JP2015103723A - Inductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inductor element capable of preventing characteristics from being deviated from desired characteristics in a configuration in which a plurality of coils are arranged side by side in a lamination direction of a laminate.SOLUTION: An inductor element 1 includes: a laminate 21 in which first base material layers 10, 11, 12, second base material layer 13, and first base material layers 14, 15 are laminated in order; and a first coil C1 and a second coil C2 which are arranged side by side in a lamination direction around a direction orthogonal to the lamination direction as a coil winding axis. The first coil C1 and the second coil C2 are wound so as to have the first base material layers 11 and 14 positioned therein, respectively. The second base material layer 13 has a relative magnetic permeability higher than that of the first base material layers 10, 11, 12, 14, 15, and is disposed between the first coil C1 and the second coil C2 in the lamination direction.

Description

  The present invention relates to an inductor element around which a conductor pattern is wound.

  Patent Document 1 discloses an inductor element with a built-in helical coil. The inductor element described in Patent Document 1 is manufactured using a laminated body in which insulators and conductors are alternately laminated, and the coil winding axis is oriented in a direction perpendicular to the laminating direction.

Japanese Patent Laid-Open No. 2004-235584

  By the way, when forming an inductor element in which a plurality of helical coils are built in one laminated body, the plurality of helical coils are arranged side by side in the laminating direction so that the size in the direction perpendicular to the laminating direction of the laminated body does not increase. Can be considered. However, in the inductor element described in Patent Document 1, when a plurality of helical coils are arranged side by side in the stacking direction of the multilayer body, the plurality of helical coils may be coupled to each other by the magnetic flux generated from each helical coil. In this case, the characteristics of the inductor element may deviate from the desired characteristics due to the coupling of the plurality of helical coils.

  Accordingly, an object of the present invention is to suppress a characteristic from deviating from a desired characteristic in a configuration in which a plurality of coils having a coil winding axis in a direction orthogonal to the lamination direction of the laminated body are arranged in the lamination direction. It is to provide an inductor element.

  The present invention provides a laminate in which a plurality of base material layers including a plurality of first base material layers and at least one second base material layer are laminated, and a direction perpendicular to the lamination direction as a coil winding axis. A first coil and a second coil arranged in a direction, and each of the first coil and the second coil is wound so that the first base material layer is located inside the first coil and the second coil. The second base material layer has a relative permeability higher than that of the first base material layer, and is disposed between the first coil and the second coil in the stacking direction. .

  In this configuration, since the second base material layer having a high relative permeability is interposed between the first coil and the second coil, the first coil and the second coil are formed by the second base material layer. Coupling with each other coil is suppressed. Thereby, it can suppress that the characteristic of an inductor element shifts from a desired characteristic resulting from the coupling | bonding of a 1st coil and a 2nd coil.

  The first base material layer preferably has a relative dielectric constant smaller than that of the second base material layer. In this configuration, the line capacitance of the first coil and the line capacitance of the second coil can be reduced.

  A part of each of the first coil and the second coil is constituted by a conductor pattern formed on the main surface of the base material layer, and the first coil is located inside the first coil. The base material layer is disposed at a position sandwiched by the conductor pattern constituting a part of the first coil in the stacking direction, and the first base material layer positioned inside the second coil is stacked In the direction, it is preferable that the second coil is disposed at a position sandwiched by the conductor pattern constituting a part of the second coil.

  In this configuration, in each coil, the first base material layer can be easily provided inside the coil by sandwiching the first base material layer in the stacking direction by the conductor pattern.

  A part of the conductor pattern is preferably formed on the main surface of the second base material layer.

  In this configuration, the number of second base material layers constituting the laminate can be reduced.

  It is preferable that a plurality of the second base material layers are provided and arranged so as to sandwich each of the first coil and the second coil from both sides in the stacking direction.

  In this configuration, since each of the first coil and the second coil is sandwiched between the second base material layers having a high relative permeability, when the inductor element is mounted, a circuit or the like near the inductor element In addition, it is possible to suppress the influence of the magnetic flux generated from each of the first coil and the second coil.

  A direction perpendicular to the laminating direction is a coil winding axis, and further includes a third coil disposed on the opposite side to the first coil with respect to the second coil in the laminating direction, A plurality of base material layers are provided, and are arranged at least between the first coil and the second coil and between the second coil and the third coil in the stacking direction. Is preferable.

  In this configuration, even if the number of coils is increased to three, the coils can be prevented from being coupled to each other.

  It is preferable that the first base material layer and the second base material layer have the same kind of thermoplastic resin as a base material.

  In this structure, since it is the same kind of thermoplastic resin, a plurality of base material layers can be integrated by a simple process using a heating press. In addition, the plurality of integrated base material layers are unlikely to peel due to the difference in thermal expansion coefficient, and the shape of the formed inductor element is easily maintained. Also by this, it can suppress that the characteristic of an inductor element shifts from a desired characteristic.

  The thermoplastic resin is preferably a liquid crystal polymer resin.

  In this configuration, the interline capacitance of the coil can be reduced by using a relatively low dielectric constant liquid crystal polymer resin.

  It is preferable that external terminals of the first coil and the second coil are formed on the surface of the outermost layer of the plurality of base material layers.

  In this configuration, it is easy to mount the inductor element by aligning the external terminals for the first coil and the second coil on the same surface of the multilayer body.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that the 1st coil and 2nd coil which were arranged in the lamination direction mutually couple | bonded. Thereby, it can suppress that the characteristic of an inductor element shifts from a desired characteristic.

1 is an exploded perspective view of an inductor element according to Embodiment 1. FIG. Sectional view taken along line II-II shown in FIG. FIG. 4 is an exploded perspective view of an inductor element according to Embodiment 2. Sectional view along line IV-IV shown in FIG. FIG. 6 is an exploded perspective view of an inductor element according to Embodiment 3. 4 is an exploded perspective view of an inductor element according to Embodiment 4. FIG. FIG. 6 is an exploded perspective view of an inductor element according to Embodiment 5.

  Hereinafter, preferred embodiments of an inductor element according to the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is an exploded perspective view of the inductor element according to the first embodiment. 2 is a cross-sectional view taken along the line II-II shown in FIG. The inductor element 1 according to the present embodiment includes a multilayer body 21 and two first coils C1 and a second coil C2 formed on the multilayer body 21 independently of each other. As for the laminated body 21, the 1st base material layers 10, 11, and 12, the 2nd base material layer 13, and the 1st base material layers 14 and 15 are laminated in order.

  Each of the base material layers 10 to 15 has a rectangular shape having a long side and a short side. The laminated body 21 is formed by laminating the base material layers 10 to 15 and performing heat pressing. The laminated body 21 has a substantially rectangular parallelepiped shape. The base material layers 10 to 15 are formed using the same kind of insulating thermoplastic resin, for example, LCP resin (liquid crystal polymer resin) as a base material. More specifically, the second base material layer 13 contains a magnetic material such as permalloy in the LCP resin, and has a higher relative magnetic permeability than the first base material layers 10, 11, 12, 14, and 15. Further, the first base material layers 10, 11, 12, 14 and 15 have a relative dielectric constant smaller than that of the second base material layer 13. Since the second base material layer 13 contains a magnetic substance, the first base material layers 10, 11, 12, 14, 15 and the second base material layer 13 are not completely identical in components, By using LCP resin as the main material, it can be said that these are based on the same kind of thermoplastic resin.

  Examples of the thermoplastic resin include PEEK (polyether ether ketone), PEI (polyether imide), PPS (poniphenylene sulfide), PI (polyimide), and the like, and these may be used instead of the LCP resin. Good.

  The first base material layer 10 is a layer that becomes a mounting surface of the inductor element 1, and input / output electrodes 10 </ b> A, 10 </ b> B, 10 </ b> C, and 10 </ b> D are formed on the surface thereof. The input / output electrodes 10 </ b> A, 10 </ b> B, 10 </ b> C, 10 </ b> D are input / output ends for the first coil and the second coil formed in the multilayer body 21. Thus, by forming the input / output ends on the same surface of the multilayer body 21, the inductor element 1 can be easily mounted.

  Via conductors are formed in the first base material layer 10 at the positions of the input / output electrodes 10A, 10B, 10C, and 10D, and the conductor patterns formed in the input / output electrodes 10A, 10B, 10C, and 10D and other layers Is conducting. In the following, although not particularly mentioned, it is assumed that necessary via conductors are formed as appropriate in the other layers as well.

  On the surface (main surface) of the first base material layer 11, strip-like conductor patterns 11A, 11B, 11C, 11D, and 11E are formed. The conductor patterns 11 </ b> A to 11 </ b> E are formed in parallel along the direction along the short side of the first base material layer 11 (hereinafter referred to as the short direction). In addition, on the surface (main surface) of the first base material layer 12, strip-shaped conductor patterns 12A, 12B, 12C, and 12D are formed. The conductor patterns 12A to 12D are formed to be inclined with respect to the conductor patterns 11A to 11E so that the conductor patterns 11A to 11E formed on the first base material layer 11 are constructed.

  Specifically, one end of the conductor pattern 11A is electrically connected to the input / output electrode 10A through the via conductor, and the other end is electrically connected to one end of the conductor pattern 12A. The other end of the conductor pattern 12A is electrically connected to one end of the conductor pattern 11B through the via conductor 101. The other end of the conductor pattern 11B is electrically connected to one end of the conductor pattern 12B through the via conductor 102. The other end of the conductor pattern 12B is electrically connected to one end of the conductor pattern 11C, and the other end of the conductor pattern 11C is electrically connected to the conductor pattern 12C through the via conductor 103. Furthermore, the other end of the conductor pattern 12C is electrically connected to one end of the conductor pattern 11D, and the other end of the conductor pattern 11D is electrically connected to one end of the conductor pattern 12D through the via conductor 104. The other end of the conductor pattern 12 </ b> D is electrically connected to one end of the conductor pattern 11 </ b> E, and the conductor pattern 11 </ b> D is connected to the input / output electrode 10 </ b> D formed on the first base material layer 10. Although not described with all reference numerals attached, the conductor pattern of each layer is conducted through via conductors formed in the base material layer.

  Thus, the first coil C1 is formed by the conductor patterns 11A to 11E, the conductor patterns 12A to 12D, and the via conductors formed on the main surfaces of the first base material layers 11 and 12. The first coil C1 is wound so that the direction perpendicular to the stacking direction is a coil winding axis and the first base material layer is located inside. The 1st base material layer 11 is arrange | positioned in the lamination direction in the position pinched | interposed by the conductor patterns 11A-11E and conductor patterns 12A-12D which comprise a part of 1st coil C1.

  On the surface (main surface) of the first base material layer 14, rectangular conductor patterns 14A and 14E and strip-shaped conductor patterns 14B, 14C and 14D are formed. The conductor patterns 14A and 14E are formed at substantially the same positions as the input / output electrodes 10B and 10C in plan view, and are electrically connected to the input / output electrodes 10B and 10C through via conductors. The conductor patterns 14 </ b> B to 14 </ b> D are formed in parallel along the short direction of the first base material layer 14. In addition, on the surface (main surface) of the first base material layer 15, strip-shaped conductor patterns 15 </ b> A, 15 </ b> B, 15 </ b> C, 15 </ b> D are formed. The conductor patterns 15A to 15D are formed to be inclined with respect to the conductor patterns 14B to 14D so that the conductor patterns 14A to 14E formed on the first base material layer 14 are installed.

  Specifically, the conductor pattern 15A has one end conducting to the conductor pattern 14A and the other end conducting to one end of the conductor pattern 14B. The other end of the conductor pattern 14B is electrically connected to one end of the conductor pattern 15B through the via conductor 105, and the other end of the conductor pattern 15B is electrically connected to one end of the conductor pattern 14C. The other end of the conductor pattern 14C is electrically connected to one end of the conductor pattern 15C through the via conductor 106, and the other end of the conductor pattern 15C is electrically connected to one end of the conductor pattern 14D. The other end of the conductor pattern 14D is electrically connected to one end of the conductor pattern 15D through the via conductor 107, and the other end of the conductor pattern 15D is electrically connected to the conductor pattern 14E. Although not described with all reference numerals attached, the conductor pattern of each layer is conducted through via conductors formed in the base material layer.

  As described above, the second coil C2 is formed by the conductor patterns 14A to 11E, the conductor patterns 15A to 15D, and the via conductors formed on the main surfaces of the first base material layers 14 and 15. The second coil C2 is wound so that the direction perpendicular to the stacking direction is a coil winding axis and the first base material layer is located inside. The 1st base material layer 14 is arrange | positioned in the lamination direction in the position pinched | interposed by conductor pattern 14A-11E and conductor pattern 15A-15D which comprise some 2nd coils C2.

  The second base material layer 13 is interposed between the first coil C1 formed on the first base material layers 11 and 12 and the second coil C2 formed on the first base material layers 14 and 15. As described above, the relative magnetic permeability is set higher than that of the first base material layers 10, 11, 12, 14, and 15. For this reason, since the magnetic field generated by the two first coils C1 and the second coil C2 mainly passes through the second base material layer 13, it is possible to suppress the influence of the magnetic field on each coil. More specifically, it is possible to prevent the magnetic flux generated in the first coil C1 from passing through the second coil C2 (or vice versa) and combining the first coil C1 and the second coil C2. Further, the first base material layers 10, 11, 12, 14 and 15 have a relative dielectric constant smaller than that of the second base material layer 13. For this reason, the line capacity of the 1st coil C1 and the 2nd coil C2 becomes small. Thereby, the inductor element 1 can be used appropriately, without changing the characteristic of each of the two first coils and the second coil.

  In addition, by using a low dielectric constant LCP resin for each of the base material layers 11 to 15, the line capacity of the coil conductor can be reduced, and each of the base material layers 11 to 15 has the same kind of thermoplasticity. Since it is a resin, it can be integrated by a simple process using a heating press, peeling due to a difference in thermal expansion coefficient hardly occurs, and the state of the inductor element 1 after formation is easily maintained.

  The manufacturing process of the inductor element 1 described above is as follows.

  A copper foil is affixed to one main surface of the resin sheet, or a single-sided copper affixed sheet is prepared. Then, a resist film is patterned on the copper foil according to the pattern of the signal line to be formed. Etching is performed to form a signal line, and the resist film is removed. A via conductor is formed. Moreover, about the base material layers 10-14, it is a laser beam to each location (location from which the copper foil was removed by the above etching) from the other surface of the resin sheet (the surface where the copper foil is not attached). To make a hole. Thereby, the base material layers 10-15 are made.

  Next, the base material layers 10 to 15 are sequentially stacked. At this time, for example, the base material layer 10 to be overlaid on the base material layer 11 has the main surface on which the input / output electrodes 10A to 10D are not formed as the base material layer 11 side, and the conductor patterns 11A to 11E in the base material layer 11 are arranged. Overlay the formed main surface. In addition, alignment is performed in consideration of the positional relationship between the via conductors formed in the base material layer 10 and the conductor patterns 11A to 11E.

  The stacked base material layers 10 to 15 are heated and pressurized to adhere them. Since the resin sheet is thermoplastic as described above, it is not necessary to use an adhesive. Thus, the inductor element 1 can be manufactured by a simple process.

(Embodiment 2)
The inductor element according to the present embodiment is different from the first embodiment in that each of the two first coils and the second coil formed in the multilayer body is sandwiched between base layers having high relative magnetic permeability. To do.

  FIG. 3 is an exploded perspective view of the inductor element according to the second embodiment. 4 is a cross-sectional view taken along line IV-IV shown in FIG. The inductor element 2 according to the present embodiment includes a multilayer body 22, and a first coil C1 and a second coil C2 that are formed on the multilayer body 22 independently of each other. As for the laminated body 22, 1st base material layers 10, 11, and 14 and 2nd base material layers 16, 17, and 18 are laminated | stacked alternately.

  The second base material layer 16 is laminated between the first base material layers 10 and 11. The second base material layer 16 is made of a thermoplastic resin such as an LCP resin as a main material, similarly to the second base material layer 13, and the thermoplastic resin contains a magnetic substance. , 14 is made higher in relative permeability.

  The second base material layer 17 is laminated between the first base material layers 11 and 14. On the surface of the second base material layer 17, strip-shaped conductor patterns 17A, 17B, 17C, and 17D are formed. The conductor patterns 17 </ b> A to 17 </ b> D form the first coil C <b> 1 with the conductor patterns 11 </ b> A to 11 </ b> E formed on the first base material layer 11. The first coil C1 is formed by a conductor pattern formed on the main surfaces of the first base material layer 11 and the second base material layer 17, and is wound so that the first base material layer 11 is located inside. Yes. The first coil C1 is sandwiched between the second base material layers 16 and 17 having a high relative permeability. The 1st base material layer 11 is arrange | positioned in the lamination direction in the position pinched | interposed by the conductor patterns 11A-11E and conductor patterns 17A-17D which comprise a part of 1st coil C1.

  The second base material layer 18 is laminated on the first base material layer 14. On the surface of the second base material layer 18, strip-shaped conductor patterns 18A, 18B, 18C, 18D are formed. The conductor patterns 18 </ b> A to 18 </ b> D form the second coil C <b> 2 with the conductor patterns 14 </ b> A to 14 </ b> E formed on the first base material layer 14. The second coil C2 is formed by a conductor pattern formed on the main surfaces of the first base material layer 14 and the second base material layer 18, and is wound so that the first base material layer 14 is located inside. Yes. The second coil C2 is sandwiched between the second base material layers 17 and 18 having a high relative magnetic permeability. The 1st base material layer 14 is arrange | positioned in the lamination direction in the position pinched | interposed by conductor pattern 14A-14E and conductor pattern 18A-18D which comprise a part of 2nd coil C2.

  As described above, the inductor element 2 has a configuration in which the first coil C1 and the second coil C2 are sandwiched between the second base material layers 16, 17, and 18 having high relative magnetic permeability. As a result, similarly to the first embodiment, the first coil C1 and the second coil C2 can be prevented from being coupled to each other and around the inductor element 2 mounted on the substrate or the like by the magnetic flux generated from each coil. Magnetic coupling with a certain element or circuit can be prevented.

  Moreover, in this embodiment, since the conductor pattern which comprises a part of 1st and 2nd coil C1, C2 is formed in the surface of the 2nd base material layers 17 and 18 which made the relative permeability high. The increase in the number of stacked layers 22 is suppressed.

  The inductor element 2 according to the present embodiment can be manufactured by the same manufacturing process as that of the first embodiment.

(Embodiment 3)
The inductor element according to the present embodiment is different from the first embodiment in that the first and second coils formed in the multilayer body are connected in series.

  FIG. 5 is an exploded perspective view of the inductor element according to the third embodiment.

  The inductor element 3 according to the present embodiment includes a multilayer body 23, and two first coils C1 and a second coil C2 formed in the multilayer body 23 and connected in series. As for the laminated body 23, the 1st base material layers 30, 32, and 34 and the 2nd base material layers 31, 33, and 35 are laminated alternately.

  Each of the base material layers 30 to 35 has a rectangular shape having a long side and a short side, and the laminate 23 has a substantially rectangular parallelepiped shape. The base material layers 30 to 35 are formed using the same kind of thermoplastic resin, for example, an LCP resin, as a base material, as in the first embodiment. The second base material layers 31, 33, and 35 contain a magnetic material such as permalloy in the LCP resin, and have a higher relative permeability than the first base material layers 30, 32, and 34. The first base material layers 30, 32 and 34 have a relative dielectric constant lower than that of the second base material layers 31, 33 and 35.

  The first base material layer 30 is a layer serving as a mounting surface of the inductor element 3, and input / output electrodes 30 </ b> A and 30 </ b> B are formed on the surface thereof. Via conductors are formed in the first base material layer 30 at the positions of the input / output electrodes 30A and 30B, and the input / output electrodes 30A and 30B are electrically connected to the conductor patterns formed in the other layers.

  On the surface of the first base material layer 32, strip-shaped conductor patterns 32A, 32B, 32C, 32D, and 32E are formed. The conductor patterns 32 </ b> A to 32 </ b> E are formed in parallel along the short direction of the first base material layer 32. In addition, strip-shaped conductor patterns 33A, 33B, 33C, and 33D are formed on the surface of the second base material layer 33. The conductor patterns 33A to 33D are formed to be inclined with respect to the conductor patterns 32A to 32E so that the conductor patterns 32A to 32E formed on the first base material layer 11 are installed.

  The conductor pattern 32A is electrically connected to the input / output electrode 30A, and is subsequently electrically connected in the order of the conductor patterns 32A, 33A, 32B, 33B, 32C, 33C, 32D, 33D, and 32E. The first coil C <b> 1 is formed by the conductor patterns formed on the main surfaces of the first base material layer 32 and the second base material layer 33. The first coil C1 is wound so that the direction perpendicular to the stacking direction is a coil winding axis and the first base material layer 32 is located inside. In addition, the second base material layer 31 is laminated on the first base material layer 32, and the first coil C1 is sandwiched between the second base material layers 31 and 33 having a high relative magnetic permeability.

  On the surface of the first base material layer 34, a rectangular conductor pattern 34A and strip-shaped conductor patterns 34B, 34C, 3D, and 34E are formed. The conductor pattern 34A is formed at substantially the same position as the input / output electrode 30B in the stacking direction, and is electrically connected to the input / output electrode 30B through the via conductor. The conductor patterns 34 </ b> B to 34 </ b> E are formed in parallel along the short direction of the first base material layer 34. In addition, on the surface of the second base material layer 35, strip-shaped conductor patterns 35A, 35B, 35C, and 35D are formed. The conductor patterns 35A to 35D are formed to be inclined with respect to the conductor patterns 34B to 34E so that the conductor patterns 34A to 34E formed on the second base material layer 35 are installed.

  The conductor pattern 34E is electrically connected to one end of the conductor pattern 32E formed on the first base material layer 32, which is the end portion of the first coil. Hereinafter, the conductor patterns 34E, 35D, 34D, 35C, 34C, It is conducting in the order of 35B, 34B, 35A, 34A. The second coil C <b> 2 is formed by the conductor pattern formed on the main surfaces of the first base material layers 34 and 35. The second coil C2 is wound so that the direction perpendicular to the stacking direction is a coil winding axis and the first base material layer 34 is located inside. Further, the second coil C2 is sandwiched between the second base material layers 33 and 35 having a high relative magnetic permeability.

  As described above, the inductor element 3 includes one coil in which the first coil C1 and the second coil C2 are connected in series. Since the first coil C1 and the second coil C2 are arranged side by side in the stacking direction, the size of the inductor element 3 in the planar direction (direction perpendicular to the stacking direction) is increased in this embodiment. In addition, the coil turns ratio can be increased, that is, the inductance value can be increased. As a result, even when the inductance value is increased, the mounting board can be saved in space.

  Moreover, since the 2nd base material layer 33 with a high relative magnetic permeability is interposed between the 1st coil C1 and the 2nd coil C2, in the 1st coil C1 and the 2nd coil C2, Since the generated magnetic field mainly passes through the second base material layer 33, the influence of the magnetic field on each coil can be suppressed. More specifically, it is possible to prevent the magnetic flux generated in the first coil C1 from passing through the second coil C2 (or vice versa) and combining the first coil C1 and the second coil C2. Thereby, the inductor element 3 can be used appropriately without changing the inductance value of the inductor element 3.

  Similarly to the second embodiment, the magnetic flux generated from each of the first coil C1 and the second coil C2 is magnetically coupled to the elements and circuits around the inductor element 3 mounted on the substrate or the like. Can be prevented.

  The inductor element 3 according to the present embodiment can be manufactured by the same manufacturing process as that of the first embodiment.

(Embodiment 4)
The inductor element according to the present embodiment has a configuration in which three first coils, a second coil, and a third coil are formed in the multilayer body, and the three first coils and the second coil. The third embodiment is different from the first embodiment in that each of the third coils is connected in series.

  FIG. 6 is an exploded perspective view of the inductor element according to the fourth embodiment. The inductor element 4 according to the present embodiment includes a multilayer body 24, and the multilayer body 24 is formed with three first coils C1, a second coil C2, and a third coil C3. The three first coils C1, the second coil C2, and the third coil C3 are connected in series. In the laminate 24, first base material layers 40, 42, 44, and 46 and second base material layers 41, 43, 45, and 47 are alternately laminated.

  Each of the base material layers 40 to 47 has a rectangular shape having a long side and a short side, and the laminate 24 has a substantially rectangular parallelepiped shape. The base material layers 40 to 47 are formed using the same kind of thermoplastic resin, for example, an LCP resin as a base material, as in the first embodiment. In addition, the second base material layers 41, 43, 45, 47 contain a magnetic material such as permalloy in the LCP resin, and have a higher relative magnetic permeability than the first base material layers 40, 42, 44, 46. . The first base material layers 40, 42, 44, 46 have a relative dielectric constant lower than that of the second base material layers 41, 43, 45, 47.

  The first base material layer 40 is a layer that becomes a mounting surface of the inductor element 4, and input / output electrodes 40 </ b> A and 40 </ b> B are formed on the surface thereof. Via conductors are formed in the first base material layer 40 at the positions of the input / output electrodes 40A and 40B, and the input / output electrodes 40A and 40B are electrically connected to the conductor patterns formed in the other layers.

  On the surface of the first base material layer 42, strip-shaped conductor patterns 42A, 42B, 42C, 42D, and 42E are formed. The conductor patterns 42 </ b> A to 42 </ b> E are formed in parallel along the short direction of the first base material layer 42. In addition, on the surface of the second base material layer 43, strip-like conductor patterns 43A, 43B, 43C, and 43D are formed. The conductor patterns 43A to 43D are formed to be inclined with respect to the conductor patterns 42A to 42E so that the conductor patterns 42A to 42E formed on the first base material layer 42 are installed.

  The conductor pattern 42A is electrically connected to the input / output electrode 40A. Hereinafter, the conductor patterns 43A, 42B, 43B, 42C, 43C, 42D, 43D, and 42E are electrically connected. The first coil C <b> 1 is formed by the conductor pattern formed on the main surfaces of the first base material layer 42 and the second base material layer 43. The first coil C1 is wound so that the direction perpendicular to the stacking direction is a coil winding axis and the first base material layer 42 is located inside. A second base material layer 41 is laminated on the first base material layer 42, and the first coil C1 is sandwiched between second base material layers 41 and 43 having a high relative magnetic permeability.

  On the surface of the first base material layer 44, strip-shaped conductor patterns 44A, 44B, 44C, 44D, and 44E are formed. The conductor patterns 44 </ b> A to 44 </ b> E are formed in parallel along the short direction of the first base material layer 44. In addition, on the surface of the second base material layer 45, strip-shaped conductor patterns 45A, 45B, 45C, and 45D are formed. The conductor patterns 44A to 44D are formed to be inclined with respect to the conductor patterns 44A to 44E so as to lay the conductor patterns 44A to 44E formed on the first base material layer 44.

  The conductor pattern 44E is electrically connected to one end of the conductor pattern 41E formed on the first base material layer 42, which is an end portion of the first coil. Hereinafter, the conductor patterns 44E, 45D, 44D, 45C, 44C, It is conducting in the order of 45B, 44B, 45A, 44A. The second coil C <b> 2 is formed by the conductor pattern formed on the main surfaces of the first base material layer 44 and the second base material layer 45. The second coil C2 is wound so that the direction perpendicular to the stacking direction is a coil winding axis and the first base material layer 44 is located inside. The second coil C2 is sandwiched between second base material layers 43 and 45 having a high relative permeability.

  On the surface of the first base material layer 46, strip-shaped conductor patterns 46A, 46B, 46C, 46D, and 46E are formed. The conductor patterns 46 </ b> A to 46 </ b> E are formed in parallel along the short direction of the first base material layer 46. Further, on the surface of the second base material layer 47, strip-like conductor patterns 47A, 47B, 47C, 47D are formed. The conductor patterns 47A to 47D are formed to be inclined with respect to the conductor patterns 46A to 46E so that the conductor patterns 46A to 46E formed on the first base material layer 46 are constructed.

  The conductor pattern 46A is electrically connected to one end of the conductor pattern 44A formed on the first base material layer 44, which is the end of the second coil. Hereinafter, the conductor patterns 46A, 47A, 46B, 47B, 46C, It is conducted in the order of 47C, 46D, 47D, 46E. The conductor pattern 46E is electrically connected to the input / output electrode 40B formed on the first base material layer 40. The third coil C3 is formed by the conductor pattern formed on the main surfaces of the first base material layer 46 and the second base material layer 47. The third coil C3 is wound so that the direction perpendicular to the stacking direction is a coil winding axis and the first base material layer 46 is located inside. The third coil C3 is sandwiched between second base material layers 45 and 47 having a high relative permeability.

  As described above, the inductor element 4 includes one coil formed by connecting the first coil C1, the second coil C2, and the third coil C3 in series. Since each of the first coil C1, the second coil C2, and the third coil C3 is sandwiched between the second base material layers 41, 43, 45, and 47 having a high relative magnetic permeability, it is generated in each coil. It can suppress that the magnetic field to influence on another coil. Thereby, the inductor element 4 can be used appropriately without changing the inductance value of the inductor element 4.

  Further, similarly to the third embodiment, even when the number of windings of the coil is increased, the size of the inductor element 4 in the planar direction can be prevented from being increased, so that the mounting board can be saved in space.

  Similarly to the second and third embodiments, the elements around the inductor element 4 mounted on the substrate or the like by the magnetic flux generated from each of the first coil C1, the second coil C2, and the third coil C3. Magnetic coupling with a circuit or the like can be prevented.

  The inductor element 4 according to this embodiment can be manufactured by the same manufacturing process as that of the first embodiment.

(Embodiment 5)
The inductor element according to the present embodiment is different from the first embodiment in that the two first coils and the second coil formed in the laminate are connected in parallel.

  FIG. 7 is an exploded perspective view of the inductor element according to the fifth embodiment. The inductor element 5 according to this embodiment includes a multilayer body 25 and two first coils C1 and second coils C2 formed in the multilayer body 25. The two first coils C1 and second coil C2 are connected in parallel. As for the laminated body 25, the 1st base material layers 50, 52, and 54 and the 2nd base material layers 51, 53, and 55 are laminated alternately.

  Each of the base material layers 50 to 55 has a rectangular shape having a long side and a short side, and the laminate 25 has a substantially rectangular parallelepiped shape. The base material layers 50 to 55 are formed using the same kind of thermoplastic resin, for example, an LCP resin, as a base material, as in the first embodiment. The second base material layers 51, 53, and 55 contain a magnetic material such as permalloy in the LCP resin, and have a higher relative magnetic permeability than the first base material layers 50, 52, and 54. The first base material layers 50, 52, and 54 have a relative dielectric constant lower than that of the second base material layers 51, 53, and 55.

  The first base material layer 50 is a layer to be a mounting surface of the inductor element 5, and input / output electrodes 50 </ b> A and 50 </ b> B are formed on the surface thereof. Via conductors are formed in the first base material layer 50 at the positions of the input / output electrodes 50A and 50B, and the input / output electrodes 50A and 50B are electrically connected to the conductor patterns formed in the other layers.

  On the surface of the first base material layer 52, strip-shaped conductor patterns 52A, 52B, 52C, 52D, and 52E are formed. The conductor patterns 52 </ b> A to 52 </ b> E are formed in parallel along the short direction of the first base material layer 52. In addition, on the surface of the second base material layer 53, strip-shaped conductor patterns 53A, 53B, 53C, and 53D are formed. The conductor patterns 53A to 53D are formed to be inclined with respect to the conductor patterns 52A to 52E so that the conductor patterns 52A to 52E formed on the first base material layer 52 are installed.

  The conductor pattern 52A is electrically connected to the input / output electrode 50A. Hereinafter, the conductor patterns 52A, 53A, 52B, 53B, 52C, 53C, 52D, 53D, and 52E are electrically connected. The conductor pattern 52E is electrically connected to the input / output electrode 50B. The first coil C <b> 1 is formed by the conductor pattern formed on the main surfaces of the first base material layer 52 and the second base material layer 53. The first coil C1 is wound so that the direction perpendicular to the stacking direction is a coil winding axis and the first base material layer 52 is positioned inside. A second base material layer 51 is laminated on the first base material layer 52, and the first coil C1 is sandwiched between second base material layers 51 and 53 having a high relative magnetic permeability.

  On the surface of the first base material layer 54, rectangular shapes 54A and 54E and strip-like conductor patterns 54B, 54C and 54D are formed. The conductor patterns 54 </ b> B to 54 </ b> D are formed in parallel along the short direction of the first base material layer 54. In addition, on the surface of the second base material layer 55, strip-shaped conductor patterns 55A, 55B, 55C, and 55D are formed. The conductor patterns 55A to 55D are formed to be inclined with respect to the conductor patterns 54B to 54D so that the conductor patterns 54A to 54E formed on the first base material layer 54 are installed.

  The conductor pattern 54A is electrically connected to the input / output electrode 50A formed on the first base material layer 50. Hereinafter, the conductor patterns 54A, 55A, 54B, 55B, 54C, 55C, 54D, 55D, and 54E are electrically connected. ing. The conductor pattern 54E is electrically connected to the input / output electrode 50B formed on the first base material layer 50. The second coil C <b> 2 is formed by the conductor pattern formed on the main surfaces of the first base material layer 54 and the second base material layer 55. The second coil C2 is wound so that the direction perpendicular to the stacking direction is a coil winding axis and the first base material layer 54 is located inside. The second coil C2 is sandwiched between second base material layers 53 and 55 having a high relative permeability.

  As described above, the inductor element 5 includes one coil formed by connecting the first coil C1 and the second coil C2 in parallel. Since each of the first coil C1 and the second coil C2 is sandwiched between the second base material layers 51, 53, and 55 having a high relative permeability, the magnetic field generated in each coil affects the other coils. Can be suppressed. Thereby, the inductor element 5 can be used appropriately without changing the inductance value of the inductor element 5.

  In addition, it is possible to prevent magnetic coupling between the elements and circuits around the inductor element 5 mounted on the substrate or the like by the magnetic flux generated from each coil.

  The inductor element 5 according to the present embodiment can be manufactured by the same manufacturing process as that of the first embodiment.

  The inductor element according to each embodiment described above can be changed as appropriate. For example, you may increase the number of layers of the laminated body with which an inductor element is provided. Further, the inductor elements according to the first, second, fourth, and fifth embodiments include two coils, but may include three or more coils. The inductor element according to Embodiment 3 includes three coils, but may include four or more coils.

1, 2, 3, 4, 5 ... inductor elements 10, 11, 12, 14, 15 ... first base layer 13, 16, 17, 18 ... second base layer 10A, 10B, 10C, 10D ... input / output Electrodes 11A, 11B, 11C, 11D, 11E ... Conductor patterns 12A, 12B, 12C, 12D ... Conductor patterns 14A, 14B, 14C, 14D, 14E ... Conductor patterns 15A, 15B, 15C, 15D ... Conductor patterns 17A, 17B, 17C , 17D ... Conductor patterns 21, 22, 23, 24, 25 ... Laminated bodies 30, 32, 34 ... First base material layers 31, 33, 35 ... Second base material layers 30A, 30B ... Input / output electrodes 32A, 32B, 32C, 32D, 32E ... Conductor patterns 33A, 33B, 33C, 33D ... Conductor patterns 34A, 34B, 34C, 34D, 34E ... Conductor patterns 35A, 35B 35C, 35D ... Conductor patterns 40, 42, 44, 46 ... First base layer 41, 43, 45, 47 ... Second base layer 40A, 40B ... Input / output electrodes 42A, 42B, 42C, 42D, 42E ... Conductor Patterns 43A, 43B, 43C, 43D ... Conductor patterns 44A, 44B, 44C, 44D, 44E ... Conductor patterns 45A, 45B, 45C, 45D ... Conductor patterns 46A, 46B, 46C, 46D, 46E ... Conductor patterns 47A, 47B, 47C , 47D ... conductor patterns 50, 52, 54 ... first substrate layers 51, 53, 55 ... second substrate layers 50A, 50B ... input / output electrodes 52A, 52B, 52C, 52D, 52E ... conductor patterns 53A, 53B, 53C, 53D ... Conductor patterns 54A, 54B, 54C, 54D, 54E ... Conductor patterns 55A, 55B, 55C, 5D ... conductor pattern 101,102,103,104,105,106,107 ... via conductors C1 ... first coil C2 ... second coil C3 ... third coil

Claims (9)

A laminate in which a plurality of substrate layers including a plurality of first substrate layers and at least one second substrate layer are laminated;
A direction perpendicular to the stacking direction as a coil winding axis, and a first coil and a second coil arranged in the stacking direction;
With
Each of the first coil and the second coil is wound so that the first base material layer is located inside,
The second base material layer has a higher relative permeability than the first base material layer, and is disposed between the first coil and the second coil in the stacking direction.
Inductor element. The first base material layer has a relative dielectric constant smaller than that of the second base material layer,
The inductor element according to claim 1. A part of each of the first coil and the second coil is constituted by a conductor pattern formed on the main surface of the base material layer,
The first base material layer located inside the first coil is disposed at a position sandwiched by the conductor pattern constituting a part of the first coil in the stacking direction,
The first base material layer located inside the second coil is arranged at a position sandwiched between the conductor patterns constituting a part of the second coil in the stacking direction.
The inductor element according to claim 1 or 2. A part of the conductor pattern is formed on the main surface of the second base material layer.
The inductor element according to claim 3. A plurality of the second base material layers are provided, and are arranged so as to sandwich each of the first coil and the second coil from both sides in the stacking direction.
The inductor element according to claim 1. A direction perpendicular to the stacking direction is a coil winding axis, and further includes a third coil disposed on the opposite side of the first coil with respect to the second coil in the stacking direction,
A plurality of the second base material layers are provided, and are arranged at least between the first coil and the second coil and between the second coil and the third coil in the stacking direction. Being
The inductor element according to claim 1. The first base material layer and the second base material layer are based on the same kind of thermoplastic resin,
The inductor element according to claim 1.   The inductor element according to claim 7, wherein the thermoplastic resin is a liquid crystal polymer resin. External terminals of the first coil and the second coil are formed on the surface of the outermost layer of the plurality of base material layers,
The inductor element according to claim 1.

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