance, and kneading and dispersing it with an insulating organic binder. Unnecessary radiation is reflected on the soft magnetic layer surface. hard.
【００３１】[0031]
【発明の実施の形態】次に、本発明の複合磁性体の一実
施の形態例を図１を参照して説明する。なお、図４及び
図５によって説明した部分と同じ部分については同じ符
号を付して説明する。Next, an embodiment of the composite magnetic material of the present invention will be described with reference to FIG. The same portions as those described with reference to FIGS. 4 and 5 are denoted by the same reference numerals and described.
【００３２】図１を参照して、複合磁性体２は、電磁障
害を抑制するための扁平状（もしくは針状）の軟磁性粉
末３、及びガラス転移温度１２０℃以上の熱可塑性樹脂
である有機結合剤４を含む。Referring to FIG. 1, a composite magnetic material 2 is a flat (or needle-shaped) soft magnetic powder 3 for suppressing electromagnetic interference and an organic resin which is a thermoplastic resin having a glass transition temperature of 120 ° C. or higher. Contains binder 4.
【００３３】なお、複合磁性体２の他の例としては、熱
可塑性樹脂に加えて微粉化した窒化アルミニウム粉末１
１を含む。さらに、有機結合剤４の例としては、熱可塑
性ポリイミド、液晶ポリマーのうち少なくとも１種類を
選択して採用することが好ましい。Another example of the composite magnetic material 2 is a finely divided aluminum nitride powder 1 in addition to a thermoplastic resin.
Including 1. Further, as an example of the organic binder 4, it is preferable to select and employ at least one of thermoplastic polyimide and liquid crystal polymer.
【００３４】軟磁性粉末３としては、高周波透磁率の大
きな鉄アルミ珪素合金（センダスト）、鉄ニッケル合金
（パーマロイ）をその代表的素材として挙げることがで
き、粉末のアスペクト比は十分に大きい（おおよそ１
０：１以上）ことが望ましい。上記熱可塑性樹脂、及び
窒化アルミニウム粉末１１を併用すると、高耐熱性を有
する複合磁性体２が得られる。As the soft magnetic powder 3, iron aluminum silicon alloy (Sendust) and iron nickel alloy (Permalloy) having high high-frequency magnetic permeability can be mentioned as typical materials, and the aspect ratio of the powder is sufficiently large (approximately). 1
0: 1 or more). When the thermoplastic resin and the aluminum nitride powder 11 are used in combination, the composite magnetic body 2 having high heat resistance can be obtained.
【００３５】図２は、配線基板２３上に能動素子として
の電子部品２４を搭載し、この熱発生の大きい電子部品
２４の熱放出を高めるために、複合磁性体２、及び電子
部品２４上にヒートシンク８を設けた応用例を示してい
る。このような電子部品２４では、熱伝導性に優れた複
合磁性体２によって熱放出が高まりヒートシンク８へと
熱伝導され放出される。FIG. 2 shows an electronic component 24 as an active element mounted on a wiring board 23. In order to enhance the heat release of the electronic component 24 which generates a large amount of heat, the composite magnetic body 2 and the electronic component 24 An application example in which a heat sink 8 is provided is shown. In such an electronic component 24, heat release is increased by the composite magnetic body 2 having excellent thermal conductivity, and the heat is conducted to the heat sink 8 and released.
【００３６】次に、図３を参照して、上記複合磁性体２
を用いた電磁干渉抑制体１について説明する。電磁干渉
抑制体１は、導電性支持体（もしくは軟磁性を有する導
電性軟磁性支持体）１０と、導電性支持体１０の少なく
とも一方面に設けた電磁障害を抑制するための複合磁性
体２とを有している。複合磁性体２は、上述した構成複
合磁性体２を採用している。Next, referring to FIG.
The electromagnetic interference suppressor 1 using the following will be described. The electromagnetic interference suppressor 1 includes a conductive support (or a conductive soft magnetic support having soft magnetism) 10 and a composite magnetic body 2 provided on at least one surface of the conductive support 10 for suppressing electromagnetic interference. And The composite magnetic body 2 employs the composite magnetic body 2 described above.
【００３７】電磁干渉抑制体１においては、導電性支持
体１０を導電体薄板、網目状導電体板、もしくは導電性
繊維の織物により構成したり、軟磁性金属板、網目状軟
磁性金属板、もしくは軟磁性金属繊維の織物により構成
する。In the electromagnetic interference suppressor 1, the conductive support 10 is made of a conductive thin plate, a mesh-like conductive plate, or a woven fabric of conductive fibers, or a soft magnetic metal plate, a mesh-like soft magnetic metal plate, Alternatively, it is constituted by a woven fabric of soft magnetic metal fibers.
【００３８】その他の電磁干渉抑制体１の構成について
は、特開平７−２１２０７９号公報に詳細に開示されて
いるため本発明では説明を省略する。The other structure of the electromagnetic interference suppressor 1 is disclosed in detail in Japanese Patent Application Laid-Open No. 7-212079, so that the description thereof is omitted in the present invention.
【００３９】本発明の電磁干渉抑制体１を用いた場合に
は、図５に示したような複数の電子部品２４、２５、２
６を実装する配線基板２１、２３が重ね合わされるよう
に存在する電子機器等において、各々の配線基板２１、
２３間に電磁干渉抑制体１を挿入することで同一配線基
板２１、２３内の結合（クロストーク）を増大化させる
ことなく配線基板２１、２３間の電磁干渉を抑制するこ
とが可能となる。When the electromagnetic interference suppressor 1 of the present invention is used, a plurality of electronic components 24, 25, 2 as shown in FIG.
In an electronic device or the like in which the wiring boards 21 and 23 for mounting the
By inserting the electromagnetic interference suppressor 1 between the wiring boards 23, it is possible to suppress the electromagnetic interference between the wiring boards 21 and 23 without increasing the coupling (crosstalk) in the same wiring boards 21 and 23.
【００４０】したがって、本発明の複合磁性体２又は電
磁干渉抑制体１をヒートシンク８と能動素子（電子部品
２４）との間に配設することで、導電体であり電気的に
はシールド効果を有するヒートシンク８をＣＰＵ等の能
動素子に密着させた場合に生じる能動素子内部での電磁
干渉を抑制できる。Therefore, by disposing the composite magnetic body 2 or the electromagnetic interference suppressor 1 of the present invention between the heat sink 8 and the active element (electronic component 24), it is a conductor and has an electrical shielding effect. Electromagnetic interference inside the active element that occurs when the heat sink 8 having the heat sink 8 is brought into close contact with an active element such as a CPU can be suppressed.
【００４１】[0041]
【発明の効果】以上、実施例により説明したように、本
発明の複合磁性体によれば、電子部品の熱放出のための
ヒートシンクに使用する場合において、複合磁性体に高
い耐熱性を付与できると共に、窒化アルムニウムの粉体
を添加することで、熱伝導性が良好となることから、発
熱の大きな電子部品に密着させて電子部品の熱放出を良
好になすことが可能となる。As described above, according to the composite magnetic material of the present invention, when used as a heat sink for heat release of electronic components, the composite magnetic material can be provided with high heat resistance. At the same time, by adding aluminum nitride powder, the thermal conductivity is improved, so that the electronic component can be closely contacted with a heat-generating electronic component, and the electronic component can emit heat well.
【００４２】また、ヒートシンク等の導電体を電子部品
に密着させることにより生じる不要輻射の反射による電
磁結合の増大化は、軟磁性粉末と有機結合剤からなる複
合磁性体の磁気損失により抑制される。Further, an increase in electromagnetic coupling due to reflection of unnecessary radiation caused by bringing a conductor such as a heat sink into close contact with an electronic component is suppressed by the magnetic loss of a composite magnetic body composed of a soft magnetic powder and an organic binder. .
【００４３】また、粉末形状が扁平状ないし針状であ
り、それが複合磁性体中で配向配列されているために、
形状磁気異方性が出現し、高周波領域にて磁気共鳴に基
づく複素透磁率の増大化が生じ、不要輻射成分が効率的
に吸収、抑制される。In addition, since the powder shape is flat or needle-like and is oriented and aligned in the composite magnetic material,
Shape magnetic anisotropy appears, the complex magnetic permeability based on magnetic resonance increases in the high frequency region, and unnecessary radiation components are efficiently absorbed and suppressed.
【００４４】さらに、導電性支持体ないし導電性軟磁性
支持体上の少なくとも一方の面上に扁平ないし針状の軟
磁性体粉末と有機結合剤からなる複合磁性体を設けてな
る本発明の電磁干渉抑制体は、導体を挿入したことによ
り生じる不要輻射の反射を増大化させることなく透過減
衰を大きく確保することができ、移動体通信機器をはじ
めとする高周波電子機器類内、及びそれらに用いられる
ＣＰＵ等の能動素子内部での電磁干渉を抑止することが
可能となる。Further, the electromagnetic substance of the present invention comprising a composite magnetic material comprising a flat or acicular soft magnetic powder and an organic binder is provided on at least one surface of the conductive support or the conductive soft magnetic support. The interference suppressor can ensure a large transmission attenuation without increasing the reflection of unnecessary radiation caused by inserting a conductor, and is used in high-frequency electronic devices such as mobile communication devices and for them. It is possible to suppress electromagnetic interference inside an active element such as a CPU.
【００４５】なお、本発明の電磁干渉抑制体は、その構
成要素からわかるように容易に製造でき、可撓性を付与
することが可能であり、複雑な形状への対応や厳しい耐
振動、衝撃要求への対応も可能である。The electromagnetic interference suppressor of the present invention can be easily manufactured, as can be seen from its components, can be given flexibility, can cope with complicated shapes, and has severe vibration resistance and shock resistance. It is also possible to respond to requests.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明の複合磁性体の一実施の形態例を示す概
略断面図である。FIG. 1 is a schematic sectional view showing one embodiment of a composite magnetic body of the present invention.
【図２】図１に示した複合磁性体の適応例を示す側面図
である。FIG. 2 is a side view showing an example of application of the composite magnetic body shown in FIG.
【図３】図１に示した複合磁性体を用いた電磁干渉抑制
体を示す概略断面図である。FIG. 3 is a schematic sectional view showing an electromagnetic interference suppressor using the composite magnetic material shown in FIG.
【図４】従来の複合磁性体を用いた電磁干渉抑制体を示
す概略断面図である。FIG. 4 is a schematic sectional view showing an electromagnetic interference suppressor using a conventional composite magnetic body.
【図５】従来の複合磁性体を用いた電磁干渉抑制体を配
線基板に実装した状態を示す概略断面図である。FIG. 5 is a schematic cross-sectional view showing a state in which a conventional electromagnetic interference suppressor using a composite magnetic body is mounted on a wiring board.
【図６】電磁干渉体の特性評価に用いる評価系を示し、
（ａ）は透過レベルを測定するための評価系概略図、
（ｂ）は結合レベルを測定するための評価系概略図であ
る。FIG. 6 shows an evaluation system used for evaluating characteristics of the electromagnetic interference body,
(A) is a schematic diagram of an evaluation system for measuring a transmission level,
(B) is a schematic diagram of an evaluation system for measuring a binding level.
１ 電磁干渉抑制体 ２ 複合磁性体 ３ 軟磁性粉末 ４ 有機結合剤 ８ ヒートシンク １０ 導電性支持体 １１ 窒化アルミニウム ２３ 配線基板 ２４、２５、２６ 電子部品 REFERENCE SIGNS LIST 1 electromagnetic interference suppressor 2 composite magnetic material 3 soft magnetic powder 4 organic binder 8 heat sink 10 conductive support 11 aluminum nitride 23 wiring board 24, 25, 26 electronic component
Claims (8)
び有機結合剤を含む複合磁性体において、前記有機結合
剤は、ガラス転移温度１２０℃以上の熱可塑性樹脂であ
ることを特徴とすることを特徴とする複合磁性体。1. A composite magnetic material comprising a soft magnetic powder for suppressing electromagnetic interference and an organic binder, wherein the organic binder is a thermoplastic resin having a glass transition temperature of 120 ° C. or higher. A composite magnetic material characterized by the following.
び有機結合剤を含む複合磁性体において、窒化アルミニ
ウム粉末を含むことを特徴とする請求項１記載の複合磁
性体。2. The composite magnetic material according to claim 1, wherein the composite magnetic material containing a soft magnetic powder for suppressing electromagnetic interference and an organic binder contains aluminum nitride powder.
であることを特徴とする請求項１又は２記載の複合磁性
体。3. The composite magnetic body according to claim 1, wherein the organic binder is a thermoplastic polyimide.
ことを特徴とする請求項１又は２記載の複合磁性体。4. The composite magnetic body according to claim 1, wherein the organic binder is a liquid crystal polymer.
くとも一方面に設けた電磁障害を抑制するための軟磁性
粉末及び有機結合剤を含む複合磁性体とを有している電
磁干渉抑制体において、前記有機結合剤はガラス転移温
度１２０℃以上の熱可塑性樹脂であることを特徴とする
電磁干渉抑制体。5. An electromagnetic interference comprising: a conductive support; and a composite magnetic material including a soft magnetic powder for suppressing electromagnetic interference and an organic binder provided on at least one surface of the conductive support. The electromagnetic interference suppressor, wherein the organic binder is a thermoplastic resin having a glass transition temperature of 120 ° C. or higher.
加えて窒化アルミニウム粉末を含むことを特徴とする請
求項５記載の電磁干渉抑制体。6. The electromagnetic interference suppressor according to claim 5, wherein the composite magnetic body contains aluminum nitride powder in addition to the thermoplastic resin.
であることを特徴とする請求項５又は６記載の電磁干渉
抑制体。7. The electromagnetic interference suppressor according to claim 5, wherein the organic binder is a thermoplastic polyimide.
ことを特徴とする請求項５又は６記載の電磁干渉抑制
体。8. The electromagnetic interference suppressor according to claim 5, wherein the organic binder is a liquid crystal polymer.
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23772496A JP3528455B2 (en) | 1996-09-09 | 1996-09-09 | Electromagnetic interference suppressor |
| PCT/JP1997/003175 WO1998010632A1 (en) | 1996-09-09 | 1997-09-09 | Highly heat-conductive composite magnetic material |
| EP97939237A EP0866649B1 (en) | 1996-09-09 | 1997-09-09 | Highly heat-conductive composite magnetic material |
| CNB97191222XA CN1179619C (en) | 1996-09-09 | 1997-09-09 | Highly heat-conductive composite magnetic material |
| TW086113017A TW345667B (en) | 1996-09-09 | 1997-09-09 | High thermal conductivity composite magnetic substance |
| KR10-1998-0703424A KR100510921B1 (en) | 1996-09-09 | 1997-09-09 | Highly heat-conductive composite magnetic material |
| DE1997627207 DE69727207T2 (en) | 1996-09-09 | 1997-09-09 | HIGHLY CONDUCTING MAGNETIC MIXING MATERIAL |
| US09/074,012 US6962753B1 (en) | 1996-09-09 | 1997-09-09 | Highly heat-conductive composite magnetic material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23772496A JP3528455B2 (en) | 1996-09-09 | 1996-09-09 | Electromagnetic interference suppressor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1084195A true JPH1084195A (en) | 1998-03-31 |
| JP3528455B2 JP3528455B2 (en) | 2004-05-17 |
Family
ID=17019561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23772496A Expired - Lifetime JP3528455B2 (en) | 1996-09-09 | 1996-09-09 | Electromagnetic interference suppressor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3528455B2 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001294752A (en) * | 2000-04-11 | 2001-10-23 | Shin Etsu Chem Co Ltd | Electromagnetic wave-absorbing, thermally conductive silicone rubber composition |
| EP1209741A2 (en) * | 2000-11-22 | 2002-05-29 | Siemens Aktiengesellschaft | Device for a clocked semiconductor chip |
| JP2002164689A (en) * | 2000-11-28 | 2002-06-07 | Polymatech Co Ltd | Radio wave absorbing body of high thermal conductivity |
| US6545212B1 (en) | 1998-10-27 | 2003-04-08 | Murata Manufacturing Co., Ltd. | Radiation noise suppressing component attachment structure |
| WO2003081973A1 (en) * | 2002-03-27 | 2003-10-02 | Toyo Services,Corp. | Electromagnetic wave shielding sheet, electromagnetic wave shielding transmission cable and electromagnetic wave shielding lsi |
| JP2005169775A (en) * | 2003-12-10 | 2005-06-30 | Mitsui Chemicals Inc | Multilayered sheet |
| KR100755775B1 (en) | 2006-05-10 | 2007-09-05 | (주)창성 | Electromagnetic noise supression film and process of production thereof |
| KR101401542B1 (en) * | 2013-05-06 | 2014-06-03 | 한국기계연구원 | Electro-magnetic absorption film including graphene oxide, and the preparation method thereof |
| JP2014107539A (en) * | 2012-11-27 | 2014-06-09 | Samsung Electro-Mechanics Co Ltd | Magnetic body sheet for non-contact power transmission apparatus |
| JP2014123705A (en) * | 2012-12-21 | 2014-07-03 | Samsung Electro-Mechanics Co Ltd | Magnetic composite sheet and electromagnetic induction module |
| JP2015103723A (en) * | 2013-11-27 | 2015-06-04 | 株式会社村田製作所 | Inductor element |
-
1996
- 1996-09-09 JP JP23772496A patent/JP3528455B2/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6545212B1 (en) | 1998-10-27 | 2003-04-08 | Murata Manufacturing Co., Ltd. | Radiation noise suppressing component attachment structure |
| JP2001294752A (en) * | 2000-04-11 | 2001-10-23 | Shin Etsu Chem Co Ltd | Electromagnetic wave-absorbing, thermally conductive silicone rubber composition |
| EP1209741A2 (en) * | 2000-11-22 | 2002-05-29 | Siemens Aktiengesellschaft | Device for a clocked semiconductor chip |
| EP1209741A3 (en) * | 2000-11-22 | 2005-03-23 | Siemens Aktiengesellschaft | Device for a clocked semiconductor chip |
| JP2002164689A (en) * | 2000-11-28 | 2002-06-07 | Polymatech Co Ltd | Radio wave absorbing body of high thermal conductivity |
| WO2003081973A1 (en) * | 2002-03-27 | 2003-10-02 | Toyo Services,Corp. | Electromagnetic wave shielding sheet, electromagnetic wave shielding transmission cable and electromagnetic wave shielding lsi |
| JP2005169775A (en) * | 2003-12-10 | 2005-06-30 | Mitsui Chemicals Inc | Multilayered sheet |
| JP4700905B2 (en) * | 2003-12-10 | 2011-06-15 | 三井化学株式会社 | Multilayer board |
| KR100755775B1 (en) | 2006-05-10 | 2007-09-05 | (주)창성 | Electromagnetic noise supression film and process of production thereof |
| JP2014107539A (en) * | 2012-11-27 | 2014-06-09 | Samsung Electro-Mechanics Co Ltd | Magnetic body sheet for non-contact power transmission apparatus |
| JP2014123705A (en) * | 2012-12-21 | 2014-07-03 | Samsung Electro-Mechanics Co Ltd | Magnetic composite sheet and electromagnetic induction module |
| KR101401542B1 (en) * | 2013-05-06 | 2014-06-03 | 한국기계연구원 | Electro-magnetic absorption film including graphene oxide, and the preparation method thereof |
| JP2015103723A (en) * | 2013-11-27 | 2015-06-04 | 株式会社村田製作所 | Inductor element |
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| JP3528455B2 (en) | 2004-05-17 |
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